BV1HJC45EFJ-CE2

Datasheet Automotive IPD Series Built-in Output Diagnosis 1ch High Side Switch BV1HJC45EFJ-C General Description Key Specifications BV1HJC45EFJ-C is a 1ch high side switch for automotive application. It has a built-in overcurrent limit function, thermal shutdown protection function, open load detection function, low power output-OFF function and short-to-VCC detection function. It is equipped with diagnostic output function for abnormality detection. ◼ ◼ ◼ ◼ ◼ Package Features ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ Power Supply Operating Range ON-Resistance (Tj = 25 °C) Overcurrent Limit Standby Current (Tj = 25 °C) Active Clamp Tolerance (Tj = 25 °C) W (Typ) x D (Typ) x H (Max) HTSOP-J8 Built-in Dual TSD (Note 1) AEC-Q100 Qualified (Note2) Built-in Overcurrent Protection Function (OCP) Built-in Thermal Shutdown Protection Function (TSD) Built-in Open Load Detection Function Built-in Short-to-VBB Detection Function Built-in Low Voltage Output OFF Function (UVLO) Built-in Reverse Battery Connection Protection Built-in Diagnostic Output Low On-Resistance Single Nch MOSFET Switch Monolithic power management IC with control unit (CMOS) and power MOSFET mounted on a single chip 6 V to 28 V 45 mΩ (Typ) 5.0 A (Min) 0.5 µA (Max) 120 mJ 4.9 mm x 6.0 mm x 1.0 mm (Note 1) Two type of built-in temperature protection: Junction temperature, and ΔTj protection that detects sudden temperature rise of the Power-MOS (Note 2) Grade 1 Application ◼ Resistance load, inductance load and capacitance load for automotive application Typical Application Circuit RST1PU RST2PU VBB RIN MCU RST1 CVBB IN ST1 BV1HJC45EFJ-C OUT RL RST2 ST2 GND ○Product structure: Silicon integrated circuit www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 ○This product has no designed protection against radioactive rays 1/31 TSZ02201-0G5G1G400110-1-2 09.Feb.2023 Rev.002 BV1HJC45EFJ-C Contents General Description ........................................................................................................................................................................ 1 Features.......................................................................................................................................................................................... 1 Application ...................................................................................................................................................................................... 1 Key Specifications .......................................................................................................................................................................... 1 Package .......................................................................................................................................................................................... 1 Typical Application Circuit ............................................................................................................................................................... 1 Contents ......................................................................................................................................................................................... 2 Pin Configuration ............................................................................................................................................................................ 3 Pin Description................................................................................................................................................................................ 3 Block Diagram ................................................................................................................................................................................ 3 Definition ......................................................................................................................................................................................... 4 Absolute Maximum Ratings ............................................................................................................................................................ 5 Recommended Operating Conditions ............................................................................................................................................. 5 Thermal Resistance ........................................................................................................................................................................ 6 Electrical Characteristics............................................................................................................................................................... 10 Typical Performance Curves ......................................................................................................................................................... 11 Measurement Circuit ..................................................................................................................................................................... 16 Switching Time Measurement Condition ................................................................................................................................ 18 Timing Chart ................................................................................................................................................................................. 19 Function Description ..................................................................................................................................................................... 20 Application Circuit Diagram........................................................................................................................................................... 25 I/O Equivalence Circuits................................................................................................................................................................ 26 Operational Notes ......................................................................................................................................................................... 27 Ordering Information ..................................................................................................................................................................... 29 Marking Diagram .......................................................................................................................................................................... 29 Physical Dimension and Packing Information ............................................................................................................................... 30 Revision History ............................................................................................................................................................................ 31 www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2/31 TSZ02201-0G5G1G400110-1-2 09.Feb.2023 Rev.002 BV1HJC45EFJ-C Pin Configuration (TOP VIEW) IN 1 8 OUT GND 2 7 OUT ST1 3 6 OUT ST2 4 5 OUT EXP-PAD = VBB Pin Description Pin No. Pin Name 1 IN 2 3 4 5 6 7 8 EXP-PAD GND ST1 ST2 OUT OUT OUT OUT VBB Function Input pin. Pull-down resistor is connected internally. Active High to turn on the switch. Ground pin Self–diagnostic output pin 1 Self-diagnostic output pin 2 Switch output pin Switch output pin Switch output pin Switch output pin Power input pin, switch input pin Block Diagram VBB lnternal supply UVLO clamp charge pump IN Gate Driver Over current detction Control Logic Power limitation thermal shut down ST1 Open load detection ST2 Battery short detection OUT Reverse Battery GND www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3/31 TSZ02201-0G5G1G400110-1-2 09.Feb.2023 Rev.002 BV1HJC45EFJ-C Definition IBB VBB VDS IIN OUT IN VBB IOUT VOUT IST ST1,ST2 VIN VST GND IGND Figure 1. Voltage and Current Definition www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/31 TSZ02201-0G5G1G400110-1-2 09.Feb.2023 Rev.002 BV1HJC45EFJ-C Absolute Maximum Ratings (Ta = 25 °C) Parameter Symbol Rating Unit VBB - OUT Voltage VDS -0.3 to Internal clamp (Note 1) V Power Supply Voltage VBB -0.3 to +40 V Input Voltage VIN -0.3 to +7.0 V Diagnostic Output Voltage VST - 0.3 to +7.0 V Output Current IOUT Diagnostic Output Current IST 10 mA Junction Temperature Width Tj -40 to +150 °C Storage Temperature Range Tstg -55 to +150 °C Tjmax +150 °C Active Clamp Energy (Single Pulse) Tj(START) = 25 °C, IOUT = 2 A (Note 3) (Note 4) EAS (25 °C) 120 mJ Active Clamp Energy (Single Pulse) Tj(START) = 150 °C, IOUT = 2 A(Note 3)(Note 4) EAS (150 °C) 60 mJ Supply Voltage for Short Circuit Protection (Note 5) VBBLIM 28 V Supply Voltage for Reverse-Battery Connection Protection VRBPLIM 18 V Maximum Junction Temperature Internal limit A (Note 2) (Note 1) Internally limited by output clamp voltage. (Note 2) Internally limited by fixed over current limit. (Note 3) Maximum active clamp energy using single pulse of IOUT(START) = 2 A and VBB = 14 V. (Note 4) Not 100% tested. (Note 5) Maximum power supply voltage that can detect short circuit protection. Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. Caution 3: When IC turns off with an inductive load, reverse energy is generated. This energy can be calculated by the following equation: 1 𝐸𝐿 = 2 × 𝐿 × 𝐼𝑂𝑈𝑇(𝑆𝑇𝐴𝑅𝑇) 2 × (1 − Where: L is the inductance of the inductive load. IOUT(START) is the output current at the time of turning off. 𝑉𝐵𝐵 𝑉𝐵𝐵 − 𝑉𝐷𝑆 ) The BV1HJC45EFJ-C integrates the active clamp function to internally absorb the reverse energy EL which is generated when the inductive load is turned off. When the active clamp operates, the thermal shutdown function does not work. Decide a load so that the reverse energy EL is active clamp tolerance EAS (refer to Figure 23. Active Clamp Energy vs Output Current) or under when inductive load is used. Recommended Operating Conditions Parameter Symbol Min Typ Max Unit Power Supply Voltage Operating Range VBB 6 14 28 V Operating Temperature Topr -40 - +150 °C Input Frequency fIN - - 1 kHz www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5/31 TSZ02201-0G5G1G400110-1-2 09.Feb.2023 Rev.002 BV1HJC45EFJ-C Thermal Resistance(Note 1) Parameter Symbol Typ Unit Condition 130.3 °C/W 1s (Note 2) 36.8 °C/W 2s (Note 3) 25.9 °C/W 2s2p (Note 4) 20 °C/W 1s (Note 2) 8 °C/W 2s (Note 3) 6 °C/W 2s2p (Note 4) HTSOP-J8 Between Junction and Surroundings Temperature Thermal Resistance θJA Between Junction and the top center of the outside surface of the component package Thermal Characterization Parameter (Note 5) ΨJT (Note 1) The thermal impedance is based on JESD51-2A (Still-Air) standard. It is used the chip of BV1HJC45EFJ-C. (Note 2) JESD51-3 standard FR4 114.3 mm x 76.2 mm x 1.57 mm 1-layer (1s) (Top copper foil: ROHM recommended Footprint + wiring to measure, 2 oz. copper.) (Note 3) JESD51-5 standard FR4 114.3 mm x 76.2 mm x 1.60 mm 2-layers (2s) (Top copper foil: ROHM recommended Footprint + wiring to measure/ Copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm, copper (top & reverse side) 2 oz) (Note 4) JESD51-5/-7 standard FR4 114.3 mm x 76.2 mm x 1.60 mm 4-layers (2s2p) (Top copper foil: ROHM recommended Footprint + wiring to measure/ 2 inner layers and copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm, copper (top & reverse side/inner layers) 2 oz/1 oz) (Note 5) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. ■ PCB Layout 1 layer (1s) 100 mm2 Footprint 600 mm2 1200 mm2 Figure 2. PCB Layout 1 Layer (1s) Dimension Value Board Finish Thickness 1.57 mm ± 10 % Board Dimension 76.2 mm x 114.3 mm Board Material FR4 Copper Thickness (Top Layer) 0.070 mm (Cu: 2 oz) Copper Foil Area Dimension Footprint/100 mm2/600 mm2/1200 mm2 www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 6/31 TSZ02201-0G5G1G400110-1-2 09.Feb.2023 Rev.002 BV1HJC45EFJ-C Thermal Resistance – continued ■ PCB Layout 2 layers (2s) Top Layer Bottom Layer Top Layer Bottom Layer Via Isolation Clearance Diameter: ≥ 0.6 mm Cross Section Figure 3. PCB Layout 2 Layers (2s) Dimension Value Board Finish Thickness 1.60 mm ± 10 % Board Dimension 76.2 mm x 114.3 mm Board Material FR4 Copper Thickness (Top/Bottom Layers) 0.070 mm (Cu + Plating) Thermal Vias Separation/Diameter 1.2 mm/0.3 mm www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 7/31 TSZ02201-0G5G1G400110-1-2 09.Feb.2023 Rev.002 BV1HJC45EFJ-C Thermal Resistance – continued ■ PCB Layout 4 layers (2s2p) TOP Layer 2nd/Bottom Layers 3rd Layer Top Layer 2nd Layer 3rd Layer Bottom Layer Via Isolation Clearance Diameter: ≥ 0.6 mm Cross Section Figure 4. PCB Layout 4 Layers (2s2p) Dimension Value Board Finish Thickness 1.60 mm ± 10 % Board Dimension 76.2 mm x 114.3 mm Board Material FR4 Copper Thickness (Top/Bottom Layers) 0.070 mm (Cu + Plating) Copper Thickness (Inner Layers) 0.035 mm Thermal Vias Separation/Diameter 1.2 mm/0.3 mm www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 8/31 TSZ02201-0G5G1G400110-1-2 09.Feb.2023 Rev.002 BV1HJC45EFJ-C Thermal Resistance – continued ■ Transient Thermal Resistance (Single Pulse) Figure 5. Transient Thermal Resistance ■ Thermal Resistance (θJA vs Copper foil area- 1s) Figure 6. Thermal Resistance www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 9/31 TSZ02201-0G5G1G400110-1-2 09.Feb.2023 Rev.002 BV1HJC45EFJ-C Electrical Characteristics (unless otherwise specified VBB = 6 V to 28 V, Tj = -40 °C to 150 °C) Parameter Symbol Limit Unit Condition 0.5 µA VBB = 14 V, VIN = 0 V, VOUT = 0 V, Tj = 25 °C - 20 µA VBB = 14 V, VIN = 0 V, VOUT = 0 V, Tj = 150 °C - 2.0 3.5 mA VBB = 14 V, VIN = 5 V, VOUT = open VUVLO - - 5.0 V VUVHYS - - 1.0 V High Level Input Voltage VINH 2.1 - - V Low Level Input Voltage VINL - - 0.9 V Input Hysteresis Voltage VHYS - 0.3 - V High Level Input Current IINH - 50 150 µA VIN = 5 V Low Level Input Current IINL -10 - +10 µA VIN = 0 V RON1 - 45 60 mΩ VBB = 8 V to 28 V, Tj = 25 °C RON2 - - 90 mΩ VBB = 8 V to 28 V, Tj = 150 °C RON3 - - 75 mΩ VBB = 6 V, Tj = 25 °C IOUTL1 - - 0.5 μA VIN = 0 V, VOUT = 0 V, Tj = 25 °C IOUTL2 - - 10 μA VIN = 0 V, VOUT = 0 V, Tj = 150 °C Output Slew Rate when ON SRON - 0.3 1.0 V/µs VBB = 14 V, RL = 6.5 Ω Output Slew Rate when OFF SROFF - 0.3 1.0 V/µs VBB = 14 V, RL = 6.5 Ω Propagation Delay when ON tOUTON - 60 120 µs VBB = 14 V, RL = 6.5 Ω Propagation Delay when OFF tOUTOFF - 60 120 µs VBB = 14 V, RL = 6.5 Ω VDS 45 50 55 V VIN = 0 V, IOUT = 10 mA Diagnostic Output L Voltage VSTL - - 0.5 V IST = 1 mA Diagnostic Output Leak Current ISTL - - 10 µA VST = 5 V Propagation Delay Time when Diagnostic Output is ON tSTON - 120 240 µs VBB = 14 V, RL = 6.5 Ω Propagation Delay Time when Diagnostic Output is OFF tSTOFF - 50 100 µs VBB = 14 V, RL = 6.5 Ω ILIM 5.0 8.0 12.0 A VDS = 5 V Short-to-VCC Detection Voltage VSHV VBB-1.8 VBB-1.2 VBB-0.5 V VIN = 0 V Load Open Detection Voltage VOLD 2.0 3.0 4.0 V VIN = 0 V Load Open Detection Sink Current IOLD - 10 30 µA VIN = 0 V, VOUT = 5 V TTSD 150 175 200 °C TTSDHYS - 15 - °C TDTJ - 120 - °C Min Typ Max IBBL1 - - IBBL2 - IBBH UVLO Detection Voltage UVLO Hysteresis Voltage Power Supply Standby current Operating Current Input Power MOS Output Output ON Resistance Output Leak Current Output Clamp Voltage Diagnostics Protection Circuit Overcurrent Limit Value Thermal Shutdown (Note 1) Thermal Shutdown Hysteresis ∆Tj Protection Temperature (Note 1) (Note 1) (Note 1) Not 100% tested. www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 10/31 TSZ02201-0G5G1G400110-1-2 09.Feb.2023 Rev.002 BV1HJC45EFJ-C Typical Performance Curves (Unless otherwise specified VBB = 14 V, IN = 5 V, Tj = 25 °C) 20 0.4 Standby Current: IBBL [μA] Standby Current: IBBL [μA] 0.5 0.3 0.2 0.1 0 10 5 0 0 5 10 15 20 25 30 35 Power Supply Voltage: VBB [V] 40 -50 0 50 100 Junction Temperature: Tj [ºC] 150 Figure 7. Standby Current vs Power Supply Voltage Figure 8. Standby Current vs Junction Temperature 4.5 4.5 4 4 3.5 3.5 Circuit Current: IBBH [mA] Circuit Current: IBBH [mA] 15 3 2.5 2 1.5 3 2.5 2 1.5 1 1 0.5 0.5 0 0 0 5 10 15 20 25 30 35 Power Supply Voltage: VBB [V] -50 40 Figure 9. Circuit Current vs Power Supply Voltage www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 0 50 100 Junction Temperature: Tj [ºC] 150 Figure 10. Circuit Current vs Junction Temperature 11/31 TSZ02201-0G5G1G400110-1-2 09.Feb.2023 Rev.002 BV1HJC45EFJ-C Typical Performance Curves - continued (Unless otherwise specified VBB = 14 V, IN = 5 V, Tj = 25 °C) 2.5 5 2.0 Input Voltage: VINH, VINL [V] UVLO Detection Voltage: VUVLO [V] 6 4 3 2 1 VINH 1.5 VINL 1.0 0.5 0.0 0 -50 0 50 100 Junction Temperature: Tj [°C] -50 150 Figure 11. UVLO Detection Voltage vs Junction Temperature 150 Figure 12. Input Voltage vs Junction Temperature 90 90 80 Output On Resistance: RON [mΩ] 100 80 Input Current: IINH [μA] 0 50 100 Junction Temperature: Tj [ºC] 70 60 50 40 30 20 70 60 50 40 30 20 10 10 0 0 -50 0 50 100 Junction Temperature: Tj [ºC] 150 0 Figure 13. Input Current vs Junction Temperature www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5 10 15 20 25 30 35 Power Supply Voltage: VBB [V] 40 Figure 14. Output ON Resistance vs Supply Voltage 12/31 TSZ02201-0G5G1G400110-1-2 09.Feb.2023 Rev.002 BV1HJC45EFJ-C Typical Performance Curves - continued (Unless otherwise specified VBB = 14 V, IN = 5 V, Tj = 25 °C) 90 10 Output Leak Current: IOUTL [μA] Output On Resistance: RON [mΩ] 80 70 60 50 40 30 20 8 6 4 2 10 0 0 0 50 100 Junction Temperature: Tj [ºC] 150 -50 Figure 15. Output ON Resistance vs Junction Temperature 150 Figure 16. Output leak Current vs Junction Temperature 1.2 175 Output ON, OFF Propagation Delay Time: tOUTON, tOUTOFF [μs] Slew Rate: SRON , SROFF [V/μs] 0 50 100 Junction Temperature: Tj [°C] 150 1.0 125 0.8 100 0.6 0.4 SROFF 0.2 SRON 0.0 tOUTON 75 tOUTOFF 50 25 0 -50 0 50 100 Junction Temperature: Tj [ºC] 150 -50 Figure 17. Output Slew Rate vs Junction Temperature www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 0 50 100 Junction Temperature: Tj [ºC] 150 Figure 18. Output ON, OFF Propagation Delay Time vs Junction Temperature 13/31 TSZ02201-0G5G1G400110-1-2 09.Feb.2023 Rev.002 BV1HJC45EFJ-C Typical Performance Curves - continued (Unless otherwise specified VBB = 14 V, IN = 5 V, Tj = 25 °C) Diagnostic Output Low Voltage: VSTL [V] 55 Output Clamp Voltage: VDS [V] 53 51 49 47 45 43 0.5 0.4 0.3 0.2 0.1 41 -50 0 50 100 Junction Temperature: Tj [ºC] 150 0.0 -50 Figure 19. Output Clamp Voltage vs Junction Temperature 0 50 100 150 Junction Temperature: Tj [ºC] Figure 20. Diagnostic Output Low Voltage vs Junction Temperature 5 Open Load Detection Voltage: VOLD [V] Diagnostic Output ON, OFF Propagation Delay Time: tSTON,tSTOFF [μs] 250 200 150 tSTON 100 tSTOFF 50 0 -50 4 3 2 1 0 0 50 100 Junction Temperature: Tj [ºC] -50 150 Figure 21. Diagnostic Output ON, OFF Propagation Delay Time vs Junction Temperature www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 0 50 100 Junction Temperature: Tj [ºC] 150 Figure 22. Open Load Detection Voltage vs Junction Temperature 14/31 TSZ02201-0G5G1G400110-1-2 09.Feb.2023 Rev.002 BV1HJC45EFJ-C Typical Performance Curves - continued Active Clamp Energy: EAS [mJ] (Unless otherwise specified VBB = 14 V, IN = 5 V, Tj = 25 °C) Tj(start) = 25 ºC 1000 100 Tj(start) = 150 ºC 10 0.1 1.0 10.0 Output Current: IOUT [A] Figure 23. Active Clamp Energy vs Output Current www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 15/31 TSZ02201-0G5G1G400110-1-2 09.Feb.2023 Rev.002 BV1HJC45EFJ-C Measurement Circuit VBB VBB VBB VBB IN IN ST1, ST2 ST1, ST2 VIN VIN OUT OUT GND GND Figure 24. Standby Current Low-Level Input Current Output Leak Current Diagnostic Output Leak Current Figure 25. Operating Current VBB VBB VBB IN VBB IN ST1, ST2 ST1, ST2 VIN OUT GND VIN 1 kΩ GND Figure 26. UVLO Detection Voltage UVLO Hysteresis Voltage High Level Input Voltage Low Level Input Voltage Input Hysteresis Voltage High Level Input Current Thermal Shutdown Thermal Shutdown Hysteresis www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 OUT Figure 27. Output ON Resistance Output Clamp Voltage 16/31 TSZ02201-0G5G1G400110-1-2 09.Feb.2023 Rev.002 BV1HJC45EFJ-C Measurement Circuit - continued VBB VBB VBB VBB IN IN 10 kΩ ST1, ST2 ST1, ST2 Monitor Monitor IST VIN VIN OUT Monitor GND OUT GND 6.5 Ω Figure 28. Output ON Slew Rate Output OFF Slew Rate Output ON Propagation Delay Time Output OFF Propagation Delay Time Diagnostic Output ON Propagation Delay Time Diagnostic Output OFF Propagation Delay Time 1 kΩ Figure 29. Diagnostic Output Low Voltage VBB VBB IN ST1, ST2 10 kΩ OUT GND Figure 30. Open Load Detection Voltage Open Load Detection Sink Current www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 17/31 TSZ02201-0G5G1G400110-1-2 09.Feb.2023 Rev.002 BV1HJC45EFJ-C Switching Time Measurement Condition VBB VBB IN VINL VINH tOUTOF SRON OUT IN 5V 20 % OUT 10 kΩ 10 kΩ 80 % 80 % 6.5 Ω tOUTON ST1 20 % SROF ST2 GND ST1 tSTON tSTOFF ST2 Figure 31. Switching Time Measurement Diagram www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Figure 32. Switching Time Measurement Waveform 18/31 TSZ02201-0G5G1G400110-1-2 09.Feb.2023 Rev.002 BV1HJC45EFJ-C Timing Chart VBB IN VINH VINL t OUTOFF SRON 80 % 80 % 20 % OUT 20 % tOUTON SROFF ST1 tSTON tSTOFF ST2 Figure 33. Timing Chart www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 19/31 TSZ02201-0G5G1G400110-1-2 09.Feb.2023 Rev.002 BV1HJC45EFJ-C Function Description 1. Protection Function Table 1. Detection and Release Conditions of Each Protection Function and Diagnostic Output Mode Normal Condition Conditions IN ST1 ST2 Standby - Low High High Operating - High Low High Detect VOUT ≥ 3.0 V (Typ) Low Low High Release VOUT ≤ 2.4 V (Typ) Low High High Detect VOUT > VBB - 1.2 V (Typ) Low Low Low Open Load Detect (OLD) Short to VBB Detection Low Voltage Output OFF (UVLO) Thermal Shutdown (TSD) (Note 1) ΔTj Protection (Note 2) Over Current Protection (OCP) Release VOUT < VBB - 2.0 V (Typ) Low Low High Detect VBB ≤ 5.0 V (Max) High High High Release VBB ≥ 6.0 V (Max) High Low High Detect Tj ≥ 175 °C (Typ) High High High Release Tj ≤ 160 °C (Typ) High Low High Detect ΔTj ≥ 120 °C (Typ) High High High Release ΔTj ≤ 80 °C (Typ) High Low High Detect IOUT ≥ 8.0 A (Typ) High High High Release IOUT < 8.0 A (Typ) High Low High (Note 1) Thermal shutdown is automatically restored to normal operation. (Note 2) Protect function by detecting PowerMOS sharp increase of temperature difference with control circuit. This IC has a built-in protection detection function as mentioned above and outputs the abnormal condition with ST1 and ST2 pins. ST1 is output for output detect and each protect function. ST1 change from High to Low when OUT rise by near VBB during normal operation. And change from Low to High when detect each protection or OUT is less than VBB - 1.2 V (Typ). ST2 is output for open load detection and Short to VBB detection during IN = Low. It is self-rest and operation becomes normal when each protection releases after detecting. www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 20/31 TSZ02201-0G5G1G400110-1-2 09.Feb.2023 Rev.002 BV1HJC45EFJ-C Function Description - continued 2. Overcurrent Protection This IC has a built-in overcurrent protection function. When overcurrent flows in the output, the output current is limited to 8.0 A (Typ) and self-diagnostic output 1 (ST1) becomes High. 3. Thermal Shutdown and ΔTj Protection Detection 3.1 Thermal Shutdown Protection This IC has a built-in thermal shutdown protection function. When the IC chip temperature exceeds175 °C (Typ), the output is turned OFF and self-diagnostic output 1 (ST1) becomes High. When the temperature goes below 160 °C (Typ), output will self-reset and operation becomes normal. 3.2 ΔTj Protection This IC has a built-in ΔTj protection function that turns OFF the output when the temperature difference (TDTJ) between the POWER-MOS unit (TPOWER-MOS) and the control unit (TAMB) in the IC is 120 °C (Typ) or more. ΔTj protection also has a built-in hysteresis (TDTJHYS) that returns the output to normal state when the temperature difference becomes 80 °C (Typ) or less. Figure 34 shows the timing chart of thermal shutdown protection and ΔTj protection during output short to GND fault. IN ILIMH IOUT TTSD TPOWER-MOS TTSDHYS TAMB TDTJHYS TDTJ ΔTj Protection Operation TSD Operation ST1 TSD Detect TSD Release (Note 1) Figure 34. Thermal Shutdown Protection and ΔTj Protection Timing Chart (Note 1) When output voltage falls to output ON detection voltage (VSHV) or less at the output to GND is shorted or rare short, IC is judged that the output voltage is abnormal. Hence, ST1, ST2 may not be able to turn low. www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 21/31 TSZ02201-0G5G1G400110-1-2 09.Feb.2023 Rev.002 BV1HJC45EFJ-C Function Description - continued 4. Open Load Detection VBB 5V VBB S OLD ROLD OUT IN Internal supply SW1 ST1 R1 logic ST2 R2 RPD RL VOLD Figure 35. Open Load Detection Block Diagram Open load can be detected by connecting an external resistance ROLD between power supply VBB and output. When output load is disconnected during input is low, diagnostic output the ST1 pin is turned to low to indicate abnormality. To reduce the standby current of the system, an open load resistance switch S OLD is recommended. When the SW1 is OFF, voltage of the OUT does not fall to GND level. Because, when the IN pin is low, the voltage of the OUT pin does not become under or equal to the Output ON Detection Voltage (VDSDET). To pulled down the OUT pin, pulled down resistance RPD is recommended. The resistance RPD is 4.3 kΩ or less for outflow current from the OUT pin. 4.1 When the OUT is pulled down by the load (Normal function) The value of external resistance ROLD is decided based on used minimum power supply voltage (V BB), internal resistance R1 and R2 and open detection voltage VOLD. External resistance RPD is unnecessary. The equation for calculating the ROLD value is shown below. 𝑅𝑂𝐿𝐷 < 𝑉𝐵𝐵 × ( 𝑅1(𝑀𝑖𝑛) + 𝑅2(𝑀𝑖𝑛) ) 𝑉𝑂𝐿𝐷(Max) − ( 𝑅1(𝑀𝑖𝑛) + 𝑅2(𝑀𝑖𝑛) ) [Ω] The above formula is summarized as follows. 𝑅𝑂𝐿𝐷 < 𝑉𝐵𝐵 × 75 × 103 − 300 × 103 [Ω] ROLD value is fell below the above calculated result. 4.2 If the SW is OFF, the output is no longer pulled down by the load The value of external resistance ROLD is decided based on used minimum power supply voltage (VBB), external resistance RPD and open detection voltage VOLD. The equation for calculating the ROLD value is shown below. 𝑅𝑂𝐿𝐷 < 𝑉𝐵𝐵 × 𝑅𝑃𝐷 𝑉𝑂𝐿𝐷(Max) − 𝑅𝑃𝐷 [Ω] When RPD is 4.3 kΩ, the above formula is summarized as follows. 𝑅𝑂𝐿𝐷 < 𝑉𝐵𝐵 × 1.075 × 103 − 4.3 × 103 [Ω] ROLD value is fell below the above calculated result www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 22/31 TSZ02201-0G5G1G400110-1-2 09.Feb.2023 Rev.002 BV1HJC45EFJ-C Function Description - continued 5. Other Detection 5.1 GND open protection 5V VBB Clamp IN Internal supply ST1 Control logic OUT ST2 GND Figure 36. GND Open Detection Block Diagram When GND of the IC is open, the output is switched OFF regardless of the input voltage. However, self-diagnostic output (ST1, ST2) is not flagged. When an inductive load is connected, the active clamp operates when the GND pin is open 5.2 Reverse-Battery Connection Protection VBB clamp DRV OUT Reverse Battery VBAT GND Figure 37. Reverse-Battery Connection Block Diagram When the battery connection is reversed, an excessive amount of current will flow to internal part of IC and this may sometimes lead to IC destruction. As a countermeasure, this IC has a built-in reverse battery connection protection function without external components such as resistors and diodes. www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 23/31 TSZ02201-0G5G1G400110-1-2 09.Feb.2023 Rev.002 BV1HJC45EFJ-C Function Description - continued 5.3 MCU I/O Protection VBB 5V Internal supply Clamp IN ST1 Control logic OUT MCU ST2 GND Figure 38. MCU I/O Protection Negative surge voltage to the IN pin, the ST1 pin and the ST2 pin may cause damage to the MCU's I/O pins. In order to prevent those damages, it is recommended to insert limiting resistors between IC pins and MCU. www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 24/31 TSZ02201-0G5G1G400110-1-2 09.Feb.2023 Rev.002 BV1HJC45EFJ-C Application Circuit Diagram RST1PU RST2PU VBB RIN MCU CVBB IN RST1 ROLD OUT ST1 BV1HJC45EFJ-C RST2 RPD RL ST2 GND Figure 39. Application Circuit Diagram Symbol Value Purpose RIN 4.7 kΩ Limit resistance for negative surge RST1, RST2 4.7 kΩ Limit resistance for negative surge RST1PU, RST2PU 10 kΩ Pull up ST1/ST2 pin to MCU power supply, these pins are open drain output CVBB 1 µF RPD 4.3 kΩ For output pulled down ROLD 2 kΩ For open load detection www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 For battery line voltage spike filter 25/31 TSZ02201-0G5G1G400110-1-2 09.Feb.2023 Rev.002 BV1HJC45EFJ-C I/O Equivalence Circuits IN ST1, ST2 10 kΩ 150 Ω IN ST1 ST2 100 kΩ VBB VBB OUT VBB OUT 227 kΩ 273 kΩ VBB Resistance values shown in the diagrams above are typical values. www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 26/31 TSZ02201-0G5G1G400110-1-2 09.Feb.2023 Rev.002 BV1HJC45EFJ-C Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Except for pins the output and the input of which were designed to go below ground, ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Recommended Operating Conditions The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 8. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 9. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 10. Ceramic Capacitor When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 11. Thermal Shutdown Function (TSD) This IC has a built-in thermal shutdown function that prevents heat damage to the IC. Normal operation should always be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD function that will turn OFF power output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD function operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD function be used in a set design or for any purpose other than protecting the IC from heat damage. www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 27/31 TSZ02201-0G5G1G400110-1-2 09.Feb.2023 Rev.002 BV1HJC45EFJ-C Operational Notes – continued 12. Over Current Protection Function (OCP) This IC incorporates an integrated overcurrent protection function that is activated when the load is shorted. This protection function is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection function. 13. Active Clamp Operation The IC integrates the active clamp function to internally absorb the reverse energy EL which is generated when the inductive load is turned off. When the active clamp operates, the thermal shutdown function does not work. Decide a load so that the reverse energy EL is active clamp tolerance EAS (refer to Figure 23. Active Clamp Energy vs Output Current) or under when inductive load is used. 14. Open Power Supply Pin When the power supply pin (VBB) becomes open at ON (IN = High), the output is switched to OFF regardless of input voltage. If an inductive load is connected, the active clamp operates when VBB is open and becomes the same potential as that on the ground. At this time, the output voltage drops down to -50 V (Typ). 15. Open GND Pin When the GND pin becomes open at ON (IN = High), the output is switched to OFF regardless of input voltage. If an inductive load is connected, the active clamp operates when the GND pin is open. 16. OUT Pin Voltage Ensure that keep OUT pin voltage less than (VBB + 0.3 V) at any time, even during transient condition. Otherwise malfunction or other problems can occur. www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 28/31 TSZ02201-0G5G1G400110-1-2 09.Feb.2023 Rev.002 BV1HJC45EFJ-C Ordering Information B V 1 H J C 4 V1: 1ch H: High side switch 5 E F J Package EFJ: HTSOP-J8 - CE 2 Product Rank C: Automotive product Packaging and Forming Specification E2: Embossed tape and reel Marking Diagram HTSOP-J8 (TOP VIEW) Part Number Marking 1 H J C 4 5 LOT Number Pin 1 Mark www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 29/31 TSZ02201-0G5G1G400110-1-2 09.Feb.2023 Rev.002 BV1HJC45EFJ-C Physical Dimension and Packing Information Package Name www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 HTSOP-J8 30/31 TSZ02201-0G5G1G400110-1-2 09.Feb.2023 Rev.002 BV1HJC45EFJ-C Revision History Date Revision 03.Sep.2021 001 New Release 002 P.5 Absolute Maximum Ratings Change the condition of EAS from IOUT = 4 A to IOUT = 2 A. P.6 Thermal Resistance Figure 2 - Change the size of PCB layout. P.15 Typical Performance Curves Figure 23 - Change the graph of EAS. P.28 Operational Notes 14. Open Power Supply Pin Change the value of output clamp voltage. 09.Feb.2023 Changes www.rohm.com © 2021 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 31/31 TSZ02201-0G5G1G400110-1-2 09.Feb.2023 Rev.002 Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. 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Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001