Datasheet
Automotive IPD Series
Built-in Output Diagnosis
1ch High Side Switch
BV1HJC45EFJ-C
General Description
Key Specifications
BV1HJC45EFJ-C is a 1ch high side switch for automotive
application. It has a built-in overcurrent limit function,
thermal shutdown protection function, open load
detection function, low power output-OFF function and
short-to-VCC detection function. It is equipped with
diagnostic output function for abnormality detection.
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Package
Features
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Power Supply Operating Range
ON-Resistance (Tj = 25 °C)
Overcurrent Limit
Standby Current (Tj = 25 °C)
Active Clamp Tolerance (Tj = 25 °C)
W (Typ) x D (Typ) x H (Max)
HTSOP-J8
Built-in Dual TSD (Note 1)
AEC-Q100 Qualified (Note2)
Built-in Overcurrent Protection Function (OCP)
Built-in Thermal Shutdown Protection Function
(TSD)
Built-in Open Load Detection Function
Built-in Short-to-VBB Detection Function
Built-in Low Voltage Output OFF Function (UVLO)
Built-in Reverse Battery Connection Protection
Built-in Diagnostic Output
Low On-Resistance Single Nch MOSFET Switch
Monolithic power management IC with control unit
(CMOS) and power MOSFET mounted on a single
chip
6 V to 28 V
45 mΩ (Typ)
5.0 A (Min)
0.5 µA (Max)
120 mJ
4.9 mm x 6.0 mm x 1.0 mm
(Note 1) Two type of built-in temperature protection:
Junction temperature, and ΔTj protection that detects sudden temperature rise
of the Power-MOS
(Note 2) Grade 1
Application
◼
Resistance load, inductance load and capacitance
load for automotive application
Typical Application Circuit
RST1PU
RST2PU
VBB
RIN
MCU
RST1
CVBB
IN
ST1
BV1HJC45EFJ-C
OUT
RL
RST2
ST2
GND
○Product structure: Silicon integrated circuit
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Contents
General Description ........................................................................................................................................................................ 1
Features.......................................................................................................................................................................................... 1
Application ...................................................................................................................................................................................... 1
Key Specifications .......................................................................................................................................................................... 1
Package .......................................................................................................................................................................................... 1
Typical Application Circuit ............................................................................................................................................................... 1
Contents ......................................................................................................................................................................................... 2
Pin Configuration ............................................................................................................................................................................ 3
Pin Description................................................................................................................................................................................ 3
Block Diagram ................................................................................................................................................................................ 3
Definition ......................................................................................................................................................................................... 4
Absolute Maximum Ratings ............................................................................................................................................................ 5
Recommended Operating Conditions ............................................................................................................................................. 5
Thermal Resistance ........................................................................................................................................................................ 6
Electrical Characteristics............................................................................................................................................................... 10
Typical Performance Curves ......................................................................................................................................................... 11
Measurement Circuit ..................................................................................................................................................................... 16
Switching Time Measurement Condition ................................................................................................................................ 18
Timing Chart ................................................................................................................................................................................. 19
Function Description ..................................................................................................................................................................... 20
Application Circuit Diagram........................................................................................................................................................... 25
I/O Equivalence Circuits................................................................................................................................................................ 26
Operational Notes ......................................................................................................................................................................... 27
Ordering Information ..................................................................................................................................................................... 29
Marking Diagram .......................................................................................................................................................................... 29
Physical Dimension and Packing Information ............................................................................................................................... 30
Revision History ............................................................................................................................................................................ 31
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Pin Configuration
(TOP VIEW)
IN
1
8
OUT
GND
2
7
OUT
ST1
3
6
OUT
ST2
4
5
OUT
EXP-PAD = VBB
Pin Description
Pin No.
Pin Name
1
IN
2
3
4
5
6
7
8
EXP-PAD
GND
ST1
ST2
OUT
OUT
OUT
OUT
VBB
Function
Input pin. Pull-down resistor is connected internally.
Active High to turn on the switch.
Ground pin
Self–diagnostic output pin 1
Self-diagnostic output pin 2
Switch output pin
Switch output pin
Switch output pin
Switch output pin
Power input pin, switch input pin
Block Diagram
VBB
lnternal
supply
UVLO
clamp
charge
pump
IN
Gate Driver
Over current
detction
Control
Logic
Power
limitation
thermal
shut down
ST1
Open load
detection
ST2
Battery short
detection
OUT
Reverse
Battery
GND
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Definition
IBB
VBB
VDS
IIN
OUT
IN
VBB
IOUT
VOUT
IST
ST1,ST2
VIN
VST
GND
IGND
Figure 1. Voltage and Current Definition
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Absolute Maximum Ratings (Ta = 25 °C)
Parameter
Symbol
Rating
Unit
VBB - OUT Voltage
VDS
-0.3 to Internal clamp (Note 1)
V
Power Supply Voltage
VBB
-0.3 to +40
V
Input Voltage
VIN
-0.3 to +7.0
V
Diagnostic Output Voltage
VST
- 0.3 to +7.0
V
Output Current
IOUT
Diagnostic Output Current
IST
10
mA
Junction Temperature Width
Tj
-40 to +150
°C
Storage Temperature Range
Tstg
-55 to +150
°C
Tjmax
+150
°C
Active Clamp Energy (Single Pulse)
Tj(START) = 25 °C, IOUT = 2 A (Note 3) (Note 4)
EAS (25 °C)
120
mJ
Active Clamp Energy (Single Pulse)
Tj(START) = 150 °C, IOUT = 2 A(Note 3)(Note 4)
EAS (150 °C)
60
mJ
Supply Voltage
for Short Circuit Protection (Note 5)
VBBLIM
28
V
Supply Voltage
for Reverse-Battery Connection Protection
VRBPLIM
18
V
Maximum Junction Temperature
Internal limit
A
(Note 2)
(Note 1) Internally limited by output clamp voltage.
(Note 2) Internally limited by fixed over current limit.
(Note 3) Maximum active clamp energy using single pulse of IOUT(START) = 2 A and VBB = 14 V.
(Note 4) Not 100% tested.
(Note 5) Maximum power supply voltage that can detect short circuit protection.
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
Caution 3: When IC turns off with an inductive load, reverse energy is generated. This energy can be calculated by the following equation:
1
𝐸𝐿 =
2
× 𝐿 × 𝐼𝑂𝑈𝑇(𝑆𝑇𝐴𝑅𝑇) 2 ×
(1
−
Where:
L is the inductance of the inductive load.
IOUT(START) is the output current at the time of turning off.
𝑉𝐵𝐵
𝑉𝐵𝐵 − 𝑉𝐷𝑆
)
The BV1HJC45EFJ-C integrates the active clamp function to internally absorb the reverse energy EL which is generated when the inductive load is
turned off. When the active clamp operates, the thermal shutdown function does not work. Decide a load so that the reverse energy EL is active
clamp tolerance EAS (refer to Figure 23. Active Clamp Energy vs Output Current) or under when inductive load is used.
Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Power Supply Voltage Operating Range
VBB
6
14
28
V
Operating Temperature
Topr
-40
-
+150
°C
Input Frequency
fIN
-
-
1
kHz
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Thermal Resistance(Note 1)
Parameter
Symbol
Typ
Unit
Condition
130.3
°C/W
1s
(Note 2)
36.8
°C/W
2s
(Note 3)
25.9
°C/W
2s2p
(Note 4)
20
°C/W
1s
(Note 2)
8
°C/W
2s
(Note 3)
6
°C/W
2s2p
(Note 4)
HTSOP-J8
Between Junction and Surroundings Temperature
Thermal Resistance
θJA
Between Junction and the top center
of the outside surface of the component package
Thermal Characterization Parameter (Note 5)
ΨJT
(Note 1) The thermal impedance is based on JESD51-2A (Still-Air) standard. It is used the chip of BV1HJC45EFJ-C.
(Note 2) JESD51-3 standard FR4 114.3 mm x 76.2 mm x 1.57 mm 1-layer (1s)
(Top copper foil: ROHM recommended Footprint + wiring to measure, 2 oz. copper.)
(Note 3) JESD51-5 standard FR4 114.3 mm x 76.2 mm x 1.60 mm 2-layers (2s)
(Top copper foil: ROHM recommended Footprint + wiring to measure/
Copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm,
copper (top & reverse side) 2 oz)
(Note 4) JESD51-5/-7 standard FR4 114.3 mm x 76.2 mm x 1.60 mm 4-layers (2s2p)
(Top copper foil: ROHM recommended Footprint + wiring to measure/
2 inner layers and copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm,
copper (top & reverse side/inner layers) 2 oz/1 oz)
(Note 5) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface
of the component package.
■ PCB Layout 1 layer (1s)
100 mm2
Footprint
600 mm2
1200 mm2
Figure 2. PCB Layout 1 Layer (1s)
Dimension
Value
Board Finish Thickness
1.57 mm ± 10 %
Board Dimension
76.2 mm x 114.3 mm
Board Material
FR4
Copper Thickness (Top Layer)
0.070 mm (Cu: 2 oz)
Copper Foil Area Dimension
Footprint/100 mm2/600 mm2/1200 mm2
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Thermal Resistance – continued
■
PCB Layout 2 layers (2s)
Top Layer
Bottom Layer
Top Layer
Bottom Layer
Via
Isolation Clearance Diameter: ≥ 0.6 mm
Cross Section
Figure 3. PCB Layout 2 Layers (2s)
Dimension
Value
Board Finish Thickness
1.60 mm ± 10 %
Board Dimension
76.2 mm x 114.3 mm
Board Material
FR4
Copper Thickness (Top/Bottom Layers)
0.070 mm (Cu + Plating)
Thermal Vias Separation/Diameter
1.2 mm/0.3 mm
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Thermal Resistance – continued
■ PCB Layout 4 layers (2s2p)
TOP Layer
2nd/Bottom Layers
3rd Layer
Top Layer
2nd Layer
3rd Layer
Bottom Layer
Via
Isolation Clearance Diameter: ≥ 0.6 mm
Cross Section
Figure 4. PCB Layout 4 Layers (2s2p)
Dimension
Value
Board Finish Thickness
1.60 mm ± 10 %
Board Dimension
76.2 mm x 114.3 mm
Board Material
FR4
Copper Thickness (Top/Bottom Layers)
0.070 mm (Cu + Plating)
Copper Thickness (Inner Layers)
0.035 mm
Thermal Vias Separation/Diameter
1.2 mm/0.3 mm
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Thermal Resistance – continued
■ Transient Thermal Resistance (Single Pulse)
Figure 5. Transient Thermal Resistance
■ Thermal Resistance (θJA vs Copper foil area- 1s)
Figure 6. Thermal Resistance
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Electrical Characteristics (unless otherwise specified VBB = 6 V to 28 V, Tj = -40 °C to 150 °C)
Parameter
Symbol
Limit
Unit
Condition
0.5
µA
VBB = 14 V, VIN = 0 V,
VOUT = 0 V, Tj = 25 °C
-
20
µA
VBB = 14 V, VIN = 0 V,
VOUT = 0 V, Tj = 150 °C
-
2.0
3.5
mA
VBB = 14 V, VIN = 5 V, VOUT = open
VUVLO
-
-
5.0
V
VUVHYS
-
-
1.0
V
High Level Input Voltage
VINH
2.1
-
-
V
Low Level Input Voltage
VINL
-
-
0.9
V
Input Hysteresis Voltage
VHYS
-
0.3
-
V
High Level Input Current
IINH
-
50
150
µA
VIN = 5 V
Low Level Input Current
IINL
-10
-
+10
µA
VIN = 0 V
RON1
-
45
60
mΩ
VBB = 8 V to 28 V, Tj = 25 °C
RON2
-
-
90
mΩ
VBB = 8 V to 28 V, Tj = 150 °C
RON3
-
-
75
mΩ
VBB = 6 V, Tj = 25 °C
IOUTL1
-
-
0.5
μA
VIN = 0 V, VOUT = 0 V, Tj = 25 °C
IOUTL2
-
-
10
μA
VIN = 0 V, VOUT = 0 V, Tj = 150 °C
Output Slew Rate when ON
SRON
-
0.3
1.0
V/µs
VBB = 14 V, RL = 6.5 Ω
Output Slew Rate when OFF
SROFF
-
0.3
1.0
V/µs
VBB = 14 V, RL = 6.5 Ω
Propagation Delay when ON
tOUTON
-
60
120
µs
VBB = 14 V, RL = 6.5 Ω
Propagation Delay when OFF
tOUTOFF
-
60
120
µs
VBB = 14 V, RL = 6.5 Ω
VDS
45
50
55
V
VIN = 0 V, IOUT = 10 mA
Diagnostic Output L Voltage
VSTL
-
-
0.5
V
IST = 1 mA
Diagnostic Output Leak Current
ISTL
-
-
10
µA
VST = 5 V
Propagation Delay Time when
Diagnostic Output is ON
tSTON
-
120
240
µs
VBB = 14 V, RL = 6.5 Ω
Propagation Delay Time when
Diagnostic Output is OFF
tSTOFF
-
50
100
µs
VBB = 14 V, RL = 6.5 Ω
ILIM
5.0
8.0
12.0
A
VDS = 5 V
Short-to-VCC Detection Voltage
VSHV
VBB-1.8
VBB-1.2
VBB-0.5
V
VIN = 0 V
Load Open Detection Voltage
VOLD
2.0
3.0
4.0
V
VIN = 0 V
Load Open Detection Sink Current
IOLD
-
10
30
µA
VIN = 0 V, VOUT = 5 V
TTSD
150
175
200
°C
TTSDHYS
-
15
-
°C
TDTJ
-
120
-
°C
Min
Typ
Max
IBBL1
-
-
IBBL2
-
IBBH
UVLO Detection Voltage
UVLO Hysteresis Voltage
Power Supply
Standby current
Operating Current
Input
Power MOS Output
Output ON Resistance
Output Leak Current
Output Clamp Voltage
Diagnostics
Protection Circuit
Overcurrent Limit Value
Thermal Shutdown
(Note 1)
Thermal Shutdown Hysteresis
∆Tj Protection Temperature
(Note 1)
(Note 1)
(Note 1) Not 100% tested.
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Typical Performance Curves
(Unless otherwise specified VBB = 14 V, IN = 5 V, Tj = 25 °C)
20
0.4
Standby Current: IBBL [μA]
Standby Current: IBBL [μA]
0.5
0.3
0.2
0.1
0
10
5
0
0
5
10 15 20 25 30 35
Power Supply Voltage: VBB [V]
40
-50
0
50
100
Junction Temperature: Tj [ºC]
150
Figure 7. Standby Current vs Power Supply Voltage
Figure 8. Standby Current vs Junction Temperature
4.5
4.5
4
4
3.5
3.5
Circuit Current: IBBH [mA]
Circuit Current: IBBH [mA]
15
3
2.5
2
1.5
3
2.5
2
1.5
1
1
0.5
0.5
0
0
0
5
10 15 20 25 30 35
Power Supply Voltage: VBB [V]
-50
40
Figure 9. Circuit Current vs Power Supply Voltage
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0
50
100
Junction Temperature: Tj [ºC]
150
Figure 10. Circuit Current vs Junction Temperature
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Typical Performance Curves - continued
(Unless otherwise specified VBB = 14 V, IN = 5 V, Tj = 25 °C)
2.5
5
2.0
Input Voltage: VINH, VINL [V]
UVLO Detection Voltage: VUVLO [V]
6
4
3
2
1
VINH
1.5
VINL
1.0
0.5
0.0
0
-50
0
50
100
Junction Temperature: Tj [°C]
-50
150
Figure 11. UVLO Detection Voltage vs Junction Temperature
150
Figure 12. Input Voltage vs Junction Temperature
90
90
80
Output On Resistance: RON [mΩ]
100
80
Input Current: IINH [μA]
0
50
100
Junction Temperature: Tj [ºC]
70
60
50
40
30
20
70
60
50
40
30
20
10
10
0
0
-50
0
50
100
Junction Temperature: Tj [ºC]
150
0
Figure 13. Input Current vs Junction Temperature
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5
10 15 20 25 30 35
Power Supply Voltage: VBB [V]
40
Figure 14. Output ON Resistance vs Supply Voltage
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Typical Performance Curves - continued
(Unless otherwise specified VBB = 14 V, IN = 5 V, Tj = 25 °C)
90
10
Output Leak Current: IOUTL [μA]
Output On Resistance: RON [mΩ]
80
70
60
50
40
30
20
8
6
4
2
10
0
0
0
50
100
Junction Temperature: Tj [ºC]
150
-50
Figure 15. Output ON Resistance vs Junction Temperature
150
Figure 16. Output leak Current vs Junction Temperature
1.2
175
Output ON, OFF Propagation Delay Time:
tOUTON, tOUTOFF [μs]
Slew Rate: SRON , SROFF [V/μs]
0
50
100
Junction Temperature: Tj [°C]
150
1.0
125
0.8
100
0.6
0.4
SROFF
0.2
SRON
0.0
tOUTON
75
tOUTOFF
50
25
0
-50
0
50
100
Junction Temperature: Tj [ºC]
150
-50
Figure 17. Output Slew Rate vs Junction Temperature
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0
50
100
Junction Temperature: Tj [ºC]
150
Figure 18. Output ON, OFF Propagation Delay Time
vs Junction Temperature
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Typical Performance Curves - continued
(Unless otherwise specified VBB = 14 V, IN = 5 V, Tj = 25 °C)
Diagnostic Output Low Voltage: VSTL [V]
55
Output Clamp Voltage: VDS [V]
53
51
49
47
45
43
0.5
0.4
0.3
0.2
0.1
41
-50
0
50
100
Junction Temperature: Tj [ºC]
150
0.0
-50
Figure 19. Output Clamp Voltage vs
Junction Temperature
0
50
100
150
Junction Temperature: Tj [ºC]
Figure 20. Diagnostic Output Low Voltage
vs Junction Temperature
5
Open Load Detection Voltage: VOLD [V]
Diagnostic Output ON, OFF Propagation
Delay Time: tSTON,tSTOFF [μs]
250
200
150
tSTON
100
tSTOFF
50
0
-50
4
3
2
1
0
0
50
100
Junction Temperature: Tj [ºC]
-50
150
Figure 21. Diagnostic Output ON, OFF
Propagation Delay Time vs Junction Temperature
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0
50
100
Junction Temperature: Tj [ºC]
150
Figure 22. Open Load Detection Voltage
vs Junction Temperature
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Typical Performance Curves - continued
Active Clamp Energy: EAS [mJ]
(Unless otherwise specified VBB = 14 V, IN = 5 V, Tj = 25 °C)
Tj(start) = 25 ºC
1000
100
Tj(start) = 150 ºC
10
0.1
1.0
10.0
Output Current: IOUT [A]
Figure 23. Active Clamp Energy vs Output Current
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Measurement Circuit
VBB
VBB
VBB
VBB
IN
IN
ST1, ST2
ST1, ST2
VIN
VIN
OUT
OUT
GND
GND
Figure 24. Standby Current
Low-Level Input Current
Output Leak Current
Diagnostic Output Leak Current
Figure 25. Operating Current
VBB
VBB
VBB
IN
VBB
IN
ST1, ST2
ST1, ST2
VIN
OUT
GND
VIN
1 kΩ
GND
Figure 26. UVLO Detection Voltage
UVLO Hysteresis Voltage
High Level Input Voltage
Low Level Input Voltage
Input Hysteresis Voltage
High Level Input Current
Thermal Shutdown
Thermal Shutdown Hysteresis
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OUT
Figure 27. Output ON Resistance
Output Clamp Voltage
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Measurement Circuit - continued
VBB
VBB
VBB
VBB
IN
IN
10 kΩ
ST1, ST2
ST1, ST2
Monitor
Monitor
IST
VIN
VIN
OUT
Monitor
GND
OUT
GND
6.5 Ω
Figure 28. Output ON Slew Rate
Output OFF Slew Rate
Output ON Propagation Delay Time
Output OFF Propagation Delay Time
Diagnostic Output ON Propagation Delay Time
Diagnostic Output OFF Propagation Delay Time
1 kΩ
Figure 29. Diagnostic Output Low Voltage
VBB
VBB
IN
ST1, ST2
10 kΩ
OUT
GND
Figure 30. Open Load Detection Voltage
Open Load Detection Sink Current
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Switching Time Measurement Condition
VBB
VBB
IN
VINL
VINH
tOUTOF
SRON
OUT
IN
5V
20 %
OUT
10 kΩ
10 kΩ
80 %
80 %
6.5 Ω
tOUTON
ST1
20 %
SROF
ST2
GND
ST1
tSTON
tSTOFF
ST2
Figure 31. Switching Time Measurement Diagram
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Figure 32. Switching Time Measurement Waveform
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Timing Chart
VBB
IN
VINH
VINL
t OUTOFF
SRON
80 %
80 %
20 %
OUT
20 %
tOUTON
SROFF
ST1
tSTON
tSTOFF
ST2
Figure 33. Timing Chart
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Function Description
1.
Protection Function
Table 1. Detection and Release Conditions of Each Protection Function and Diagnostic Output
Mode
Normal
Condition
Conditions
IN
ST1
ST2
Standby
-
Low
High
High
Operating
-
High
Low
High
Detect VOUT ≥ 3.0 V (Typ)
Low
Low
High
Release VOUT ≤ 2.4 V (Typ)
Low
High
High
Detect VOUT > VBB - 1.2 V (Typ)
Low
Low
Low
Open Load Detect (OLD)
Short to VBB Detection
Low Voltage Output OFF
(UVLO)
Thermal Shutdown
(TSD) (Note 1)
ΔTj Protection (Note 2)
Over Current Protection
(OCP)
Release VOUT < VBB - 2.0 V (Typ)
Low
Low
High
Detect VBB ≤ 5.0 V (Max)
High
High
High
Release VBB ≥ 6.0 V (Max)
High
Low
High
Detect Tj ≥ 175 °C (Typ)
High
High
High
Release Tj ≤ 160 °C (Typ)
High
Low
High
Detect ΔTj ≥ 120 °C (Typ)
High
High
High
Release ΔTj ≤ 80 °C (Typ)
High
Low
High
Detect IOUT ≥ 8.0 A (Typ)
High
High
High
Release IOUT < 8.0 A (Typ)
High
Low
High
(Note 1) Thermal shutdown is automatically restored to normal operation.
(Note 2) Protect function by detecting PowerMOS sharp increase of temperature difference with control circuit.
This IC has a built-in protection detection function as mentioned above and outputs the abnormal condition
with ST1 and ST2 pins.
ST1 is output for output detect and each protect function.
ST1 change from High to Low when OUT rise by near VBB during normal operation.
And change from Low to High when detect each protection or OUT is less than VBB - 1.2 V (Typ).
ST2 is output for open load detection and Short to VBB detection during IN = Low.
It is self-rest and operation becomes normal when each protection releases after detecting.
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Function Description - continued
2. Overcurrent Protection
This IC has a built-in overcurrent protection function. When overcurrent flows in the output, the output current is limited
to 8.0 A (Typ) and self-diagnostic output 1 (ST1) becomes High.
3. Thermal Shutdown and ΔTj Protection Detection
3.1 Thermal Shutdown Protection
This IC has a built-in thermal shutdown protection function. When the IC chip temperature exceeds175 °C (Typ), the
output is turned OFF and self-diagnostic output 1 (ST1) becomes High. When the temperature goes below 160 °C
(Typ), output will self-reset and operation becomes normal.
3.2 ΔTj Protection
This IC has a built-in ΔTj protection function that turns OFF the output when the temperature difference (TDTJ)
between the POWER-MOS unit (TPOWER-MOS) and the control unit (TAMB) in the IC is 120 °C (Typ) or more. ΔTj
protection also has a built-in hysteresis (TDTJHYS) that returns the output to normal state when the temperature
difference becomes 80 °C (Typ) or less.
Figure 34 shows the timing chart of thermal shutdown protection and ΔTj protection during output short to GND fault.
IN
ILIMH
IOUT
TTSD
TPOWER-MOS
TTSDHYS
TAMB
TDTJHYS
TDTJ
ΔTj Protection Operation
TSD
Operation
ST1
TSD Detect
TSD Release
(Note 1)
Figure 34. Thermal Shutdown Protection and ΔTj Protection Timing Chart
(Note 1) When output voltage falls to output ON detection voltage (VSHV) or less at the output to GND is shorted or rare short, IC is judged that the output
voltage is abnormal. Hence, ST1, ST2 may not be able to turn low.
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Function Description - continued
4. Open Load Detection
VBB
5V
VBB
S OLD
ROLD
OUT
IN
Internal
supply
SW1
ST1
R1
logic
ST2
R2
RPD
RL
VOLD
Figure 35. Open Load Detection Block Diagram
Open load can be detected by connecting an external resistance ROLD between power supply VBB and output.
When output load is disconnected during input is low, diagnostic output the ST1 pin is turned to low to indicate abnormality.
To reduce the standby current of the system, an open load resistance switch S OLD is recommended.
When the SW1 is OFF, voltage of the OUT does not fall to GND level. Because, when the IN pin is low, the voltage of the
OUT pin does not become under or equal to the Output ON Detection Voltage (VDSDET). To pulled down the OUT pin, pulled
down resistance RPD is recommended. The resistance RPD is 4.3 kΩ or less for outflow current from the OUT pin.
4.1 When the OUT is pulled down by the load (Normal function)
The value of external resistance ROLD is decided based on used minimum power supply voltage (V BB), internal
resistance R1 and R2 and open detection voltage VOLD. External resistance RPD is unnecessary.
The equation for calculating the ROLD value is shown below.
𝑅𝑂𝐿𝐷 <
𝑉𝐵𝐵 × ( 𝑅1(𝑀𝑖𝑛) + 𝑅2(𝑀𝑖𝑛) )
𝑉𝑂𝐿𝐷(Max)
− ( 𝑅1(𝑀𝑖𝑛) + 𝑅2(𝑀𝑖𝑛) ) [Ω]
The above formula is summarized as follows.
𝑅𝑂𝐿𝐷 < 𝑉𝐵𝐵 × 75 × 103 − 300 × 103 [Ω]
ROLD value is fell below the above calculated result.
4.2 If the SW is OFF, the output is no longer pulled down by the load
The value of external resistance ROLD is decided based on used minimum power supply voltage (VBB), external
resistance RPD and open detection voltage VOLD.
The equation for calculating the ROLD value is shown below.
𝑅𝑂𝐿𝐷 <
𝑉𝐵𝐵 × 𝑅𝑃𝐷
𝑉𝑂𝐿𝐷(Max)
− 𝑅𝑃𝐷 [Ω]
When RPD is 4.3 kΩ, the above formula is summarized as follows.
𝑅𝑂𝐿𝐷 < 𝑉𝐵𝐵 × 1.075 × 103 − 4.3 × 103 [Ω]
ROLD value is fell below the above calculated result
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Function Description - continued
5. Other Detection
5.1 GND open protection
5V
VBB
Clamp
IN
Internal
supply
ST1
Control
logic
OUT
ST2
GND
Figure 36. GND Open Detection Block Diagram
When GND of the IC is open, the output is switched OFF regardless of the input voltage.
However, self-diagnostic output (ST1, ST2) is not flagged. When an inductive load is connected,
the active clamp operates when the GND pin is open
5.2 Reverse-Battery Connection Protection
VBB
clamp
DRV
OUT
Reverse
Battery
VBAT
GND
Figure 37. Reverse-Battery Connection Block Diagram
When the battery connection is reversed, an excessive amount of current will flow to internal part of IC
and this may sometimes lead to IC destruction.
As a countermeasure, this IC has a built-in reverse battery connection protection function without external
components such as resistors and diodes.
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Function Description - continued
5.3 MCU I/O Protection
VBB
5V
Internal
supply
Clamp
IN
ST1
Control
logic
OUT
MCU
ST2
GND
Figure 38. MCU I/O Protection
Negative surge voltage to the IN pin, the ST1 pin and the ST2 pin may cause damage to the MCU's I/O pins. In order to
prevent those damages, it is recommended to insert limiting resistors between IC pins and MCU.
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Application Circuit Diagram
RST1PU
RST2PU
VBB
RIN
MCU
CVBB
IN
RST1
ROLD
OUT
ST1
BV1HJC45EFJ-C
RST2
RPD
RL
ST2
GND
Figure 39. Application Circuit Diagram
Symbol
Value
Purpose
RIN
4.7 kΩ
Limit resistance for negative surge
RST1, RST2
4.7 kΩ
Limit resistance for negative surge
RST1PU, RST2PU
10 kΩ
Pull up ST1/ST2 pin to MCU power supply, these pins are open drain output
CVBB
1 µF
RPD
4.3 kΩ
For output pulled down
ROLD
2 kΩ
For open load detection
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I/O Equivalence Circuits
IN
ST1, ST2
10 kΩ
150 Ω
IN
ST1
ST2
100 kΩ
VBB
VBB
OUT
VBB
OUT
227 kΩ
273 kΩ
VBB
Resistance values shown in the diagrams above are typical values.
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
Ground Voltage
Except for pins the output and the input of which were designed to go below ground, ensure that no pins are at a
voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
8.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
9.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
10. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
11. Thermal Shutdown Function (TSD)
This IC has a built-in thermal shutdown function that prevents heat damage to the IC. Normal operation should
always be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued
period, the junction temperature (Tj) will rise which will activate the TSD function that will turn OFF power output pins.
When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD function operates in a situation that exceeds the absolute maximum ratings and therefore, under
no circumstances, should the TSD function be used in a set design or for any purpose other than protecting the IC
from heat damage.
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Operational Notes – continued
12. Over Current Protection Function (OCP)
This IC incorporates an integrated overcurrent protection function that is activated when the load is shorted. This
protection function is effective in preventing damage due to sudden and unexpected incidents. However, the IC
should not be used in applications characterized by continuous operation or transitioning of the protection function.
13. Active Clamp Operation
The IC integrates the active clamp function to internally absorb the reverse energy EL which is generated when the
inductive load is turned off. When the active clamp operates, the thermal shutdown function does not work. Decide a
load so that the reverse energy EL is active clamp tolerance EAS (refer to Figure 23. Active Clamp Energy vs Output
Current) or under when inductive load is used.
14. Open Power Supply Pin
When the power supply pin (VBB) becomes open at ON (IN = High), the output is switched to OFF regardless of
input voltage. If an inductive load is connected, the active clamp operates when VBB is open and becomes the same
potential as that on the ground. At this time, the output voltage drops down to -50 V (Typ).
15. Open GND Pin
When the GND pin becomes open at ON (IN = High), the output is switched to OFF regardless of input voltage. If an
inductive load is connected, the active clamp operates when the GND pin is open.
16. OUT Pin Voltage
Ensure that keep OUT pin voltage less than (VBB + 0.3 V) at any time, even during transient condition.
Otherwise malfunction or other problems can occur.
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Ordering Information
B
V
1
H
J
C
4
V1: 1ch
H: High side switch
5
E
F
J
Package
EFJ: HTSOP-J8
-
CE 2
Product Rank
C: Automotive product
Packaging and Forming Specification
E2: Embossed tape and reel
Marking Diagram
HTSOP-J8 (TOP VIEW)
Part Number Marking
1 H J C 4 5
LOT Number
Pin 1 Mark
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Physical Dimension and Packing Information
Package Name
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HTSOP-J8
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Revision History
Date
Revision
03.Sep.2021
001
New Release
002
P.5 Absolute Maximum Ratings
Change the condition of EAS from IOUT = 4 A to IOUT = 2 A.
P.6 Thermal Resistance
Figure 2 - Change the size of PCB layout.
P.15 Typical Performance Curves
Figure 23 - Change the graph of EAS.
P.28 Operational Notes
14. Open Power Supply Pin
Change the value of output clamp voltage.
09.Feb.2023
Changes
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Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
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Rev.001
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