Datasheet
Load Switch IC
34 V Breakdown Voltage
Variable Overcurrent Detection
1ch Load Switch
BV1HAL45EFJ
General Description
Key Specifications
BV1HAL45EFJ is a single Nch MOSFET high side load
switch applicable to 8.0 V to 32.0 V input. It has a built-in
overcurrent protection, Thermal shutdown protection,
soft-start function and low power output OFF function. It
is equipped with error flag notification pin to indicate
thermal shutdown and overcurrent. Single chip power
supply management is possible.
◼
◼
◼
◼
◼
Package
W (Typ) x D (Typ) x H (Max)
4.9 mm x 6.0 mm x 1.0 mm
HTSOP-J8
Features
◼
◼
◼
◼
◼
◼
◼
Input Voltage Range:
8.0 V to 32.0 V
Output ON Resistance:
45mΩ (Typ)
Variable Overcurrent Detection: 3.4 A to 10.0 A (Typ)
Standby Current:
0.5 μA (Max)
Operating Temperature Range:
-40 °C to +85 °C
Dual TSD(Note 1)
Low On-Resistance Single Nch MOSFET Switch
Variable Output Soft-Start Time
Overcurrent Protection Function (Latch-Off)
Thermal Shutdown Protection Function (TSD)
Low Voltage Output OFF Function (UVLO)
Error Flag Notification Pin
(Note 1) This IC has thermal shutdown function (Junction temperature
detect) and ΔTj Protection function (Power-MOS
steep temperature rising detect).
Applications
◼ Multifunction Machine and TV
◼ Overcurrent Monitoring of Various Power Lines and
Power Management
Application Circuit
12 V / 24 V
C IN = 1 µF
IN
SS
OUT
ILIM
OUT
GND
N.C.
R SS
C OUT
Load
RLIM
10 kΩ to
100 kΩ
EN
FLAG
〇Product structure : Silicon integrated circuit
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〇This product has no designed protection against radioactive rays.
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Table of Contents
General Description ........................................................................................................................................................................ 1
Features.......................................................................................................................................................................................... 1
Applications .................................................................................................................................................................................... 1
Key Specifications .......................................................................................................................................................................... 1
Package .......................................................................................................................................................................................... 1
Application Circuit ........................................................................................................................................................................... 1
Table of Contents ........................................................................................................................................................................... 2
Pin Configuration ............................................................................................................................................................................ 3
Pin Description................................................................................................................................................................................ 3
Block Diagram ................................................................................................................................................................................ 3
Definition ......................................................................................................................................................................................... 4
Absolute Maximum Ratings ............................................................................................................................................................ 5
Thermal Resistance ........................................................................................................................................................................ 6
Recommended Operating Conditions ........................................................................................................................................... 10
Electrical Characteristics............................................................................................................................................................... 10
Typical Performance Curves......................................................................................................................................................... 11
Measurement Setup ..................................................................................................................................................................... 17
Timing Chart ................................................................................................................................................................................. 19
Function Description ..................................................................................................................................................................... 20
1. Truth Table ............................................................................................................................................................................ 20
2. Overcurrent Protection .......................................................................................................................................................... 21
2.1 Latch-off due to Fixed Overcurrent Limit (IOCD1)............................................................................................................... 21
2.2 Duration of Fixed Overcurrent Limit (IOCD1) is less than tBLANK ......................................................................................... 23
2.3 Latch-off due to Variable Overcurrent Detection (IOCD2) ................................................................................................... 25
2.4 Duration of Variable Overcurrent Detection (IOCD2) is less than tBLANK .............................................................................. 25
2.5 Setting Variable Overcurrent Detection ............................................................................................................................ 26
3. Setting Soft Start Function .................................................................................................................................................... 27
4. Thermal Shutdown Function, ΔTj Protection Function .......................................................................................................... 30
4.1 Thermal Shutdown Function ............................................................................................................................................ 30
4.2 ΔTj Protection Function.................................................................................................................................................... 30
4.3 The case of connecting the capacitance load .................................................................................................................. 31
5. Output Load is Open ............................................................................................................................................................. 37
I/O Equivalence Circuit ................................................................................................................................................................. 37
Operational Notes ......................................................................................................................................................................... 38
Ordering Information ..................................................................................................................................................................... 40
Marking Diagram .......................................................................................................................................................................... 40
Physical Dimension and Packing Information ............................................................................................................................... 41
Revision History ............................................................................................................................................................................ 42
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BV1HAL45EFJ
Pin Configuration
HTSOP-J8
(TOP VIEW)
Pin Description
Pin No.
Pin Name
1
SS
Function
Variable soft-start time setting pin
2
ILIM
Variable overcurrent detection setting pin
3
GND
Ground pin
4
FLAG
5
EN
6
N.C.
Error flag output pin (Active low when TSD and OCD is detected.)
Enable pin (Pull-down resistor is connected internally.)
Active High to turn on the switch
Not connected pin(Note 1)
7,8
OUT
Switch output pin
EXP-PAD
IN
Power input pin, switch input pin
(Note 1) GND short connection is recommended for the N.C. pin. It can also be open since the N.C. pin is not connected inside the IC.
Block Diagram
IN
Control
Gate Control
Clamp
CLK
Charge
Pump
Power MOS FET
Gate Driver
OUT
EN
lnternal
supply
SS
Protect
Control
Logic
TSD
FLAG
UVLO
for TSD,OCP
ILIM
OCD
GND
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BV1HAL45EFJ
Definition
IN
IEN
IIN
VDS
EN
VIN
IOUT
OUT
VOUT
ISS
IFLAG
FLAG
SS
VFLAG
IILIM
VILIM
VSS
VEN
ILIM
GND
IGND
Figure 1. Voltage and Current Definition
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BV1HAL45EFJ
Absolute Maximum Ratings (Ta = 25 °C)
Item
Symbol
Power Supply Output Voltage
VDS
Rating
-0.3 to Internal
unit
limit(Note 1)
V
Power Supply Voltage (IN)
VIN
-0.3 to +34
V
Storage Temperature Range
Tstg
-55 to +150
°C
Tjmax
150
°C
VEN
-0.3 to +7.0
V
VFLAG
-0.3 to +7.0
V
Maximum Junction Temperature
EN Input Voltage
FLAG Output Voltage
Internal
limit(Note 2)
Output Current
IOUT
FLAG Output Current
IFLAG
10
mA
A
Active Clamp Capability (single pulse)
Tj(START) = 25 °C, IOUT(START) = 1 A(Note 3)(Note 4)
EAS
53.2
mJ
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated
over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing
board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 1) Internal limit according to output clamp voltage
(Note 2) Internal limit according to fixed overcurrent limit
(Note 3) This is the maximum value of active clamp tolerance (single pulse) under the conditions of IOUT(START) = 1 A, VIN = 24 V.
The OUT pin potential drops less than 0 V during turned off when L load is connected in the OUT pin.
The energy at this time is consumed in BV1HAL45EFJ. This energy is expressed in the equation below.
𝐸𝐴𝑆 = 𝑉𝐷𝑆 ×
𝑅𝐿 × 𝐼𝑂𝑈𝑇(𝑆𝑇𝐴𝑅𝑇)
𝐿
𝑉𝐼𝑁 − 𝑉𝐷𝑆
×[
× 𝑙𝑛 (1 −
) + 𝐼𝑂𝑈𝑇(𝑆𝑇𝐴𝑅𝑇) ]
𝑅𝐿
𝑅𝐿
𝑉𝐼𝑁 − 𝑉𝐷𝑆
Following equation simplifies under the assumption of RL = 0 Ω.
𝐸𝐴𝑆 =
1
𝑉𝐼𝑁
× 𝐿 × 𝐼𝑂𝑈𝑇(𝑆𝑇𝐴𝑅𝑇) 2 × ( 1 −
)
2
𝑉𝐼𝑁 − 𝑉𝐷𝑆
(Note 4) Not 100 % tested.
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Thermal Resistance(Note 1)
Parameter
Symbol
Typ
Unit
Condition
121.2
°C/W
1s
(Note 2)
37.2
°C/W
2s
(Note 3)
25.3
°C/W
2s2p
(Note 4)
HTSOP-J8
Between Junction and Surroundings Temperature
Thermal Resistance
θJA
(Note 1) The thermal impedance is based on JESD51-2A (Still-Air) standard. It is used in the chip of BV1HAL45EFJ.
(Note 2) JESD51-3 standard FR4 114.3 mm x 76.2 mm x 1.57 mm 1-layer (1s)
(Top copper foil: ROHM recommended Footprint + wiring to measure, 2 oz. copper.)
(Note 3) JESD51-5 standard FR4 114.3 mm x 76.2 mm x 1.60 mm 2-layers (2s)
(Top copper foil: ROHM recommended Footprint + wiring to measure / Copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm,
copper (top & reverse side) 2 oz.)
(Note 4) JESD51-5/- 7 standard FR4 114.3 mm x 76.2 mm x 1.60 mm 4-layers (2s2p)
(Top copper foil: ROHM recommended Footprint + wiring to measure / 2 inner layers and copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm,
copper (top & reverse side/inner layers) 2 oz./1 oz.)
■ PCB Layout 1 Layer (1s)
Figure 2. PCB Layout 1 Layer (1s)
Dimension
Value
Board Finish Thickness
1.57 mm ± 10 %
Board Dimension
76.2 mm x 114.3 mm
Board Material
FR4
Copper Thickness (Top/Bottom Layers)
0.070 mm (Cu : 2 oz)
2
Copper Foil Area Dimension
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2
Footprint / 100 mm / 600 mm / 1200 mm
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BV1HAL45EFJ
Thermal Resistance – continued
■
PCB Layout 2 Layers (2s)
Figure 3. PCB Layout 2 Layers (2s)
Dimension
Value
Board Finish Thickness
1.60 mm ± 10 %
Board Dimension
76.2 mm x 114.3 mm
Board Material
FR4
Copper Thickness (Top/Bottom Layers)
0.070 mm (Cu +Plating)
Thermal Vias Separation / Diameter
1.2 mm / 0.3 mm
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Thermal Resistance – continued
■ PCB Layout 4 Layers (2s2p)
Figure 4. PCB Layout 4 Layers (2s2p)
Dimension
Value
Board Finish Thickness
1.60 mm ± 10 %
Board Dimension
76.2 mm x 114.3 mm
Board Material
FR4
Copper Thickness (Top/Bottom Layers)
0.070 mm (Cu +Plating)
Copper Thickness (Inner Layers)
0.035 mm
Thermal Vias Separation / Diameter
1.2 mm / 0.3 mm
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Thermal Resistance – continued
■ Transient Thermal Resistance (Single Pulse)
1000
θJA [ °C/W]
100
10
1s footprint
1
2s
2s2p
0
0.0001
0.001
0.01
0.1
1
Pulse Time [s]
10
100
1000
Figure 5. θJA vs Pulse Time
■ Thermal Resistance (θJA vs Copper foil area - 1s)
140
120
θJA [ °C/W]
100
80
60
40
20
0
0
200
400
600
800
Copper Foil Area (1s) [mm2]
1000
1200
Figure 6. θJA vs Copper Foil Area (1s)
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Recommended Operating Conditions
Parameter
Power
Supply(Note 1)
Operating Temperature
Symbol
Min
Typ
Max
Unit
VIN
8.0
-
32.0
V
Topr
-40
-
+85
°C
(Note 1) Do not exceed the maximum junction temperature.
Electrical Characteristics (Unless otherwise specified VIN = 8.0 V to 32.0 V, Tj = -40 °C to +85 °C, RLIM = 100 kΩ)
Parameter
Symbol
Min
Typ
Max
Unit
Standby Current
ISTB
-
-
0.5
µA
Operating Current
ICC
-
2.00
3.50
mA
Condition
[Power Supply]
VIN = 24 V, VEN = 0 V,
Tj = 25 °C
VIN = 24 V, VEN = 5 V,
Tj = 25 °C
UVLO Detection Voltage
VUVLO
-
-
6.0
V
UVLO Hysteresis Voltage
VUVHYS
0.5
0.9
1.3
V
EN High Voltage
VENH
2.1
-
-
V
EN Low Voltage
VENL
-
-
0.9
V
EN Hysteresis Voltage
VENHYS
0.10
0.45
0.80
V
EN High Input Current
IENH
-
50
100
μA
VEN = 5 V
EN Low Input Current
IENL
-1
-
+1
μA
VEN = 0 V
Output ON Resistance
RON
-
45
60
mΩ
Output Leakage Current
ILSW
-
-
0.5
µA
Output ON Slew Rate
SRON
0.24
0.40
0.56
V/ms
Output OFF Slew Rate
SROFF
-
0.10
0.30
V/μs
Output ON Delay Time
tON
36
60
84
ms
Output OFF Delay Time
tOFF
-
360
900
μs
VDSCLP
45
50
55
V
VEN = 5 V, Tj = 25 °C
VEN = 0 V, VOUT = 0 V,
Tj = 25 °C
VIN = 24 V, Tj = 25 °C
RSS = 100 kΩ, RL = 100 Ω,
VOUT:20 %→80 %
VIN = 24 V, Tj = 25 °C
RSS = 100 kΩ, RL = 100 Ω,
VOUT:80 %→20 %
VIN = 24 V, Tj = 25 °C
RSS = 100 kΩ, RL = 100 Ω,
VEN:50 %→VOUT:80 %
VIN = 24 V, Tj = 25 °C
RSS = 100 kΩ, RL = 100 Ω,
VEN:50 %→VOUT:20 %
VEN = 0 V,
IOUT = 10 mA
FLAG Low Output Voltage
VFLAG
-
-
0.5
V
IFLAG = 1 mA
FLAG Pin Leakage Current
ILFLAG
-
-
1
µA
VFLAG = 5 V
FLAG Output Delay Time
tBLANK
15
30
45
ms
The time from overcurrent
detection to VFLAG = Low.
Thermal Shutdown Detection(Note 1)
TTSD
150
175
200
°C
Thermal Shutdown Hysteresis(Note 1)
TTSDHYS
-
15
-
°C
TDTJ
-
105
-
°C
[Input (VEN)]
[Power MOS Output]
Output Clamp Voltage
[FLAG]
[Diagnostic Functions]
ΔTj
Protection(Note 1)
ΔTj Protection
Hysteresis(Note 1)
TDTJHYS
-
30
-
°C
Fixed Overcurrent Limit
IOCD1
17.4
26.0
34.6
A
Tj = 25 °C
Variable Overcurrent Detection
IOCD2
3.7
5.8
7.9
A
RLIM = 100 kΩ, Tj = 25 °C
(Note 1) Not 100 % tested.
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Typical Performance Curves
0.6
0.6
0.4
0.4
Standby Current: ISTB [μA]
Standby Current: ISTB [μA]
(Unless otherwise specified VIN = 24 V, VEN = 5 V, Tj = 25 °C)
0.2
0
-0.2
0
-0.2
-0.4
-0.4
VEN = 0 V
-0.6
VEN = 0 V
-0.6
0
5
10
15
20
25
Supply Voltage: VIN [V]
30
35
-50
Figure 7. Standby Current vs Supply Voltage
-25
0
25
50
75
Junction Temperature: Tj [°C]
100
Figure 8. Standby Current vs Junction Temperature
3.5
3.5
3.0
3.0
Operating Current: ICC [mA]
Operating Current: ICC [mA]
0.2
2.5
2.0
1.5
1.0
VEN = 5 V
0.5
2.5
2.0
1.5
1.0
VEN = 5 V
0.5
0.0
0.0
0
5
10
15
20
25
Supply Voltage: VIN [V]
30
35
-50
Figure 9. Operating Current vs Supply Voltage
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-25
0
25
50
75
Junction Temperature: Tj [°C]
100
Figure 10. Operating Current vs Junction Temperature
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Typical Performance Curves – continued
(Unless otherwise specified VIN = 24 V, VEN = 5 V, Tj = 25 °C)
1.4
1.2
UVLO Hysteresis Voltage: VUVHYS [V]
UVLO Detection Voltage: VUVLO [V]
5
4
3
2
1
0
0.8
0.6
0.4
0.2
0.0
-50
-25
0
25
50
75
Junction Temperature: Tj [°C]
100
Figure 11. UVLO Detection Voltage vs Junction Temperature
-50
-25
0
25
50
75
Junction Temperature: Tj [°C]
100
Figure 12. UVLO Hysteresis Voltage vs Junction Temperature
4.0
150
3.5
125
3.0
EN Input Current: IENH,IENL [μA]
EN Voltage: VENH, VENL [V]
1.0
100
2.5
VENH
2.0
1.5
1.0
VENL
0.5
75
IENH
50
25
IENL
0.0
0
-50
-25
0
25
50
75
Junction Temperature: Tj [°C]
100
Figure 13. EN Voltage vs Junction Temperature
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-50
-25
0
25
50
75
Junction Temperature: Tj [°C]
100
Figure 14. EN Input Current vs Junction Temperature
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Typical Performance Curves – continued
0.8
80
0.7
70
Output ON Resistance: RON [mΩ]
EN Hysteresis Voltage: VENHYS [V]
(Unless otherwise specified VIN = 24 V, VEN = 5 V, Tj = 25 °C)
0.6
0.5
0.4
0.3
0.2
0.1
60
50
40
30
20
10
0
0
-50
-25
0
25
50
75
Junction Temperature: Tj [°C]
100
0
Figure 15. EN Hysteresis Voltage vs Junction Temperature
10
15
20
25
Supply Voltage: VIN [V]
30
35
Figure 16. Output ON Resistance vs Supply Voltage
0.6
100
0.4
Output Leakage Current: ILSW [μA]
120
Output ON Resistance: RON [mΩ]
5
80
60
40
0.2
0
-0.2
20
-0.4
0
-0.6
-80
-40
0
40
80
120 160
Junction Temperature: Tj [°C]
200
Figure 17. Output ON Resistance vs Junction Temperature
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-50
-25
0
25
50
75
Junction Temperature: Tj [°C]
100
Figure 18. Output Leakage Current vs Junction Temperature
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Typical Performance Curves – continued
(Unless otherwise specified VIN = 24 V, VEN = 5 V, Tj = 25 °C)
1.20
0.2
Output ON Slew Rate: SRON [V/ms]
RSS = 100 kΩ
RL = 100 Ω
Output OFF Slew Rate: SROFF [V/us]
RSS = 100 kΩ
RL = 100 Ω
1.05
0.90
0.15
0.75
0.60
0.45
0.30
0.1
0.05
0.15
0.00
0
-50
-25
0
25
50
75
Junction Temperature: Tj [°C]
100
Figure 19. Output ON Slew Rate vs Junction
Temperature
-50
-25
0
25
50
75
Junction Temperature: Tj [°C]
100
Figure 20. Output OFF Slew Rate vs Junction Temperature
100
500
450
Output OFF Delay Time: tOFF [μs]
Output ON Delay Time: tON [ms]
90
80
70
400
60
50
350
40
300
30
20
RSS = 100 kΩ
RL = 100 Ω
250
10
0
200
-50
-25
0
25
50
75
Junction Temperature: Tj [°C]
Figure 21. Output ON Delay Time vs Junction
Temperature
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100
-50
-25
0
25
50
75
Junction Temperature: Tj [°C]
100
Figure 22. Output OFF Delay Time vs Junction Temperature
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Typical Performance Curves – continued
(Unless otherwise specified VIN = 24 V, VEN = 5 V, Tj = 25 °C)
0.5
70
FLAG Low Output Voltage: VFLAG [V]
Output Clamp Voltage: VDSCLP [V]
80
60
50
40
30
20
IOUT = 10 mA
VEN = 0 V
10
0
0.4
0.3
0.2
0.1
0.0
-50
-25
0
25
50
75
Junction Temperature: Tj [°C]
100
-50
0
25
50
75
Junction Temperature: Tj [°C]
100
Figure 24. FLAG Low Output Voltage vs Junction
Temperature
45
30
40
29
Fixed Overcurrent Detection: IOCD1 [A]
FLAG Output Delay TIme: tBLANK [ms]
Figure 23. Output Clamp Voltage vs Junction
Temperature
-25
35
30
25
20
15
10
5
0
28
27
26
25
24
23
22
21
20
-50
-25
0
25
50
75
Junction Temperature: Tj [°C]
100
Figure 25. FLAG Output Delay Time vs Junction
Temperature
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-50
-25
0
25
50
75
Junction Temperature: Tj [°C]
100
Figure 26. Fixed Overcurrent Limit vs Junction Temperature
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Typical Performance Curves – continued
(Unless otherwise specified VIN = 24 V, VEN = 5 V, Tj = 25 °C)
1000
10
8
Active Clamp Energy: EAS [mJ]
Variable Overcurrent Detection: IOCD2 [A]
9
7
6
5
4
3
2
100
Tj(START) = 25 ºC
Tj(START) = 150 ºC
10
1
1
0
-50
-25
0
25
50
75
Junction Temperature: Tj [°C]
100
Figure 27. Variable Overcurrent Detection vs Junction
Temperature
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0.1
1.0
Output Current: IOUT [A]
10.0
Figure 28. Active Clamp Energy vs Output Current
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Measurement Setup
VIN
VIN
IN
IN
SS
SS
OUT
OUT
ILIM
ILIM
EN
FLAG
5.1 kΩ
EN
FLAG
GND
GND
VEN
VEN
VFLAG
Figure 29. Standby Current
EN Low Input Current
Output Leakage Current
FLAG Pin Leakage Current
Figure 30. Operating Current
VIN
VIN
IN
SS
IN
SS
OUT
OUT
IOUT
ILIM
ILIM
1 kΩ
EN
EN
FLAG
FLAG
GND
VEN
GND
Figure 31. UVLO Detection Voltage
UVLO Hysteresis Voltage
EN High Voltage
EN Low Voltage
EN Hysteresis Voltage
EN High Input Current
EN Low Input Current
Thermal Shutdown Detection
Thermal Shutdown Hysteresis
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VEN
Figure 32. Output ON Resistance
Output Clamp Voltage
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Measurement Setup – continued
VIN
VIN
IN
IN
SS
SS
100 Ω
RSS
ILIM
Monitor
5.1 kΩ
VFLAG
VEN
VFLAG
EN
FLAG
Monitor
GND
5.1 kΩ
I OUT
ILIM
EN
FLAG
Monitor
OUT
OUT
Figure 33. Output ON Slew Rate
Output OFF Slew Rate
Output ON Delay Time
Output OFF Delay Time
FLAG Output Delay Time
GND
VEN
Figure 34. FLAG Low Output Voltage
VIN
IN
SS
OUT
IOUT
ILIM
RLIM
EN
FLAG
Monitor
5.1 kΩ
GND
VEN
VFLAG
Figure 35. Fixed Overcurrent Limit
Variable Overcurrent Detection
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Timing Chart
Input Voltage
VIN
t
EN Voltage
VEN
50 %
50 %
t
tOFF
tON
80 %
Output Voltage
VOUT
80 %
20 %
20 %
t
SRON
SROFF
Error Flag
VFLAG
t
Figure 36. Output ON / OFF Timing Chart
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Function Description
1. Truth Table
Control
Logic
EN
Input
Voltage
VIN
Table 1. Protection Detection and Error FLAG Output
Junction
Output
Output State
Error Flag Output
Temperature
Current
OUT
VFLAG
Tj
IOUT
Mode
IOUT < IOCD2
ON
H
Normal
IOUT > IOCD2
ON
H
Overcurrent
Detection
IOUT > IOCD2
tBLANK after
Latch Off
L
Latch Off (Note 1)
IOUT > IOCD1
Output
Limited
H
Overcurrent
Limitation
Tj > TTSD
-
OFF
L
TSD protection
ΔTj(Note 2 ) > TDTJ
-
OFF
L
ΔTj protection
VIN < VUVLO
-
-
OFF
H
Stand-by
-
-
-
OFF
H
Stand-by
Tj < TTSD
VIN > VUVLO
H
L
(Note 1) When thermal shutdown protection is triggered while overcurrent protection is active, output is Latch Off even if t < tBLANK. The condition of Latch Off release is
switching of EN voltage (VEN) or IN voltage (VIN).
(Note 2) The temperature difference of Power MOS FET and control in the IC.
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Function Description – continued
2. Overcurrent Protection
This IC has two overcurrent detection functions: Fixed Overcurrent Limit (IOCD1) to protect the IC and Variable Overcurrent
Detection (IOCD2) to protect the load. Variable Overcurrent Detection (IOCD2) is set by an external resistor RLIM at the ILIM
Pin.
2.1 Latch-off due to Fixed Overcurrent Limit (IOCD1)
Figure 37 and Figure 38 show the timing chart of the Latch-off function when Fixed Overcurrent Limit (IOCD1) is
detected.
④
EN Voltage
VEN
t
③
Output Voltage
VOUT
t
①
Output Current
IOUT
②
IOCD1
IOCD2
Latch-off
Normal Current
tSS
t
tBLANK
Error FLAG
VFLAG
t
Figure 37. The timing chart with Latch-off when IOUT after Fixed Overcurrent Limit (IOCD1) detection is equal to IOCD2 or higher
①
②
③
④
When IOUT exceeds the Fixed Overcurrent Limit (IOCD1), IOUT decreases momentarily then becomes
IOUT ≥ IOCD2.
IOUT increases until it reaches IOCD1.
The time it takes for IOUT = IOCD1 (tSS) depends on the setting of Soft Start Function by external resistor R SS (Table
3, 4). When IOUT = IOCD1, Output voltage (VOUT) = Load resistance (RL) × Fixed Overcurrent Limit (IOCD1)
When IOUT exceeds the Variable Overcurrent Detection (IOCD2) and the duration exceeds tBLANK, output is latched
off and Error FLAG VFLAG is set to Low.
When EN is turned OFF, Latch-Off function is released and Error FLAG VFLAG is set to High.
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2.1 Latch-off due to Fixed Overcurrent Limit (IOCD1) – continued
④
EN Voltage
VEN
t
③
Output Voltage
VOUT
t
①
Output Current
IOUT
Latch-off
②
IOCD1
IOCD2
Normal Current
t
tSS
tBLANK
Error FLAG
VFLAG
t
Figure 38. The timing chart with Latch-off when IOUT after Fixed Overcurrent Limit (IOCD1) detection is less than IOCD2
①
②
③
④
When IOUT exceeds the Fixed Overcurrent Limit (IOCD1), IOUT decreases momentarily then becomes
IOUT < IOCD2.
IOUT increases until it reaches IOCD1.
The time it takes for IOUT = IOCD1 (tSS) depends on the setting of Soft Start Function by external resistor R SS (Table
3, 4). When IOUT = IOCD1, Output voltage (VOUT) = Load resistance (RL) × Fixed Overcurrent Limit (IOCD1)
When IOUT exceeds the Variable Overcurrent Detection (IOCD2) and the duration exceeds tBLANK, output is latched
off and Error FLAG VFLAG is set to Low.
When EN is turned OFF, Latch-Off function is released and Error FLAG VFLAG is set to High.
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2. Overcurrent Protection – continued
2.2 Duration of Fixed Overcurrent Limit (IOCD1) is less than tBLANK
Figure 39 and Figure 40 show the timing chart without the Latch-off function when Fixed Overcurrent Limit (IOCD1) is
detected.
EN Voltage
VEN
t
③
④
Output Voltage
VOUT
t
①
Output Current
IOUT
②
IOCD1
IOCD2
Normal Current
tSS
t
tBLANK
Error FLAG
VFLAG
t
Figure 39. The timing chart without Latch-off when IOUT after Fixed Overcurrent Limit (IOCD1) detection is equal to IOCD2 or higher
①
②
③
④
When IOUT exceeds the Fixed Overcurrent Limit (IOCD1), IOUT decreases momentarily then becomes
IOUT ≥ IOCD2.
IOUT increases until it reaches IOCD1.
The time it takes for IOUT = IOCD1 (tSS) depends on the setting of Soft Start Function by external resistor RSS (Table
3, 4). When IOUT = IOCD1, Output voltage (VOUT) = Load resistance (RL) × Fixed Overcurrent Limit (IOCD1)
When the duration where IOUT exceeds the Variable Overcurrent Detection (IOCD2) is less than tBLANK,
the output does not latch off.
Indicates tBLANK.
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2.2 Duration of Fixed Overcurrent Limit (IOCD1) is less than tBLANK – continued
EN Voltage
VEN
t
③
④
Output Voltage
VOUT
t
①
Output Current
IOUT
②
IOCD1
IOCD2
Normal Current
t
tSS
tBLANK
Error FLAG
VFLAG
t
Figure 40. The timing chart without Latch-off when IOUT after Fixed Overcurrent Limit (IOCD1) detection is less than IOCD2
①
②
③
④
When IOUT exceeds the Fixed Overcurrent Limit (IOCD1), IOUT decreases momentarily then becomes
IOUT < IOCD2.
IOUT increases until it reaches IOCD1.
The time it takes for IOUT = IOCD1 (tSS) depends on the setting of Soft Start Function by external resistor RSS (Table
3, 4). When IOUT = IOCD1, Output voltage (VOUT) = Load resistance (RL) × Fixed Overcurrent Limit (IOCD1)
When the duration where IOUT exceeds the Variable Overcurrent Detection (IOCD2) is less than tBLANK,
the output does not latch off.
Indicates tBLANK.
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2. Overcurrent Protection – continued
2.3 Latch-off due to Variable Overcurrent Detection (IOCD2)
Figure 41 shows the timing chart of the Latch-off function when Variable Overcurrent Detection (IOCD2) is detected.
③
EN Voltage
VEN
t
①
②
Output Voltage
VOUT
t
Latch-off
Output Current
IOUT
IOCD1
IOCD2
Normal Current
t
tBLANK
Error FLAG
VFLAG
Figure 41. The timing chart of Latch-off function due to Variable Overcurrent Detection (IOCD2)
①
②
③
t
When IOUT exceeds the Variable Overcurrent Detection (IOCD2) but is the Fixed Overcurrent Limit (IOCD1) or less,
IOUT is not limited.
When IOUT exceeds the Variable Overcurrent Detection (IOCD2) and the duration exceeds tBLANK, output is latched
off and Error FLAG is set to Low.
When EN is turned OFF, Latch-Off function is released and Error FLAG is set to High.
2.4 Duration of Variable Overcurrent Detection (IOCD2) is less than tBLANK
Figure 42 shows the timing chart without the Latch-off function when Variable Overcurrent Detection (IOCD2) is
detected.
EN Voltage
VEN
t
①
Output Voltage
VOUT
②
③
t
Output Current
IOUT
IOCD1
IOCD2
Normal Current
t
tBLANK
Error FLAG
VFLAG
t
Figure 42. The timing chart of Variable Overcurrent Detection (IOCD2) without latch-off function
①
②
③
When IOUT exceeds the Variable Overcurrent Detection (IOCD2) but is the Fixed Overcurrent Limit (IOCD1) or less,
IOUT is not limited.
When the duration where IOUT exceeds the Variable Overcurrent Detection (IOCD2) is less than tBLANK,
the output does not latch off.
Indicates tBLANK.
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2. Overcurrent Protection – continued
2.5 Setting Variable Overcurrent Detection
This IC has a Variable Overcurrent Detection (IOCD2) that can be set by an external resistor RLIM. The Variable
Overcurrent Detection (IOCD2) value is set by RLIM value as shown below. RLIM should be set from 50 kΩ to 200 kΩ.
Table 2. Variable Overcurrent Detection against RLIM Value
Variable Overcurrent Detection (IOCD2) [A]
RLIM [kΩ]
Min
Typ
Max
50
6.48
9.94
13.42
70
5.53
8.51
11.49
100
3.77
5.80
7.83
120
3.26
5.01
6.77
130
3.01
4.63
6.25
170
2.21
3.41
4.60
200
2.18
3.35
4.52
16
Variable Overcurernt Detection: IOCD2 [A]
Max
14
Typ
Min
12
10
8
6
4
2
0
0
50
100
150
200
250
RLIM [kΩ]
Figure 43. Variable Overcurrent Detection vs RLIM
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Function Description – continued
3. Setting Soft Start Function
This IC has a soft start function that can be set by an external resistor R SS.
The output on delay time (tON) and output on slew rate (SRON) set against RSS value at VIN = 12 V and VIN = 24 V is
shown below. Set RSS within 15 kΩ to 120 kΩ range. (Note 1) (Note 2)
15
Table 3. Output On Delay Time against RSS Value (Tj = 25 °C)
Output ON Delay Time (tON) [ms]
VIN = 12 V
VIN = 24 V
Min
Typ
Max
Min
Typ
7.08
11.79
16.51
8.26
13.77
Max
19.27
20
8.48
14.14
19.79
9.98
16.63
23.28
30
11.51
19.18
26.85
13.20
21.99
30.79
40
14.38
23.97
33.56
15.83
26.39
36.95
50
17.14
28.57
40.00
19.74
32.90
46.06
60
19.93
33.21
46.49
23.00
38.34
53.67
100
31.80
53.00
74.20
36.00
60.00
84.00
120
38.43
64.05
89.67
42.78
71.30
99.82
RSS [kΩ]
120
Max
Output ON Delay Time: tON [ms]
VIN = 12 V,
Tj = 25 °C
Typ
100
Min
80
60
40
20
0
0
20
40
60
RSS [kΩ]
80
100
120
140
Figure 44. Output ON Delay Time vs RSS (VIN = 12 V, Tj = 25 °C)
(Note 1) In the case that VIN is 12 V, the Approximate expression for the output rising edge delay time (tON) set against RSS value is expressed in the equation
below.
𝑡𝑂𝑁 (𝑇𝑦𝑝) = 0.50 × 𝑅𝑆𝑆 + 4.32
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3. Setting Soft Start Function – continued
120
Max
100
Output ON Delay Time: tON [ms]
VIN = 24 V,
Tj = 25 °C
Typ
Min
80
60
40
20
0
0
20
40
60
RSS [kΩ]
80
100
120
140
Figure 45. Output ON Delay Time vs RSS (VIN = 24 V, Tj = 25 °C)
(Note 2) In the case that VIN is 24 V, the Approximate expression for the output rising edge delay time (tON) set against RSS value is expressed in the equation
below.
𝑡𝑂𝑁 (𝑇𝑦𝑝) = 0.55 × 𝑅𝑆𝑆 + 5.55
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3. Setting Soft Start Function – continued
Table 4. Output ON Slew Rate against RSS Value (Tj = 25 °C)
Output ON Slew Rate (SRON) [V/ms]
RSS [kΩ]
VIN = 12 V
VIN = 24 V
Min
Typ
Max
Min
Typ
0.72
1.21
1.69
1.09
1.82
15
0.61
1.01
1.42
0.94
1.57
20
Max
2.55
2.19
30
0.45
0.74
1.04
0.67
1.11
1.56
40
0.36
0.60
0.84
0.55
0.92
1.28
50
0.30
0.50
0.70
0.46
0.76
1.07
60
0.26
0.43
0.60
0.40
0.66
0.93
100
0.16
0.27
0.38
0.24
0.40
0.56
120
0.13
0.22
0.31
0.20
0.34
0.47
2
Output ON Slew Rate: SRON [V/ms]
Max
VIN = 12 V,
Tj = 25 °C
Typ
Min
1
0
0
20
40
60
RSS [kΩ]
80
100
120
140
Figure 46. Output ON Slew Rate vs RSS (VIN = 12 V, Tj = 25 °C)
Output ON Slew Rate: SRON [V/ms]
3
VIN = 24 V,
Tj = 25 °C
Max
2
Typ
Min
1
0
0
20
40
60
RSS [kΩ]
80
100
120
140
Figure 47. Output ON Slew Rate vs RSS (VIN = 24 V, Tj = 25 °C)
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Function Description – continued
4. Thermal Shutdown Function, ΔTj Protection Function
4.1 Thermal Shutdown Function (Thermal Shutdown Detection TTSD, Thermal Shutdown Hysteresis TTSDHYS)
This IC has a built-in TSD function. When the temperature of the IC reaches Thermal Shutdown Detection (TTSD) =
175 °C (Typ) or more, the output is turned off, and the FLAG outputs Low. Hysteresis (TTSDHYS) is installed for thermal
shutdown function, and output automatically returns to normal when chip temperature become 160 °C (Typ) or less.
The condition for Latch-Off is when Variable Overcurrent Detection (IOCD2) is reached and the temperature of IC
reaches Thermal Shutdown Detection (TTSD) = 175 °C (Typ) or more. The condition for Latch-off Release is the
switching of EN voltage (VEN) or IN voltage (VIN).
4.2 ΔTj Protection Function (ΔTj Protection TDTJ, ΔTj Protection Hysteresis TDTJHYS)
This IC has a ΔTj protection function. The output is turned off when chip temperature difference (ΔTj) of Power MOS
FET (TPOWER-MOS) and control (TAMB) in the IC rises to 105 °C (Typ) or more. Furthermore, hysteresis (TDTJHYS) is
installed for ΔTj protection function, and returns to its normal state when ΔTj becomes 75 °C (Typ) or less.
Figure 48 is shown that the timing chart of thermal shutdown function and ΔTj protection function with Latch-off
function.
The condition for Latch-off is when Thermal Shutdown Detection (TTSD) is operated and Variable Overcurrent
Detection (IOCD2) is reached.
EN
I OCD1
I OCD2
I OUT
T POWER-MOS
Thermal Shutdown Detection
T TSD
Δ Tj Protection
Detect
T DTJ
TAMB
T DTJ - T DTJHYS
Tj
FLAG
ΔTj Protection Operation
Latch-off
Latch-off Release
Figure 48. Timing chart of thermal shutdown function and ΔTj protection function with Latch-off function
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4.2 ΔTj Protection Function (ΔTj Protection TDTJ, ΔTj Protection Hysteresis TDTJHYS) – continued
Figure 49 is shown that the timing chart of thermal shutdown function and ΔTj protection function without Latch-off
function.
The condition for without the activation of the Latch-off is when Thermal Shutdown Detection (TTSD) is operated and
Variable Overcurrent Detection (IOCD2) is not reached.
EN
I OCD1
I OCD2
I OUT
T POWER-MOS
Thermal Shutdown
Detection
T TSD
TTSDHYS
Δ Tj Protection
Detect
TAMB
TDTJ - T DTJHYS
T DTJ
Tj
FLAG
ΔTj Protection Operation
TSD Operation
Enable OFF
Figure 49. Timing chart of thermal shutdown function and ΔTj protection function without Latch-off function
4.3 The case of connecting the capacitance load
At startup, the load connected is used to detect ΔTj protection function. The RSS region where ΔTj protection function
is detected versus the output current (IOUT)(Note 3) are shown in Figure 50 to Figure 55 (Note 4). Pay attention to detect ΔTj
protection function.
(Note 3) IOUT is not including the capacitance load current at startup.
(Note 4) This results are used evaluation board of ROHM.
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4.3 The case of connecting the capacitance load – continued
120
VIN = 12 V,
Tj = 25 °C,
COUT = 0 ~ 330 μF
105
ΔTj
Protection
detected
SRon(MIN)
SRON(MIN)
90
SRon(TYP)
SRON(TYP)
RSS [kΩ]
SRon(MAX)
SRON(MAX)
75
60
45
30
15
0
1
2
3
4
5
IOUT [A]
Figure 50. ΔTj protection function detection region at startup (VIN = 12 V, COUT = 0 to 330 μF)
120
VIN = 12 V,
Tj = 25 °C,
COUT = 470 μF
105
ΔTj
Protection
detected
SRon(MIN)
SRON(MIN)
SRon(TYP)
SR (TYP)
90
ON
RSS [kΩ]
SRon(MAX)
SRON(MAX)
75
60
45
30
15
0
3
4
5
IOUT [A]
Figure 51. ΔTj protection function detection region at startup (VIN = 12 V, COUT = 470 μF)
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4.3 The case of connecting the capacitance load – continued
120
VIN = 12 V,
Tj = 25 °C,
COUT = 1000 μF
105
ΔTj
Protection
detected
SRon(MIN)
SRON(MIN)
90
SRon(TYP)
SRON(TYP)
RSS [kΩ]
SRon(MAX)
SRON(MAX)
75
60
45
30
15
0
1
2
3
4
5
IOUT [A]
Figure 52. ΔTj protection function detection region at startup (VIN = 12 V, COUT = 1000 μF)
120
VIN = 24 V,
Tj = 25 °C,
COUT = 0 μF
105
ΔTj
Protection
detected
SRON(MIN)
SRON(MIN)
90
SRon(TYP)
SRON(TYP)
RSS [kΩ]
SRON(MAX)
SRon(MAX)
75
60
45
30
15
0
3
4
5
IOUT [A]
Figure 53. ΔTj protection function detection region at startup (VIN = 24 V, COUT = 0 μF)
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4.3 The case of connecting the capacitance load – continued
120
VIN = 24 V,
Tj = 25 °C,
COUT = 100 μF
105
ΔTj
Protection
detected
SRON(MIN)
SRon(MIN)
90
SRON(TYP)
SRon(TYP)
RSS [kΩ]
SRON(MAX)
SRon(MAX)
75
60
45
30
15
0
1
2
3
4
5
IOUT [A]
Figure 54. ΔTj protection function detection region at startup (VIN = 24 V, COUT = 100 μF)
120
VIN = 24 V,
Tj = 25 °C,
COUT = 220 μF
105
ΔTj
Protection
detected
SRon(MIN)
SRON(MIN)
90
SRon(TYP)
SRON(TYP)
RSS [kΩ]
SRon(MAX)
SRON(MAX)
75
60
45
30
15
0
3
4
5
IOUT [A]
Figure 55. ΔTj protection function detection region at startup (VIN = 24 V, COUT = 220 μF)
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4.3 The case of connecting the capacitance load – continued
120
VIN = 24 V,
Tj = 25 °C,
COUT = 330 μF
105
ΔTj
Protection
detected
SRon(MIN)
SRON(MIN)
90
SRon(TYP)
SRON(TYP)
RSS [kΩ]
SRON(MAX)
SRon(MAX)
75
60
45
30
15
0
1
2
3
4
5
IOUT [A]
Figure 56. ΔTj protection function detection region at startup (VIN = 24 V, COUT = 330 μF)
120
VIN = 24 V,
Tj = 25 °C,
COUT = 470 μF
105
ΔTj
Protection
detected
SRON(MIN)
SRon(MIN)
SR
ON(TYP)
SRon(TYP)
90
RSS [kΩ]
SRON(MAX)
SRon(MAX)
75
60
45
30
15
0
3
4
5
IOUT [A]
Figure 57. ΔTj protection function detection region at startup (VIN = 24 V, COUT = 470 μF)
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4.3 The case of connecting the capacitance load – continued
120
VIN = 24 V,
Tj = 25 °C,
COUT = 1000 μF
105
ΔTj
Protection
detected
SRon(MIN)
SRON(MIN)
SRon(TYP)
SRON(TYP)
90
RSS [kΩ]
SRON(MAX)
SRon(MAX)
75
60
45
30
15
0
3
4
5
IOUT [A]
Figure 58. ΔTj protection function detection region at startup (VIN = 24 V, COUT = 1000 μF)
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5. Output Load is Open
When EN is OFF and no load is connected to OUT, output voltage does not fall to GND potential.
I/O Equivalence Circuit
SS
1 kΩ
ILIM
10 kΩ
1 kΩ
12 kΩ
SS
ILIM
10 kΩ
10 kΩ
FLAG
150 Ω
EN
EN
FLAG
10 kΩ
100 kΩ
OUT
IN
OUT
Resistance in the figures are typical values.
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
8.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
10. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
11. Thermal Shutdown Function (TSD)
This IC has a built-in thermal shutdown function that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD function that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD function operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD function be used in a set design or for any purpose other than protecting the IC from
heat damage.
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Operational Notes – continued
12. Over Current Protection Function (OCP)
This IC incorporates an integrated overcurrent protection function that is activated when the load is shorted. This
protection function is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection function.
13. Active Clamp Operation
The IC integrates the active clamp function to internally absorb the reverse energy which is generated when the
inductive load is turned off. When the active clamp operates, the thermal shutdown function does not work. Decide a
load so that the reverse energy is active clamp tolerance (refer to Figure 28. Active Clamp Energy vs Output Current)
or under when inductive load is used.
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Ordering Information
B
V
1
H
A
L
4
5
E
F
J
Package
EFJ: HTSOP-J8
-
E2
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
HTSOP-J8 (TOP VIEW)
Part Number Marking
1 H A L 4 5
LOT Number
Pin 1 Mark
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Physical Dimension and Packing Information
Package Name
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Revision History
Date
Revision
19.May.2020
001
28.Jun.2021
002
04.Sep.2023
003
Changes
New Release
About the title of Figure 50,51,52,53,54,55, correct COUT value.
About the title of Figure 51,52, correct VIN value.
About the correct value of pull-down resistance at EN Pin in I/O Equivalence Circuit.
About the correct value of internal resistance at SS Pin in I/O Equivalence Circuit.
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Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
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