BU9796AFS-E2

Datasheet Standard LCD Segment Driver BU9796Axxx Series MAX 80 segments (SEG20×COM4) ●Features ◼ Integrated RAM for display data (DDRAM): 20 x 4 bit (Max 80 Segment) ◼ LCD drive output : 4 Common output, Max 20 Segment output ◼ Integrated Buffer AMP for LCD driving ◼ Integrated Oscillator circuit ◼ No external components ◼ Low power consumption design ●Key Specifications ■ Supply Voltage Range: +2.5V to +5.5V ■ Operating Temperature Range: -40°C to +85°C ■ Max Segments: BU9796AFS 80 Segments BU9796AMUV 48 Segments Display Duty: 1/4 ■ Bias: 1/2, 1/3 selectable ■ Interface: 2wire serial interface ●Package W (Typ.) x D (Typ.) x H (Max.) ●Applications ◼ Telephone ◼ FAX ◼ Portable equipment (POS, ECR, PDA etc.) ◼ DSC ◼ DVC ◼ Car audio ◼ Home electrical appliance ◼ Meter equipment etc. VQFN024V4040 4.00mm x 4.00mm x 1.00mm SSOP-A32 13.60mm x 7.80mm x 2.01mm ●Typical Application Circuit VDD BU9796AFS VDD VLCD COM0 COM1 COM2 COM3 SDA SCL Controller Segment LCD OSCIN TEST1 TEST2 VSS ・・・・・・・ ・・・・・・・ SEG0 SEG1 SEG19 Using internal oscillator Figure 1. Typical application circuit ○Product structure：Silicon monolithic integrated circuit www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･14･001 ○This product is not designed protection against radioactive rays. 1/28 TSZ02201-0A2A0D300100-1-2 18.Dec.2020 Rev.004 BU9796Axxx Series Datasheet MAX 80 segments (SEG20×COM4) ●Block Diagram / Pin Configuration / Pin Description COM 0 SEG 19 SEG 18 SEG 15 SEG 16 SEG 17 COM 2 COM 1 SEG 13 SEG 14 VLCD COM 3 SEG 11 SEG 12 VSS VDD SEG 9 SEG 10 TEST 2 TEST 1 SEG 7 OSCIN SEG 6 SEG 8 SDA SCL SEG 4 SEG 5 Segment driver LCD voltage generator SEG 1 Common driver VDD SEG0 SEG0…… SEG19 SEG 2 COM0……COM3 SEG 3 BU9796AFS ＋ － LCD BIAS SELECTOR Common counter ＋ － Blink timing generator DDRAM VLCD Command Data Decoder Command register OSCIN OSCILLATOR Power On Reset Serial interface IF FILTER VSS SDA Figure 2. SCL Block Diagram Figure 3. Pin Configuration (TOP VIEW) Table 1 Pin Description Terminal Terminal No. I/O TEST1 26 I Function Test input (ROHM use only) Must be connect to VSS Test input (ROHM use only) TEST2=”L”: POR circuit enable TEST2=”H”: POR circuit disenable, refer to “Cautions in Power ON/OFF” External clock input External clock and Internal clock can be selected by command. Must be connect to VSS when use internal oscillation circuit. TEST2 27 I OSCIN 28 I SDA 30 I/O serial data in-out terminal SCL 29 I serial data transfer clock VSS 25 GND VDD 24 Power supply VLCD 23 Power supply for LCD driving SEG0-19 31,32 1-18 O SEGMENT output for LCD driving COM0-3 19-22 O COMMON output for LCD driving www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 2/28 TSZ02201-0A2A0D300100-1-2 18.Dec.2020 Rev.004 BU9796Axxx Series Datasheet MAX 80 segments (SEG20×COM4) ●Block Diagram / Pin Configuration / Pin Description- continued BU9796AMUV COM0 ……COM3 SEG0 …… SEG11 Common driver Segment driver Blink timing generator DDRAM SEG0 SEG1 SEG2 4 6 SEG5 10 SEG6 VSS VDD 21 VLCD 20 11 SEG7 COM3 19 12 SEG8 13 SEG10 SEG9 EXT-PAD 15 IF FILTER VSS Figure 4. 5 SEG4 9 22 Serial interface SDA SDA TEST1 14 Power On Reset 3 SEG3 8 SEG11 OSCILLATOR OSCIN 7 23 16 Command Data Decoder Command register SCL 24 VLCD OSCIN 2 TEST2 COM0 － 17 Common counter ＋ COM1 LCD BIAS SELECTOR 18 ＋ － COM2 LCD voltage generator 1 VDD SCL Block Diagram Figure 5. Pin Configuration (BOTTOM VIEW) Table 1 Pin Description Terminal Terminal No. I/O TEST1 23 I Function Test input (ROHM use only) Must be connect to VSS Test input (ROHM use only) TEST2=”L”: POR circuit enable TEST2=”H”: POR circuit disenable, refer to “Cautions in Power ON/OFF” External clock input External clock and Internal clock can be selected by command. Must be connect to VSS when use internal oscillation circuit. TEST2 24 I OSCIN 1 I SDA 3 I/O serial data in-out terminal SCL 2 I serial data transfer clock VSS 22 GND VDD 21 Power supply VLCD 20 Power supply for LCD driving SEG0-11 4-15 O SEGMENT output for LCD driving COM0-3 16-19 O COMMON output for LCD driving EXT-PAD -(*1) - Substrate *1: To radiate heat, please contact a board with the EXT-PAD which is located at the bottom side of VQFN024V4044 package. Please supply VSS level or Open state as the input condition for this PAD. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 3/28 TSZ02201-0A2A0D300100-1-2 18.Dec.2020 Rev.004 BU9796Axxx Series Datasheet MAX 80 segments (SEG20×COM4) ●Absolute Maximum Ratings (VSS=0V) Parameter Symbol Ratings Unit Remarks Power Supply Voltage1 VDD -0.5 to +7.0 V Power supply Power Supply Voltage2 VLCD -0.5 to VDD V 0.64 W 0.27 W LCD drive voltage When use more than Ta=25℃, subtract 6.4mW per degree. (BU9796AFS) (Package only) When use more than Ta=25℃, subtract 2.7mW per degree. (BU9796AMUV) (Package only) Allowable loss Pd Input voltage range VIN -0.5 to VDD+0.5 V Operational temperature range Topr -40 to +85 ℃ Storage temperature range Tstg -55 to +125 ℃ ●Recommended Operating Ratings (Ta=-40°C to +85°C,VSS=0V) Ratings Parameter Symbol MIN TYP MAX Unit Remarks Power Supply Voltage1 VDD 2.5 - 5.5 V Power supply Power Supply Voltage2 VLCD 0 - VDD-2.4 V LCD drive voltage ●Electrical Characteristics DC Characteristics (VDD=2.5V to 5.5V, VLCD=0V, VSS=0V, Ta=-40℃ to 85℃, unless otherwise specified) Limits Parameter Symbol Unit Conditions MIN TYP MAX “H” level input voltage VIH 0.7VDD - VDD “L” level input voltage VIL VSS - “H” level input current IIH - - “L” level input current IIL -1 SEG RON COM RON VLCD supply voltage Standby current Power consumption LCD Driver on resistance www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 V SDA,SCL 0.3VDD V SDA,SCL 1 µA SDA,SCL - - µA SDA,SCL - 3 - kΩ - 3 - kΩ VLCD 0 - VDD-2.4 V VDD-VLCD2.4V IDD1 - - 5 µA IDD2 - 12.5 30 µA Display off, Oscillation off VDD=3.3V, VLCD=0V, Ta=25℃ Power save mode1, FR=71Hz 1/3 bias, Frame inverse 4/28 Iload=±10µA TSZ02201-0A2A0D300100-1-2 18.Dec.2020 Rev.004 BU9796Axxx Series Datasheet MAX 80 segments (SEG20×COM4) Oscillation Characteristics (VDD=2.5V to 5.5V, VLCD=0V, VSS=0V, Ta=-40℃ to 85℃, unless otherwise specified) Limits Parameter Symbol Unit Conditions MIN TYP MAX FR = 80Hz setting, VDD=3.3V Frame frequency fCLK 56 80 104 Hz Internal OSC is used. External frequency fEXCLK 15 300 KHz External clock is used. (*1) (*1) DISCTL 80Hz setting : Frame frequency [Hz] = external clock [Hz] / 512 DISCTL 71Hz setting : Frame frequency [Hz] = external clock [Hz] / 576 DISCTL 64Hz setting : Frame frequency [Hz] = external clock [Hz] / 648 DISCTL 53Hz setting : Frame frequency [Hz] = external clock [Hz] / 768 【Reference Data】 110.00 105.00 100.00 VDD = 5.5V VDD = 5.0V Frame f requency [Hz] 95.00 90.00 85.00 VDD = 3.3V 80.00 VDD = 2.5V 75.00 70.00 65.00 60.00 55.00 50.00 -40 -20 0 20 40 60 80 Temperature[○C] Typical temperature characteristics www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 5/28 TSZ02201-0A2A0D300100-1-2 18.Dec.2020 Rev.004 BU9796Axxx Series Datasheet MAX 80 segments (SEG20×COM4) ●Electrical Characteristics - continued MPU interface Characteristics (VDD=2.5V to 5.5V, VLCD=0V, VSS=0V, Ta=-40℃ to 85℃, unless otherwise specified) Limits Parameter Symbol Unit Conditions MIN TYP MAX Input rise time tr - - 0.3 µs Input fall time tf - - 0.3 µs SCL cycle time tSCYC 2.5 - - µs “H” SCL pulse width tSHW 0.6 - - µs “L” SCL pulse width tSLW 1.3 - - µs SDA setup time tSDS 100 - - µs SDA hold time tSDH 100 - - us Buss free time tBUF 1.3 - - µs START condition hold time tHD;STA 0.6 - - µs START condition setup time tSU;STA 0.6 - - µs STOP condition setup time tSU;STO 0.6 - - µs SDA tBUF tf tS LW tSCYC SCL tHD; STA tr tSDH tS HW tSDS SDA tSU; STO tSU; STA Figure6. Interface Timing ●I/O equivalent circuit VDD VDD VLCD VSS VSS SDA SCL VSS VSS VDD VDD TEST1 TEST2 VSS VSS VDD VDD OSCIN SEG/COM VSS VSS Figure7. I/O equivalent circuit www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 6/28 TSZ02201-0A2A0D300100-1-2 18.Dec.2020 Rev.004 BU9796Axxx Series Datasheet MAX 80 segments (SEG20×COM4) ●Example of recommended circuit VDD VDD VLCD COM0 COM1 COM2 COM3 SDA SCL Controller Segment LCD OSCIN TEST1 TEST2 VSS ・・・・・・・ ・・・・・・・ SEG0 SEG1 SEG19 Internal Oscillator circuit use mode VDD VDD VLCD COM0 COM1 COM2 COM3 SDA SCL Controller Segment LCD OSCIN TEST1 TEST2 VSS ・・・・・・・ ・・・・・・・ SEG0 SEG1 SEG19 External clock input mode Figure8. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Example of recommended circuit 7/28 TSZ02201-0A2A0D300100-1-2 18.Dec.2020 Rev.004 BU9796Axxx Series Datasheet MAX 80 segments (SEG20×COM4) ●Example of recommended circuit - continued VDD VDD VLCD COM 0 COM 1 COM 2 COM 3 SDA SCL Controller SEG 0 SEG 1 ・ ・ ・ ・ ・ ・ ・ OSCIN TEST 1 TEST 2 VSS Segment LCD ・ ・ ・ ・ ・ ・ ・ SEG 11 Internal Oscillator circuit use mode VDD VDD VLCD COM 0 COM 1 COM 2 COM 3 SDA SCL Controller SEG 0 SEG 1 ・ ・ ・ ・ ・ ・ ・ SEG 11 OSCIN TEST 1 TEST 2 VSS Segment LCD ・ ・ ・ ・ ・ ・ ・ External clock input mode Figure 9. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Example of recommended circuit 8/28 TSZ02201-0A2A0D300100-1-2 18.Dec.2020 Rev.004 BU9796Axxx Series Datasheet MAX 80 segments (SEG20×COM4) ●Functional descriptions ○Command /Data transfer method This device is controlled by 2wire signal (SDA, SCL). SDA SCL START condition STOP condition Figure10. 2-SPI Command/Data transfer Format It has to generate the condition such as START condition and STOP condition in 2wire serial interface transfer method. Slave address S 0 1 1 1 1 1 0 0 A C A Command Display Data A P 0 Command or data judgment bit START condition STOP condition Acknowledge Figure11. Interface protcol Method of how to transfer command and data is shown as follows. 1) Generate “START condition”. 2) Issue Slave address. 3) Transfer command and display data. ○Acknowledge Data format is 8bits and return Acknowledge after transfer 8bits data. When SCL 8th=’L’ after transfer 8bit data (Slave Address, Command, Display Data), output ’L’ and open SDA line. When SCL 9th=’L’, stop output function. (As Output format is NMOS-Open-Drain, can’t output ‘H’ level.) If no need Acknowledge function, please input ‘L’ level from SCL 8th=’L’ to SCL 9th=’L’. SDA 1-7 8 9 1-7 8 9 1-7 8 9 SCL S P SLAVE ADDRESS ACK DATA ACK START condition ACK STOP condition Figure 12. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 DATA Acknowledge timing 9/28 TSZ02201-0A2A0D300100-1-2 18.Dec.2020 Rev.004 BU9796Axxx Series Datasheet MAX 80 segments (SEG20×COM4) ○Command transfer method Issue Slave Address (“01111100”) after generate “START condition”. 1byte after Slave Address always becomes command input. MSB (“command or data judge bit”) of command decide to next data is command or display data. When set “command or data judge bit”=‘1’, next byte will be command. When set “command or data judge bit”=‘0’, next byte data is display data. S Slave address A 1 Command A 1 Command A 1 Command A Display Data A 0 Command … P Once it becomes display data transfer condition, it cannot input command. When want to input command again, please generate “START condition” once. If “START condition” or “STOP condition” are inputted in the middle of command transmission, command will be canceled. If Slave address is continuously inputted following “START condition”, it will be in command input condition. Please input “Slave Address” in the first data transmission after “START condition”. When Slave Address cannot be recognized in the first data transmission, Acknowledge does not return and next transmission will be invalid. When data transmission is in invalid status, if “START conditions” are transmitted again, it will return to valid status. Please consider the MPU interface characteristic such as Input rise time and Setup/Hold time when transferring command and data (Refer to MPU Interface). ○Write display and transfer method This device has Display Data RAM (DDRAM) of 20×4=80bit. The relationship between data input and display data, DDRAM data and address are as follows; Slave address Command S 01111100 A 0 0000000 A a b c d e f g h A i j k l m n o p A … P Display Data 8 bit data will be stored in DDRAM. The address to be written is the address specified by ADSET command, and the address is automatically incremented in every 4bit data. Data can be continuously written in DDRAM by transmitting Data continuously. (When RAM data is written successively after writing RAM data to 13h (SEG19), the address is returned to 00h (SEG0) by the auto-increment function. BIT 04 DDRAM address 05 06 07 ・・・ 00 01 02 03 0 a e i m COM0 1 b f j n COM1 2 c g k o COM2 3 d h l p COM3 SEG0 SEG1 SEG2 SEG3 SEG4 SEG5 SEG6 SEG7 11h 12h 13h SEG17 SEG18 SEG19 Data transfer to DDRAM happens every 4bit data. So it will be finished to transfer with no need to wait ACK. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 10/28 TSZ02201-0A2A0D300100-1-2 18.Dec.2020 Rev.004 BU9796Axxx Series Datasheet MAX 80 segments (SEG20×COM4) This device has Display Data RAM (DDRAM) of 12×4=48bit. The relationship between data input and display data, DDRAM data and address are as follows; Slave address Command S 01111100 A 0 0000000 A a b c d e f g h A i j k l m n o p A … P Display Data 8 bit data will be stored in DDRAM. The address to be written is the address specified by ADSET command, and the address is automatically incremented in every 4bit data. Data can be continuously written in DDRAM by transmitting Data continuously. (When RAM data is written successively after writing RAM data to 13h (SEG19), the address is returned to 00h (SEG0) by the auto-increment function. BIT Dummy data ・・・ 00 01 02 03 0 a e i m COM0 1 b f j n COM1 2 c g k o COM2 d h l p 3 04 DDRAM address ・・・ 0B 0C 11h 12h 13h COM3 SEG0 SEG1 SEG2 SEG3 SEG4 SEG11 SEG12 SEG17 SEG18 SEG19 Data transfer to DDRAM happens every 4bit data. So it will be finished to transfer with no need to wait ACK. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 11/28 TSZ02201-0A2A0D300100-1-2 18.Dec.2020 Rev.004 BU9796Axxx Series Datasheet MAX 80 segments (SEG20×COM4) ○OSCILLATOR The clock signals for logic and analog circuit can be generated from internal oscillator or external clock. If internal oscillator circuit is used, OSCIN must be connected to VSS level. *When using external clock mode, input external clock from OSCIN terminal after ICSET command setting. OSCIN OSCIN BU9796A Clock BU9796A VSS VSS Figure 13. Internal oscillator circuit mode Figure 14. Ext clock input mode ○ LCD Driver Bias Circuit This device generates LCD driving voltage with on-chip Buffer AMP. And it can drive LCD at low power consumption. *1/3 and 1/2Bias can set in MODESET command. *Line and frame inversion can set in DISCTL command. Refer to the “LCD driving waveform” about each LCD driving waveform. ○ Blink timing generator This device has Blink function. * This device will be Blink mode with BLKCTL command. Blink frequency varies widely by characteristic of fCLK, when internal oscillation circuit. About the characteristics of fCLK, refer to Oscillation Characteristics. ○ Reset initialize condition Initial condition after execute Software Reset is as follows. ・Display is OFF. ・DDRAM address is initialized (DDRAM Data is not initialized). Refer to Command Description about initialize value of register. ●Command / Function List Description List of Command / Function No. Command Function 1 Display Control (DISCTL) Set LCD display mode 1 2 Mode Set (MODESET) Set LCD drive mode 3 Address Set (ADSET) Set LCD display mode 2 4 Set IC Operation (ICSET) Set IC operation 5 Blink Control (BLKCTL) Set blink mode 6 All Pixel Control (APCTL) Set pixel condition www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 12/28 TSZ02201-0A2A0D300100-1-2 18.Dec.2020 Rev.004 BU9796Axxx Series Datasheet MAX 80 segments (SEG20×COM4) ●Detailed command description D7 (MSB) is bit for command or data judgment. Refer to Command and data transfer method. C: 0: Next byte is RAM write data. 1: Next byte is command. ○Display control (DISCTL) MSB D7 D6 D5 D4 C 0 1 P4 D3 P3 Set Power save mode FR Power save mode FR D2 P2 D1 P1 LSB D0 P0 P4 P3 Reset initialize condition Normal mode (80Hz) 0 0 ○ Power save mode1 (71Hz) 0 1 Power save mode2 (64Hz) 1 0 Power save mode3 (50Hz) 1 1 * Power consumption is reduced in the follow order: Normal mode > Power save mode1 > Power save mode2 > Power save mode3 Set LCD drive waveform Setup P2 Reset initialize condition Line inversion 0 ○ Frame inversion 1 * Power consumption is reduced in the follow order: Refer to LCD drive waveform Set Power save mode SR Setup Line inversion > Frame inversion P1 P0 Power save mode1 0 0 Power save mode2 0 1 Normal mode 1 0 High power mode 1 1 Reset initialize condition ○ * Power consumption is increased in the follow order: Power save mode 1 < Power save mode 2 < Normal mode < High power mode (Reference current consumption data) Setup Current consumption Power save mode 1 ×0.5 Power save mode 2 ×0.67 Normal mode ×1.0 High power mode ×1.8 *Above data is reference. It depends on Panel load. (Note) The setting of Power save mode FR, LCD waveform, Power save mode will influence the following display image qualities. Please select most suitable value from current consumption and display image quality with LCD panel. Mode Power save mode Flicker FR LCD waveform Power save mode SR www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Image quality, contrast ○ - ○ ○ - ○ 13/28 TSZ02201-0A2A0D300100-1-2 18.Dec.2020 Rev.004 BU9796Axxx Series ○Mode Set (MODE SET) MSB D7 D6 D5 C 1 0 MAX 80 segments (SEG20×COM4) D4 * D3 P3 D2 P2 Datasheet LSB D0 * D1 * ( * : Don’t care) Set display ON and OFF Setting P3 Display OFF 0 Display ON 1 Reset initialize condition ○ Display OFF : Regardless of DDRAM data, all SEGMENT and COMMON output will be stopped after 1frame off data write. Display OFF mode will be disabled after Display ON command. Display ON : SEGMENT and COMMON output will be active and start to read the display data from DDRAM. Set bias level setup P2 Reset initialize condition 0 ○ 1/3 Bias 1/2 Bias 1 Refer to LCD driving waveform ○Address set (ADSET) MSB D7 D6 D5 C 0 0 D4 P4 D3 P3 D2 P2 LSB D0 P0 D1 P1 The range of address can be set as 00000 to 10011(2). Don’t set out of range address, otherwise address will be set 00000. ○Set IC Operation (ICSET) MSB D7 D6 D5 D4 C 1 1 0 D3 1 D2 * LSB D0 P0 D1 P1 ( * : Don’t care) Set software reset execution Setup P1 No operation 0 Software Reset execute 1 This command will be set initialize condition. Set oscillator mode setup P0 Reset initialize condition Internal oscillation 0 ○ External clock input 1 Internal oscillation: Must be connected to VSS. External clock input: Input external clock from OSCIN terminal 【Frame frequency Calculation at external clock mode】 DISCTL 80Hz setting: Frame frequency [Hz] = external clock [Hz] / 512 DISCTL 71Hz setting: Frame frequency [Hz] = external clock [Hz] / 576 DISCTL 64Hz setting: Frame frequency [Hz] = external clock [Hz] / 648 DISCTL 53Hz setting: Frame frequency [Hz] = external clock [Hz] / 768 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 14/28 TSZ02201-0A2A0D300100-1-2 18.Dec.2020 Rev.004 BU9796Axxx Series Datasheet MAX 80 segments (SEG20×COM4) ICSET Command OSCIN_EN (internal) Internal OSC mode External clock mode INT oscillation (internal) EXT clock (OSCIN) Figure 15. ○Blink control (BLKCTL) MSB D7 D6 D5 C 1 1 D4 1 D3 0 Oscillator mode change timing LSB D0 P0 D2 * D1 P1 P1 P0 Reset initialize condition OFF 0 0 ○ 0.5 0 1 1 1 0 2 1 1 ( * : Don’t care) Set blink mode Blink mode (Hz) The Blink cycle varies by fclk characteristic when the internal oscillation circuit is used. Refer to the item of oscillation characteristic for the fclk characteristic. ○All Pixel control (APCTL) MSB D7 D6 D5 D4 C 1 1 1 D3 1 All display set ON, OFF APON P1 Normal 0 All pixel ON 1 APOFF Normal D2 1 D1 P1 LSB D0 P0 Reset initialize condition ○ P0 Reset initialize condition 0 ○ All pixel OFF 1 All pixels ON: All pixels are ON regardless of DDRAM data All pixels OFF: All pixels are OFF regardless of DDRAM data (Note) This command is valid in Display on status. The data of DDRAM don’t change by this command. If set both P1 and P0 =”1”, APOFF will be select. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 15/28 TSZ02201-0A2A0D300100-1-2 18.Dec.2020 Rev.004 BU9796Axxx Series Datasheet MAX 80 segments (SEG20×COM4) ●LCD driving waveform (1/3bias) Line inversion Frame inversion SEGn SEG n+1 SEG n+2 SEG n+3 SEGn SEG n+1 SEG n+2 SEG n+3 COM0 stateA COM0 stateA COM1 stateB COM1 stateB COM2 COM2 COM3 COM3 1frame VDD 1frame VDD COM0 COM0 VLCD VLCD VDD VDD COM1 COM1 VLCD VLCD VDD VDD COM2 COM2 VLCD VLCD VDD VDD COM3 COM3 VLCD VLCD VDD VDD SEGn SEGn VLCD VLCD VDD VDD SEGn+1 SEGn+1 VLCD VLCD VDD VDD SEGn+2 SEGn+2 VLCD VLCD VDD VDD SEGn+3 SEGn+3 VLCD VLCD stateA (COM0-SEGn) stateA (COM0-SEGn) (VDD-VLCD) (VDD-VLCD) 2/3 (VDD-VLCD) 1/3 (VDD-VLCD) 0 -1/3 (VDD-VLCD) -2/3 (VDD-VLCD) - (VDD-VLCD) 2/3 (VDD-VLCD) 1/3 (VDD-VLCD) 0 -1/3 (VDD-VLCD) -2/3 (VDD-VLCD) - (VDD-VLCD) stateB (COM1-SEGn) stateB (COM1-SEGn) (VDD-VLCD) (VDD-VLCD) 2/3 (VDD-VLCD) 2/3 (VDD-VLCD) 1/3 (VDD-VLCD) 1/3 (VDD-VLCD) 0 0 -1/3 (VDD-VLCD) -1/3 (VDD-VLCD) -2/3 (VDD-VLCD) -2/3 (VDD-VLCD) - (VDD-VLCD) -(VDD-VLCD) Figure 16. LCD waveform at line inversion (1/3bias) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Figure 17. 16/28 LCD waveform at frame inversion (1/3bias) TSZ02201-0A2A0D300100-1-2 18.Dec.2020 Rev.004 BU9796Axxx Series Datasheet MAX 80 segments (SEG20×COM4) (1/2bias) Line inversion Frame inversion SEGn SEG n+1 SEG n+2 SEG n+3 SEGn SEG n+1 SEG n+2 SEG n+3 COM0 stateA COM0 stateA COM1 stateB COM1 stateB COM2 COM2 COM3 COM3 VDD 1frame 1frame VDD COM0 COM0 VLCD VLCD VDD VDD COM1 COM1 VLCD VLCD VDD VDD COM2 COM2 VLCD VLCD VDD VDD COM3 COM3 VLCD VLCD VDD VDD SEGn SEGn VLCD VLCD VDD VDD SEGn+1 SEGn+1 VLCD VLCD VDD VDD SEGn+2 SEGn+2 VLCD VLCD VDD SEGn+3 VDD SEGn+3 VLCD stateA (COM0-SEGn) (VDD-VLCD) 1/2 (VDD-VLCD) VLCD stateA (COM0-SEGn) (VDD-VLCD) 1/2 (VDD-VLCD) 0 0 -1/2 (VDD-VLCD) -1/2 (VDD-VLCD) -(VDD-VLCD) -(VDD-VLCD) stateB (COM1-SEGn) (VDD-VLCD) stateB (COM1-SEGn) (VDD-VLCD) 1/2 (VDD-VLCD) 1/2 (VDD-VLCD) 0 0 -1/2 (VDD-VLCD) -1/2 (VDD-VLCD) -(VDD-VLCD) -(VDD-VLCD) Figure 18. LCD waveform in line inversion (1/2bias) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Figure 19. LCD waveform in frame inversion (1/2bias) 17/28 TSZ02201-0A2A0D300100-1-2 18.Dec.2020 Rev.004 BU9796Axxx Series Datasheet MAX 80 segments (SEG20×COM4) ●Example of display data If LCD layout pattern is like as Figure 20, Figure 21, and display pattern is like as Figure . Display data will be shown as follows; COM0 COM1 COM2 COM3 Figure 20. SEG1 SEG3 SEG2 E.g. COM line pattern SEG5 SEG7 SEG4 SEG6 SEG8 SEG9 SEG10 Figure 21. E.g. SEG line pattern Figure 22. E.g. Display pattern S E G 0 S E G 1 S E G 2 S E G 3 S E G 4 S E G 5 S E G 6 S E G 7 S E G 8 S E G 9 S E G 10 S E G 11 S E G 12 S E G 13 S E G 14 S E G 15 S E G 16 S E G 17 S E G 18 S E G 19 COM0 D0 0 1 1 0 1 1 1 1 0 1 0 0 0 0 0 0 0 0 0 0 COM1 D1 0 0 1 1 1 0 0 1 1 1 1 0 0 0 0 0 0 0 0 0 COM2 D2 0 0 0 1 0 1 0 0 1 1 1 0 0 0 0 0 0 0 0 0 COM3 D3 0 0 1 1 0 0 0 1 0 1 0 0 0 0 0 0 0 0 0 0 Address 00h 01h 02h 03h 04h 05h 06h 07h 08h 09h 0Ah 0Bh 0Ch 0Dh 0Eh 0Fh 10h 11h 12h 13h www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 18/28 TSZ02201-0A2A0D300100-1-2 18.Dec.2020 Rev.004 BU9796Axxx Series Datasheet MAX 80 segments (SEG20×COM4) ●Initialize sequence Please follow below sequence after Power-on to set this LSI to initial condition. Power on ↓ STOP condition ↓ START condition ↓ Issue slave address ↓ Execute Software Reset by sending ICSET command. *Each register value and DDRAM address, DDRAM data are random condition after power on till initialize sequence is executed. D7 D6 D5 D4 D3 D2 D1 D0 Descriptions VDD=0→5V (Tr=0.1ms) Initialize IC Stop condition Start condition 1 1 1 1 1 0 0 Issue slave address 1 1 1 0 1 * 1 0 Software Reset 1 1 1 1 0 * 0 1 1 0 1 1 1 1 0 0 1 1 1 0 1 * 0 1 0 0 0 0 0 0 0 0 RAM address set * * * * * * * * * * * * * * * * address address 00h - 01h 02h - 03h * * * * * * * * address 12h - 13h … 0 … ●Start sequence ○Start sequence example1 No. Input 1 Power on ↓ 2 wait 100µs ↓ 3 Stop ↓ 4 Start ↓ 5 Slave address ↓ 6 ICSET ↓ 7 BLKCTL ↓ 8 DISCTL ↓ 9 ICSET ↓ 10 ADSET ↓ 11 Display Data Display Data 12 13 14 15 16 Display Data ↓ Stop ↓ Start ↓ Slave address ↓ MODESET ↓ Stop www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Stop condition Start condition 0 1 1 1 1 1 0 0 Issue slave address 1 1 0 * 1 0 * * Display ON Stop condition 19/28 TSZ02201-0A2A0D300100-1-2 18.Dec.2020 Rev.004 BU9796Axxx Series MAX 80 segments (SEG20×COM4) Datasheet ○Start sequence example2 Initialize Initialize Sequence DISPON DISPON Sequence RAM write RAM write Sequence DISPOFF DISPOFF Sequence This LSI is initialized with Initialize Sequence. And start to display with DISPON Sequence. This LSI will update display data with RAM write Sequence. And stop the display with DISPOFF sequence. If you want to restart to display, This LSI will restart to display with DISPON Sequence. Initialize sequence Input DATA Description D7 D6 D5 D4 D3 D2 D1 D0 Power on wait 100us STOP START Slave address ICSET MODESET ADSET Display data … 0 1 1 1 1 1 0 0 1 1 1 0 1 0 1 0 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 * * * * * * * * Execute Software Reset Display OFF RAM address set Display data STOP Dispon sequence Input DATA Description D7 D6 D5 D4 D3 D2 D1 D0 START Slave address ICSET DISCTL BLKCTL APCTL MODESET 0 1 1 1 1 1 0 0 1 1 1 0 1 0 0 0 1 0 1 1 1 1 1 1 1 1 1 1 0 0 0 0 1 1 1 1 1 1 0 0 1 1 0 0 1 0 0 0 Execute internal OSC mode Set Display Control Set BLKCTL Set APCTL Display ON STOP RAM write sequence DATA Input Description D7 D6 D5 D4 D3 D2 D1 D0 START Slave address ICSET DISCTL BLKCTL APCTL MODESET ADSET Display Data … STOP 0 1 1 1 1 1 0 0 1 1 1 0 1 0 0 0 1 0 1 1 1 1 1 1 1 1 1 1 0 0 0 0 1 1 1 1 1 0 1 0 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 * * * * * * * * Execute internal OSC mode Set Display Control Set BLKCTL Set APCTL Display ON RAM address set Display data Dispoff sequence Input DATA Description D7 D6 D5 D4 D3 D2 D1 D0 START Slave address ICSET MODESET STOP 0 1 1 1 1 1 0 0 1 1 1 0 1 0 0 0 1 1 0 0 0 0 0 0 Execute internal OSC mode Display OFF Abnormal operation may occur in BU9796A due to the effect of noise or other external factor. To avoid this phenomenon, please input command according to sequence described above during initialization, display ON/OFF and refresh of RAM data. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 20/28 TSZ02201-0A2A0D300100-1-2 18.Dec.2020 Rev.004 BU9796Axxx Series Datasheet MAX 80 segments (SEG20×COM4) ●DISCTL setup flow chart START Picture quality Reduce Power consumption or Best picture image quality Power save FR = Normal Mode Line inversion Power save SR = High Power Mode DISCTL setting "10100011" Power save FR = Save mode3 Frame inversion Power save SR = Save mode1 DISCTL setting "10111100" Power save FR = Save mode2 Frame inversion Power save SR = Save mode1 DISCTL setting "10110100" Power save FR = Save mode1 Line inversion Power save SR = Save mode1 DISCTL setting "10101100" Power consumption Power save FR = Save mode3 Frame inversion Power save SR = Save mode1 DISCTL setting "10111100" No Display flicker exist? Yes Power save FR = Save mode2 Frame inversion Power save SR = Save mode1 DISCTL setting "10110100" No Display flicker exist? Yes Power save FR = Save mode1 Frame inversion Power save SR = Save mode1 DISCTL setting "10101100" No Display flicker exist? Yes Power save FR = Normal Frame inversion Power save SR = Save mode1 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 DISCTL setting "10100100" 21/28 TSZ02201-0A2A0D300100-1-2 18.Dec.2020 Rev.004 BU9796Axxx Series Datasheet MAX 80 segments (SEG20×COM4) ●Cautions in Power ON/OFF This device has “P.O.R” (Power-On Reset) circuit and Software Reset function. Please keep the following recommended Power-On conditions in order to power up properly. Please set power up conditions to meet the recommended tR, tF, tOFF, and Vbot spec below in order to ensure P.O.R operation *It has to set TEST1=”L” to be valid in POR circuit. VDD tF tR tOFF Figure 23. Vbot Recommended condition of tR, tF, tOFF, Vbot (Ta=25℃) tR tF tOFF Vbot Less than Less than More than Less than 1ms 1ms 100ms 0.1V Power ON/OFF waveform If it is difficult to meet above conditions, execute the following sequence after Power-On. * It has to keep the following sequence in the case of TEST2=”H”. As POR circuit is invalid status. But it is not able to accept Command input in Power off status, it has to take care that software reset is not perfectly alternative method of POR function. (1) Generate STOP condition Figure 24. Stop Condition (2) Generate START condition. Figure 25. Start Condition (3) Issue slave address (4) Execute Software Reset (ICSET) command www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 22/28 TSZ02201-0A2A0D300100-1-2 18.Dec.2020 Rev.004 BU9796Axxx Series MAX 80 segments (SEG20×COM4) Datasheet ●Operational Notes (1) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) Operating conditions These conditions represent a range within which characteristics can be provided approximately as expected. The electrical characteristics are guaranteed under the conditions of each parameter. (3) Reverse connection of power supply connector The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal. (4) Power supply line Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard, or the digital block power supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. For the GND line, give consideration to design the patterns in a similar manner. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (5) GND voltage Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient. (6) Short circuit between terminals and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down. (7) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. (8) Inspection with set PCB On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress. Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set PCB. (9) Input terminals In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (10) Ground wiring pattern If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well. (11) External capacitor In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. (12) No Connecting input terminals In terms of extremely high impedance of CMOS gate, to open the input terminals causes unstable state. And unstable state brings the inside gate voltage of p-channel or n-channel transistor into active. As a result, battery current may increase. And unstable state can also causes unexpected operation of IC. So unless otherwise specified, input terminals not being used should be connected to the power supply or GND line. (13) Rush current When power is first supplied to the CMOS IC, it is possible that the internal logic may be unstable and rush current may flow instantaneously. Therefore, give special condition to power coupling capacitance, power wiring, width of GND wiring, and routing of connections. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 23/28 TSZ02201-0A2A0D300100-1-2 18.Dec.2020 Rev.004 BU9796Axxx Series Datasheet MAX 80 segments (SEG20×COM4) ●Ordering Information B U 9 7 9 6 A x FS MUV 20 12 x - Package Part Number ●Lineup Segment output x Common output 4 : SSOP-A32 : VQFN024V4040 E2 Packaging and forming specification E2: Embossed tape and reel (SSOP-A32/ VQFN024V4040) Package Orderable Part Number SSOP-A32 Reel of 2000 BU9796AFS-E2 VQFN024V4040 Reel of 2500 BU9796AMUV-E2 Status of this document The Japanese version of this document is formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document formal version takes priority. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 24/28 TSZ02201-0A2A0D300100-1-2 18.Dec.2020 Rev.004 BU9796Axxx Series MAX 80 segments (SEG20×COM4) Datasheet ●Physical Dimension Tape and Reel Information BU9796AFS(SSOP-A32) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 25/28 TSZ02201-0A2A0D300100-1-2 18.Dec.2020 Rev.004 BU9796Axxx Series MAX 80 segments (SEG20×COM4) Datasheet BU9796AMUV(VQFN024V4040) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 26/28 TSZ02201-0A2A0D300100-1-2 18.Dec.2020 Rev.004 BU9796Axxx Series Datasheet MAX 80 segments (SEG20×COM4) ●Marking Diagram SSOP-A32(TOP VIEW) VQFN024V4040 (TOP VIEW) Part Number Marking BU9796A LOT Number Part Number Marking 9 7 9 6 A 1PIN MARK Part Number 1PIN MARK Package Part Number Marking BU9796AFS SSOP-A32 BU9796A BU9796AMUV VQFN024V4040 9796A www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 LOT Number 27/28 TSZ02201-0A2A0D300100-1-2 18.Dec.2020 Rev.004 BU9796Axxx Series Datasheet MAX 80 segments (SEG20×COM4) ●Revision History Date Revision 31. Aug.2012 16. Jul. 2013 13. Jun. 2014 18. Dec. 2020 001 002 003 004 Changes New Release Add description for External Clock and Temperature Characteristics in page 5 Add Frame frequency Calculation at external clock mode in page 14 Updated packages and part numbers in page 28-2, 28-3 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 28/28 TSZ02201-0A2A0D300100-1-2 18.Dec.2020 Rev.004 BU9796Axxx Series Datasheet MAX 80 segments (SEG20×COM4) ●Ordering Information B U 9 7 9 6 A M U V Package MUV: VQFN24V4040A Part Number - Z Production site Z: Added E2 Packaging and forming specification E2: Embossed tape and reel ●Marking Diagram VQFN24V4040A (TOP VIEW) Part Number Marking 9 7 9 6 A LOT Number 1PIN MARK www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 28-2/28 TSZ02201-0A2A0D300100-1-2 18.Dec.2020 Rev.004 BU9796Axxx Series MAX 80 segments (SEG20×COM4) Datasheet Physical Dimension and Packing Information Package Name www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 VQFN24V4040A 28-3/28 TSZ02201-0A2A0D300100-1-2 18.Dec.2020 Rev.004 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001