BU99022NUX-3TR

Datasheet I2C BUS 2kbit + 2kbit 2ports serial EEPROM BU99022NUX-3 ●Description 2 BU99022NUX-3 series is 2kbit + 2kbit 2ports serial EEPROM of I C BUS interface method. ●FEATURES ・ 2kbit + 2kbit 2ports serial EEPROM ・ Other devices than EEPROM can be connected to the same port, saving microcontroller port ・ 1.7V～5.5V single power source action most suitable for battery use ・ 1.7V～5.5Ｖwide limit of action voltage, possible FAST MODE 400KHz action ・ Page write mode useful for initial value write at factory shipment ・ Auto erase and auto end function at data write ・ Low current consumption ・ Write mistake prevention function Write (write protect) function added (only port2 EEPROM) Write mistake prevention function at low voltage ・ VSON008X2030 small package ・ Data rewrite up to 1,000,000 times ・ Data kept for 40 years ・ Noise filter built in SCL / SDA terminal ・ Shipment data all address FFh www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 1/23 TSZ02201-0R2R0G100010-1-2 2011.12.19 Rev.001 Datasheet BU99022NUX-3 ●Absolute maximum rating (Ta=25℃) ●Memory cell characteristics (Ta=25℃, Vcc=1.7～5.5V) Parameter symbol Limits Unit Impressed voltage Permissible dissipation Storage temperature range VCC -0.3～+6.5 V Pd 300 *1 mW Tstg －65～+150 ℃ ction temperature range Topr －40～+85 ℃ Terminal voltage ‐ －0.3～Vcc+1.0*2 V Junction Temperature *3 Tjmax 150 ℃ Parameter Write/Erase cycle *1 Data retention Unit Limits *1 Min. Typ. Max 1,000,000 － － cycles － Years － 40 *1 Not 100% TESTED ●Recommended operating condition Parameter *1 When using at Ta=25℃ or higher, 3.0mW to be reduced per 1℃. *2 The Max value of Terminal Voltage is not over 6.5V. When the pulse width is 50ns or less, the Min value of Terminal Voltage is not under -0.8V. *3 Junction temperature at the storage condition. Symbol Limits Unit Power source voltage Vcc 1.7～5.5 V Input voltage VIN 0～Vcc ●DC operating characteristics (Unless otherwise specified, Ta=－40～+85℃、VCC=1.7～5.5V) Specification Parameter Symbol Unit Min. Typ. Max. － Vcc+1.0 V － 0.3Vcc V Test Condition “H”input voltage1 VIH1 0.7Vcc “L”input voltage1 VIL1 －0.3 “L”output voltage1 VOL1 － － 0.4 V IOL=3.0mA, 2.5V≦Vcc≦5.5V (SDA1,SDA2) “L”output voltage2 VOL2 － － 0.2 V IOL=0.7mA, 1.7V≦Vcc＜2.5V (SDA1,SDA2) Input leak current ILI －1 － 1 μA VIN=0～Vcc Output leak current ILO －1 － 1 μA VOUT=0～Vcc (SDA1,SDA2) ICCw1 － － 2.0 *1 Vcc1=5.5V,fSCL=400kHz, tWR=5ms, Bytewrite Pagewrite mA ICCw2 － － 2.0 Vcc2=5.5V,fSCL=400kHz, tWR=5ms, Bytewrite Pagewrite ICCr1 － － 0.5 Vcc1=5.5V,fSCL=400kHz Random read, current read, sequential read Operating Current mA ICCr2 － － 0.5 ISB1 － － 2.0 Standby current Vcc2=5.5V,fSCL=400kHz Random read, current read, sequential read Vcc1=5.5V, SDA1・SCL1=Vcc μA ISB2 － － Vcc2=5.5V, SDA2・SCL2=Vcc WP2=GND 2.0 ○This product is not designed for protection against radio active rays. *1 When the pulse width is 50ns or less, it is -0.8V. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 2/23 TSZ02201-0R2R0G100010-1-2 2011.12.19 Rev.001 Datasheet BU99022NUX-3 ●AC operating characteristic (Unless otherwise specified, Ta=－40～+85℃, VCC=1.7～5.5V) Limit Parameter Symbol Unit Min. Typ. Max. SCL frequency fSCL － － 400 kHz Data clock “HIGH“ time tHIGH 0.6 － － μs Data clock “LOW“ time tLOW 1.2 － － μs tR － － 1.0 μs tF － － 1.0 μs Start condition hold time tHD:STA 0.6 － － μs Start condition setup time tSU:STA 0.6 － － μs Input data hold time tHD:DAT 0 － － ns Input data setup time tSU:DAT 100 － － ns Output data delay time tPD 0.1 － 0.9 μs Output data hold time tDH 0.1 － － μs *1*2 SDA, SCL rise time SDA, SCL fall time *1*2 tSU:STO 0.6 － － μs Bus release time before transfer start tBUF 1.2 － － μs Internal write cycle time tWR － － 5 ms tI － － 0.1 μs WP hold time tHD:WP 1.0 － － μs WP setup time tSU:WP 0.1 － － μs WP valid time tHIGH:WP 1.0 － － μs Stop condition setup time Noise removal valid period (SDA, SCL terminal) *1 Not 100% TESTED. *2 It is recommended that tR/tF is less than 300ns fundamentally. When tR/tF is more than 300ns and less than 1us, it is possible that other device on the same bus are entered unintended start/stop condition. For prevent it, note in designing the AC timing. Condition Input data level:VIL=0.2×Vcc VIH=0.8×Vcc Input data timing refarence level: 0.3×Vcc/0.7×Vcc Output data timing refarence level: 0.3×Vcc/0.7×Vcc Rise/Fall time : ≦20ns ●Sync data input / output timing tR tF SCL tHIGH 70% 70% 70% 30% 70% 70% 30% 30% 30% tLOW tHD:DAT tSU:DAT 70% 70% SDA (input) 70% 30% tPD tBUF DATA(n) DATA(1) 70% SDA (output) D0 D1 70% ACK ACK tWR tDH 70% 70% 30% 30% 30% 30% tSU:WP ○Input read at the rise edge of SCL ○Data output in sync with the fall of SCL tHD:WP STOP CONDITION Fig.2 WP timing at write execution Fig.1-(a) Sync data input / output timing 70% 70% 70% tSU:STA DATA(n) DATA(1) tHD:STA D1 tSU:STO D0 ACK ACK 70% 30% 30% 70% ACK Fig.3 WP timing at write cancel 70% 70% write data (n-th address) 70% STOP CONDITION START CONDITION Fig.1-(b) Start-stop bit timing D0 70% tWR tHIGH:WP tWR STOP CONDITION START CONDITION Fig.1-(c) Write cycle timing www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 3/23 TSZ02201-0R2R0G100010-1-2 2011.12.19 Rev.001 Datasheet BU99022NUX-3 ●Block diagram Vcc1 1 2Kbit EEPROM array 8 Vcc2 2Kbit EEPROM array 8bit GND 2 8bit Data register Word Address register start 8bit Address decorder Address decorder stop stop SCL1 3 Vcc level detect Word Address register Data register 7 WP2 start 6 SCL2 Control logic Control logic SDA1 4 8bit High voltage gen. High voltage gen. 5 SDA2 Vcc level detect Port2 EEPROM Port1 EEPROM Fig.4 Block Diagram ●Pin assignment and description Function Pin No. Pin Name Input/output 1 Vcc1 － Connect the power source 2 GND － Reference voltage of all input/output,0V 3 SCL1 Input 4 SDA1 input/output Serial data input /serial data output for port1 EEPROM 5 SDA2 input/output Serial data input /serial data output for port2 EEPROM 6 SCL2 input Serial clock input for port2 EEPROM 7 WP2 input Write protect terminal for port2 EEPROM 8 Vcc2 － Serial clock input for port1 Connect the power source ●Operating condition of port1 and port2 EEPROM Vcc1 Vcc2 port1 port2 0V 0V × × 0V Vcc × ○ 0V open × × Vcc 0V ○ × Vcc Vcc ○ ○ Vcc open ○ × open 0V × × open Vcc × ○ open open × × ○ : operating possible ×: operating impossible www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 4/23 TSZ02201-0R2R0G100010-1-2 2011.12.19 Rev.001 Datasheet BU99022NUX-3 ●Characteristic data (The following values are Typ. ones.) 6 6 5 Ta=-40℃ Ta=25℃ Ta=85℃ 4 L INPUT VOLTAGE : VIL1(V) 4 H INPUT VOLTAGE : VIH1(V) 5 Ta=-40℃ Ta=25℃ Ta=85℃ 3 SPEC 2 1 3 2 1 SPE SPEC C 0 0 0 1 2 3 4 5 0 6 1 SUPPLY VOLTAGE : Vcc(V) 5 6 Fig.6　'L' input voltage VIL1 (SCL1,SCL2,SDA1,SDA2,WP2) Fig.5　'H' input voltage VIH1 (SCL1,SCL2,SDA1,SDA2,WP2) 1 1 Ta=-40℃ Ta=25℃ Ta=85℃ 0.6 0.4 SPEC SPE C 0.2 Ta=-40℃ Ta=25℃ Ta=85℃ 0.8 L OUTPUT VOLTAGE : VOL2(V) 0.8 L OUTPUT VOLTAGE : VOL1(V) 2 3 4 SUPPLY VOLTAGE : Vcc(V) 0 0.6 SPEC 0.4 0.2 0 0 1 2 3 4 5 6 0 2 3 4 5 6 Fig.8　'L' output voltage VOL2-IOL(Vcc=2.5V) Fig.7 'L' output voltage VOL1-IOL(Vcc=1.7V) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 1 L OUTPUT CURRENT : IOL(mA) L OUTPUT CURRENT : IOL(mA) 5/23 TSZ02201-0R2R0G100010-1-2 2011.12.19 Rev.001 Datasheet BU99022NUX-3 ●Characteristic data (The following values are Typ. ones.) 1.2 1.2 SPEC SPEC 1 0.8 OUTPUT LEAK CURRENT : I LO(uA) INPUT LEAK CURRENT : ILI(uA) 1 Ta=-40℃ Ta=25℃ Ta=85℃ 0.6 0.4 0.2 0 0 1 2 3 4 5 Ta=-40℃ Ta=25℃ Ta=85℃ 0.8 0.6 0.4 0.2 0 6 0 SUPPLYVOLTAGE : Vcc(V) 2 3 4 5 6 SUPPLY VOLTAGE : Vcc(V) Fig.9　Input leak current ILI (SCL1,SCL2,SDA1,SDA2,WP2) Fig.10　Output leak current ILO (SDA1,SDA2) 0.6 2.5 SPEC 2 Ta=-40℃ Ta=25℃ Ta=85℃ 1.5 SPEC 0.5 CURRENT CONSUMPTION AT READING : Icc2(mA) CURRENT CONSUMPTION AT WRITING : Icc1(mA) 1 1 0.5 Ta=-40℃ Ta=25℃ Ta=85℃ 0.4 0.3 0.2 0.1 0 0 0 1 2 3 4 5 0 6 2 3 4 5 6 Fig.12 Current consumption at READ operation ICC2 (fscl=400kHz) (fscl=400kHz BR24T01/02/04/08/16/32/64/128/256-W) Fig.11 Current consumption at WRITE operation ICC1 (fscl=400kHz ) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 1 SUPPLY VOLTAGE : Vcc(V) SUPPLY VOLTAGE : Vcc(V) 6/23 TSZ02201-0R2R0G100010-1-2 2011.12.19 Rev.001 Datasheet BU99022NUX-3 ●Characteristic data (The following values are Typ. ones.) 10000 2.5 SPEC 1000 SCL FREQUENCY : fｓｃｌ（ｋHZ） STANBY CURRENT : ISB(uA) 2 Ta=-40℃ Ta=25℃ Ta=85℃ 1.5 1 0.5 SPEC 100 Ta=-40℃ Ta=25℃ Ta=85℃ 10 1 0 0.1 0 1 2 3 4 SUPPLY VOLTAGE : Vcc(V) 5 6 0 1 Fig.13　Stanby operation ISB 3 4 5 6 5 6 Fig.14　SCL frequency fSCL 1 1.5 Ta=-40℃ Ta=25℃ Ta=85℃ SPEC 1.2 ＤＡＴＡ CLK L TIME : tLOW(us) 0.8 DATA CLK H TIME : tHIGH(us) 2 SUPPLY VOLTAGE : Vcc(V) SPEC 0.6 0.4 0.2 Ta=-40℃ Ta=25℃ Ta=85℃ 0.9 0.6 0.3 0 0 1 2 3 4 5 0 6 0 SUPPLY VOLTAGE : Vcc(V) 2 3 4 SUPPLY VOLTAGE : Vcc（V） Fig.16 Data clock Low Period　tLOW Fig.15 Data clock High Period tHIGH www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 1 7/23 TSZ02201-0R2R0G100010-1-2 2011.12.19 Rev.001 Datasheet BU99022NUX-3 ●Characteristic data (The following values are Typ. ones.) 1.1 Ta=-40℃ Ta=25℃ Ta=85℃ 0.9 0.8 START CONDITION SET UP TIME : tSU:STA(us) START CONDITION HOLD TIME : tHD : STA(us) 1 SPEC 0.6 Ta=-40℃ Ta=25℃ Ta=85℃ 0.4 0.2 0.7 SPEC 0.5 0.3 0.1 -0.1 0 0 1 2 3 4 5 6 0 1 2 4 5 6 Fig.18　Start Condition Setup Time　tSU : STA Fig.17 Start Condition Hold Time tHD : STA 50 50 SPEC SPEC 0 INPUT DATA HOLD TIME : tHD :DAT(ns) INPUT DATA HOLD TIME : tHD: STA(ns) 3 SUPPLY VOLTAGE : Vcc(V) SUPPLY VOLTAGE : Vcc(V) -50 Ta=-40℃ Ta=25℃ Ta=85℃ -100 -150 -200 0 -50 Ta=-40℃ Ta=25℃ Ta=85℃ -100 -150 -200 0 1 2 3 4 5 6 0 2 3 4 5 6 Fig.20　Input Data Hold Time ｔHD : DAT(LOW） Fig.19　Input Data Hold Time tHD : DAT（HIGH） www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 1 SUPPLY VOLTAGE : Vcc(V) SUPPLY VOLTAGE : Vcc(V) 8/23 TSZ02201-0R2R0G100010-1-2 2011.12.19 Rev.001 Datasheet BU99022NUX-3 300 300 200 200 INPUT DATA SET UP TIME : tSU : DAT(ns) INPUT DATA SET UP TIME : tSU: DAT(ns) ●Characteristic data (The following values are Typ. ones.) SPEC 100 0 Ta=-40℃ Ta=25℃ Ta=85℃ -100 -200 0 1 2 3 4 5 SPEC 100 0 Ta=-40℃ Ta=25℃ Ta=85℃ -100 -200 6 0 1 2 SUPPLY VOLTAGE : Vcc(V) Fig.21　Input Data Setup Time ｔSU: DAT(HIGH) 4 5 6 Fig.22　Input Data setup time tSU : DAT(LOW) 2.0 2.0 Ta=-40℃ Ta=25℃ Ta=85℃ 1.5 OUTPUT DATA DELAY TIME : tPD(us) OUTPUT DATA DELAY TIME : tPD(us) 3 SUPPLY VOLTAGE : Vcc(V) 1.0 SPE SPEC C 0.5 Ta=-40℃ Ta=25℃ Ta=85℃ 1.5 1.0 SPEC 0.5 SPEC SPE SPEC 0.0 0.0 0 1 2 3 4 5 6 0 SUPPLY VOLTAGE : Vcc(V) 2 3 4 5 6 SUPPLY VOLTAGE : Vcc(V) Fig.24 'H' Data output delay time ｔPD1 Fig..23　'L' Data output delay time tPD0 www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 1 9/23 TSZ02201-0R2R0G100010-1-2 2011.12.19 Rev.001 Datasheet BU99022NUX-3 ●Characteristic data (The following values are Typ. ones.) 2 Ta=-40℃ Ta=25℃ Ta=85℃ 1.5 BUS OPEN TIME BEFORE TRANSMISSION : tBUF(us) STOP CONDITION SETUP TIME : tsu:STO(us) 2.0 1.0 SPEC 0.5 0.0 -0.5 1.5 SPEC 1 Ta=-40℃ Ta=25℃ Ta=85℃ 0.5 0 0 1 2 3 4 SUPPLY VOLTAGE : Vcc(V) 5 6 0 1 2 3 4 5 6 SUPPLY VOLTAGE : Vcc(V) Fig.25 Stop condition setup time 　ｔSU:STO Fig.26 BUS open time before transmission　ｔBUF 0.6 6 SPEC 0.5 NOISE REDUCTION EFECTIVE TIME : tl(SCL H) (us) 5 INTERNAL WRITING CYCLE TIME : tWR(ms) 4 3 2 Ta=-40℃ Ta=25℃ Ta=85℃ 1 Ta=-40℃ Ta=25℃ Ta=85℃ 0.4 0.3 0.2 0.1 SPEC 0 0 0 1 2 3 4 5 6 0 SUPPLY VOLTAGE : Vcc(V) 2 3 4 5 6 SUPPLY VOLTAGE : Vcc(V) Fig.27 Internal writing cycle time　ｔWR Fig.28 Noise reduction efection time tl（SCL H） www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 1 10/23 TSZ02201-0R2R0G100010-1-2 2011.12.19 Rev.001 Datasheet BU99022NUX-3 0.6 0.6 0.5 0.5 Ta=-40℃ Ta=25℃ Ta=85℃ 0.4 NOISE REDUCTION EFECTIVE TIME : tl(SDA H)(us) NOISE REDUCTION EFECTIVE TIME : tl(SCL L)(us) ●Characteristic data (The following values are Typ. ones.) 0.3 0.2 SPEC Ta=-40℃ Ta=25℃ Ta=85℃ 0.4 0.3 0.2 SPEC 0.1 0.1 0 0 0 1 2 3 4 5 0 6 1 3 4 5 6 Fig.30　Noise resuction efecctive time　ｔｌ（SDA H） Fig.29　Noise reduction efective time　tl（SCL L） 0.6 1.2 0.5 1.0 SPEC Ta=-40℃ Ta=25℃ Ta=85℃ 0.4 WP DATA HOLD TIME : tHD : WP(us) NOISE REDUCTION EFFECTIVE TIME : tl(SAD L)(us) 2 SUPPLY VOLATGE : Vcc(V) SUPPLY VOLTAGE : Vcc(V) 0.3 0.2 SPEC 0.1 0.8 Ta=-40℃ Ta=25℃ Ta=85℃ 0.6 0.4 0.2 0 0.0 0 1 2 3 4 SUPPLY VOLTAGE : Vcc(V) 5 6 0 2 3 4 5 6 SUPPLYVOLTAGE : Vcc(V) Fig.31 Noise reduction efective time tl（SDA L） Fig.32 WP data hold time tHD:WP www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 1 11/23 TSZ02201-0R2R0G100010-1-2 2011.12.19 Rev.001 Datasheet BU99022NUX-3 ●Characteristic data (The following values are Typ. ones.) 0.2 1.2 SPEC 0.1 SPEC 1.0 WP SET UP TIME : tSU : WP(us) -0.1 WP EFFECTIVE TIME : tHIGH : WP(us) Ta=-40℃ Ta=25℃ Ta=85℃ 0.0 -0.2 -0.3 -0.4 0.8 Ta=-40℃ Ta=25℃ Ta=85℃ 0.6 0.4 0.2 -0.5 -0.6 0.0 0 1 2 3 4 5 6 0 2 3 4 5 6 Fig.34 WP efective time tHIGH : WP Fig.33 WP setup time tSU : WP www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 1 SUPPLYVOLTAGE : Vcc(V) SUPPLY VOLTAGE : Vcc(V) 12/23 TSZ02201-0R2R0G100010-1-2 2011.12.19 Rev.001 Datasheet BU99022NUX-3 ●I2C BUS communication ○I2C BUS data communication I2C BUS data communication starts by start condition input, and ends by stop condition input. Data is always 8bit long, and 2 acknowledge is always required after each byte. I C BUS carries out data transmission with plural devices connected by 2 communication lines of serial data (SDA) and serial clock (SCL). Among devices, there are “master” that generates clock and control communication start and end, and “slave” that is controlled by address peculiar to devices. EEPROM becomes “slave”. And the device that outputs data to bus during data communication is called “transmitter”, and the device that receives data is called “receiver”. SDA SCL 1-7 S START ADDRESS condition 8 9 R/W ACK 1-7 8 DATA 9 ACK 1-7 DATA 8 9 ACK P STOP condition Fig.35 Data transfer timing ○Start condition (Start bit recognition) ・Before executing each command, start condition (start bit) where SDA goes from 'HIGH' down to 'LOW' when SCL is 'HIGH' is necessary. ・This IC always detects whether SDA and SCL are in start condition (start bit) or not, therefore, unless this confdition is satisfied, any command is executed. ○Stop condition (stop bit recongnition) ・Each command can be ended by SDA rising from 'LOW' to 'HIGH' when stop condition (stop bit), namely, SCL is 'HIGH' ○Acknowledge (ACK) signal ・This acknowledge (ACK) signal is a software rule to show whether data transfer has been made normally or not. In master and slave, the device (μ-COM at slave address input of write command, read command, and this IC at data output of read command) at the transmitter (sending) side releases the bus after output of 8bit data. ・The device (this IC at slave address input of write command, read command, and μ-COM at data output of read command) at the receiver (receiving) side sets SDA 'LOW' during 9 clock cycles, and outputs acknowledge signal (ACK signal) showing that it has received the 8bit data. ・This IC, after recognizing start condition and slave address (8bit), outputs acknowledge signal (ACK signal) 'LOW'. ・Each write action outputs acknowledge signal (ACK signal) 'LOW', at receiving 8bit data (word address and write data). ・Each read action outputs 8bit data (read data), and detects acknowledge signal (ACK signal) 'LOW'. When acknowledge signal (ACK signal) is detected, and stop condition is not sent from the master (μ-COM) side, this IC continues data output. When acknowledge signal (ACK signal) is not detected, this IC stops data transfer, and recognizes stop cindition (stop bit), and ends read action. And this IC gets in status. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 13/23 TSZ02201-0R2R0G100010-1-2 2011.12.19 Rev.001 Datasheet BU99022NUX-3 ●Write Command ○Write cycle ・Arbitrary data is written to EEPROM. When to write only 1 byte, byte write is normally used, and when to write continuous data of 2 bytes or more, simultaneous write is possible by page write cycle. The maximum number of write bytes is up to 8. S T A R T W R I T E SLAVE ADDRESS SDA L IN E 1 0 1 0 0 0 W ORD ADDRESS D A TA WA 7 0 R / W S T O P WA 0 D7 D0 A C K A C K A C K Fig.36 Byte write cycle (port1 EEPROM) S T A R T W R I T E SLAVE ADDRESS SDA L IN E 1 0 1 W ORD ADDRESS WA 7 0 ＊ ＊ ＊ R / W S T O P D A TA WA 0 D7 D0 A C K A C K A C K Fig.37 Byte write cycle (port2 EEPROM) S T A R T SDA LINE SLAVE ADDRESS 1 0 1 W R I T E SDA LINE SLAVE ADDRESS 1 0 1 0 R A / C W K A C K A C DATA(n) WORD ADDRESS(n) WA 7 * * * D0 A C K K Fig.38 Page write cycle (port1 EEPROM) W R I T E D7 WA 0 S T O P DATA(n+15) D0 D7 WA 0 WA 7 R A / C W K S T A R T DATA(n) WORD ADDRESS(n) 0 0 0 0 * D o n ’t C a re A C K *Don’t Care S T O P DATA(n+15) D0 D0 A C K Fig.39 Page write cycle (port2 EEPROM) A C K *Don’t Care ・During internal write execution, all input commands are ignored, therefore ACK is not sent back. ・Data is written to the address designated by word address (n-th address) ・By issuing stop bit after 8bit data input, write to memory cell inside starts. ・When internal write is started, command is not accepted for tWR (5ms at maximum). ・By page write cycle, the following can be written in bulk : And when data of the maximum bytes or higher is sent, data from the first byte is overwritten. ・As for page write cycle , after the significant 5 bits of word address are designated arbitrarily, by continuing data input of 2 bytes or more, the address of insignificant 3 bits is incremented internally, and data up to 8 bytes can be written. ○Write protect (WP2) terminal ・Write protect (WP2) function When WP2 terminal is set Vcc (H level), data rewrite of all addresses is prohibited (only port2 EEPROM). When it is set GND (L level), data rewrite of all address is enabled. Be sure to connect this terminal to Vcc or GND, or control it to H level or L level. Do not use it open. In the case of use it as an ROM, it is recommended to connect it to pull up or Vcc. At extremely low voltage at power ON / OFF, by setting the WP terminal 'H', mistake write can be prevented. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 14/23 TSZ02201-0R2R0G100010-1-2 2011.12.19 Rev.001 Datasheet BU99022NUX-3 ●Read Command ○Read cycle Data of EEPROM is read. In read cycle, there are random read cycle and current read cycle. Random read cycle is a command to read data by designating address, and is used generally. Current read cycle is a command to read data of internal address register without designating address, and is used when to verify just after write cycle. In both the read cycles, sequential read cycle is available, and the next address data can be read in succession. S T A R T SLAVE ADDRESS SDA L IN E W R I T E S T A R T W ORD A D D R E S S (n ) WA 0 WA 7 1 0 1 0 0 0 0 R A / C W K R E A D SLAVE ADDRESS 0 1 0 0 1 D A T A (n ) 0 0 A C K S T O P D0 D7 A C K R A / C W K Fig.40 Random read cycle (port1 EEPROM) S T A R T SDA L IN E W R I T E SLAVE ADDRESS S T A R T W ORD A D D R E S S (n ) 1 0 1 0 ＊ ＊＊ SLAVE ADDRESS WA 0 WA 7 R A / C W K R E A D 1 D A T A (n ) 0 1 0 ＊ ＊＊ A C K D0 D7 A C K R A / C W K SDA L IN E R E A D SLAVE ADDRESS D A T A (n ) 1 0 1 0 0 0 0 D7 SDA LINE R E A D 1 0 1 0 0 0 0 D7 S T O P DATA(n+x) D7 A C K D0 A C K A C K It is necessary to input 'H' to the last ACK. Fig.44 Sequential read cycle (port1 EEPROM) S T A R T SDA LINE SLAVE ADDRESS R E A D 1 0 1 0 ＊ ＊＊ R A / C W K S T O P DATA(n+x) DATA(n) D7 D0 D7 A C K A C K*Don’t Care Fig.43 Current read cycle (port2 EEPROM) D0 R A / C W K D0 R A / C W K DATA(n) D7 S T O P D A T A (n ) 1 0 1 0 ＊ ＊＊ A C K Fig.42 Current read cycle (port1 EEPROM) SLAVE ADDRESS R E A D SLAVE ADDRESS SDA L IN E D0 R A / C W K S T A R T S T A R T S T O P *Don’t Care It is necessary to input 'H' to the last ACK. Fig.41 Random read cycle (port2 EEPROM) S T A R T It is necessary to input 'H' to the last ACK. S T O P A C K D0 A C K *Don’t Care Fig.45 Sequential read cycle (port2 EEPROM) ・In random read cycle, data of designated word address can be read. ・When the command just before current read cycle is random read cycle, current read cycle (each including sequential read cycle), data of incremented last read address (n)-th address, i.e., data of the (n+1)-th address is output. ・When ACK signal 'LOW' after D0 is detected, and stop condition is not sent from master (μ-COM) side, the next address data can be read in succession. ・Read cycle is ended by stop condition where 'H' is input to ACK signal after D0 and SDA signal is started at SCL signal 'H' . ・When 'H' is not input to ACK signal after D0, sequential read gets in, and the next data is output. Therefore, read command cycle cannot be ended. When to end read command cycle, be sure input stop condition to input 'H' to ACK signal after D0, and to start SDA at SCL signal 'H'. ・Sequential read is ended by stop condition where 'H' is input to ACK signal after arbitrary D0 and SDA is started at SCL signal 'H'. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 15/23 TSZ02201-0R2R0G100010-1-2 2011.12.19 Rev.001 Datasheet BU99022NUX-3 ●Software reset Software reset is executed when to avoid malfunction after power on, and to reset during command input. Software reset has several kinds, and 3 kinds of them are shown in the figure below. (Refer to Fig.46, Fig.47, Fig.48.) In dummy clock input area, release the SDA bus ('H' by pull up). In dummy clock area, ACK output and read data '0' (both 'L' level) may be output from EEPROM, therefore, if 'H' is input forcibly, output may conflict and over current may flow, leading to instantaneous power failure of system power source or influence upon devices. Dummy clock×14 SCL 1 2 Start×2 13 Normal command 14 SDA Normal command Fig.46 The case of dummy clock +START+START+ command input SCL Start Dummy clock×9 Start 1 2 8 Normal command 9 SDA Normal command Fig.47 The case of START +9 dummy clocks +START+ command input Start×9 SCL 1 2 3 7 8 Normal command 9 SDA Normal command SD Fig.48 START×9+ command input タ ト ※Start command from START input. ●Acknowledge polling During internal write execution, all input commands are ignored, therefore ACK is not sent back. During internal automatic write execution after write cycle input, next command (slave address) is sent, and if the first ACK signal sends back 'L', then it means end of write action, while if it sends back 'H', it means now in writing. By use of acknowledge polling, next command can be executed without waiting for tWR = 5ms. When to write continuously, R/W = 0, when to carry out current read cycle after write, slave address R/W = 1 is sent, and if ACK signal sends back 'L', then execute word address input and data output and so forth. During internal write, ACK = HIGH is sent back. First write command S T A R T Write command S T O P S T Slave A R address T A C K H tWR S T Slave A R address T A C K H … Second write command … S T Slave A R address T A C K H S T Slave A R address T A C K L Word address A C K L Data A C K L S T O P tWR After completion of internal write, ACK=LOW is sent back, so input next word address and data in succession. Fig.49 Case to continuously write by acknowledge polling www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 16/23 TSZ02201-0R2R0G100010-1-2 2011.12.19 Rev.001 Datasheet BU99022NUX-3 ●WP valid timing (write cancel) WP2 is usually fixed to 'H' or 'L', but when WP is used to cancel write cycle and so forth, pay attention to the following WP valid timing. During write cycle execution, in cancel valid area, by setting WP2='H', write cycle can be cancelled. In both byte write cycle and page write cycle, the area from the first start condition of command to the rise of clock to taken in D0 of data(in page write cycle, the first byte data) is cancel invalid area. WP input in this area becomes Don't care. The area from the rise of SCL to take in D0 to input the stop condition is cancel valid area. And, after execution of forced end by WP, standby status gets in. ・Rise of SDA ・Rise of D0 taken clock SCL SDA SCL D1 D0 ACK SDA Enlarged view SDA S T Slave A R address T A C Word K address L D0 ACK Enlarged view A C D7 D6 D5 D4 D3 D2 D1 D0 K L WP cancel invalid area A C K L Data A C K L S T O P WP cancel valid area tWR WP cancel invalid area WP2 Data is not written. Fig.50 WP valid timing ●Command cancel by start condition and stop condition During command input, by continuously inputting start condition and stop condition, command can be cancelled. (Fig.51) However, in ACK output area and during data read, SDA bus may output 'L', and in this case, start condition and stop condition cannot be input, so reset is not available. Therefore, execute software reset. And when command is cancelled by start, stop condition, during random read cycle, sequential read cycle, or current read cycle, internal setting address is not determined, therefore, it is not possible to carry out current read cycle in succession. When to carry out read cycle in succession, carry out random read cycle. SCL SDA 1 0 1 0 Start condition Stop condition Fig.51 Case of cancel by start, stop condition during slave address input www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 17/23 TSZ02201-0R2R0G100010-1-2 2011.12.19 Rev.001 Datasheet BU99022NUX-3 ●I/O peripheral circuit ○Pull up resistance of SDA terminal SDA is NMOS open drain, so requires pull up resistance. As for this resistance value (RPU), select an appropriate value to this resistance value from microcontroller VIL, IL, and VOL-IOL characteristics of this IC. If RPU is large, action frequency is limited. The smaller the RPU, the larger the consumption current at action. ○Maximum value of RPU The maximum value of RPU is determined by the following factors. ①SDA rise time to be determined by the capacitance (CBUS) of bus line of RPU and SDA should be tR or below. And AC timing should be satisfied even when SDA rise time is late. ②The bus electric potential A to be determined by input leak total (IL) of device connected to bus at output of 'H' to SDA bus and RPU should sufficiently secure the input 'H' level (VIH) of microcontroller and EEPROM including recommended noise margin 0.2Vcc. VCC－ILRPU－0.2 VCC ≧ VIH ∴ RPU ≦ Ex.) VCC =3V from② RPU ≦ 0.8VCC－VIH IL Microcontroller BU99022NUX-3 IL=10μA VIH=0.7 VCC RPU SDA terminal A 0.8×3－0.7×3 -6 10×10 IL IL Bus line capacity ≦ 300 ［kΩ］ ○ Minimum value of RPU CBUS The minimum value of RPU is determined by the following factors. When IC outputs LOW, it should be satisfied that VOLMAX=0.4V and IOLMAX=3mA. Fig.52 I/O circuit diagram VCC－VOL ≦ IOL RPU ∴ RPU ≧ VCC－VOL IOL ②VOLMAX= should secure the input 'L' level (VIL) of microcontroller and EEPROM including recommended noise margin 0.1Vcc. VOLMAX ≦ VIL－0.1 VCC Ex.) VCC =3V、VOL=0.4V、IOL=3mA、microcontroller, EEPROM VIL=0.3Vcc from① RPU ≧ 3－0.4 3×10 -3 ≧ 867 ［Ω］ And VOL=0.4［V］ VIL=0.3×3 =0.9［V］ Therefore, the condition ② is satisfied. ○Pull up resistance of SCL terminal When SCL control is made at CMOS output port, there is no need, but in the case there is timing where SCL becomes 'Hi-Z', add a pull up resistance. As for the pull up resistance, one of several kΩ ~ several ten kΩ is recommended in consideration of drive performance of output port of microcontroller. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 18/23 TSZ02201-0R2R0G100010-1-2 2011.12.19 Rev.001 Datasheet BU99022NUX-3 ●Cautions on microcontroller connection ○RS 2 In I C BUS, it is recommended that SDA port is of open drain input/output. However, when to use CMOS input / output of tri state to SDA port, insert a series resistance Rs between the pull up resistance Rpu and the SDA terminal of EEPROM. This is controls over current that occurs when PMOS of the microcontroller and NMOS of EEPROM are turned ON simultaneously. Rs also plays the role of protection of SDA terminal against surge. Therefore, even when SDA port is open drain input/output, Rs can be used. ACK SCL RPU RS SDA 'H' output of microcontroller 'L' output of EEPROM Over current flows to SDA line by 'H' output of microcontroller and 'L' output of EEPROM. EEPROM Microcontroller Fig.53-(a) I/O circuit diagram Fig.53-(b) Input / output collision timing ○Maximum value of Rs The maximum value of Rs is determined by the following relations. ①SDA rise time to be determined by the capacity (CBUS) of bus line of Rpu and SDA should be tR or below. And AC timing should be satisfied even when SDA rise time is late. ②The bus electric potential A to be determined by Rpu and Rs the moment when EEPROM outputs 'L' to SDA bus sufficiently secure the input 'L' level (VIL) of microcontroller including recommended noise margin 0.1Vcc. (VCC－VOL)×RS RPU+RS VCC RPU RS A VOL ∴ RS VIL－VOL－0.1VCC 1.1VCC-VIL ≦ IOL Micro controller × RPU Ex.）VCC=3V　VIL=0.3VCC　VOL=0.4V　RPU=20kΩ Bus line capacity CBUS VIL + VOL+0.1VCC≦VIL RS EEPROM ≦ 0.3×3－0.4－0.1×3 1.1×3－0.3×3 × 20×10 3 ≦ 1.67［kΩ］ Fig.54-(a) I/O Circuit Diagram ○Minimum value of Rs The minimum value of Rs is determined by over current at bus collision. When over current flows, noises in power source line, and instantaneous power failure of power source may occur. When allowable over current is defined as I, the following relation must be satisfied. Determine the allowable current in consideration of impedance of power source line in set and so forth. Set the over current to EEPROM 10mA or below. VCC ≦ RS RPU 'L'output ∴ RS ≧ RS Over current I I VCC I Ex.) VCC=3V, I=10mA 'H' output RS Microcontroller EEPROM ≧ 3 -3 10×10 ≧ 300［Ω］ Fig.54-(b) I/O circuit diagram www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 19/23 TSZ02201-0R2R0G100010-1-2 2011.12.19 Rev.001 Datasheet BU99022NUX-3 ●I2C BUS input / output circuit ○Input (SCL1,SCL2,WP2) Fig.55-(a) Input pin circuit diagram ○Input / output (SDA1,SDA2) Fig.55-(b) Input / output pin circuit diagram www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 20/23 TSZ02201-0R2R0G100010-1-2 2011.12.19 Rev.001 Datasheet BU99022NUX-3 ●Notes on power ON At power on, in IC internal circuit and set, Vcc rises through unstable low voltage area, and IC inside is not completely reset, and malfunction may occur. To prevent this, functions of POR circuit and LVCC circuit are equipped. To assure the action, observe the following conditions at power on. 1. Set SDA = 'H' and SCL ='L' or 'H’ 2. Start power source so as to satisfy the recommended conditions of tR, tOFF, and Vbot for operating POR circuit. tR Recommended conditions of tR, tOFF,Vbot tR tOFF Vbot VCC 10ms or below 10ms or larger 0.3V or below tOFF Vbot 100 or below 10ms or larger 0.2V or below 0 Fig.56 Rise waveform diagram 3. Set SDA and SCL so as not to become 'Hi-Z'. When the above conditions 1 and 2 cannot be observed, take the following countermeasures. a) In the case when the above condition 1 cannot be observed. When SDA becomes 'L' at power on . →Control SCL and SDA as shown below, to make SCL and SDA, 'H' and 'H'. VCC tLOW SCL SDA After Vcc becomes stable After Vcc becomes stable tDH Fig.57 When tSU:DAT SCL= 'H' and SDA= 'L' tSU:DAT Fig.58 When SCL='L' and SDA='L' ｂ) In the case when the above condition 2 cannot be observed. →After power source becomes stable, execute software reset(P15). ｃ) In the case when the above conditions 1 and 2 cannot be observed. →Carry out a), and then carry out b). ●Low voltage malfunction prevention function LVCC circuit prevents data rewrite action at low power, and prevents wrong write. At LVCC voltage (Typ. =1.2V) or below, it prevent data rewrite. ●Vcc noise countermeasures ○Bypass capacitor When noise or surge gets in the power source line, malfunction may occur, therefore, for removing these, it is recommended to attach a by pass capacitor (0.1μF) between IC Vcc and GND. At that moment, attach it as close to IC as possible. And, it is also recommended to attach a bypass capacitor between board Vcc and GND. ●Cautions on use (1) Described numeric values and data are design representative values, and the values are not guaranteed. (2) We believe that application circuit examples are recommendable, however, in actual use, confirm characteristics further sufficiently. In the case of use by changing the fixed number of external parts, make your decision with sufficient margin in consideration of static characteristics and transition characteristics and fluctuations of external parts and our LSI. (3) Absolute maximum ratings If the absolute maximum ratings such as impressed voltage and action temperature range and so forth are exceeded, LSI may be destructed. Do not impress voltage and temperature exceeding the absolute maximum ratings. In the case of fear exceeding the absolute maximum ratings, take physical safety countermeasures such as fuses, and see to it that conditions exceeding the absolute maximum ratings should not be impressed to LSI. (4) GND electric potential Set the voltage of GND terminal lowest at any action condition. Make sure that each terminal voltage is lower than that of GND terminal. (5) Terminal design In consideration of permissible loss in actual use condition, carry out heat design with sufficient margin. (6) Terminal to terminal shortcircuit and wrong packaging When to package LSI onto a board, pay sufficient attention to LSI direction and displacement. Wrong packaging may destruct LSI. And in the case of shortcircuit between LSI terminals and terminals and power source, terminal and GND owing to foreign matter, LSI may be destructed. (7) Use in a strong electromagnetic field may cause malfunction, therefore, evaluate design sufficiently. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 21/23 TSZ02201-0R2R0G100010-1-2 2011.12.19 Rev.001 Datasheet BU99022NUX-3 ● Revision history Date 19-Dec-2011 Revision 001 Changes Initial Document Release www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 22/23 TSZ02201-0R2R0G100010-1-2 2011.12.19 Rev.001 Datasheet BU99022NUX-3 ●Ordering information B U 9 9 0 2 2 N U X - 3 TR Package Packaging and forming specification NUX : VSON008X2030 TR : Embossed tape and reel ●Physical Dimantion. Tape abd Reel information VSON008X2030 3.0±0.1 2.0±0.1 0.6MAX 1PIN MARK 0.25 TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand ) (0.12) +0.03 0.02 −0.02 1.5±0.1 4000pcs 0.5 1 4 8 5 1.4±0.1 0.3±0.1 C0.25 Embossed carrier tape Quantity Direction of feed S 0.08 S Tape 1pin +0.05 0.25 −0.04 Reel (Unit : mm) Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. ●Marking Diagram 2.0±0.1 3.0±0.1 022 BU99022NUX-3 Product Name: BU99022-3 LOT NO． +0.03 0.02 -0.02 (0.12) 0.6MAX 1PIN MARK 1.5±0.1 0.5 0.3±0.1 1.4±0.1 C0.25 0.25 +0.05 0.25-0.04 www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 23/23 Drawing　No. : EX187-6001 (UNIT:mm) TSZ02201-0R2R0G100010-1-2 2011.12.19 Rev.001 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. 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ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001