High Reliability Serial EEPROMs
WL-CSP EEPROM family SPI BUS
BU9832GUL-W
●Description BU9832GUL-W is a serial EEPROM of SPI BUS interface method. ●Features 1) High speed clock action up to 5MHz (Max.) 2) Wait function by HOLD terminal. 3) Part or whole of memory arrays settable as read only memory area by program. 4) 1.8 ~ 5.5V single power source action most suitable for battery use. 5) Page write mode useful for initial value write at factory shipment. 6) For SPI bus interface (CPOL, CPHA) = (0, 0), (1, 1) 7) Auto erase and auto end function at data rewrite. 8) Low current consumption At write action (5V) : 1.5mA (Typ.) At read action (5V) : 1.0mA (Typ.) At standby action (5V) : 0.1µA (Typ.) 9) Address auto increment function at read action 10) Write mistake prevention function Write prohibition at power on. Write prohibition by command code (WRDI). Write prohibition by WP pin. Write prohibition block setting by status registers (BP1, BP0) Write mistake prevention function at low voltage. 11) Data at shipment Memory array: FFh, status register WPEN, BP1, BP0 : 0 12) Data kept for 40 years. 13) Data rewrite up to 1,000,000times. ●Page write Product number BU9832GUL-W ●BU9832GUL-W Type BU9832GUL-W ●Absolute maximum ratings (Ta=25℃) Parameter Impressed voltage Permissible dissipation Storage Temperature range Operating Temperature range Terminal voltage Symbol Vcc Pd Tstg Topr ― Ratings -0.3~+6.5 220(VCSP50L2) *1 -65~+125 -40~+85 -0.3~Vcc+0.3 Unit V mW ℃ ℃ V Capacity 8Kbit Bit format 1K×8 Power source voltage 1.8~5.5V Package VCSP50L2 Number of pages 32 Byte
No.10001EAT16
*1 When using at Ta=25℃ or higher, 220mW to be reduced per 1℃
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1/18
2010.10 - Rev.A
BU9832GUL-W
● Recommended action conditions Parameter Power source voltage Input voltage Symbol Vcc Vin Ratings 1.8~5.5 V 0~Vcc Unit
Technical Note
● Memory cell characteristics (Ta=25℃, Vcc=1.8~5.5V) Limits Parameter Min. Typ. Number of data rewrite times Data hold years
*1 : Not 100% TESTED
*1 *1
Max – –
Unit Times Years
1,000,000 40
– –
● Input / output capacity (Ta=25℃, frequency=5MHz) Limits Parameter Symbol Min. Max Input capacity Output capacity
*1 : Not 100% TESTED
*1 *1
Unit pF pF
Conditions VIN=GND VOUT=GND
CIN COUT
– –
8 8
●Electrical characteristics (Unless otherwise specified, Ta=-40~+85℃, Vcc=1.8~5.5V) Limits Symbol Unit Parameter Min. Typ. Max. “H” input voltage 1 “L” input voltage 1 “L” output voltage 1 “L” output voltage 2 “H” output voltage 1 “H” output voltage 2 Input leak current Output leak current VIH1 VIL1 VOL1 VOL2 VOH1 VOH2 ILI ILO ICC1 Current consumption at write action ICC2 ICC3 ICC4 ICC5 ISB 0.7xVcc -0.3 0 0 Vcc-0.5 Vcc-0.2 -1 -1 – – – – – – – – – – – – – – – – – – – – Vcc+0.3 0.3xVcc 0.4 0.2 Vcc Vcc 1 1 1.0 2.0 3.0 1.5 2.0 2 V V V V V V µA µA mA mA mA mA mA µA
Conditions
1.8≦Vcc≦5.5V 1.8≦Vcc≦5.5V IOL=2.1mA(Vcc=2.5V~5.5V) IOL=150µA(Vcc=1.8V~2.5V) IOH=-0.4mA(Vcc=2.5V~5.5V) IOH=-100µA(Vcc=1.8V~2.5V) VIN=0~Vcc VOUT=0~Vcc, CS =Vcc Vcc=1.8V,fSCK=2MHz, tE/W=5ms Byte write, Page write, Write status register Vcc=2.5V,fSCK=5MHz, tE/W=5ms Byte write, Page write, Write status register Vcc=5.5V,fSCK=5MHz, tE/W=5ms Byte write, Page write, Write status register Vcc=2.5V,fSCK=5MHz Read, Read status register Vcc=5.5V,fSCK=5MHzN Read, Read status register Vcc=5.5V SCK=SI=Vcc or=GND,SO=OPEN
Current consumption at read action Standby current
○This product is not designed for protection against radioactive rays.
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2/18
2010.10 - Rev.A
BU9832GUL-W
●Operating timing characteristics (Ta=-40~+85℃, unless otherwise specified, load capacity CL1=100pF) 1.8≤Vcc≺2.5V Parameter Symbol Min. Typ. Max. SCK frequency SCK high time SCK low time CS high time CS setup time CS hold time SCK setup time SCK hold time SI setup time SI hold time
Data output delay time1
Technical Note
2.5≤Vcc≺5.5V Min. – 85 85 85 90 85 90 90 20 40 – – 0 – 60 40 60 70 – – – – – – – Typ. – – – – – – – – – – – – – – – – – – – – – – – – – Max. 5 – – – – – – – – – 70 55 – 100 – – – – 100 70 1 1 50 50 5
Unit
MHz
fSCK
tSCKWH tSCKWL
– 200 200 200 200 200 200 200 40 50 – – 0 – 120 90 120 140 – – – – – – –
– – – – – – – – – – – – – – – – – – – – – – – – –
2 – – – – – – – – – 150 145 – 250 – – – – 250 150 1 1 100 100 5
ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns µs µs ns ns ms
tCS tCSS tCSH
tSCKS tSCKH
tDIS tDIH tPD1 tPD2 tOH tOZ tHFS tHFH tHRS tHRH tHOZ tHPD tRC tFC tRO tFO tE/W
Data output delay time2 (CL2=30pF) Output hold time Output disable time HOLD setting setup time HOLD setting hold time HOLD release setup time HOLD release hold time Time from HOLD to output High-Z Time from HOLD To output change SCK rise time SCK fall time Output rise time Output fall time Write time
*1 NOT 100% TESTED
*1 *1 *1 *1
●AC measurement conditions Parameter Load capacity 1 Load capacity 2 Input rise time Input fall time Input voltage Input / Output judgment voltage Symbol CL1 CL2 – – – – Limits Min. – – – – Typ. – – – – 0.2Vcc/0.8Vcc 0.3Vcc/0.7Vcc Max. 100 30 50 50 Unit pF pF ns ns V V
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2010.10 - Rev.A
BU9832GUL-W
●Sync data input / output timing
tCS tCSS
Technical Note
CS
tSCKWL tSCKWH tRC tFC
"H" "L"
CS SCK
tHFS
tHFH
tHRS tHRH
tSCKS
SCK
tDIS
tDIS tDIH
SI
n+1 tHOZ High-Z tHPD
n
n-1
SI SO
High-Z
SO
Dn+1
Dn
Dn
Dn-1
Fig.1 Input timing
SI is taken into IC inside in sync with data rise edge of SCK. IInput address and data from the most significant bit MSB.
tCS
HOLD
Fig.3 HOLD timing
CS SCK SI SO
tPD
tCSH tSCKH
tOH
tRO,tFO
tOZ
High-Z
Fig.2 Input / Output timing
SO is output in sync with data fall edge of SCK. Data is output from the most significant bit MSB.
●Block diagram
CS SCK
VOLTAGE INSTRUCTION DECODE CONTROL CLOCK GENERATION WRITE INHIBITION HIGH VOLTAGE GENERATOR DETECTION
SI
HOLD
INSTRUCTION REGISTER ADDRESS REGISTER DATA REGISTER ADDRESS DECODER READ/WRITE AMP
STATUS REGISTER
11bit
11bit
1~64K EEPROM
WPB SO
8bit
8 bit
Fig.4 Block diagram
●Pin assignment and description Land Terminal No. name A1
C B A
C1 B1 A1 A2 C2 C3 B3
Input/ Output Input – Input
Function Write protect input Write status register command is prohibited. All input / output reference voltage, 0V Start bit, ope code, address, and serial data input
WPB GND SI SO SCK CS Vcc HOLD
A2 A3
INDEX post
A3
B1 B3 C1 C2 C3
Output Serial data output Input Input – Input Serial clock input Chip select input Power source to be connected Hold input Command communication may be suspended temporarily (HOLD status)
1
2
3
Fig.5 Pin assignment diagram
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4/18
2010.10 - Rev.A
BU9832GUL-W
●Characteristic data (The following characteristic data are Typ. Values.)
6 5 4 VIH[V] 3 2 1 0 0 1 2 3 Vcc[V] 4 5 6 VIL[V] 6
1
Technical Note
Ta=-40℃ Ta=25℃ Ta=85℃ SPEC
5 4
Ta=-40℃ Ta=25℃ Ta=85℃
VOL[V]
0.8
Ta=-40℃ Ta=25℃ Ta=85℃
0.6
3 2 1 0 0 1 2 3 Vcc[V] 4 5 6
0.4
SPEC
0.2
SPEC
0 0 1 2 3 4 5 6
IOL[mA]
Fig.6 "H" input voltege VIH(CS,SCK,SI,HOLD,WP)
2
Fig.7 "L" input voltage VIL(CS,SCK,SI,HOLD,WP)
1 0.8 0.6 0.4
Fig.8 "L" output voltage VOL-IOL (Vcc=1.8V)
2.6
1.8 VOH[V] VOL[V]
Ta=-40℃ Ta=25℃ Ta=85℃
VOH[V]
2.4
1.6
2.2
SPEC
1.4
Ta=-40℃ Ta=25℃ Ta=85℃
SPEC
0.2 0
2
SPEC
Ta=-40℃ Ta=25℃ Ta=85℃
1.2 0 0.4 IOH[mA] 0.8 1.2
1.8
0
1
2
3 IOL[mA]
4
5
6
0
0.4
0.8
1.2
IOH[mA]
Fig.9 "H" output voltage VOH-IOH (Vcc=1.8V)
1.5
1.5
Fig.10 "L" output voltage VOL-IOL (Vcc=2.5V)
Fig.11 "H" output voltage VOH-IOH (Vcc=2.5V)
4
SPEC
1
ILI[μA] ILO[μA] 1
SPEC
ICC1,2,3[mA]
3
fSK=5MHz DATA=55h
Ta=-40℃ Ta=25℃ Ta=85℃ SPEC
0.5
Ta=-40℃ Ta=25℃ Ta=85℃
Ta=-40℃ Ta=25℃ Ta=85℃
0.5
2
SPEC
1
0 0 1 2 3 Vcc[V] 4 5 6
0 0 1 2 3 Vcc[V] 4 5 6
0 0 1 2 3 Vcc[V] 4 5 6
Fig.12 Input leak current ILI(CS,SCK,SI,HOLD,WP)
2.5 2
ICC4,5[mA] 2.5
Fig.13 Output leak current ILO(SO)
Fig.14 Current consumption at WRITE operation ICC1,2,3 (WRITE,PAGE WRITE,WRSR,fSCK=5MHz)
100
fSK=5MHz DATA=55h SPEC SPEC
ISB[μA]
SPEC
2 fSCK[MHz] 1.5 1 0.5 0 10
1.5 1 0.5 0 0 1 2 3 Vcc[V] 4 5 6
Ta=-40℃ Ta=25℃ Ta=85℃
Ta=-40℃ Ta=25℃ Ta=85℃
SPEC SPEC
1
Ta=-40℃ Ta=25℃ Ta=85℃
0
1
2
3 Vcc[V]
4
5
6
0.1 0 1 2 3 Vcc[V] 4 5 6
Fig.15 Consumption current at READ operation ICC4,5(READ,WRSR,fSK=5MHz)
250
Fig.16 Consumption current at standby operation ISB
250
250
Fig.17 SCK frequency fSCK
SPEC
200 tSCKWH[ns] 150
Ta=-40℃ Ta=25℃ Ta=85℃
tSCKWL[ns]
SPEC
200 150
Ta=-40℃ Ta=25℃ Ta=85℃
tCS[ns]
200
SPEC
Ta=-40℃ Ta=25℃ Ta=85℃
150
SPEC
100 50 0 0 1 2 3 Vcc[V] 4 5 6
SPEC
100 50 0 0 1 2 3 Vcc[V] 4 5 6
SPEC
100
50
0 0 1 2 3 Vcc[V] 4 5 6
Fig.18 tSCK high time tSCKWH
Fig.19 tSCK low time tSCKWL
Fig.20 CS high time tCS
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5/18
2010.10 - Rev.A
BU9832GUL-W
●Characteristic data (The following characteristic data are Typ. Values.)
250 200
250 60
Technical Note
SPEC
150
tCSS[ns]
Ta=-40℃ Ta=25℃ Ta=85℃
tCSH[ns]
200 150
SPEC
Ta=-40℃ Ta=25℃ Ta=85℃ SPEC
tDIS[ns]
40
SPEC SPEC
Ta=-40℃ Ta=25℃ Ta=85℃
20 0
100
SPEC
50 0 -50 0 1 2 3 Vcc[V] 4 5 6
100 50 0 0 1 2 3 Vcc[V] 4 5 6
-20 -40 0 1 2 3 Vcc[V] 4 5 6
Fig.21 CS setup time tCSS
60 50 40 tDIH[ns] tPD1[ns] 30 20 50 10 0 0 1 2 3 Vcc[V] 4 5 6 0 0 1 200
Fig.22 CS hold time tCSH
200
Fig.23 SI setup time tDIS
SPEC SPEC SPEC Ta=-40℃ Ta=25℃ Ta=85℃
150
Ta=-40℃ Ta=25℃ Ta=85℃
tPD2[ns]
150
SPEC
Ta=-40℃ Ta=25℃ Ta=85℃
100
100
SPEC
SPEC
50
0 2 3 Vcc[V] 4 5 6 0 1 2 3 Vcc[V] 4 5 6
Fig.24 SI hold time tDIH
300
Fig.25 Data output delay time tPD1(CL=100pF)
Fig.26 Data output delay time tPD2(CL=30pF)
150
140 250 200 tHFH[ns] tOZ[ns] 150
SPEC
Ta=-40℃ Ta=25℃ Ta=85℃
120 100 80 60 40 20
SPEC
Ta=-40℃ Ta=25℃ Ta=85℃
tHRH[ns]
120 90 60 30 0 -30
SPEC
Ta=-40℃ Ta=25℃ Ta=85℃
SPEC
100 50 0 0 1 2 3 Vcc[V] 4 5 6
SPEC
SPEC
0 -20 0 1 2 3 Vcc[V] 4 5 6
0
1
2
3 Vcc[V]
4
5
6
Fig.27 Output disable time tOZ
300 250 200 tHOZ[ns] tHPD[ns] 80 40 0 -40 0 1 2 3 Vcc[V] 4 5 6 0 150 160
Fig.28 HOLD setting hold time tHFH
120
Fig.29 HOLD release hold time tHRH
SPEC
Ta=-40℃ Ta=25℃ Ta=85℃
120
SPEC SPEC
Ta=-40℃ Ta=25℃ Ta=85℃
tRO[ns]
SPEC
90
Ta=-40℃ Ta=25℃ Ta=85℃
SPEC
100 50 0
CS
60
SPEC
CS
CS
30
0
1
2
3 Vcc[V]
4
5
6
0
1
2
3 Vcc[V]
4
5
6
Fig.30 Time From HOLD to output High-Z tHOZ
120
Fig.31 Time from HOLD to output change tHPD
10
Fig.32 Output rise time tRO
SPEC
90 tFO[ns]
Ta=-40℃ Ta=25℃ Ta=85℃ SPEC
tE/W[ms]
8
Ta=-40℃ Ta=25℃ Ta=85℃ SPEC
6
60
4
30
2
0 0 1 2 3 Vcc[V] 4 5 6
0 0 1 2 3 Vcc[V] 4 5 6
Fig.33 Output fall time tFO
Fig.34 Write cycle time tE/W
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6/18
2010.10 - Rev.A
BU9832GUL-W
Technical Note
●Features ○Status registers This IC has status registers. The status registers are of 8 bits and express the following parameters. BP0 and BP1 can be set by write status register command. These 2 bits are memorized into the EEPROM, therefore are valid even when power source is turned off. Rewrite characteristics and data hold time are same as characteristics of the EEPROM. WEN can be set by write enable command and write disable command. WEN becomes write disable status when power ― source is turned off. R/B is for write confirmation, therefore cannot be set externally. The value of status register can be read by read status command. ●Status registers Product number BU9832GUL-W bit Memory location EEPROM bit 7 WPEN bit 6 0 bit 5 0 Function
WP pin enable / disable designation bit
WPEN=0=invalid WPEN=1=valid
bit 4 0
bit 3 BP1
bit 2 BP0
bit 1 WEN
bit 0 R/B Contents
―
WPEN
This enables / disables the functions of WP pin. This designates the write disable area of EEPROM. Write designation areas of product numbers are shown below.
BP1 BP0
EEPROM EEPROM write disable block designation bit Write and write status register write enable / disable status confirmation bit
WEN=0=prohibited WEN=1=permitted
WEN
Register
―
R/B
Register
Write cycle status (READY / BUSY) status confirmation bit
R / B =0=READY R / B =1=BUSY
●Write disable block setting BP1 0 0 1 1 BP0 0 1 0 1 Write disable block None 300h-3FFh 200h-3FFh 000h-3FFh
○ WP pin By setting WP =LOW, write command is prohibited. As for BU9832GUL-W when WPEN bit is set “1”, the WP pin functions become valid. And the write command to be disabled at this moment is WRSR. However, when write cycle is in execution, no interruption can be made. Product number BU9832GUL-W WRSR Prohibition possible but WPEN bit “1” WRITE Prohibition impossible
○ HOLD pin By HOLD pin, data transfer can be interrupted. When SCK=”1”, by making HOLD from “1” into”0”, data transfer to EEPROM is interrupted. When SCK = “0”, by making HOLD from “0” into “1”, data transfer is restarted.
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7/18
2010.10 - Rev.A
BU9832GUL-W
●Command mode Command WREN WRDI READ WRITE RDSR WRSR Write enable Write disable Read Write Read status register Write status register Contents Write enable command Write disable command Read command Write command Status register read command Status register write command Ope code 0000 0000 0000 0000 0000 0000 0110 0100 0011 0010 0101 0001
Technical Note
●Timing chart 1. Write enable (WREN) / disable (WRDI) cycle ・WREN (WRITE ENABLE): Write enable
―――
CS
CS
SCK
0
0
1
2
3
4
5
6
7
SI
0
0
0
0
1
1
0
High-Z
SO
Fig.35 Write enable command ・WRDI (WRITE DISABLE): Write disable
――― CS
CS
SCK
0
0
1
2
3
4
5
6
7
SI
0
0
0
0
1
0
0
High-Z
SO
Fig.36 Write disable ○This IC has write enable status and write disable status. It is set to write enable status by write enable command, and it is set to write disable status by write disable command. As for these commands, set CS LOW, and then input the respective ope codes. The respective commands accept command at the 7-th clock rise. Even with input over 7 clocks, command becomes valid. When to carry out write and write status register command, it is necessary to set write enable status by the write enable command. If write or write status register command is input in the write disable status, commands are cancelled. And even in the write enable status, once write and write status register command is executed once, it gets in the write disable status. After power on, this IC is in write disable status.
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8/18
2010.10 - Rev.A
BU9832GUL-W
2. Read command (READ)
CS
~~ ~~ ~~ ~~
23 24
Technical Note
~~
SCK
0
1
2
3
4
5
6
7
8
~~
30
~~
~~ * A9 ~~ ~~ A1 A0 ~~ ~~
SI SO
0
0
0
0
0
0
1
1
*
*~ ~ ~~
High-Z
D7 D6
~~
D2
D1
D0
*=Don't Care
Fig.37 Read command By read command, data of EEPROM can be read. As for this command, set CS LOW, then input address after read ope code. EEPROM starts data output of the designated address. Data output is started from SCK fall of 15 clock, and from D7 to D0 sequentially. This IC has increment read function. After output of data for 1 byte (8bits), by continuing input of SCK, data of the next address can be read. Increment read can read all the addresses of EEPROM. After reading data of the most significant address, by continuing increment read, data of the most insignificant address is read. 3. Write command (WRITE)
CS SCK SI SO
0 1 2 3 4 5 6 7 8
~~
~~
~~ ~~
~~
~~ ~~
23
24
30
31
~~
A1 A0 D7 D6
0
0
0
0
0
0
1
0
*
*
~ ~* ~~
A9
~~
~~ ~~
D2
D1
D0
High-Z
*=Don't Care
Fig.38 Write command By write command, data of EEPROM can be written. As for this command, set CS LOW, then input address and data after write ope code. Then, by making CS HIGH, the EEPROM starts writing. The write time of EEPROM requires time of tE/W (Max 5ms). During tE/W, other than status read command is not accepted. Start CS after taking the last data (D0), and before the next SCK clock starts. At other timing, write command is not executed, and this write command is cancelled. This IC has page write function, and after input of data for 1 byte (8 bits), by continuing data input without starting CS , data up to 16 bytes can be written for one tE/W. In page write, the insignificant 4 bit of the designated address is incremented internally at every time when data of 1 byte is input and data is written to respective addresses. When data of the maximum bytes or higher is input, address rolls over, and previously input data is overwritten.
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2010.10 - Rev.A
BU9832GUL-W
Technical Note
4. Status register write / read command
CS S CK SI SO
0 0 1 2 3 4 5 6 7
bit 7
8
9
bit 6
10
bit 5
11
bi t4
12
bit 3
13
bit 2
14
bit 1
15
bit 0
0
0
0
0
0
0
1
WP E N
*
*
*
BP1
BP0
*
*
High-Z *=Don't care
Fig.39 Status register write command
*1 Write status register command can write status register data. The data can be written by this command are 2 bits , that is, BP1 (bit3) and BP0 (bit2) among 8 bits of status register. By BP1 and BP0, write disable block of EEPROM can be set. As for this command, set CS LOW, and input ope code of write status register, and input data. Then, by making CS HIGH, EEPROM starts writing. Write time requires time of tE/W as same as write. As for CS rise, start CS after taking the last data bit (bit0), and before the next SCK clock starts. At other timing, command is cancelled. Write disable block is determined by BP1 and BP0, and the block can be selected from 1/4 of memory array, 1/2, and entire memory array. (Refer to the write disable block setting table.) To the write disabled block, write cannot be made, and only read can be made.
*1
3bits including 1WPEN (bit7)
CS
SCK
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
SI
0
0
0
0
0
1
0
1 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
SO
High-Z
WPEN
0
0
0
BP1 BP0
W EN R/B
Fig.40 Status register read command
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10/18
2010.10 - Rev.A
BU9832GUL-W
Technical Note
●At standby ○Current at standby Set CS “H”, and be sure to set SCK, SI, WP , HOLD input “L” or “H”. Do not input intermediate electric potantial. ○Timing As shown in Fig.41, at standby, when SCK is “H”, even if CS is fallen, SI status is not read at fall edge. SI status is read at SCK rise edge after fall of CS . At standby and at power ON/OFF, set CS “H” status.
Even if CS is fallen at SCK=SI=”H”, SI status is not read at that edge. CS
――― ―――
Command start here. SI is read.
SCK
0
1
2
SI
Fig.41 Operating timing ● WP cancel valid area WP is normally fixed to “H” or “L” for use, but when WP is controlled so as to cancel write status register command and write command, pay attention to the following WP valid timing. While write or write status register command is executed, by setting WP = “L” in cancel valid area, command can be cancelled. The area from command ope code before CS rise at internal automatic write start becomes the cancel valid area. However, once write is started, any input cannot be cancelled. WP input becomes Don’t Care, and cancellation becomes invalid.
S CK
15
16
CS O pe Code W P cancel invalid area Data tE/W Data write time W P cancel invalid area
Fig.42
WP valid timing (WRSR)
O pe Code
A d d res s WP cancel invalid area
D a ta
tE /W D a ta wr it e tim e W P cancel invalid area
Fig.43
WP valid timing (WRITE)
● HOLD pin By HOLD pin, command communication can be stopped temporarily (HOLD status). The HOLD pin carries out command communications normally when it is HIGH. To get in HOLD status, at command communication, when SCK=LOW, set the HOLD pin LOW. At HOLD status, SCK and SI become Don’t Care, and SO becomes high impedance (High-Z). To release the HOLD status, set the HOLD pin HIGH when SCK=LOW. After that, communication can be restarted from the point before the HOLD status. For example, when HOLD status is made after A5 address input at read, after release of HOLD status, by starting A4 address input, read can be restarted. When in HOLD status, leave CS LOW. When it is set CS =HIGH in HOLD status, the IC is reset, therefore communication after that cannot be restarted.
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11/18
2010.10 - Rev.A
BU9832GUL-W
●Method to cancel each command ○READ ・Method to cancel : cancel by CS = “H”
Technical Note
Ope code 8 bits
Address 8 bits
Data 8 bits
Cancel available in all areas of read mode
Fig.44 READ cancel valid timing ○RDSR ・Method to cancel : cancel by CS = “H”
Ope code 8 bits Data 8 bits
Cancel available in all areas of rdsr mode
Fig.45 RDSR cancel valid timing ○WRITE, PAGE WRITE a: Ope code, address input area. Cancellation is available by CS =”H” b: Data input area (D7~D1 input area) Cancellation is available by CS =”H” c: Data input area (D0 area) When CS is started, write starts. After CS rise, cancellation cannot be made by any means. d: tE/W area. Cancellation is available by CS = “H”. However, when write starts ( CS is started) in the area c, cancellation cannot be made by any means. And by inputting on SCK clock, cancellation cannot be made. In page write mode, there is write enable area at every 8 clocks.
Note 1) Note 2)
Ope code 8bits
a Address Data(n) tE/W
8bits
8bits
b c d
Fig.46 WRITE cancel valid timing
SCK D7 D6 D5 D4 b D3 D2 D1 D0 c
SI
If Vcc is made OFF during write execution, designated address data is not guaranteed, therefore write it once again. If CS is started at the same timing as that of the SCK rise, write execution / cancel becomes unstable,therefore, it is necessary to fall in SCK = “L” area. As for SCK rise, assure timing of tCSS / tCSH or higher.
SCK 14 15 16 17
○WRSR a: From ope code to 15 rise. Cancel by CS =”H”. b: From 15 clock rise to 16 clock rise (write enable area). When CS is started, write starts. After CS rise, cancellation cannot be made by any means. c: After 16 clock rise. Cancel by CS =”H”. However, when write starts ( CS is started) in the area b, cancellation cannot be made by any means. And, by inputting on SCK clock, cancellation cannot be made.
Note 1) Note 2)
SI
D1 a
D0 b c tE/W
Ope code 8 bits a
Address 8 bits
c b
Fig.47 WRSR cancel valid timing
If Vcc is made OFF during write execution, designated address data is not guaranteed, therefore write it once again If CS is started at the same timing as that of the SCK rise, write execution / cancel becomes unstable, therefore, it is necessary to fall in SCK = “L” area. As for SCK rise, assure timing of tCSS / tCSH or higher.
○WREN/WRDI a: From ope code to clock rise, cancel by CS = “H”. b: Cancellation is not available when CS is started after 7 clock.
SCK
7 a
8 b
9
Ope code 8 bits a b
Fig.48 WREN/WRDI cancel valid timing
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12/18
2010.10 - Rev.A
BU9832GUL-W
Technical Note
●High speed operation In order to realize stable high speed operations, pay attention to the following input / output pin conditions. ○Input pin pull up, pull down resistance When to attach pull up, pull down resistance to EEPROM input pin, select an appropriate value for the microcontroller VOL, IOL from VIL characteristics of this IC. ○Pull up resistance RPU≥ VOLM≤ VCC-VOLM IOLM VILE
・・・① ・・・②
Microcontroller VOLM “L” output
IOLM
RPU
EEPROM VILE “L” input
Example) When Vcc=5V, VILM=1.5V, VOLM=0.4V, IOLM=2mA, from the equation ①, RPU≥ ∴RPU≥ 5-0.4 2×10
-3
Fig.49 Pull up resistance
2.3[kΩ]
With the value of RPU to satisfy the above equation, VOLM becomes 0.4V or higher, and with VILE (=1.5V), the equation ② is also satisfied. ・VILM :EEPROM VIH specifications ・VOLM :Microcontroller VOL specifications ・IOLM :Microcontroller IOL specifications And, in order to prevent malfunction, mistake write at power ON/OFF, be sure to make CS pull up. ○Pull down resistance RPD≥ VOHM≥
IOHM
VOHM IOHM VIHE
EEPROM VOHM VIHE
・・・③ ・・・④
Fig.50 Pull down resistance
Example) When VCC=5V, VOHM=VCC-0.5V, IOHM=0.4mA, VIHM=VCC×0.7V, from the equation③, RPD≥ ∴RPU≥ 5-0.5 0.4×10-3 11.3[kΩ]
Further, by amplitude VIHE, VILE of signal input to EEPROM, operation speed changes. By inputting signal of amplitude of VCC / GND level to input, more stable high speed operations can be realized. On the contrary, when amplitude of 0.8VCC ж1 / 0.2Vcc is input, operation speed becomes slow. In order to realize more stable high speed operation, it is recommended to make the values of RPU, RPD as large as possible, and make the amplitude of signal input to EEPROM close to the amplitude of VCC / GND level. (ж1 At this moment, operating timing guaranteed value is guaranteed.)
tPD_VIL characteristics 80 Spec 70 60 50 tPD[ns] 40 30 20 10 0 0 0.2 0.4 VIL[V] 0.6 0.8 1
Vcc=2.5V Ta=25℃ VIH=Vcc CL =100pF
Fig.51 VIL dependency of data output delay time
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13/18
2010.10 - Rev.A
BU9832GUL-W
Technical Note
○SO load capacity condition Load capacity of SO output pin affects upon delay characteristic of SO output. (Data output delay time, time from HOLD to High-Z) In order to make output delay characteristic into higher speed, make SO load capacity small. In concrete, “Do not connect many devices to SO bus”, “Make the wire between the controller and EEPROM short”, and so forth.
tPD-CL characteristics 80 Vcc=2.5V Ta=25℃ 70 60 tPD[ns] 50 40 30 20 0 20 40 60 CL[pF] 80 100 120 VIH/VIL=0.8Vcc/0.2Vcc Spec
EEPROM
Spec
SO
CL
Fig.52 SO load dependency of data output delay time ○Other cautions Make the wire length from the microcontroller to EEPROM input signal same length, in order to prevent setup / hold violation to EEPROM, owing to difference of wire length of each input.
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14/18
2010.10 - Rev.A
BU9832GUL-W
●Equivalent circuit ○Output circuit
Technical Note
SO
OEint.
Fig.53 SO output equivalent circuit ○Input circuit
RESETint.
―――
CS
Fig.54 CS input equivalent circuit
SCK SI
Fig.55 SCK input equivalent circuit
Fig.56 SI input equivalent circuit
――――――
HOLD
―――
WP
Fig.57 HOLD input equivalent circuit
Fig.58 WP input equivalent circuit
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15/18
2010.10 - Rev.A
BU9832GUL-W
Technical Note
●Notes on power ON/OFF ○At power ON/OFF, set CS “H” (=Vcc). When CS is “L”, this IC gets in input accept status (active). If power is turned on in this status, noises and the likes may cause malfunction, mistake write or so. To prevent these, at power ON, set CS “H”. (When CS is in “H” status, all inputs are canceled.)
Vcc Vcc GND Vcc
CS
GND Good example Bad example
Fig.59 CS timing at power ON/OFF (Good example) CS terminal is pulled up to Vcc. At power OFF, take 10ms or higher before supply. If power is turned on without observing this condition, the IC internal circuit may not be reset, which please note. CS terminal is “L” at power ON/OFF. In this case, CS always becomes “L” (active status), and EEPROM may have malfunction, mistake write owing to noises and the likes. Even when CS input is High-Z, the status becomes like this case, which please note.
(Bad example)
○P.O.R. circuit This IC has a P.O.R. (Power On Reset) circuit as mistake write countermeasure. After P.O.R. action, it gets in write disable status. The P.O.R. circuit is valid only when power is ON, and does not work when power is OFF. When power is ON, if the recommended conditions of the following tR, tOFF, and Vbot are not satisfied, it may become write enable status owing to noises and the likes.
Vcc tR
Recommended conditions of tR, tOFF, Vbot
tR
tOFF 0 Vbot
tOFF 10ms or higher 10ms or higher
Vbot 0.3V or below 0.2V or below
10ms or below 100ms or below
Fig.60 Rise waveform
●Noise countermeasures ○Vcc noise (bypass capacitor) When noise or surge gets in the power source line, malfunction may occur, therefore, for removing these, it is recommended to attach a bypass capacitor (0.1µF) between IC Vcc and GND. At that moment, attach it as close to IC as possible. And, it is also recommended to attach a bypass capacitor between board Vcc and GND. ○SCK noise When the rise time (tR) of SCK is long, and a certain degree or more of noise exists, malfunction may occur owing to clock bit displacement. To avoid this, a Schmitt trigger circuit is built in SCK input. The hysterisis width of this circuit is set about 0.2V, if noises exist at SCK input, set the noise amplitude 0.2Vp-p or below. And it is recommended to set the rise time (tR) of SCK 100ns or below. In the case when the rise time is 100ns or higher, take sufficient noise countermeasures. Make the clock rise, fall time as small as possible. ○ WP noise During execution of write status register command, if there exist noises on WP pin, mistake in recognition may occur and forcible cancellation may result, which please note. To avoid this, a Schmitt trigger circuit is built in WP input. In the same manner, a Schmitt trigger circuit is built in SI input, SI input and HOLD input too.
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16/18
2010.10 - Rev.A
BU9832GUL-W
Technical Note
●Notes for use (1) Described numeric values and data are design representative values, and the values are not guaranteed. (2) We believe that application circuit examples are recommendable, however, in actual use, confirm characteristics further sufficiently. In the case of use by changing the fixed number of external parts, make your decision with sufficient margin in consideration of static characteristics and transition characteristics and fluctuations of external parts and our LSI. (3) Absolute maximum ratings If the absolute maximum ratings such as impressed voltage and operating temperature range and so forth are exceeded, LSI may be destructed. Do not impress voltage and temperature exceeding the absolute maximum ratings. In the case of fear exceeding the absolute maximum ratings, take physical safety countermeasures such as fuses, and see to it that conditions exceeding the absolute maximum ratings should not be impressed to LSI. (4) GND electric potential Set the voltage of GND terminal lowest at any action condition. Make sure that each terminal voltage is higher than that of GND terminal. (5) Heat design In consideration of permissible dissipation in actual use condition, carry out heat design with sufficient margin. (6) Terminal to terminal short circuit and wrong packaging When to package LSI onto a board, pay sufficient attention to LSI direction and displacement. Wrong packaging may destruct LSI. And in the case of short circuit between LSI terminals and terminals and power source, terminal and GND owing to foreign matter, LSI may be destructed. (7) Use in a strong electromagnetic field may cause malfunction, therefore, evaluate design sufficiently.
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17/18
2010.10 - Rev.A
BU9832GUL-W
●Ordering part number
Technical Note
B
Part No.
U
9
Part No.
8
3
2
G
U
L
-W
W-CELL
E
2
Package GUL : VCSP50L2
Packaging and forming specification E2: Embossed tape and reel
VCSP50L2(BU9832GUL-W)
1PIN MARK
1.85±0.1
Tape Quantity
0.55MAX 0.1±0.05
Embossed carrier tape 3000pcs E2
The direction is the 1pin of product is at the upper left when you hold
2.09±0.1
S
Direction of feed
( reel on the left hand and you pull out the tape on the right hand
)
0.05 A B A (φ0.15)INDEX POST
C B A 1 2 3
P=0.5×2
B
0.425±0.1
8- φ 0.25± 0.05
0.08 S
0.545±0.1
P=0.5×2
1pin
Direction of feed
(Unit : mm)
Reel
∗ Order quantity needs to be multiple of the minimum quantity.
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18/18
2010.10 - Rev.A
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.
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R1010A