BV1HJ180EFJ-CE2

Datasheet Automotive IPD Series 1ch High Side Switch with output abnormality detection BV1HJ180EFJ-C General Description Key Specifications Features Package BV1HJ180EFJ-C is a 1ch high side switch for automotive application. It has a built-in overcurrent limit function, thermal shutdown protection function, open load detection function, low power output-OFF function and short-to-VCC detection function. It is equipped with diagnostic output function for abnormality detection. It also operates in deep drop of supply voltage, so it can deal with cold cranking. ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ Power Supply Operating Range 4 V to 28 V ON-Resistance (Tj = 25 °C) 180 mΩ (Typ) Overcurrent Limit 2.0 A (Min) Standby Current (Tj = 25 °C) 0.5 μA (Max) Active Clamp Tolerance (Tj = 25 °C) 55 mJ UVLO Detection Voltage (in supply voltage decreasing): 2.8 V (Max) W (Typ) x D (Typ) x H (Max) HTSOP-J8 Cold Cranking Support Keeps active status of output up to 2.8 V (Max) when power supply voltage drops AEC-Q100 Qualified (Note 1) Built-in Overcurrent Protection Function (OCP) Built-in Dual TSD (Note 2) Built-in Open Load Detection Function Built-in Short-to-VCC Detection Function Built-in Under Voltage Lockout Function (UVLO) Built-in Diagnostic Output Monolithic power management IC with control unit (CMOS) and power MOSFET mounted on a single chip 4.9 mm x 6.0 mm x 1.0 mm HTSOP-J8 (Note 1) Grade 1 (Note 2) Two type of built-in temperature protection: Junction temperature, and Δ Tj protection that detects sudden temperature rise of the Power-MOS Application ◼ Resistance load, inductance load and capacitance load for automotive application Typical Application Circuit RST1PU RIN MCU RST1 RST2 RST2PU VBB CVBB IN ST1 BV1HJ180EFJ-C OUT RL ST2 GND RGND ○Product structure：Silicon integrated circuit www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 •14 • 001 DGND ○This product has no designed protection against radioactive rays 1/29 TSZ02201-0G5G1G400100-1-2 08.Oct.2021 Rev.002 BV1HJ180EFJ-C Contents General Description ........................................................................................................................................................................ 1 Features.......................................................................................................................................................................................... 1 Application ...................................................................................................................................................................................... 1 Key Specifications .......................................................................................................................................................................... 1 Package .......................................................................................................................................................................................... 1 Typical Application Circuit ............................................................................................................................................................... 1 Contents ......................................................................................................................................................................................... 2 Pin Configuration ............................................................................................................................................................................ 3 Pin Description................................................................................................................................................................................ 3 Block Diagram ................................................................................................................................................................................ 3 Definition ......................................................................................................................................................................................... 4 Absolute Maximum Ratings ............................................................................................................................................................ 5 Recommended Operating Conditions ............................................................................................................................................. 6 Thermal Resistance ........................................................................................................................................................................ 6 Electrical Characteristics............................................................................................................................................................... 10 Typical Performance Curves ......................................................................................................................................................... 11 Measurement Circuit ..................................................................................................................................................................... 16 Timing Chart ................................................................................................................................................................................. 18 Function Description ..................................................................................................................................................................... 19 Application Circuit Diagram........................................................................................................................................................... 23 I/O Equivalence Circuits................................................................................................................................................................ 24 Operational Notes ......................................................................................................................................................................... 25 Ordering Information ..................................................................................................................................................................... 27 Marking Diagram .......................................................................................................................................................................... 27 Physical Dimension and Packing Information ............................................................................................................................... 28 Revision History ............................................................................................................................................................................ 29 www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2/29 TSZ02201-0G5G1G400100-1-2 08.Oct.2021 Rev.002 BV1HJ180EFJ-C Pin Configuration (TOP VIEW) IN 1 8 OUT GND 2 7 OUT ST1 3 6 OUT ST2 4 5 OUT EXP-PAD = VBB Pin Description Pin No. Pin Name 1 IN 2 3 4 5 6 7 8 EXP-PAD GND ST1 ST2 OUT OUT OUT OUT VBB Function Input pin. Pull-down resistor is connected internally. Active High to turn on the switch. Ground pin Self–diagnostic output pin 1 Self-diagnostic output pin 2 Switch output pin Switch output pin Switch output pin Switch output pin Power input pin, switch input pin Block Diagram VBB lnternal Supply UVLO Charge Pump IN Clamp Gate Driver Thermal Shut Down Control Logic Over Current Detction ST1 Open Load Detection Battery Short Detection ST2 OUT GND www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3/29 TSZ02201-0G5G1G400100-1-2 08.Oct.2021 Rev.002 BV1HJ180EFJ-C Definition IBB VBB VDS IIN OUT IN VBB IOUT VOUT ST1,ST2 IST VIN VST GND IGND Figure 1. Voltage and Current Definition www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/29 TSZ02201-0G5G1G400100-1-2 08.Oct.2021 Rev.002 BV1HJ180EFJ-C Absolute Maximum Ratings Parameter Symbol Rating Unit VBB - OUT Voltage VDS -0.3 to +45 V Power Supply Voltage VBB -0.3 to +40 V Input Voltage VIN -0.3 to +7.0 V Diagnostic Output Voltage VST - 0.3 to +7.0 V Output Current IOUT Internal limit (Note 1) A Diagnostic Output Current IST 10 mA Junction Temperature Width Tj -40 to +150 °C Storage Temperature Range Tstg -55 to +150 °C Tjmax +150 °C Active Clamp Energy (Single Pulse) Tj(START) = 25 °C, IOUT = 1 A(Note 2) EAS(25 °C) 55 mJ Active Clamp Energy (Single Pulse) Tj(START) = 150 °C, IOUT = 1 A(Note 2) EAS(150 °C) 25 mJ VBBLIM 28 V Maximum Junction Temperature Supply Voltage for Short Circuit Protection (Note 3) (Note 1) Internally limited by over current limit. (Note 2) Not 100 % tested. (Note 3) Maximum power supply voltage that can detect short circuit protection. Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. Caution 3: When IC turns off with an inductive load, reverse energy has to be dissipated in the BV1HJ180EFJ-C. This energy can be calculated by the following equation: 1 𝑉𝐵𝐴𝑇 𝐸𝐿 = 𝐿𝐼𝑂𝑈𝑇(𝑆𝑇𝐴𝑅𝑇) 2 × (1 − ) 2 𝑉𝐵𝐴𝑇 − 𝑉𝑂𝑈𝑇(𝐶𝐿) Where: L is the inductance of the inductive load. IOUT(START) is the output current at the time of turning off. VOUT(CL) is the output clamp voltage. The IC integrates the active clamp function to internally absorb the reverse energy EL which is generated when the inductive load is turned off. When the active clamp operates, the thermal shutdown function does not work. Decide a load so that the reverse energy E L is active clamp tolerance EAS (refer to Figure .2) or under when inductive load is used. Active Clamp Energy (Single Pulse): EAS [mJ] 1000 Tj(start)=25ºC 100 Tj(start)=150ºC 10 1 0.1 1.0 10.0 Output Current (Start): IOUT(START)[A] Figure 2. Active Clamp Energy (Single Pulse) vs Output Current (Start) www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5/29 TSZ02201-0G5G1G400100-1-2 08.Oct.2021 Rev.002 BV1HJ180EFJ-C Recommended Operating Conditions Symbol Min Typ Max Unit Power Supply Voltage Operating VBB 4 14 28 V Operating Temperature Topr -40 - +150 °C fIN - - 1 kHz Parameter Input Frequency Thermal Resistance(Note 1) Parameter Symbol Typ Unit Condition 169.8 °C/W 1s (Note 2) 50.7 °C/W 2s (Note 3) 37.8 °C/W 2s2p (Note 4) HTSOP-J8 Between Junction and Surroundings Temperature Thermal Resistance θJA (Note 1) The thermal impedance is based on JESD51-2A (Still-Air) standard. It is used the chip of BV1HJ180EFJ-C (Note 2) JESD51-3 standard FR4 114.3 mm x 76.2 mm x 1.57 mm 1-layer (1s) (Top copper foil: ROHM recommended Footprint + wiring to measure, 2 oz. copper.) (Note 3) JESD51-5 standard FR4 114.3 mm x 76.2 mm x 1.60 mm 2-layers (2s) (Top copper foil: ROHM recommended Footprint + wiring to measure/ Copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm, copper (top & reverse side) 2 oz.) (Note 4) JESD51-5/- 7 standard FR4 114.3 mm x 76.2 mm x 1.60 mm 4-layers (2s2p) (Top copper foil: ROHM recommended Footprint + wiring to measure/ 2 inner layers and copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm, copper (top & reverse side/inner layers) 2 oz./1 oz.) ■ PCB Layout 1 layer (1s) Footprint 300 mm2 600 mm2 1200 mm2 Figure 3. PCB Layout 1 Layer (1s) Dimension www.rohm.com Value Board Finish Thickness 1.57 mm ± 10 % Board Dimension 76.2 mm x 114.3 mm Board Material FR4 Copper Thickness (Top Layer) 0.070 mm (Cu: 2 oz) Copper Foil Area Dimension Footprint/100 mm2/600 mm2/1200 mm2 © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 6/29 TSZ02201-0G5G1G400100-1-2 08.Oct.2021 Rev.002 BV1HJ180EFJ-C Thermal Resistance – continued ■ PCB Layout 2 layers (2s) Top Layer Bottom Layer Top Layer Bottom Layer Via Isolation Clearance Diameter: ≥ 0.6 mm Cross Section Figure 4. PCB Layout 2 Layers (2s) www.rohm.com Dimension Value Board Finish Thickness 1.60 mm ± 10 % Board Dimension 76.2 mm x 114.3 mm Board Material FR4 Copper Thickness (Top/Bottom Layers) 0.070 mm (Cu +Plating) Thermal Vias Separation/Diameter 1.2 mm/0.3 mm © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 7/29 TSZ02201-0G5G1G400100-1-2 08.Oct.2021 Rev.002 BV1HJ180EFJ-C Thermal Resistance – continued ■ PCB Layout 4 layers (2s2p) TOP Layer 2nd/Bottom Layers 3rd Layer Top Layer 2nd Layer 3rd Layer Bottom Layer Via Isolation Clearance Diameter: ≥0.6 mm Cross Section Figure 5. PCB Layout 4 Layers (2s2p) www.rohm.com Dimension Value Board Finish Thickness 1.60 mm ± 10 % Board Dimension 76.2 mm x 114.3 mm Board Material FR4 Copper Thickness (Top/Bottom Layers) 0.070 mm (Cu +Plating) Copper Thickness (Inner Layers) 0.035 mm Thermal Vias Separation/Diameter 1.2 mm/0.3 mm © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 8/29 TSZ02201-0G5G1G400100-1-2 08.Oct.2021 Rev.002 BV1HJ180EFJ-C Thermal Resistance – continued θJA[°C/W] ■ Transient Thermal Resistance (Single Pulse) Figure 6. Transient Thermal Resistance θJA[°C/W] ■ Thermal Resistance (θJA vs Copper foil area- 1s) Figure 7. Thermal Resistance www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 9/29 TSZ02201-0G5G1G400100-1-2 08.Oct.2021 Rev.002 BV1HJ180EFJ-C Electrical Characteristics (unless otherwise specified VBB = 4 V to 28 V, Tj = -40 °C to 150 °C) Parameter Symbol Limit Min Typ Max Unit Condition Power Supply Standby current 1 IBBL1 - - 0.5 μA Standby current 2 IBBL2 - - 20 μA Operating Current IBBH - 3.0 4.5 mA UVLO Detection Voltage VUVLO - - 2.8 V UVLO Hysteresis VUVHYS - - 0.45 V High Level Input Voltage VINH 2.1 - - V Low Level Input Voltage VINL - - 0.9 V Input Hysteresis VBB = 14 V, VIN = 0 V, VOUT = 0 V, Tj = 25 °C VBB = 14 V, VIN = 0 V, VOUT = 0 V, Tj = 150 °C VBB = 14 V, VIN = 5 V, VOUT = open Input VHYS - 0.15 - V High Level Input Current IINH - 50 150 μA VIN = 5 V Low Level Input Current IINL -10 - +10 μA VIN = 0 V Output ON Resistance 1 RON1 - 180 240 mΩ Output ON Resistance 2 RON2 - - 400 mΩ Output ON Resistance 3 RON3 - - 300 mΩ Output ON Resistance 4 RON4 - - 1800 mΩ Output Leak Current 1 IOUTL1 - - 0.5 μA Output Leak Current 2 IOUTL2 - - 10 μA Output Slew Rate when ON SRON - 0.3 1.0 V/μs Output Slew Rate when OFF SROFF - 0.3 1.0 V/μs Propagation Delay when ON tOUTON - 60 120 μs VIN = 0 V, VOUT = 0 V, Tj = 150 °C VBB = 14 V, RL = 15 Ω VOUT = 20 % -> 80 % of VBB VBB = 14 V, RL = 15 Ω VOUT = 80 % -> 20 % of VBB VBB = 14 V, RL = 15 Ω Propagation Delay when OFF tOUTOFF - 60 120 μs VBB = 14 V, RL = 15 Ω VDS 45 50 55 V VIN = 0 V, IOUT = 10 mA Diagnostic Output L Voltage VSTL - - 0.5 V IST = 1 mA Diagnostic Output Leak Current Propagation Delay Time when Diagnostic Output is ON Propagation Delay Time when Diagnostic Output is OFF ISTL - - 10 µA VST = 5 V tSTON - 100 200 µs VBB = 14 V, RL = 15 Ω tSTOFF - 50 125 µs VBB = 14 V, RL = 15 Ω Power MOS Output Output Clamp Voltage VBB = 8 V to 28 V, Tj = 25 °C, IOUT = 1 A VBB = 8 V to 28 V, Tj = 150 °C, IOUT = 1 A VBB = 4 V, Tj = 25 °C, IOUT = 1 A VBB = 2.8 V, Tj = 150 °C, IOUT = 200 mA VIN = 0 V, VOUT = 0 V, Tj = 25 °C Diagnostics Protection Circuit Overcurrent Limit Value ILIM 2.0 3.2 4.4 A VDS > 5 V Short-to-VBB Detection Voltage VSHV VBB-1.8 VBB-1.2 VBB-0.5 V VBB = 6 V to 28 V, VIN = 0 V Open Load Detection Voltage VOLD 2.0 3.0 4.0 V Open Load Detection Sink Current IOLD - 8 24 µA Open Load Detection Time tOLD - 200 350 µs VBB = 6 V to 28 V, VIN = 0 V VBB = 6 V to 28 V, VIN = 0 V, VOUT = 4 V VBB = 6 V to 28 V, VIN = 5 V to 0 V Thermal Shutdown (Note 1) Thermal Shutdown Hysteresis (Note 1) Operating Temperature Detection Value (Note 1) TTSD 150 175 200 °C TTSDHYS 8 15 24 °C TDTJ - 90 - °C (Note 1) Not 100 % tested. www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 10/29 TSZ02201-0G5G1G400100-1-2 08.Oct.2021 Rev.002 BV1HJ180EFJ-C Typical Performance Curves (Unless otherwise specified VBB = 14 V, IN = 5 V, Tj = 25 °C) 20 0.5 Standby Current: IBBL [μA] Standby Current: IBBL [μA] 0.4 0.3 0.2 0.1 0.0 0 5 10 15 20 25 30 35 Power Supply Voltage: VBB [V] 5 -50 0 50 100 Junction Temperature: Tj [ºC] 150 Figure 9. Standby Current vs Junction Temperature 4.5 Circuit Current: IBBH [mA] 4.5 Circuit Current: IBBH [mA] 10 0 40 Figure 8. Standby Current vs Power Supply Voltage 3.0 3.0 1.5 1.5 0.0 15 0 5 10 15 20 25 30 35 Power Supply Voltage: VBB [V] 0.0 40 Figure 10. Circuit Current vs Power Supply Voltage www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 -50 0 50 100 Junction Temperature: Tj [°C] 150 Figure 11. Circuit Current vs Junction Temperature 11/29 TSZ02201-0G5G1G400100-1-2 08.Oct.2021 Rev.002 BV1HJ180EFJ-C Typical Performance Curves - continued (Unless otherwise specified VBB = 14 V, IN = 5 V, Tj = 25 °C) 2.5 Input Voltage: VINH, VINL [V] UVLO Detection Voltage: VUVLO [V] 4 3 2 1 0 -50 0 50 100 2.0 1.5 VINH 1.0 VINL 0.5 0.0 150 -50 0 Figure 12. UVLO Detection Voltage vs Junction Temperature 150 Figure 13. Input Voltage vs Junction Temperature 150 500 Output ON Resistance: RON [mΩ] 125 Input Current: IINH, IINL [μA] 100 Junction Temperature: Tj [°C] Junction Temperature: Tj [°C] 100 75 IINH 50 25 0 50 IINL -50 0 50 100 Figure 14. Input Current vs Junction Temperature © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 300 200 100 0 150 Junction Temperature: Tj [°C] www.rohm.com 400 0 5 10 15 20 25 30 35 Power Supply Voltage : VBB [V] 40 Figure 15. Output ON Resistance vs Supply Voltage 12/29 TSZ02201-0G5G1G400100-1-2 08.Oct.2021 Rev.002 BV1HJ180EFJ-C Typical Performance Curves - continued (Unless otherwise specified VBB = 14 V, IN = 5 V, Tj = 25 °C) 1800 10 Output Leak Current: IOUTL [μA] Output ON Resistance: RON [mΩ] 1500 1200 900 VBB = 2.8 V 600 VBB = 4 V 300 0 6 4 2 VBB = 14 V -50 0 50 100 Junction Temperature: Tj [°C] 0 150 Figure 16. Output ON Resistance vs Junction Temperature -50 0 50 100 Junction Temperature: Tj [°C] 150 Figure 17. Output leak Current vs Junction Temperature 120 Output ON, OFF Propagation Delay Time: tOUTON, tOUTOFF [μs] 1.0 Output Slew Rate: SRON,SROFF [V/μs] 8 100 0.8 80 0.6 60 SRON 0.4 0.2 20 0 50 100 Junction Temperature: Tj [ºC] 150 Figure 18. Output Slew Rate vs Junction Temperature www.rohm.com tOUTOFF 40 SROFF 0.0 -50 tOUTON © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 0 -50 0 50 100 Junction Temperature: Tj [ºC] 150 Figure 19. Output ON, OFF Propagation Delay Time vs Junction Temperature 13/29 TSZ02201-0G5G1G400100-1-2 08.Oct.2021 Rev.002 BV1HJ180EFJ-C Typical Performance Curves - continued (Unless otherwise specified VBB = 14 V, IN = 5 V, Tj = 25 °C) 0.5 Diagnostic Output Low Voltage: VSTL [V] Output Clamp Voltage: VDS [V] 55 53 51 49 47 45 -50 0 50 100 0.4 0.3 0.2 0.1 0.0 -50 150 Junction Temperature: Tj [ºC] Figure 20. Output Clamp Voltage vs Junction Temperature 150 Figure 21. Diagnostic Output Low Voltage vs Junction Temperature 200 6.4 5.6 Overcurrent Limit Value: ILIM [A] Diagnostic Output ON, OFF Delay Time: tSTON,tSTOFF [μs] 0 50 100 Junction Temperature: Tj [ºC] 150 100 50 tSTON tSTOFF 0 -50 0 50 100 3.2 2.4 1.6 0.8 0 50 100 150 Junction Temperature: Tj [ºC] Figure 22. Diagnostic Output ON, OFF Propagation Delay Time vs Junction Temperature © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4.0 0.0 -50 150 Junction Temperature: Tj [ºC] www.rohm.com 4.8 Figure 23. Overcurrent Limit Value vs Junction Temperature 14/29 TSZ02201-0G5G1G400100-1-2 08.Oct.2021 Rev.002 BV1HJ180EFJ-C Typical Performance Curves - continued (Unless otherwise specified VBB VBB = 14 V, IN = 5 V, Tj =25 °C) VBB -2.0 2.0 Short-to-VBB Detection Voltage: VSHV [V] Open Load Detection Voltage: VOLD [V] 6.0 VBB -1.6 1.6 VBB1.2 -1.2 VBB0.8 -0.8 VBB0.4 -0.4 -50 0 50 100 Junction Temperature: Tj [ºC] 5.0 4.0 3.0 2.0 1.0 0.0 150 Figure 24. Short-to-VBB Detection Voltage vs Junction Temperature -50 0 50 100 Junction Temperature: Tj [ºC] 150 Figure 25. Open Load Detection Voltage vs Output Current Open Load Detection Time: tOLD [μs] 400 300 200 100 0 -50 0 50 100 Junction Temperature: Tj [ºC] 150 Figure 26. Open Load Detection Time vs Junction Temperature www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 15/29 TSZ02201-0G5G1G400100-1-2 08.Oct.2021 Rev.002 BV1HJ180EFJ-C Measurement Circuit VBB VBB VBB VBB IN IN ST1, ST2 ST1, ST2 VIN VIN OUT OUT GND GND Figure 27. Standby Current 1/2 Low Level Input Current Output Leak Current 1/2 Diagnostic Output Leak Current Figure 28.Operating Current VBB VBB VBB IN VBB ST1, ST2 IN ST1, ST2 VIN OUT GND VIN 1 kΩ GND Figure 29. UVLO Detection Voltage UVLO Hysteresis High Level Input Voltage Low Level Input Voltage Input Voltage Hysteresis High Level Input Current Thermal Shutdown Thermal Shutdown Hysteresis www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 OUT Figure 30. Output ON Resistance 1/2/3/4 Output Clamp Voltage 16/29 TSZ02201-0G5G1G400100-1-2 08.Oct.2021 Rev.002 BV1HJ180EFJ-C Measurement Circuit - continued VBB VBB VBB IN VBB ST1, ST2 Monitor IN 10 kΩ ST1, ST2 Monitor IST VIN VIN OUT GND OUT Monitor GND 15 Ω Figure 31. Output ON Slew Rate Output OFF Slew Rate Output ON Propagation Delay Time Output OFF Propagation Delay Time Diagnostic Output ON Propagation Delay Time Diagnostic Output OFF Propagation Delay Time 1 kΩ Figure 32. Diagnostic Output Low Voltage VBB VBB 1 kΩ VBB IN VBB ST1, ST2 IN 10 kΩ Monitor 10 kΩ ST1, ST2 Monitor VIN OUT OUT GND GND Figure 33. Overcurrent Limit Short to VBB Detection Voltage Open Load Detection Voltage Open Load Detection Sink Current www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Figure 34.Diagnostic Output Low Voltage 17/29 TSZ02201-0G5G1G400100-1-2 08.Oct.2021 Rev.002 BV1HJ180EFJ-C Timing Chart VBB IN VINL VINH tOUTOFF SRON 80 % 80 % 20 % 20 % OUT t OUTON SROFF ST1 t STON t STOFF ST2 Figure 35. ON/OFF Operation Timing Chart www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 18/29 TSZ02201-0G5G1G400100-1-2 08.Oct.2021 Rev.002 BV1HJ180EFJ-C Function Description 1. Protection Function Table 1. Detection and Release Conditions of Each Protection Function and Diagnostic Output Mode Normal Condition Conditions IN ST1 ST2 Standby - Low High High Operating - High Low High Detect VOUT ≥ 3.0 V (Typ) Low Low High Release VOUT ≤ 2.4 V (Typ) Low High High Detect VOUT ≥ VBB - 1.2 V (Typ) Low Low Low Release VOUT ≤ VBB - 1.6 V (Typ) Low Low High Detect Tj ≥ 175 °C (Typ) High High High Release Tj ≤ 160 °C (Typ) High Low High Detect ΔTj ≥ 90 °C (Typ) High High High Release ΔTj ≤ 30 °C (Typ) High Low High Detect IOUT ≥ 3.2 A (Typ) High High High Release IOUT ≤ 3.2 A (Typ) High Low High Open Load Detect (OLD) Short-to-VBB Detection Thermal Shutdown (TSD) ΔTj Protection (Note 1) Over Current Protection (OCP) (Note 1) Protect function by detecting Power-MOS sharp increase of temperature difference with control circuit. This IC has a built-in abnormal detection function as mentioned above and outputs the abnormal condition with ST1 and ST2 pins. It will automatically recover when the abnormality is resolved. ST1 outputs the diagnostic result that detects the output voltage. ST1 change from High to Low when OUT rise more than VBB – 1.2 V (typ) during normal operation. And change from Low to High when detect each protection or OUT is less than VBB - 1.6 V (Typ). ST2 is output to identify the difference between Open Load Detection and Short-to-VBB Detection during IN = Low. www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 19/29 TSZ02201-0G5G1G400100-1-2 08.Oct.2021 Rev.002 BV1HJ180EFJ-C Function Description - continued 2. Overcurrent Protection This IC has a built-in overcurrent protection function. When overcurrent flows in the output, the output current is limited to 3.2 A (Typ) and self-diagnostic output (ST1) becomes High. Figure 36 shows the timing chart during output short to GND fault. 3. Thermal Shutdown and ΔTj Protection 3.1 Thermal Shutdown Protection This IC has a built-in thermal shutdown protection function. When the IC chip temperature exceeds175 °C (Typ), the output is turned OFF and self-diagnostic output (ST1) becomes High. When the temperature goes below 160 °C (Typ), output will self-reset and operation becomes normal. 3.2 ΔTj Protection This IC has a built-in ΔTj protection function. When the difference (TDTJ) between the temperature (TPOWER-MOS) of Power-MOS part in the IC and the temperature (TAMB) of the control part is 90 °C (Typ) or more, the output is turned off. The delta Tj protector has a built-in hysteresis that returns to normal when the temperature difference reaches 30 °C (Typ) or less (TDTJREL). Figure 36 shows the timing chart during output short to GND fault. IN ILIM IOUT TTSD TPOWER-MOS TTSDHYS TAMB TDTJ TDTJREL ΔTj Protection Operation TSD Operation ST1 TSD Detect TSD Release Figure 36. Timing Chart during output short to GND fault www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 20/29 TSZ02201-0G5G1G400100-1-2 08.Oct.2021 Rev.002 BV1HJ180EFJ-C Function Description - continued 4. Open Load Detection VBB Internal Supply V BB Clamp IN SOLD Gate Driver ROLD OUT Control Logic ST VOLD R1 R2 VREF RL GND Figure 37. Open Load Detection Block Diagram By inserting an external resistor ROLD between the power supply VBB and the output OUT, this IC detects a disconnection of the load when the input IN is low and self-diagnostic output (ST1) becomes Low. When the OUT voltage is higher than the Short-to-VBB Detection Voltage VBB-1.2 V (Typ), the auto-diagnostic output (ST2) becomes Low, so that the open-load and short-to-VBB can be distinguished. An undetected period is provided to prevent false detection immediately after the output is turned off. Therefore, it is possible to judge the abnormality after the Open Load Detection Time 350 μs (Max) after switching the input IN to Low. Similarly, immediately after the power supply (VBB) is turned on, the open-load and short-to-VBB are not detected for 350 μs (Max). Also, note that if RL is large enough, the open-load may be detected without lowering the output OUT even if the input IN is low. The external resistance ROLD value for detecting the open-load can be calculated from the maximum value of the Open Load Detection Voltage VOLD and the minimum value of the power supply voltage VBB used by the following equation. 𝑅𝑂𝐿𝐷 < 𝑉𝐵𝐵(𝑀𝑖𝑛) ×(𝑅1(𝑀𝑖𝑛) +𝑅2(𝑀𝑖𝑛) ) 𝑉𝑂𝐿𝐷(Max) − (𝑅1(𝑀𝑖𝑛) + 𝑅2(𝑀𝑖𝑛) ) [kΩ] 𝑅𝑂𝐿𝐷 < 𝑉𝐵𝐵(𝑀𝑖𝑛) × 75 − 300 [kΩ] To distinguish between the open-load state and the short-to-VBB state, set ROLD value to be greater than ROLD value of the following equation and less than ROLD value of the above equation, which is obtained from the maximum value of the Shortto-VBB Detection Voltage VSHV. 𝑅𝑂𝐿𝐷 > 𝑉𝐵𝐵(𝑀𝑖𝑛) ×(𝑅1(𝑀𝑖𝑛) +𝑅2(𝑀𝑖𝑛) ) 𝑉𝑆𝐻𝑉(Max) − (𝑅1(𝑀𝐼𝑛) + 𝑅2(𝑀𝑖𝑛) ) [kΩ] 𝑉 𝑅𝑂𝐿𝐷 > 𝑉 𝐵𝐵(𝑀𝑖𝑛) × 300 − 300 [kΩ] 𝑆𝐻𝑉(Max) www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 21/29 TSZ02201-0G5G1G400100-1-2 08.Oct.2021 Rev.002 BV1HJ180EFJ-C Function Description - continued 5. Other Detection 5.1 GND open protection 5V VBB Clamp IN Internal supply ST1 Control logic OUT ST2 GND Figure 38. GND Open Detection Block Diagram When GND of the IC is open, the output is switched OFF regardless of the input voltage. However, self-diagnostic output is not flagged. When an inductive load is connected, the active clamp operates when the GND pin is open 5.2 MCU I/O Protection VBB 5V Internal supply Clamp IN ST1 Control logic OUT MCU ST2 GND Figure 39. MCU I/O Protection As a countermeasure to prevent damage from the surge voltage, limiting resistance is inserted in between input terminal and MCU. Recommended input resistance range values are 4.7 kΩ to 10 kΩ. www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 22/29 TSZ02201-0G5G1G400100-1-2 08.Oct.2021 Rev.002 BV1HJ180EFJ-C Application Circuit Diagram RST1PU RST2PU RIN MCU VBB CVBB IN RST1 ROLD OUT ST1 BV1HJ180EFJ-C RST2 RL ST2 GND RGND DGND Figure 40. Application Circuit Diagram Symbol Value Purpose RIN 4.7 kΩ Limit resistance for negative surge RST1, RST2 4.7 kΩ Limit resistance for negative surge RST1PU, RST2PU 10 kΩ Pull up ST1/ST2 pin to MCU power supply, these pins are open drain output CVBB 1 µF For battery line voltage spike filter RGND 1 kΩ For current limit for reverse battery connection DGND - ROLD 51 kΩ www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 BV1HJ180EFJ-C protection for reverse battery connection For open load detection 23/29 TSZ02201-0G5G1G400100-1-2 08.Oct.2021 Rev.002 BV1HJ180EFJ-C I/O Equivalence Circuits IN IN ST1, ST2 10 kΩ 10 kΩ 150 Ω ST1 ST2 90 kΩ OUT VBB OUT 254.5 kΩ 245.5 kΩ Resistance values shown in the diagrams above are typical values www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 24/29 TSZ02201-0G5G1G400100-1-2 08.Oct.2021 Rev.002 BV1HJ180EFJ-C Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Except for pins the output and the input of which were designed to go below ground, ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Recommended Operating Conditions The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 8. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other specially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 9. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So, unless otherwise specified, unused input pins should be connected to the power supply or ground line. 10. Ceramic Capacitor When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 11. Thermal Shutdown Circuit (TSD) This IC has a built-in thermal shutdown function that prevents heat damage to the IC. Normal operation should always be within the IC’s maximum junction temperature rating. If by any chance the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD function that will turn OFF power output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD function operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD function be used in a set design or for any purpose other than protecting the IC from heat damage. www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 25/29 TSZ02201-0G5G1G400100-1-2 08.Oct.2021 Rev.002 BV1HJ180EFJ-C Operational Notes – continued 12. Over Current Protection Function (OCP) This IC incorporates an integrated overcurrent protection function that is activated when the load is shorted. This protection function is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection function. 13. Active Clamp Operation The IC integrates the active clamp function to internally absorb the reverse energy EL which is generated when the inductive load is turned off. When the active clamp operates, the thermal shutdown function does not work. Decide a load so that the reverse energy EL is active clamp tolerance EAS (refer to Figure 2. Active Clamp Energy (Single Pulse) vs Output Current (Start)) or under when inductive load is used. 14. OPEN Power Supply Pin When power supply pin (VBB) becomes open at ON (IN = High), the output is switched to OFF regardless of input voltage. If an inductive load is connected, the active clamp operates when VBB is OPEN and becomes the same potential as that on the ground. At this time, the output voltage drops down to -50 V (Typ). 15. OPEN GND Pin When GND pin becomes open at ON (IN = High), the output is switched to OFF regardless of the input voltage. If an inductive load is connected, the active clamp operates when GND pin is open. 16. OUT Pin Voltage Ensure that keep OUT pin voltage less than (VBB + 0.3 V) at any time, even during transient condition. Otherwise malfunction or other problems can occur. www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 26/29 TSZ02201-0G5G1G400100-1-2 08.Oct.2021 Rev.002 BV1HJ180EFJ-C Ordering Information B V 1 H J 1 8 V1: 1ch H: High side switch 0 E F J Package EFJ: HTSOP-J8 - CE 2 Product Rank C: Automotive product Packaging and Forming Specification E2: Embossed tape and reel Marking Diagram HTSOP-J8 (TOP VIEW) Part Number Marking 1 H J 1 8 0 LOT Number Pin 1 Mark www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 27/29 TSZ02201-0G5G1G400100-1-2 08.Oct.2021 Rev.002 BV1HJ180EFJ-C Physical Dimension and Packing Information Package Name www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 HTSOP-J8 28/29 TSZ02201-0G5G1G400100-1-2 08.Oct.2021 Rev.002 BV1HJ180EFJ-C Revision History Date Revision 14.Jul.2021 001 New Release 002 P.10 Electrical Characteristics Limit of Open Load Detection Time is changed. Limit of Thermal Shutdown Hysteresis is changed. P.21 Function Description Value of Open Load Detection Time is changed. 08.Oct.2021 www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Changes 29/29 TSZ02201-0G5G1G400100-1-2 08.Oct.2021 Rev.002 Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. 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Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001