BUXXTD3WG

1/4 STRUCTURE PRODUCT Silicon Monolithic Integrated Circuit CMOS-type Series Regulator NAME ＢＵＸＸＴＤ３ＷＧ Series ○ PIN DESCRIPTION PIN No. 1 VREF 5 ○ BLOCK DIAGRAM and APPLICATION CIRCUIT VIN VIN 1 PIN NAME VIN GND STBY N.C. VOUT DESCRIPTION INPUT Pin GROUND Pin OUTPUT CONTROL Pin (High: ON, Low: OFF) Cin GND 2 VOUT VOUT 2 3 4 5 OCP Co NO CONNECT OUTPUT Pin TSD VSTBY 4 STBY 3 STBY CON Discharge N.C. Cin･･･0.47μF (Ceramic) Co ･･･0.47μF (Ceramic) Fig.1 BLOCK DIAGRAM and APPLICATION CIRCUIT ○ ABSOLUTE MAXIMUM RATINGS (Ta=25℃) PARAMETER Power Supply Voltage Power Dissipation Maximum Junction Temperature Operating Temperature Range Storage Temperature Range Symbol VMAX Pd TjMAX Topr Tstg Limit -0.3 ～ +6.5 540 (*1) +125 -40 ～ +85 -55 ～ +125 Unit V mW ℃ ℃ ℃ (*1) Pd deleted at 5.4mW/℃ at temperatures above Ta=25℃, mounted on 70×70×1.6mm glass-epoxy PCB. ○ RECOMMENDED OPERATING RANGE (Not to exceed Pd) PARAMETER Power Supply Voltage Maximum Output Current Symbol VIN IMAX Limit 1.7～5.5 200 Unit V mA REV. B 2/4 ○ OPERATING CONDITIONS PARAMETER Input Capacitor Output Capacitor Symbol Cin Co MIN. 0.22 (*2) 0.22 (*2) TYP. 0.47 0.47 MAX. Unit μF μF CONDITION Ceramic capacitor recommended Ceramic capacitor recommended (*2) Make sure that the output capacitor value is not kept lower than this specified level across a variety of temperature, DC bias, changing as time progresses characteristic. ○ ELECTRICAL CHARACTERISTICS (Ta=25℃, VIN=VOUT+1.0V (*3), STBY=VIN, Cin=0.47μF, Co=0.47μF, unless otherwise noted.) Limit MIN. TYP. MAX. PARAMETER Symbol Unit Conditions Overall Device VOUT×0.99 Output Voltage Operating Current Operating Current (STBY) Ripple Rejection Ratio VOUT VOUT-25mV VOUT 35 70 280 260 240 220 2 10 VOUT×1.01 V VOUT+25mV IOUT=10μA, VOUT≧2.5V IOUT=10μA, VOUT＜2.5V IOUT=0mA STBY=0V VRR=-20dBv, fRR=1kHz, IOUT=10mA 2.5V≦VOUT≦2.6V (VIN=0.98*VOUT, IOUT=200mA) 2.7V≦VOUT≦2.85V (VIN=0.98*VOUT, IOUT=200mA) 2.9V≦VOUT≦3.1V (VIN=0.98*VOUT, IOUT=200mA) 3.2V≦VOUT≦3.4V (VIN=0.98*VOUT, IOUT=200mA) IIN ISTBY RR 45 - 60 1.0 540 500 460 420 20 80 μA μA dB mV mV mV mV mV mV Dropout Voltage VSAT - Line Regulation Load Regulation VDL VDLO - VIN=VOUT+1.0V to 5.5V (*4), IOUT=10μA IOUT=0.01mA to 100mA Over Current Protection (OCP) Limit Current Short Current ILMAX ISHORT 220 20 400 70 700 150 mA mA Vo=VOUT*0.95 Vo=0V Standby Block Discharge Resistor STBY Pin Pull-down Current STBY Control Voltage ON OFF RDSC ISTB VSTBH VSTBL 20 0.1 1.2 -0.3 50 0.6 80 2.0 5.5 0.3 Ω μA V V VIN=4.0V, STBY=0V, VOUT=4.0V STBY=1.5V ●This product is not designed for protection against radioactive rays. (*3) VIN=2.5V for VOUT≦1.5V (*4) VIN=2.5V to 5.5V for VOUT≦1.5V ○ ELECTRICAL CHARACTERISTICS of each Output Voltage (Ta=25℃, STBY=VIN, Cin=0.47μF, Co=0.47μF, unless otherwise noted.) Output Voltage 1.0V, 1.2V 1.5V 1.8V, 1.85V, 1.9V, 2.0V, 2.1V PARAMETER Maximum output current MIN. 80 200 60 200 200 TYP. 160 120 - MAX. - Unit Conditions VIN=1.7V VIN=2.1V VIN=1.8V VIN=2.2V VIN=VOUT+0.6V mA REV. B 3/4 ○ POWER DISSIPATION CURVES ○ DEVICE NAME and MARKING Device Name: 0.8 0.6 0.4 0.2 0.54 W Conditions : Mounted on glass epoxy PCB. Size : 70mm×70mm×1.6mm XX 10 12 15 18 1J 19 20 BUXXTD3WG a Description Output Voltage 1.0V typ. 1.2V typ. 1.5V typ. 1.8V typ. 1.85V typ. 1.9V typ. 2.0V typ. 2.1V typ. 2.5V typ. 2.6V typ. 2.7V typ. 2.8V typ. 2.85V typ. 2.9V typ. 3.0V typ. 3.1V typ. 3.2V typ. 3.3V typ. 3.4V typ. Marking F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 G0 G1 G2 G3 G4 G5 G6 G7 G8 Pd (W) 0 25 50 75 85 100 Ta (℃) 125 a 21 25 26 27 28 2J 29 30 31 32 Fig.2 Pd reduction (example) ○ PACKAGE DIMENSIONS (SSOP5) 33 34 Marking Lot No. Fig.3 Package dimensions (Unit : mm) REV. B 4/4 ○ OPERATION NOTES 1.) Absolute maximum ratings Use of the IC in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may result in damage to the IC. Assumptions should not be made regarding the state of the IC (e.g., short mode or open mode) when such damage is suffered. If operational values are expected to exceed the maximum ratings for the device, consider adding protective circuitry (such as fuses) to eliminate the risk of damaging the IC. 2.) GND potential The potential of the GND pin must be the minimum potential in the system in all operating conditions. Never connect a potential lower than GND to any pin, even if only transiently. 3.) Thermal design Use a thermal design that allows for a sufficient margin for that package power dissipation rating (Pd) under actual operating conditions. 4.) Inter-pin shorts and mounting errors Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting or shorts between pins may result in damage to the IC. 5.) Operation in strong electromagnetic fields Strong electromagnetic fields may cause the IC to malfunction. Caution should be exercised in applications where strong electromagnetic fields may be present. 6.) Common impedance Wiring traces should be as short and wide as possible to minimize common impedance. Bypass capacitors should be use to keep ripple to a minimum. 7.) Voltage of STBY pin To enable standby mode for all channels, set the STBY pin to 0.3 V or less, and for normal operation, to 1.2 V or more. Setting STBY to a voltage between 0.3 V and 1.2 V may cause malfunction and should be avoided. Keep transition time between high and low (or vice versa) to a minimum. Additionally, if STBY is shorted to VIN, the IC will switch to standby mode and disable the output discharge circuit, causing a temporary voltage to remain on the output pin. If the IC is switched on again while this voltage is present, overshoot may occur on the output. Therefore, in applications where these pins are shorted, the output should always be completely discharged before turning the IC on. 8.) Over-current protection circuit (OCP) This IC features an integrated over-current and short-protection circuitry on the output to prevent destruction of the IC when the output is shorted. The OCP circuitry is designed only to protect the IC from irregular conditions (such as motor output shorts) and is not designed to be used as an active security device for the application. Therefore, applications should not be designed under the assumption that this circuitry will engage. 9.) Thermal shutdown circuit (TSD) This IC also features a thermal shutdown circuit that is designed to turn the output off when the junction temperature of the IC exceeds. This feature is intended to protect the IC only in the event of thermal overload and is not designed to guarantee operation or act as an active security device for the application. Therefore, applications should not be designed under the assumption that this circuitry will engage. 10.) Input/output capacitor Capacitors must be connected between the input/output pins and GND for stable operation, and should be physically mounted as close to the IC pins as possible (refer to figure 4). The input capacitor helps to counteract increases in power supply impedance, and increases stability in applications with long or winding power supply traces. The output capacitance value is directly related to the overall stability and transient response of the regulator, and should be set to the largest possible value for the application to increase these characteristics. During design, keep in mind that in general, ceramic capacitors have a wide range of tolerances, temperature coefficients and DC bias characteristics, and that their capacitance values tend to decrease over time. Confirm these details before choosing appropriate capacitors for your application.. (Please refer the technical note, regarding ceramic capacitor of recommendation.) ESR [Ω] ESR　[Ω] Cout=0.47μF, Cin=0.47μF, Temp=+25℃ 100 Unstable region 10 1 Stable region 0.1 0.01 0 50 100 IOUT[mA] IOUT [mA] 150 200 Fig.4 Stable region (example) REV. B Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. 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