Datasheet
Automotive IPD 1ch Low Side Switch
BV1LB045FPJ-C
Features
Key Specifications
■
■
■
■
■
■
AEC-Q100 Qualifies(Note 1)
Built-in Over Current Protection Function(OCP)
Built-in Thermal Shutdown Function (TSD)
Built-in Active Clamp Function
Direct Control Enabled from CMOS Logic IC, etc.
On Resistance RDS(ON)=45 mΩ(Typ)
(when VIN5 V, IOUT=2.4 A, Tj25 C)
■ Monolithic Power Management IC with the Control
Block (CMOS) and Power MOS FET Mounted on a
Single Chip
On-state Resistance (Tj =25 °C, Typ)
Over Current Detection Current
(Tj =25 °C, Typ)
Output Clamp Voltage (Min)
Active Clamp Energy (Tj(START) =25 °C)
Package
TO252-J3
(Note 1) Grade1
45 mΩ
24 A
42 V
150 mJ
W (Typ) x D (Typ) x H (Max)
6.60 mm x 10.07 mm x 2.50 mm
General Description
The BV1LB045FPJ-C is an automotive 1ch low side
switch IC, which has built-in over current protection
function, thermal shutdown function and active clamp
function.
Application
■ Driving Resistive, Inductive and Capacitive Load
Block Diagram
IN
OUT
Active Clamp Circuit
TSD
OCP
GND
Figure 1. Block Diagram
Product structure: Silicon monolithic integrated circuit
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Contents
Features ................................................................................................................................................................................. 1
General Description ................................................................................................................................................................ 1
Application .............................................................................................................................................................................. 1
Key Specifications ................................................................................................................................................................... 1
Package ................................................................................................................................................................................. 1
Block Diagram ........................................................................................................................................................................ 1
Pin Configuration .................................................................................................................................................................... 3
Pin Description........................................................................................................................................................................ 3
Term ....................................................................................................................................................................................... 3
Absolute Maximum Ratings ..................................................................................................................................................... 4
Recommended Operating Conditions ...................................................................................................................................... 4
Thermal Resistance ................................................................................................................................................................ 5
Electrical Characteristics ......................................................................................................................................................... 9
Typical Performance Curves .................................................................................................................................................. 10
Measurement Circuit for Typical Performance Curves ............................................................................................................ 15
I/O Pin Truth Table ................................................................................................................................................................ 16
Timing Chart ......................................................................................................................................................................... 16
Operational Notes ................................................................................................................................................................. 17
Ordering Information ............................................................................................................................................................. 18
Marking Diagram................................................................................................................................................................... 18
Physical Dimension and Packing Information ......................................................................................................................... 19
Revision History .................................................................................................................................................................... 20
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Pin Configuration
TO252-J3
(TOP VIEW)
OUT
1
2
3
IN OUT GND
Figure 2. Pin Configuration
Pin Description
.
Pin No.
Pin Name
Function
1
IN
2
OUT
Output pin. When output pin shorted to battery and output current exceeding
the over current detection value, output current will be limited to protect IC.
3
GND
GND pin.
4(FIN)
OUT
Output pin, when output pin shorted to battery and output current exceeding the
over current detection value, output current will be limited to protect IC.
Input pin, with internal pull-down resistor.
Term
VBAT
VBAT
RL, ZL
IOUT
OUT
IIN
IN
VIN
VOUT
GND
VIN
GND
Figure 3. Term
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Absolute Maximum Ratings(Tj =25°C)
Parameter
Output Voltage
Input Voltage
Symbol
Ratings
Unit
VOUT
-0.3 to +42
V
VIN
-0.3 to +7
V
Output Current
IOUT(OCP)
Active Clamp Energy (Single Pulse)
Tj(START) = 25 °C(Note 2)
EAS(25 °C)
18(inside limited)(Note 1)
A
150
mJ
Active Clamp Energy (Single Pulse)
Tj(START) = 150 °C(Note 2) (Note 3)
Operating Temperature Range
Storage Temperature Range
Maximum Junction Temperature
EAS(150 °C)
80
Tj
-40 to +150
°C
Tstg
-55 to +150
°C
Tjmax
150
°C
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open
circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case
the IC is operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of
the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into
consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 1) Internally limited by over current protection function.
(Note 2) Active clamp energy (Single Pulse), at the condition IOUT(START) = 4.6 A, VBAT = 16 V.
EAS =
1
2
LIOUT(START)2 × ( 1 -
VBAT
)
VBAT - VOUT(CL)
(Note 3) Not 100 % tested.
Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Input Voltage
VIN
3.0
5.0
5.5
V
Operating Temperature
Tj
-40
+25
+150
°C
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Thermal Resistance(Note 1)
Parameter
Symbol
Typ
Unit
Condition
109.5
°C / W
1s
(Note 2)
27.8
°C / W
2s
(Note 3)
19.5
°C / W
2s2p
(Note 4)
TO252-J3
Between Junction and Surroundings Temperature
Thermal Resistance
θJA
(Note 1) The thermal impedance is based on JESD51 - 2A (Still - Air) standard. It is used the chip of BV1LB045FPJ-C
(Note 2) JESD51 - 3 standard FR4 114.3 mm x 76.2 mm x 1.57 mm 1 - layer (1s)
(Top copper foil: ROHM recommended Footprint + wiring to measure, 2 oz. copper.)
(Note 3) JESD51 - 5 standard FR4 114.3 mm x 76.2 mm x 1.60 mm 2 - layers (2s)
(Top copper foil: ROHM recommended Footprint + wiring to measure /
Copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm,
copper (top & reverse side) 2 oz.)
(Note 4) JESD51 - 5 / - 7 standard FR4 114.3 mm x 76.2 mm x 1.60 mm 4 - layers (2s2p)
(Top copper foil: ROHM recommended Footprint + wiring to measure /
2 inner layers and copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm,
copper (top & reverse side / inner layers) 2 oz. / 1 oz.)
■ PCB Layout 1 layer (1s)
300 mm2
Footprint
600 mm2
1200 mm2
Figure 4. PCB Layout 1 layer (1s)
Dimension
Value
Board Finish Thickness
1.57 mm ± 10 %
Board Dimension
76.2 mm x 114.3 mm
Board Material
FR4
Copper Thickness (Top Layer)
0.070 mm (Cu:2 oz)
Copper Foil Area Dimension
Footprint / 300 mm2 / 600 mm2 / 1200 mm2
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Thermal Resistance – continued
■
PCB Layout 2 layers (2s)
Top Layer
Bottom Layer
Top Layer
Bottom Layer
Via
Isolation Clearance Diameter : ≥0.6 mm
Cross Section
Figure 5. PCB Layout 2 layers (2s)
Dimension
Value
Board Finish Thickness
1.60 mm ± 10 %
Board Dimension
76.2 mm x 114.3 mm
Board Material
FR4
Copper Thickness (Top/Bottom Layers)
0.070 mm (Cu +Plating)
Thermal Vias Separation / Diameter
1.2 mm / 0.3 mm
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Thermal Resistance – continued
■ PCB Layout 4 layers (2s2p)
TOP Layer
2nd/Bottom Layers
3rd Layer
Top Layer
2nd Layer
3rd Layer
Bottom Layer
Via
Isolation Clearance Diameter : ≥0.6 mm
Cross Section
Figure 6. PCB Layout 4 layers (2s2p)
Dimension
Value
Board Finish Thickness
1.60 mm ± 10 %
Board Dimension
76.2 mm x 114.3 mm
Board Material
FR4
Copper Thickness (Top/Bottom Layers)
0.070 mm (Cu +Plating)
Copper Thickness (Inner Layers)
0.035 mm
Thermal Vias Separation / Diameter
1.2 mm / 0.3 mm
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Thermal Resistance – continued
■ Transient Thermal Resistance (Single Pulse)
1000
Zth [ °C / W]
100
10
footprint
1
2s
2s2p
0
0.0001
0.001
0.01
0.1
1
Pulse Time[s]
10
100
1000
Figure 7. Transient Thermal Resistance
■ Thermal Resistance (θJA vs Copper foil area- 1s)
140
120
Zth [ °C / W]
100
80
60
40
20
0
0
200
400
600
800
Copper Foil Area (1s) [mm^2]
1000
1200
Figure 8. Thermal Resistance
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Electrical Characteristics (Unless otherwise specified, 40 C ≤ Tj ≤ 150 C)
Parameter
Symbol
Output Clamp Voltage
Limit
Unit
Conditions
Min
Typ
Max
VOUT(CL)
42
48
54
V
RDS(ON)
-
45
57
mΩ
VIN=5 V, IOUT=2.4 A, Tj=25 °C
RDS(ON)
-
82
106
mΩ
VIN=5 V, IOUT=2.4 A, Tj=150 °C
RDS(ON)
-
57
81
mΩ
VIN=3 V, IOUT=2.4 A, Tj=25 °C
RDS(ON)
-
100
137
mΩ
VIN=3 V, IOUT=2.4 A, Tj=150 °C
Leak Current (Tj=25 °C)
IOUT(L)
-
0
4.0
μA
VIN=0 V, VOUT=18 V, Tj=25 °C
Leak Current (Tj=150 °C)
IOUT(L)
-
10
60
μA
VIN=0 V, VOUT=18 V, Tj=150 °C
Turn-ON TIME
tON
-
-
120
μs
Turn-OFF TIME
tOFF
-
-
120
μs
Slew Rate On
SRON
-
0.4
0.8
V/μs
Slew Rate Off
SROFF
-
0.8
1.6
V/μs
Input Threshold Voltage
VIN(TH)
1.1
-
2.7
V
RL=4.7 Ω, VBAT=12 V
IIN(H1)
-
100
200
μA
VIN=5 V
IIN(H2)
-
-
500
μA
VIN=5 V
IIN(L)
-10
0
+10
μA
VIN=0 V
IOUT(OCP)
18
24
30
A
VIN=5 V, Tj=25 °C
Tjo
150
175
-
°C
VIN=5 V
Tjr
135
-
-
°C
VIN=5 V
TjΔHYS
-
15
-
°C
VIN=5 V
On-state Resistance
(VIN=5 V, Tj=25 °C)
On-state Resistance
(VIN=5 V, Tj=150 °C)
On-state Resistance
(VIN=3 V, Tj=25 °C)
On-state Resistance
(VIN=3 V, Tj=150 °C)
High-level Input Current1
(in Normal Operation)
High-level Input Current2
(in Abnormal Operation)(Note 1)
Low-level Input Current
Over Current Detection Current
Thermal Shutdown Operated
Temperature(Note 2)
Thermal Shutdown Released
Temperature(Note 2)
Thermal Shutdown Hysteresis
(Note 2)
VIN=0 V, IOUT=1 mA
VIN=0 V to 5 V, RL=4.7 Ω,
VBAT=12 V, Tj=25 °C
VIN=5 V to 0 V, RL=4.7 Ω,
VBAT=12 V, Tj=25 °C
VIN=0 V to 5 V, RL=4.7 Ω,
VBAT=12 V, Tj=25 °C
VIN=5 V to 0 V, RL=4.7 Ω,
VBAT=12 V, Tj=25 °C
(Note 1) When thermal shutdown function or over current protection function is ON.
(Note 2) Not 100 % tested.
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54
60
52
55
On-state Resistance: RDS(ON) [mΩ]
Output Clamp Voltage: VOUT(CL) [V]
Typical Performance Curves(Unless otherwise specified, Tj=25 °C, VIN=5.0 V)
50
48
46
44
42
50
45
40
35
30
-40
0
40
80
120
150
3
4
Junction Temperature: Tj[℃]
Figure 9. Output Clamp Voltage
vs Junction Temperature
6
7
Figure 10. On-state Resistance vs Input Voltage
60
140
VIN=3 V
120
50
VIN=5 V
Leak Current : IOUT(L) [µA]
On-state Resistance: RDS(ON) [mΩ]
5
Input Voltage: VIN [V]
100
80
60
40
40
30
20
10
20
0
0
-40
0
40
80
120
150
Figure 11. On-state Resistance
vs Junction Temperature
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-40
0
40
80
120
150
Junction Temperature: Tj[℃]
Junction Temperature: Tj[℃]
Figure 12. Leak Current vs Junction Temperature
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150
120
125
100
Turn-OFF TIME: ｔOFF [µs]
Turn-ON TIME: ｔON [µs]
Typical Performance Curves (Unless otherwise specified, Tj=25 °C, VIN=5.0 V) – continued
100
75
50
25
80
60
40
20
0
0
3
4
5
6
7
3
4
Input Voltage: VIN [V]
Figure 13. Turn-ON TIME vs Input Voltage
6
7
Figure 14. Turn-OFF TIME vs Input Voltage
120
100
100
Turn-OFF TIME: ｔOFF [µs]
120
Turn-ON TIME: ｔON [µs]
5
Input Voltage: VIN [V]
80
60
40
20
80
60
40
20
0
0
-40
0
40
80
120
150
Junction Temperature: Tj[℃]
0
40
80
120
150
Junction Temperature: Tj[℃]
Figure 15. Turn-ON TIME vs Junction Temperature
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Figure 16. Turn-OFF TIME vs Junction Temperature
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0.8
1.6
0.6
1.2
Slew Rate Off: SROFF [V/µs]
Slew Rate On: SR ON [V/µs]
Typical Performance Curves (Unless otherwise specified, Tj=25 °C, VIN=5.0 V) – continued
0.4
0.2
0.8
0.4
0.0
0.0
3
4
5
6
3
7
4
Figure 17. Slew Rate On vs Input Voltage
6
7
Figure 18. Slew Rate Off vs Input Voltage
0.8
1.6
0.6
1.2
Slew Rate Off: SROFF [V/µs]
Slew Rate On: SR ON [V/µs]
5
Input Voltage: VIN [V]
Input Voltage: VIN [V]
0.4
0.2
0.0
0.8
0.4
0.0
-40
0
40
80
120
150
150
Junction Temperature: Tj[℃]
0
40
80
120
150
Junction Temperature: Tj[℃]
Figure 20. Slew Rate Off vs Junction Temperature
Figure 19. Slew Rate On vs Junction Temperature
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Typical Performance Curves (Unless otherwise specified, Tj=25 °C, VIN=5.0 V) – continued
2.7
200
VIN(TH) High
High-level Input Current1: IIN(H1) [µA]
Input Threshold Voltage: VIN(TH) [V]
VIN(TH) Low
2.3
1.9
1.5
150
100
1.1
-40
0
40
80
120
50
0
150
3
4
Junction Temperature: Tj[℃]
6
7
Input Voltage: VIN [V]
Figure 22. High-level Input Current1 (in Normal
Operation) vs Input Voltage
Figure 21. Input Threshold Voltage
vs Junction Temperature
30
Over Current Detection Current: IOUT(OCP) [A]
200
High-level Input Current1: IIN(H1) [µA]
5
150
100
50
0
25
20
15
VIN=3 V
10
VIN=4 V
VIN=5 V
VIN=6 V
5
VIN=7 V
0
-40
0
40
80
120
150
Junction Temperature: Tj[℃]
2
4
6
8
Output Voltage: VOUT [V]
10
12
Figure 24. Over Current Detection Current
vs Output Voltage
Figure 23. High-level Input Current1 (in Normal
Operation) vs Junction Temperature
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Typical Performance Curves (Unless otherwise specified, Tj=25 °C, VIN=5.0 V) – continued
10000
Active Clamp Enargy (Single Pulse): EAS[mJ]
Over Current Detection Current: IOUT(OCP) [A]
30
26
Tj(START)=25 °C
Tj(START)=150 °C
1000
22
18
-40
0
40
80
120
150
Junction Temperature: Tj[℃]
Figure 25. Over Current Detection Current
vs Junction Temperature
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100
10
1
2
3
4
Output Current (Start):IOUT(START)[A]
5
Figure 26. Active Clamp Energy (Single Pulse)
vs Output Current (Start)
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Measurement Circuit for Typical Performance Curves
RDS(ON)
= VOUT/IOUT
IOUT = 2.4 A
IOUT = 1ｍA
OUT
IN
OUT
IN
V
VIN
GND
V
GND
Measurement Circuit for
Figure 9
Measurement Circuit for
Figure 10, 11
RL = 4.7 Ω
VOUT = 18 V
A
VBAT = 12 V
OUT
OUT
Monitor
IN
IN
Monitor
GND
VIN
GND
Measurement Circuit for
Figure 12
Measurement Circuit for
Figure 13, 14, 15, 16, 17, 18,19, 20
VBAT = 12 V
RL = 4.7 Ω
RL = 4.7 Ω
OUT
IN
VBAT = 12 V
OUT
A
V
IN
V
VIN
GND
VIN
Measurement Circuit for
Figure 21
A
GND
Measurement Circuit for
Figure 22, 23
VOUT
OUT
A
VIN
IN
GND
Measurement Circuit for
Figure 24, 25
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I/O Pin Truth Table
Input Signal
Operating Status
Output Status
L
Standby
OFF
H
Normal
ON
H
Over Current
Current Limiting
H
Over Temperature
OFF
Timing Chart
VIN[V]
VIN
VIN(TH)
t
0
VOUT[V]
VOUT(CL)
VOUT
VBAT
IOUT x RDS(ON)
0
t
IOUT[A]
VBAT
ZL + RDS(ON)
IOUT
t
0
Figure 27. Inductive Load Operation
VIN[V]
tr ≤ 0.1 µs
tf ≤ 0.1 µs
5V
90 %
VIN
10 %
0
ｔ
VOUT[V]
tON[µs]
tOFF[µs]
≈12 V
90 %
80 %
VOUT
0
20 %
10 %
SROFF[V/µs]
SRON[V/µs]
ｔ
≈0V
Figure 28. Switching Time
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Operational Notes
1.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
2.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately
but connected to a single ground at the reference point of the application board to avoid fluctuations in the
small-signal ground caused by large currents. Also ensure that the ground traces of external components do not
cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line
impedance.
3.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
4.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
5.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
6.
Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
7.
Thermal Shutdown Function (TSD)
This IC has a built-in thermal shutdown function that prevents heat damage to the IC. Normal operation should
always be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued
period, the junction temperature (Tj) will rise which will activate the TSD function that will turn OFF power output pins.
When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD function operates in a situation that exceeds the absolute maximum ratings and therefore, under
no circumstances, should the TSD function be used in a set design or for any purpose other than protecting the IC
from heat damage.
8.
Over Current Protection Function (OCP)
This IC incorporates an integrated over current protection function that is activated when the load is shorted. This
protection function is effective in preventing damage due to sudden and unexpected incidents. However, the IC
should not be used in applications characterized by continuous operation or transitioning of the protection function.
9.
Active Clamp Operation
The IC integrates the active clamp function to internally absorb the reverse energy which is generated when the
inductive load is turned off. When the active clamp operates, the thermal shutdown function does not work. Please do
not exceed active clamp endurance when inductive load is used.
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Ordering Information
B
V
1
L
B
0
1: 1ch
L: Low Side Switch
B: Built-in Self Restart TSD
4
5
F
P
J
On-state Resistance Package
045: 45 mΩ
FPJ: TO252-J3
(Tj=25 °C,Typ)
C
E
1
Product Grade
C: For Automotive
Packaging and Forming Specification
E1: Embossed Tape and Reel
Marking Diagram
TO252-J3
(TOP VIEW)
Part Number Marking
V1LB045
LOT Number
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
18/20
TSZ02201-0GBG1G400030-1-2
16.Jan.2018 Rev.001
BV1LB045FPJ-C
Physical Dimension and Packing Information
Package Name
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TO252-J3
19/20
TSZ02201-0GBG1G400030-1-2
16.Jan.2018 Rev.001
BV1LB045FPJ-C
Revision History
Date
Revision
16.Jan.2018
001
Changes
New Release
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
20/20
TSZ02201-0GBG1G400030-1-2
16.Jan.2018 Rev.001
Notice
Precaution on using ROHM Products
1.
(Note 1)
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
