BUS1DJC3GWZ-E2

Datasheet 1ch Ultra Small High Side Load Switch BUS1DJC0GWZ BUS1DJC3GWZ General Description Key Specifications BUS1DJC0GWZ and BUS1DJC3GWZ are low ON-Resistance high-side power switch P-channel MOSFETs. It comes in ultra-small package for portable digital applications. This switch IC operates on low input voltages ranging from 1.1V to 5.0V and exhibits a typical ON-resistance of 63 mΩ at 3.3V. The turn ON time of the device can be controlled to avoid inrush current. „ „ „ „ „ „ Package Features „ „ „ „ „ „ „ „ „ „ Input Voltage Range: RON (at VIN=1.2V): RON (at VIN=3.3V): Bias Current: Standby Current: Operating Temperature Range: 1.1V to 5.0V 140mΩ (Typ) 63mΩ (Typ) 0.35µA(Typ) 0.01μA (Typ) -30°C to +85°C W(Typ) x D(Typ) x H(Max) 0.8mm x 0.8mm x 0.35mm UCSP30L1 P-MOSFET high-side load switch Low input voltage Ultra low bias current Ultra low standby current Built-in discharge circuit Built-in soft start circuit Built-in short circuit protection Input logic : Active-High Ultra small package ESD protection Applications „ „ „ „ „ Digital cameras Mobile phones Smart phones Portable devices Digital video cameras Typical Application Circuits VIN VOUT CIN CL ON/OFF EN GND Figure 1. Typical Application Circuits ○Product structure：Silicon monolithic integrated circuit www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product has no designed protection against radioactive rays 1/24 TSZ02201-0R5R0GZ00010-1-2 8.Apr.2014 Rev.002 BUS1DJC0GWZ Datasheet BUS1DJC3GWZ Pin Configurations B EN GND B A VIN 2 VOUT 1 A Top View 2 1 Top View 1 2 Bottom View Figure 2. Pin Configuration Pin Descriptions Pin No. Pin Name A1 VOUT A2 VIN B1 GND B2 EN Pin Function Switch output Switch input Ground Enable input Block Diagram VIN EN VOUT Gate Driver with Soft Start Short Circuit Protection GND Figure 3. Block Diagram www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/24 TSZ02201-0R5R0GZ00010-1-2 8.Apr.2014 Rev.002 BUS1DJC0GWZ Datasheet BUS1DJC3GWZ Absolute Maximum Ratings (Ta = 25°C) Parameter Symbol Rating Unit VIN -0.3 to +5.5 V Switch Output Voltage VOUT -0.3 to VIN+0.3 V Enable Input Voltage VEN -0.3 to +5.5 V Switch Input Voltage Power Dissipation Pd 0.41 (Note 1) W Operating Temperature Range Topr -30 to +85 °C Storage Temperature Range Tstg -55 to +125 °C Tjmax 125 °C Junction Temperature (Note 1) Derate by 4.1mW/°C when operating above 25°C. (When mounted on a 9 layer glass-epoxy board with 63mm x 55mm x 1.6mm dimension.) Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions (Ta= -30°C to +85°C) Parameter Switch Input Voltage Output Current Symbol Min Typ VIN 1.1 IOUT - Max Unit - 5.0 V - (Note 2) A 2 (Note 2) Not to exceed Pd and ASO. Electrical Characteristics (Unless otherwise specified, VIN=3.3V, VEN=3.3V, Ta=25°C) Parameter Symbol Min Typ Max Unit IIN - 0.35 1 µA VEN=3.3V, IOUT=0A OFF Supply Current IIN_OFF - 0.01 1 µA VEN=0V, VOUT=OPEN Leakage Current IIN_Leak - 0.01 1 µA VEN=0V, VOUT=0V ON-Resistance 1 RON1 - 140 245 mΩ VIN=1.2V ON-Resistance 2 RON2 - 80 125 mΩ VIN=1.8V ON-Resistance 3 RON3 - 63 85 mΩ VIN=3.3V VIN=5.0V Operating Current Conditions ON-Resistance 4 RON4 - 58 80 mΩ EN High Voltage VEN_High 0.85 - 5.0 V EN Low Voltage VEN_Low -0.3 - 0.4 V EN Bias Current IEN - 0.7 1.5 μA VEN=3.3V RON_DIS 50 80 110 Ω VEN=0V Symbol Min Typ Max Unit Turn-ON Time 1 tON1 - 32 - µsec VIN=1.2V, RL=510Ω, CL=0.1μF Turn-ON Time 2 tON2 - 12 - µsec VIN=3.3V, RL=510Ω, CL=0.1μF Turn-OFF Time tOFF - 25 - µsec VIN=3.3V, RL=510Ω, CL=0.1μF Symbol Min Typ Max Unit Turn-ON Time 1 tON1 - 510 - µsec VIN=1.2V, RL=510Ω, CL=0.1μF Turn-ON Time 2 tON2 - 190 - µsec VIN=3.3V, RL=510Ω, CL=0.1μF Turn-OFF Time tOFF - 25 - µsec VIN=3.3V, RL=510Ω, CL=0.1μF Discharge ON-Resistance BUS1DJC0GWZ Parameter Conditions BUS1DJC3GWZ Parameter www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/24 Conditions TSZ02201-0R5R0GZ00010-1-2 8.Apr.2014 Rev.002 BUS1DJC0GWZ Datasheet BUS1DJC3GWZ Measurement Circuit VIN CIN VOUT CL ON/OFF RL EN GND Figure 4. Measurement Circuit EN 50% 50% tON tOFF 90% 90% VOUT 10% 10% tf tr Figure 5. Timing Diagram www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/24 TSZ02201-0R5R0GZ00010-1-2 8.Apr.2014 Rev.002 BUS1DJC0GWZ Datasheet BUS1DJC3GWZ Typical Performance Curves 160 160 140 140 ON-Resistance RON [mΩ]: RON [mΩ] RON [mΩ] ON-Resistance : RON [mΩ] (Unless otherwise specified, Ta=25°C, VEN=3.3V, VIN=3.3V) 120 100 80 60 Ta=85°C Ta=25°C Ta=-30°C 40 20 120 100 80 60 VIN=1.2V VIN=1.8V VIN=3.3V VIN=5.0V 40 20 0 0 1 2 3 4 5 -30 Switch Input Voltage VIN [V] : VIN [V] 10 30 50 70 Temperature : Ta Ta [℃ ] [°C] Figure 6. ON-Resistance vs Switch Input Voltage Figure 7. ON-Resistance vs Temperature 1 Operating Current IIN [μA] : IIN [µA] 1 Operating Current IIN [µA] : IIN [µA] -10 0.8 0.6 0.4 0.2 0 0 1 2 3 4 0.8 0.6 0.4 0.2 0 5 25 Switch Input : VIN [V] V INVoltage [V] 45 65 85 105 125 Temperature Ta [℃] : Ta [°C] Figure 8. Operating Current vs Switch Input Voltage www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 VIN=5.0V VIN=3.3V VIN=1.8V VIN=1.2V Figure 9. Operating Current vs Temperature 5/24 TSZ02201-0R5R0GZ00010-1-2 8.Apr.2014 Rev.002 BUS1DJC0GWZ Datasheet BUS1DJC3GWZ Typical Performance Curves - continued 3 OFF Supply Current : IIN_OFF [µA] 0.8 IIN_OFF [ µA] OFF Supply Current IIN_OFF [μA] : IIN_OFF [µA] 1 0.6 0.4 0.2 0 0 1 2 3 4 2.5 2 1.5 VIN=5.0V VIN=3.3V VIN=1.8V VIN=1.2V 1 0.5 0 5 25 Switch Input VVoltage IN [V] : VIN [V] 45 65 85 105 125 Temperature Ta [ ℃ ] : Ta [°C] Figure 10. OFF Supply Current vs Switch Input Voltage (VEN=0V) Figure 11. OFF Supply Current vs Temperature (VEN=0V) 3 Leakage Current[ µA] : IIN_Leak [µA] IIN_Leak LeakageIIN_Leak Current : IIN_Leak [µA] [μA] 1 0.8 0.6 0.4 0.2 0 0 1 2 3 4 2.5 2 1.5 VIN=5.0V VIN=3.3V VIN=1.8V VIN=1.2V 1 0.5 0 5 25 Switch Input : VIN [V] VINVoltage [V] 45 65 85 105 125 Temperature Ta [ ℃ ] : Ta [°C] Figure 12. Leakage Current vs Switch Input Voltage (VEN=0V, VOUT=0V) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Figure 13. Leakage Current vs Temperature (VEN=0V, VOUT=0V) 6/24 TSZ02201-0R5R0GZ00010-1-2 8.Apr.2014 Rev.002 BUS1DJC0GWZ Datasheet BUS1DJC3GWZ Typical Performance Curves – continued 5 Switch Output Voltage : VOUT [V] 4 3 VOUT [V] Switch Output Voltage VOUT [V] : VOUT [V] 5 2 1 0 4 3 2 1 0 0 0.2 0.4 0.6 0.8 1 0 0.2 Enable Input Voltage VEN [V] : VEN [V] 0.4 0.6 0.8 1 Enable Input Voltage VEN [V] : VEN [V] Figure 14. Switch Output Voltage vs Enable Input Voltage (VIN=1.2V) Figure 15. Switch Output Voltage vs Enable Input Voltage (VIN=1.8V) Switch Output VOUTVoltage [V] : VOUT [V] Switch Output Voltage VOUT [V] : VOUT [V] 5 4 3 2 1 0 5 4 3 2 1 0 0 0.2 0.4 0.6 0.8 1 0 Enable InputVVoltage EN [V] : VEN [V] 0.4 0.6 0.8 1 Enable Input Voltage VEN [V] : VEN [V] Figure 16. Switch Output Voltage vs Enable Input Voltage (VIN=3.3V) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0.2 7/24 Figure 17. Switch Output Voltage vs Enable Input Voltage (VIN=5.0V) TSZ02201-0R5R0GZ00010-1-2 8.Apr.2014 Rev.002 BUS1DJC0GWZ Datasheet BUS1DJC3GWZ Typical Performance Curves – continued 120 Discharge ON-Resistance RON_DIS[Ω] : RON_DIS [Ω] IEN [µA] EN Bias Current : IEN [µA] 2 1.6 1.2 0.8 0.4 110 100 90 80 70 60 0 0 1 2 3 4 1 5 Enable InputVVoltage EN [V] : VEN [V] 2 3 4 5 VIN [V] : VIN [V] Switch Input Voltage Figure 18. EN Bias Current vs Enable Input Voltage Figure 19. Discharge ON-Resistance vs Switch Input Voltage 5 Switch Output Voltage VOUT [V] : VOUT [V] Switch Output Voltage VOUT [V] : VOUT [V] 5 4 3 2 1 0 4 3 2 1 0 0 1 2 3 4 5 0 Switch Input : VIN [V] VINVoltage [V] 2 3 4 5 Switch Input V Voltage IN [V] : VIN [V] Figure 20. Switch Output Voltage vs Switch Input Voltage (VEN=3.3V) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 1 8/24 Figure 21. Switch Output Voltage vs Switch Input Voltage (VEN=0V) TSZ02201-0R5R0GZ00010-1-2 8.Apr.2014 Rev.002 BUS1DJC0GWZ Datasheet BUS1DJC3GWZ Typical Performance Curves – continued 1.8 Switch Output : VOUT [V] VOUTVoltage [V] Switch Output Voltage : VOUT [V] 1.5 VOUT [V] 1.2 0.9 0.6 0.3 0 1.5 1.2 0.9 0.6 0.3 0 0 0.3 0.6 0.9 1.2 1.5 1.8 0 0.5 Output Current : IOUT [A] IOUT [A] 2 2.5 3 3.5 Figure 23. Switch Output Voltage vs Output Current (VIN=1.5V) 2.8 Switch Output : VOUT [V] VOUTVoltage [V] 2.1 OUT 1.5 IOUT [A]: IOUT [A] Output Current Figure 22. Switch Output Voltage vs Output Current (VIN=1.2V) Switch Output V Voltage [V] : VOUT [V] 1 1.8 1.5 1.2 0.9 0.6 2.4 2 1.6 1.2 0.8 0.4 0.3 0 0 0 0.8 1.6 2.4 3.2 4 0 4.8 Output Current : IOUT [A] IOUT [A] 2 3 4 5 6 Output Current : IOUT [A] IOUT [A] Figure 25. Switch Output Voltage vs Output Current (VIN=2.5V) Figure 24. Switch Output Voltage vs Output Current (VIN=1.8V) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 1 9/24 TSZ02201-0R5R0GZ00010-1-2 8.Apr.2014 Rev.002 BUS1DJC0GWZ Datasheet BUS1DJC3GWZ Typical Performance Curves – continued 6 Switch Output : VOUT [V] VOUT Voltage [V] Switch Output Voltage VOUT [V] : VOUT [V] 3.5 3 2.5 2 1.5 1 0.5 0 5 4 3 2 1 0 0 1 2 3 4 5 6 7 0 1 2 3 4 5 6 7 Output Current IOUT [A]: IOUT [A] [A] : IOUT [A] OutputIOUT Current Figure 26. Switch Output Voltage vs Output Current (VIN=3.3V) Figure 27. Switch Output Voltage vs Output Current (VIN=5.0V) 30 40 Riset rTime : tr [µsec] [µsec] Turn-ON Time : tON [µsec] tON [µsec] 25 30 20 20 15 10 10 5 0 0 1 2 3 4 1 5 Switch InputVVoltage IN [V] : VIN [V] 3 4 5 Figure 29. Rise Time vs Switch Input Voltage (BUS1DJC0GWZ) Figure 28. Turn-ON Time vs Switch Input Voltage (BUS1DJC0GWZ) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2 Switch Input [V] : VIN [V] VINVoltage 10/24 TSZ02201-0R5R0GZ00010-1-2 8.Apr.2014 Rev.002 BUS1DJC0GWZ Datasheet BUS1DJC3GWZ Typical Performance Curves – continued 30 25 30 Fall Time : tf [µsec] tf [µsec] Turn-OFF Time : tOFF [µsec] tOFF [µsec] 40 20 10 20 15 10 5 0 0 1 2 3 4 5 1 2 3 4 5 Switch Input V Voltage IN [V] : VIN [V] Switch Input [V] : VIN [V] VINVoltage Figure 30. Turn-OFF Time vs Switch Input Voltage (BUS1DJC0GWZ) Figure 31. Fall Time vs Switch Input Voltage (BUS1DJC0GWZ) t:10[µsec/div] EN:2[V/div] EN:2[V/div] VOUT:500[mV/div] VOUT:500[mV/div] t:10[µsec/div] Figure 32. Turn ON Response 1 (BUS1DJC0GWZ VIN=1.2V) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Figure 33. Turn OFF Response 1 (BUS1DJC0GWZ VIN=1.2V) 11/24 TSZ02201-0R5R0GZ00010-1-2 8.Apr.2014 Rev.002 BUS1DJC0GWZ Datasheet BUS1DJC3GWZ Typical Performance Curves – continued t:10[µsec/div] EN:2[V/div] EN:2[V/div] VOUT:500[mV/div] VOUT:500[mV/div] t:10[µsec/div] Figure 34. Turn ON Response 2 (BUS1DJC0GWZ VIN=1.5V) Figure 35. Turn OFF Response 2 (BUS1DJC0GWZ VIN=1.5V) t:10[µsec/div] EN:2[V/div] EN:2[V/div] VOUT:500[mV/div] VOUT:500[mV/div] t:10[µsec/div] Figure 36. Turn ON Response 3 (BUS1DJC0GWZ VIN=1.8V) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Figure 37. Turn OFF Response 3 (BUS1DJC0GWZ VIN=1.8V) 12/24 TSZ02201-0R5R0GZ00010-1-2 8.Apr.2014 Rev.002 BUS1DJC0GWZ Datasheet BUS1DJC3GWZ Typical Performance Curves – continued t:10[µsec/div] EN:2[V/div] EN:2[V/div] VOUT:1 [V/div] VOUT:1[V/div] t:4[µsec/div] Figure 38. Turn ON Response 4 (BUS1DJC0GWZ VIN=2.5V) Figure 39. Turn OFF Response 4 (BUS1DJC0GWZ VIN=2.5V) t:10[µsec/div] EN:2[V/div] EN:2[V/div] VOUT:1[V/div] VOUT:1[V/div] t:4 [µsec/div] Figure 40. Turn ON Response 5 (BUS1DJC0GWZ VIN=3.3V) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Figure 41. Turn OFF Response 5 (BUS1DJC0GWZ VIN=3.3V) 13/24 TSZ02201-0R5R0GZ00010-1-2 8.Apr.2014 Rev.002 BUS1DJC0GWZ Datasheet BUS1DJC3GWZ Typical Performance Curves – continued t:10[µsec/div] EN:2[V/div] EN:2[V/div] VOUT:2 [V/div] VOUT:2[V/div] t:4[µsec/div] Figure.42 Turn on response 6 (BUS1DJC0GWZ VIN=5.0V) Figure.43 Turn off response 6 (BUS1DJC0GWZ VIN=5.0V) 600 500 400 Riset rTime : tr [µsec] [µsec] Turn-ON Time : tON [µsec] tON [µsec] 500 400 300 200 300 200 100 100 0 0 1 2 3 4 5 1 Switch InputVVoltage IN [V] : VIN [V] 3 4 5 Switch Input Voltage [V] : VIN [V] VIN Figure 45. Rise Time vs Switch Input Voltage (BUS1DJC3GWZ) Figure 44. Turn-ON Time vs Switch Input Voltage (BUS1DJC3GWZ) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2 14/24 TSZ02201-0R5R0GZ00010-1-2 8.Apr.2014 Rev.002 BUS1DJC0GWZ Datasheet BUS1DJC3GWZ Typical Performance Curves – continued 30 25 30 Fall Time : tf [µsec] tf [µsec] Turn-OFF Time : tOFF [µsec] tOFF [µsec] 40 20 10 20 15 10 5 0 0 1 2 3 4 5 1 2 3 4 5 Switch Input V Voltage IN [V] : VIN [V] Switch Input [V] : VIN [V] VINVoltage Figure 46. Turn-OFF Time vs Switch Input Voltage (BUS1DJC3GWZ) Figure 47. Fall Time vs Switch Input Voltage (BUS1DJC3GWZ) t:10[µsec/div] EN:2[V/div] EN:2[V/div] VOUT:500 [mV/div] VOUT:500[mV/div] t:100[µsec/div] Figure.48 Turn on response 7 (BUS1DJC3GWZ VIN=1.2V) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Figure.49 Turn off response 7 (BUS1DJC3GWZ VIN=1.2V) 15/24 TSZ02201-0R5R0GZ00010-1-2 8.Apr.2014 Rev.002 BUS1DJC0GWZ Datasheet BUS1DJC3GWZ Typical Performance Curves – continued t:10[µsec/div] EN:2[V/div] EN:2[V/div] VOUT:500[mV/div] VOUT:500[mV/div] t:100[µsec/div] Figure.51 Turn off response 8 (BUS1DJC3GWZ VIN=1.5V) Figure.50 Turn on response 8 (BUS1DJC3GWZ VIN=1.5V) t:10[µsec/div] EN:2[V/div] EN:2[V/div] VOUT:500[mV/div] VOUT:500[mV/div] t:100[µsec/div] Figure.53 Turn off response 9 (BUS1DJC3GWZ VIN=1.8V) Figure.52 Turn on response 9 (BUS1DJC3GWZ VIN=1.8V) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 16/24 TSZ02201-0R5R0GZ00010-1-2 8.Apr.2014 Rev.002 BUS1DJC0GWZ Datasheet BUS1DJC3GWZ Typical Performance Curves – continued t:10[µsec/div] EN:2[V/div] EN:2[V/div] VOUT:1 [V/div] VOUT:1[V/div] t:40[µsec/div] Figure.55 Turn off response 10 (BUS1DJC3GWZ VIN=2.5V) Figure.54 Turn on response 10 (BUS1DJC3GWZ VIN=2.5V) t:10[µsec/div] EN:2[V/div] EN:2[V/div] VOUT:1[V/div] VOUT:1[V/div] t:40 [µsec/div] Figure.57 Turn off response 11 (BUS1DJC3GWZ VIN=3.3V) Figure.56 Turn on response 11 (BUS1DJC3GWZ VIN=3.3V) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 17/24 TSZ02201-0R5R0GZ00010-1-2 8.Apr.2014 Rev.002 BUS1DJC0GWZ Datasheet BUS1DJC3GWZ Typical Performance Curves – continued t:10[µsec/div] EN:2[V/div] EN:2[V/div] VOUT:2 [V/div] VOUT:2[V/div] t:40[µsec/div] Figure.58 Turn on response 12 (BUS1DJC3GWZ VIN=5V) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Figure.59 Turn off response 12 (BUS1DJC3GWZ VIN=5V) 18/24 TSZ02201-0R5R0GZ00010-1-2 8.Apr.2014 Rev.002 BUS1DJC0GWZ Datasheet BUS1DJC3GWZ Application Information It is recommended that an input bypass/decoupling capacitor (over 0.1μF) is placed near the IC between the VIN and GND pins. The capacitor between VIN and GND pins is necessary when there is high impedance on the power supply or if the power trace is long. Larger capacitance value (0.1μF to 100μF) would result to better line regulation and will improve power characteristics during load change. However, IC operation must be confirmed by mounting the device on an actual application board. Power Dissipation An estimation of heat reduction characteristics and internal power consumption of the IC are shown below. Use these for reference. It is recommended to measure Pd on a set board since power dissipation changes substantially according to the implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.). Exceeding the power dissipation of IC may lead to degradation of the original IC performance, such as reduction in current capability of the device. It is recommended to provide sufficient margin within the power dissipation rating for usage. Calculation of the internal power consumption of IC (P) P = RON × I OUT × I OUT Where: RON is the ON-state resistance IOUT is the Average output current ○ Measurement Conditions Evaluation Board Layout of Board for Measurement Top Layer (Top View) Measurement State Bottom Layer (Top View) With board implemented (Wind speed 0 m/s) Board Material Glass epoxy resin (9 layers) Board Size 63 mm x 55 mm x 1.6 mm Wiring Rate Top layer Bottom layer Metal (GND) wiring rate: Approx. 0% Metal (GND) wiring rate: Approx. 50% Through Hole Diameter 0.5mm x 6 holes Power Dissipation Thermal Resistance www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0.41W θja=243.9°C/W 19/24 TSZ02201-0R5R0GZ00010-1-2 8.Apr.2014 Rev.002 BUS1DJC0GWZ Datasheet BUS1DJC3GWZ 0.5 Power Dissipation :Pd [W] 0.41W 0.4 * Please design the margin so that P is less than Pd (P < Pd) within the usage temperature range 0.3 0.2 0.1 0 0 25 50 75 85 100 Ambient Temperature :Ta [°C] 125 Figure 60. UCSP30L1(BUS1DJC0GWZ/ BUS1DJC3GWZ) Power Dissipation Heat Reduction Characteristics (Reference) I/O Equivalence Circuits A2(VIN) / A1(VOUT) B1(GND) A2(VIN) B2(EN) B2(EN) B1(GND) Depression NMOS A1(VOUT) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 20/24 TSZ02201-0R5R0GZ00010-1-2 8.Apr.2014 Rev.002 BUS1DJC0GWZ Datasheet BUS1DJC3GWZ Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply terminals. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned OFF completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 21/24 TSZ02201-0R5R0GZ00010-1-2 8.Apr.2014 Rev.002 BUS1DJC0GWZ Datasheet BUS1DJC3GWZ Operational Notes – continued 11. Unused Input Terminals Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have voltages within the values specified in the electrical characteristics of this IC. 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO). www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 22/24 TSZ02201-0R5R0GZ00010-1-2 8.Apr.2014 Rev.002 BUS1DJC0GWZ Datasheet BUS1DJC3GWZ Ordering Information B U S 1 D J C 0 G W Z – E2 Part number Switch Number Discharge of channel FET 1:1ch D:Built in N:None Voltage resistance J:5.5V I:7.0V H:10V Output current 5:500mA A:1A C:2A Slew rate 0:None 1:Fast 3:Middle 5:Slow Package Packaging and forming specification GWZ:UCSP30L1 E2:Embossed tape and reel Marking Diagram 1Pin Mark Marking x x Part No. BUS1DJC0GWZ BUS1DJC3GWZ Lot No. Marking GV GX Physical Dimension, Tape and Reel Information UCSP50L1(BUS1DJC0GWZ (BUXXSA4WGWL) UCSP30L1 / BUS1DJC3GWZ) 0.8±0.05 0.8±0.05 0.1±0.05 0.08±0.05 0.35MAX 0.55MAX 1PIN MARK Tape Embossed carrier tape Quantity 3000pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) S 4-φ0.20±0.05 4-φ0.25±0.05 0.05 A B A 0.4 B B A 0.2±0.05 0.2±0.05 0.06 S 1 0.4 2 1pin (Unit : mm) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Reel 23/24 Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. TSZ02201-0R5R0GZ00010-1-2 8.Apr.2014 Rev.002 BUS1DJC0GWZ Datasheet BUS1DJC3GWZ Revision History Date 11.Mar.2014 8.Apr.2014 Revision 001 002 www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Changes New Release Added BUS1DJC3GWZ 24/24 TSZ02201-0R5R0GZ00010-1-2 8.Apr.2014 Rev.002 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001