BV1LC105FJ-CE2

Datasheet Automotive IPD Series 1ch/2ch Low Side Switch IC BV1LC105FJ-C / BM2LC105FJ-C Product Summary Features ■ ■ ■ ■ ■ ■ ■ ■ AEC-Q100 Qualified (Note1) Built-in overcurrent limiting circuit(OCP) Built-in thermal shutdown circuit(TSD) Built-in active clamp circuit Built-in Open load detection circuit(OLD) at output off Direct control enabled from CMOS logic IC, etc. Built-in diagnostic(ST) output function On-state resistance RDS(ON)=105mΩ(Typ) (when VIN5V, Iout=0.8A, Tj25C) ■ Monolithic power management IC with the control block (CMOS) and power MOS FET mounted on a single chip ■ Surface mount package SOP-J8 (Note 1) On-state resistance (Tj =25°C, Typ) Overcurrent limit (Tj =25°C, Typ) Output clamp voltage (Min) Active clamp energy (Tj =25°C) Package 105mΩ 6A 42V 150mJ W(Typ) x D(Typ) x H(Max) 4.90mm x 6.00mm x 1.65mm SOP-J8 Grade1 General Description BV1LC105FJ-C is 1ch, BM2LC105FJ-C is 2ch automotive low side switch IC, which has built-in overcurrent limiting circuit, thermal shutdown circuit, overvoltage (active clamp) protection circuit and open load detection circuit. Applications Low side switch for driving resistive, Inductive load, Capacitive load Ordering Information B V 1 L C V1:1ch, M2:2ch L ：Low side SW C ：Self-restart TSD (Built-in diagnostic(ST) output function) 1 0 5 F J On-state Resistance Package 105：105mΩ FJ：SOP-J8 (Tj=25℃,Typ) C E 2 Packaging and forming specification C：High-reliability product E2：Embossed tape and reel Line up On-state resistance (Typ) Ordering Information (Typ) 105mΩ 6A Total channel number Package 1 BV1LC105FJ-CE2 SOP-J8 2 ○Product structure: Silicon monolithic integrated circuit www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 Ordering Information BM2LC105FJ-CE2 This product is not designed to protect it from radiation. 1/23 TSZ02201-0GBG1BD00020-1-2 22.Sep.2017 Rev.002 BV1LC105FJ-C BM2LC105FJ-C Block Diagrams IN1 1 8 OUT1 Active Clamp Circuit Open Load Detection Circuit Thermal Shutdown Circuit Overcurrent Limiting Circuit ST1 2 7 GND1 N.C. 3 6 N.C. N.C. 4 5 N.C. IN1 1 8 OUT1 Active Clamp Circuit Open Load Detection Circuit Thermal Shutdown Circuit Overcurrent Limiting Circuit ST1 2 7 GND1 IN2 3 6 OUT2 Active Clamp Circuit Open Load Detection Circuit Thermal Shutdown Circuit ST2 4 www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 Overcurrent Limiting Circuit 5 GND2 2/23 TSZ02201-0GBG1BD00020-1-2 22.Sep.2017 Rev.002 BV1LC105FJ-C BM2LC105FJ-C Pin Configurations IN 1 8 OUT IN1 1 8 OUT1 ST 2 7 GND ST1 2 7 GND1 N.C. 3 6 N.C. IN2 3 6 OUT2 N.C. 4 5 N.C. ST2 4 5 GND2 BV1LC105FJ-C BM2LC105FJ-C Pin Descriptions  BV1LC105FJ-C Pin No. Symbol Function 1 IN Input pin. Input pin is used to internally connect a pull-down resistor. 2 ST Self-diagnostic output pin 3 N.C. N.C pin(Note 1) 4 N.C. N.C pin(Note 1) 5 N.C. N.C pin(Note 1) 6 N.C. N.C pin(Note 1) 7 GND GND pin 8 OUT Output pin (Note 1) N.C.Pin is recommended to short with GND. N.C.Pin can be open because it isn’t connect it inside of IC.  BM2LC105FJ-C Pin No. Symbol Function 1 IN1 Input pin 1. Input pin is used to internally connect a pull-down resistor. 2 ST1 Self-diagnostic output pin 1 3 IN2 Input pin 2. Input pin is used to internally connect a pull-down resistor. 4 ST2 Self-diagnostic output pin 2 5 GND2 GND pin 2 6 OUT2 Output pin 2 7 GND1 GND pin 1 8 OUT1 Output pin 1 www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 3/23 TSZ02201-0GBG1BD00020-1-2 22.Sep.2017 Rev.002 BV1LC105FJ-C BM2LC105FJ-C Definition VBAT VBAT RL IOUT VMCU IST RST OUT ST VOUT,VDS VST IIN IN CST GND VIN VIN Figure 1. Definition Absolute Maximum Ratings (Tj =25°C) Parameter Symbol Ratings Unit Drain-Source voltage in output block V DS -0.3 to +42 (Note 1) V Input voltage V IN -0.3 to +7.0 V Output current (DC) I OUT(OCP) 3.0(Internally limited) (Note 2) A Diagnostic output voltage V ST -0.3 to +7.0 V Diagnostic output current I ST 10 mA Active clamp energy (Single pulse) Tj(start) = 25°C (Note 3) E AS(25°C) 150 Active clamp energy (Single pulse) Tj(start) = 150°C (Note 3) (Note 4) E AS(150°C) 50 Tj -40 to +150 °C Storage temperature range T stg -55 to +150 °C Maximum junction temperature T jma x 150 °C Operating temperature range mJ (Note 1) Please refer to P.21 “Operation Notes”, when is used at less than -0.3V. (Note 2) Internally limited by the overcurrent limiting circuit. (Note 3) Maximum Active clamp energy, using single non-repetitive pulse of IAR =1.9A, VBAT = 16V . EAS = 1 VBAT LIAR2 ・ ( 1 ) 2 VBAT - VOUT(CL) (Note 4) Not 100% tested. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 4/23 TSZ02201-0GBG1BD00020-1-2 22.Sep.2017 Rev.002 BV1LC105FJ-C BM2LC105FJ-C Thermal Characteristics (Note 1) Parameter Symbol Ratings Unit Conditions 167.9 °C / W 1s (Note 2) 105.8 °C / W 2s (Note 3) 85.6 °C / W 2s2p (Note 4) Ratings Unit 141.5 °C / W 1s (Note 2) 84.1 °C / W 2s (Note 3) 67.1 °C / W 2s2p (Note 4) SOP-J8(1ch ON) Thermal Resistance between channel and ambient temperature Parameter θJA Symbol Conditions SOP-J8(All ch ON) Thermal Resistance between channel and ambient temperature (Note 1) (Note 2) (Note 3) (Note 4) θJA The thermal impedance is based on JESD51 - 2A (Still - Air) standard . It is used the chip of BM2LC105FJ-C JESD51 - 3 compliance FR4 114.3 mm × 76.2 mm × 1.57 mm 1 layer (1s) (top layer copper：Rohm recommend land pattern + measurement wiring, copper thickness 2oz) JESD51 -5 compliance FR4 114.3 mm × 76.2 mm × 1.60 mm 2 layer (2s) (top layer copper：Rohm recommend land pattern + measurement wiring, bottom layer copper area：74.2 mm × 74.2 mm、 Copper thickness (top and bottom layers) 2 oz) JESD51 -5 / -7 compliance FR4 114.3 mm × 76.2 mm × 1.60 mm 4 layer (2s2p) (top layer copper：Rohm recommend land pattern + measurement wiring / 2 layer, 3 layer, bottom layer copper area: 74.2 mm × 74.2 mm, Copper thickness (top and bottom layers / inner layer) 2 oz / 1oz) ■ PCB layout 1 layer (1s) Footprint Only Figure 2. PCB layout 1 layer (1s) Dimension Board finish thickness Board dimension Board material Copper thickness (Top layer) www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 Value 1.57 mm ± 10% 76.2 mm x 114.3 mm FR4 0.070mm (Cu:2oz) 5/23 TSZ02201-0GBG1BD00020-1-2 22.Sep.2017 Rev.002 BV1LC105FJ-C BM2LC105FJ-C ■ PCB layout 2layers (2s) Top Layer Bottom Layer Cross section Top Layer Bottom Layer Figure 3. PCB layout 2layer (2s) Dimension Board finish thickness Board dimension Board material Copper thickness (Top/Bottom layers) ■ Value 1.60 mm ± 10% 76.2 mm x 114.3 mm FR4 0.070mm (Cu + Plating) PCB layout 4layers (2s2p) Top Layer 2nd Layer 3rd Layer Bottom Layer Cross section Top Layer 2nd/3rd/Bottom Layers Figure 4. PCB layout 4layer (2s2p) Dimension Board finish thickness Board dimension Board material Copper thickness (Top/Bottom layers) Copper thickness (Inner layers) www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 Value 1.60 mm ± 10% 76.2 mm x 114.3 mm FR4 0.070mm (Cu + Plating) 0.035mm 6/23 TSZ02201-0GBG1BD00020-1-2 22.Sep.2017 Rev.002 BV1LC105FJ-C BM2LC105FJ-C ■ Transient Thermal Resistance (Single Pulse) 1ch ON 1000 Zth [ °C / W] 100 10 footprint 1 2s 2s2p 0 0.0001 0.001 0.01 0.1 1 Pulse time[s] 10 100 1000 Figure 5. Transient Thermal Resistance ■ Transient Thermal Resistance (Single Pulse) All ch ON 1000 Zth [ °C / W] 100 10 footprint 1 2s 2s2p 0 0.0001 0.001 0.01 0.1 1 Pulse time[s] 10 100 1000 Figure 6. Transient Thermal Resistance www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 7/23 TSZ02201-0GBG1BD00020-1-2 22.Sep.2017 Rev.002 BV1LC105FJ-C BM2LC105FJ-C Electrical Characteristics1 (Unless otherwise specified, 40C  Tj  150C and VIN3.0V to 5.5V) Parameter Symbol Output Clamp Voltage Limit Unit Conditions Min Typ Max VOUT(CL) 42 48 54 V On-state Resistance1 (at 25 °C) RDS(ON1) - 105 130 mΩ VIN=5V,IOUT=0.8A,Tj=25°C On-state Resistance1 (at 150 °C) RDS(ON1) - 200 250 mΩ VIN=5V,IOUT=0.8A,Tj=150°C On-state Resistance2 (at 25 °C) RDS(ON2) - 135 175 mΩ VIN=3V,IOUT=0.8A,Tj=25°C On-state Resistance2 (at 150 °C) RDS(ON2) - 245 315 mΩ VIN=3V,IOUT=0.8A,Tj=150°C Leak Current (at 25 °C) IOUT(L) 40 60 80 μA VIN=0V,VOUT=18V,Tj=25°C Leak Current (at 150 °C) IOUT(L) 50 85 200 μA VIN=0V,VOUT=18V,Tj=150°C Turn-ON TIME1 tON1 - - 80 μs Turn-OFF TIME1 tOFF1 - - 80 μs Turn-ON TIME2 tON2 - - 80 μs Turn-OFF TIME2 tOFF2 - - 100 μs Slew rate on1 SRON1 - 0.7 1.2 V/μs Slew rate off1 SROFF1 - 1.0 1.5 V/μs Slew rate on2 SRON2 - 0.7 1.2 V/μs Slew rate off2 SROFF2 - 1.0 1.5 V/μs VIN=0V to 5V, RL=15Ω, VBAT=12V, Tj=25°C VIN=5V to 0V, RL=15Ω, VBAT=12V, Tj=25°C VIN=OPEN to 5V, RL=15Ω, VBAT=12V, Tj=25°C VIN=5V to OPEN, RL=15Ω, VBAT=12V, Tj=25°C VIN=0V to 5V, RL=15Ω, VBAT=12V, Tj=25°C VIN=5V to 0V, RL=15Ω, VBAT=12V, Tj=25°C VIN=OPEN to 5V, RL=15Ω, VBAT=12V, Tj=25°C VIN=5V to OPEN, RL=15Ω, VBAT=12V, Tj=25°C Input Threshold Voltage VIN(TH) 1.5 - 2.7 V IOUT=1mA IIN(H1) - 125 250 μA VIN=5V IIN(H2) - - 500 μA VIN=5V IIN(L) -10 0 10 μA VIN=0V High-level Input Current1 (in normal operation) High-level Input Current2 (in abnormal operation) (Note1) Low-level Input Current VIN=0V,IOUT=1mA (Note1) When Thermal Shutdown circuit or Overcurrent Limiting circuit is ON. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 8/23 TSZ02201-0GBG1BD00020-1-2 22.Sep.2017 Rev.002 BV1LC105FJ-C BM2LC105FJ-C Electrical Characteristics2 (Unless otherwise specified, 40C  Tj  150C and VIN3.0V to 5.5V) Parameter Symbol Limit Min Typ Max Unit Conditions Overcurrent Detection Current IOCP 3 6 9 A VIN=5V, VBAT=12V, Tj=25°C Open Load Detection Voltage VOPEN 1.5 - 4.5 V VIN=0V ST Output On Voltage1 VST(ON1) - 0.2 0.5 V VIN=5V，IST=1mA ST Output On Voltage2 VST(ON2) - 0.2 0.5 V VIN=0V，VOUT=4.5V，IST=0.5mA ST Output Leak Current1 IST(L1) - - 20 μA VIN=5V，VST=5V ST Output Leak Current2 IST(L2) - - 20 μA VIN=0V，VOUT=1.5V，VST=5V ST Output Delay Time Detect TSTDET - 3 30 μs ST Output Delay Time Release TSTREL - 3 30 μs VIN=0V，VOUT=5V to 1V, VMCU=5V，RST=10kΩ，CST=10pF VIN=0V，VOUT=1V to 5V, VMCU=5V，RST=10kΩ，CST=10pF TSD Detection Temperature (Note 2) T jd 150 175 - °C VIN=5V TSD Release Temperature (Note 2) T jr 135 - - °C VIN=5V Tj⊿HYS - 15 - °C VIN=5V TSD Hysteresis (Note 2) (Note 2) Not 100% tested. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 9/23 TSZ02201-0GBG1BD00020-1-2 22.Sep.2017 Rev.002 BV1LC105FJ-C BM2LC105FJ-C 54 140 52 130 On-state Resistance: RDS(ON) [mΩ] Output clamp voltage: VOUT(CL) [V] Typical Performance Curves (Unless otherwise specified, Tj=25°C,VIN=5.0V) 50 48 46 44 120 110 100 42 90 80 -40 0 40 80 120 150 3 4 Junction Temperature: Tj[℃] Figure 7. Output clamp voltage vs. Junction Temperature 5 6 Input voltage: VIN [V] 7 Figure 8. On-state Resistance vs. Input voltage 90 320 VIN=3V VIN=3V 280 80 70 Leak Current : IOUT(L) [μA] On-state Resistance: RDS(ON) [mΩ] VIN=5V VIN=5V 240 200 160 120 60 50 40 30 20 80 10 40 0 -40 0 40 80 120 150 0 40 80 120 150 Junction Temperature: Tj[℃] Junction Temperature: Tj[℃] Figure 9. On-state Resistance vs. Junction Temperature www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 -40 Figure 10. Leak Current vs. Junction Temperature 10/23 TSZ02201-0GBG1BD00020-1-2 22.Sep.2017 Rev.002 BV1LC105FJ-C BM2LC105FJ-C Typical Performance Curves (Unless otherwise specified, Tj=25°C,VIN=5.0V) – continued 120 100 80 Turn-OFF TIME1: tOFF [μS] Turn-ON TIME1: tON [μS] 100 80 60 40 60 40 20 20 0 0 3 4 5 6 Input voltage: VIN [V] 7 3 4 5 6 Input voltage: VIN [V] 7 Figure 12. Turn-OFF TIME1 vs. Input voltage Figure 11. Turn-ON TIME1 vs. Input voltage 100 80 Turn-OFF TIME1: tOFF [μS] Turn-ON TIME1: tON [μS] 80 60 40 20 60 40 20 0 0 -40 0 40 80 120 150 0 40 80 120 150 Junction Temperature: Tj[℃] Junction Temperature: Tj[℃] Figure 14. Turn-OFF TIME1 vs. Junction Temperature Figure 13. Turn-ON TIME1 vs. Junction Temperature www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 -40 11/23 TSZ02201-0GBG1BD00020-1-2 22.Sep.2017 Rev.002 BV1LC105FJ-C BM2LC105FJ-C 1.2 1.5 1.0 1.3 Slew rate off1: SROFF [V/μS] Slew rate on1: SRON [V/μS] Typical Performance Curves (Unless otherwise specified, Tj=25°C,VIN=5.0V) – continued 0.8 0.6 0.4 1.1 0.9 0.7 0.2 0.5 3 4 5 6 Input voltage: VIN [V] 7 3 5 6 Input voltage: VIN [V] 7 Figure 16. Slew rate off1 vs. Input voltage 1.2 1.5 1.0 1.3 Slew rate off1: SROFF [V/μS] Slew rate on1: SRON [V/μS] Figure 15. Slew rate on1 vs. Input voltage 4 0.8 0.6 0.4 1.1 0.9 0.7 0.2 0.5 -40 0 40 80 120 150 Junction Temperature: Tj[℃] 0 40 80 120 150 Junction Temperature: Tj[℃] Figure 17. Slew rate on1 vs. Junction Temperature www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 -40 12/23 Figure 18. Slew rate off1 vs. Junction Temperature TSZ02201-0GBG1BD00020-1-2 22.Sep.2017 Rev.002 BV1LC105FJ-C BM2LC105FJ-C Typical Performance Curves (Unless otherwise specified, Tj=25°C,VIN=5.0V) – continued 2.7 200 VIN(TH) High VIN(TH) High High-level input current1: IIN(H1) [μA] VIN(TH) Low VIN(TH) Low Input voltage: VIN(TH) [V] 2.3 1.9 1.5 150 100 50 1.1 0 -40 0 40 80 120 3 150 4 Junction Temperature: Tj[℃] 7 Figure 20. High-level input current1 (in normal operation) vs. Input voltage Figure 19. Input voltage vs. Junction Temperature 200 8 Overcurrent detection current: IOUT(OCP) [A] High-level input current1: IIN(H1) [μA] 5 6 Input voltage: VIN [V] 150 100 50 0 -40 0 40 80 120 150 Junction Temperature: Tj[℃] Figure 21. High-level input current1 (in normal operation) vs. Junction Temperature www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 13/23 7 6 5 4 IN=3V 3 IN=4V 2 IN=5V IN=6V 1 IN=7V 0 0 2 4 6 8 Output voltage: VOUT [V] 10 Figure 22. Overcurrent detection current vs. Output voltage TSZ02201-0GBG1BD00020-1-2 22.Sep.2017 Rev.002 12 BV1LC105FJ-C BM2LC105FJ-C Typical Performance Curves (Unless otherwise specified, Tj=25°C,VIN=5.0V) – continued 5 7 Open Load Detection Voltage: VOPEN [V] Overcurrent detection current: IOUT(OCP) [A] 8 6 5 4 3 2 1 0 -40 0 40 80 120 4 3 2 1 0 150 -40 0 Junction Temperature: Tj[℃] Figure 23. Overcurrent detection current vs. Junction Temperature 80 120 150 Figure 24. Open Load Detection Voltage vs. junction temperature 0.5 0.5 ST Output On Voltage2: VST(ON2) [V] ST Output On Voltage1: VST(ON1) [V] 40 Junction Temperature: Tj[℃] 0.4 0.3 0.2 0.1 0.0 -40 0 40 80 120 150 Junction Temperature: Tj[℃] 0.3 0.2 0.1 0.0 -40 0 40 80 120 Junction Temperature: Tj[℃] Figure 25. ST Output On Voltage1 vs. junction temperature www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 0.4 Figure 26. ST Output On Voltage2 vs. junction temperature 14/23 TSZ02201-0GBG1BD00020-1-2 22.Sep.2017 Rev.002 150 BV1LC105FJ-C BM2LC105FJ-C 0.30 3.0 0.25 2.5 ST Output Leak Current2: IST(L2) [μA] ST Output Leak Current1: IST(L1) [μA] Typical Performance Curves (Unless otherwise specified, Tj=25°C,VIN=5.0V) – continued 0.20 0.15 0.10 0.05 0.00 2.0 1.5 1.0 0.5 0.0 -40 0 40 80 120 -40 150 0 Junction Temperature: Tj[℃] Figure 27. ST Output Leak Current1 vs. junction temperature 80 120 150 Figure 28. ST Output Leak Current2 vs. junction temperature 5 ST Output Delay Time: TSTREL [μs] 5 ST Output Delay Time Release: TSTDET [μs] 40 Junction Temperature: Tj[℃] 4 3 2 1 0 4 3 2 1 0 -40 0 40 80 120 150 Junction Temperature: Tj[℃] 0 40 80 120 Junction Temperature: Tj[℃] Figure 29. ST Output Delay Time Release vs. junction temperature www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 -40 Figure 30. ST Output Delay Time vs. junction temperature 15/23 TSZ02201-0GBG1BD00020-1-2 22.Sep.2017 Rev.002 150 BV1LC105FJ-C BM2LC105FJ-C Measurement circuit for Typical Performance Curves RDS(ON) = VOUT/IOUT IOUT = 0.8A IOUT = 1ｍA OUT OUT ST ST V V IN IN GND GND VIN Measurement Circuit for Figure 8,9 Measurement Circuit for Figure 7 RL = 15Ω A VOUT = 18V VBAT = 12V OUT OUT ST ST Monitor IN IN GND 0V to 5V or 5V to 0V GND Monitor Measurement Circuit for Figure 11, 12, 13, 14, 15, 16, 17, 18 Measurement Circuit for Figure 10 RL = 15Ω VBAT = 12V VBAT = 12V RL = 15Ω OUT OUT ST ST V A IN IN GND GND VIN V VIN Measurement Circuit for Figure 19 Measurement Circuit for Figure 20, 21 A VOUT OUT OUT 10kΩ ST ST 5V IN V IN GND GND VIN Measurement Circuit for Figure 22, 23 www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 Measurement Circuit for Figure 24 16/23 TSZ02201-0GBG1BD00020-1-2 22.Sep.2017 Rev.002 BV1LC105FJ-C BM2LC105FJ-C Measurement circuit for Typical Performance Curves – continued VOUT = 4.5V 12V OUT OUT ST IST = 1mA ST IOUT = 0.5ｍA V V IN IN GND GND VIN Measurement Circuit for Figure 26 Measurement Circuit for Figure 25 VOUT= 1.5V OUT OUT A ST A ST VST= 5V 5V IN IN GND GND VIN Measurement Circuit for Figure 28 Measurement Circuit for Figure 27 1V to 5V or 5V to 1V OUT 10kΩ ST 5V 10pF Monitor Monitor IN GND Measurement Circuit for Figure 29, 30 I/O Pin Truth Table Operating Status Normal Overcurrent Load open Over Temperature www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 Input Signal L H L H L H L H 17/23 Output Level H L H Clamp L L H H ST Level L H L L H H L L TSZ02201-0GBG1BD00020-1-2 22.Sep.2017 Rev.002 BV1LC105FJ-C BM2LC105FJ-C Timing Chart VIN[V] VIN VIN(TH) t 0 VOUT[V] VOUT(CL) VOUT VBAT IOUT x RDS(ON) 0 t IOUT[A] VBAT ZL + RDS(ON) IOUT t 0 Figure 31. Inductive Load Operation VIN[V] tr ≤ 0.1[μs] tf ≤ 0.1[μs] 5V 90% VIN 10% 0 ｔ VOUT[V] tON[μs] tOFF[μs] ≈12V 90% VOUT 10% 0 ｔ SROFF[V/μs] SRON[V/μs] ≈ 0V Figure 32. Switching Time VIN[V] VIN[V] VIN VIN VIN=0V VIN=0V t 0 VOUT[V] VOUT[V] 5V VOUT VOUT 1.5V 1V 0 VST[V] VST ≈0V t t TSTREL 5V 2.5V 0 0 VST[V] TSTDET 5V 4.5V 1V t ≈5V VST t 0 ≈5V 2.5V 0 ≈0V t Figure 33. ST Output Delay Time www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 18/23 TSZ02201-0GBG1BD00020-1-2 22.Sep.2017 Rev.002 BV1LC105FJ-C BM2LC105FJ-C Marking Diagram  BV1LC105FJ-C  BM2LC105FJ-C SOP-J8(TOP VIEW) SOP-J8(TOP VIEW) Part Number Marking 1 L C 1 0 2 L C 1 0 LOT Number 1PIN MARK www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 Part Number Marking LOT Number 1PIN MARK 19/23 TSZ02201-0GBG1BD00020-1-2 22.Sep.2017 Rev.002 BV1LC105FJ-C BM2LC105FJ-C Physical Dimension, Tape and Reel Information Package Name SOP-J8 Tape and Reel information Tape Quantity Direction of Feed Embossed carrier tape 2500pcs E2 The direction is the 1pin of product is at the upper left when you hold reel on the left hand and pull out the tape on the right hand Direction of Feed 1pin Reel www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ※Order quantity need to be multiple of minimum quantity. 20/23 TSZ02201-0GBG1BD00020-1-2 22.Sep.2017 Rev.002 BV1LC105FJ-C BM2LC105FJ-C Operational Notes 1. Grounding Interconnection Pattern When a small-signal ground and a high-current ground are used, it is recommended to isolate the high-current grounding interconnection pattern and the small-signal grounding interconnection pattern and establish a single ground at the reference point of a set so that voltage changes due to the resistance and high current of patterned interconnects will not cause any changes in the small-signal ground voltage. Pay careful attention to prevent changes in the interconnection pattern of ground for external components. The ground lines must be as short and thick as possible to reduce line impedance. 2. Thermal Consideration The amount of heat generated depends on the On-state resistance and Output current. Should by any condition the maximum junction temperature Tjmax = 150 °C rating be exceeded by the temperature increase of the chip, it may result in deterioration of the properties of the chip. The thermal impedance in this specification is based on recommended PCB and measurement condition by JEDEC standard. Verify the application and allow sufficient margins in the thermal design. 3. Absolute Maximum Ratings Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. 4. Inspections on Set Board If a capacitor is connected to a low-impedance pin in order to conduct inspections of the IC on a set board, stress may apply to the IC. To avoid that, be sure to discharge the capacitor in each process. In addition, to connect or disconnect the IC to or from a jig in the testing process, be sure to turn OFF the power supply prior to connecting the IC, and disconnect it from the jig only after turning OFF the power supply. Furthermore, in order to protect the IC from static electricity, establish a ground for the IC assembly process and pay utmost attention to transport and store the IC. 5. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 6. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 7. Thermal Shutdown Circuit IC has a built-in thermal shutdown circuit as an overheat-protection measure. The circuit is designed to turn OFF output when the temperature of the IC chip exceeds 175C (Typ) and return the IC to the normal operation when the temperature falls below 160C (Typ). The thermal shutdown circuit is a circuit absolutely intended to protect the IC from thermal runaway, not intended to protect or guarantee the IC. Consequently, do not operate the IC based on the subsequent continuous use or operation of the circuit. 8. Overcurrent Limiting Circuit IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. 9. Overvoltage (Active Clamp) Protection Function IC has a built-in overvoltage protection function in order for the IC to absorb counter-electromotive force energy generated when inductive load is turned OFF. Since the input voltage is clamped at 0V. When the active clamp circuit is activated, the thermal shutdown circuit is disabled. 10. Counter-electromotive Force Fully ensure that the counter-electromotive force presents no problems in the operation of the IC. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 21/23 TSZ02201-0GBG1BD00020-1-2 22.Sep.2017 Rev.002 BV1LC105FJ-C BM2LC105FJ-C Operational Notes – continued 11. Negative Current of Output When supply a negative current from OUT(DRAIN) terminal in the state that supplied the voltage to IN terminal. The current pass from IN terminal to OUT(DRAIN) terminal through a parasitic transistor and voltage of IN terminal descend as shown in Figure 34 and Figure 35. As shown in Figure 34 power MOS is turned on, set the OUT(DRAIN) terminal is more than -0.3V. Because a negative current may be passed to OUT(DRAIN) terminal from a power supply of the connection of the IN terminal (MCU, and so on). As shown in Figure 35 power MOS is turned off, add a restriction resistance higher than 330 Ω to IN terminal. Because a negative current may be passed to DRAIN terminal from GND of the connection of the IN terminal. The restriction resistance value, set up in consideration of the voltage descent caused by the IN terminal current. MCU GND (SOURCE) 330Ω N+ IN N+ N+ N+ PParasitic Element P+ P- N+ N+ N-epi N+sub OUT (DRAIN) Figure 34. Negative current path (when power MOS is turned on) MCU GND (SOURCE) 330Ω N+ IN N+ N+ N+ PParasitic Element P+ P- N+ N+ N-epi N+sub OUT (DRAIN) Figure 35. Negative current path (when power MOS is turned off) www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 22/23 TSZ02201-0GBG1BD00020-1-2 22.Sep.2017 Rev.002 BV1LC105FJ-C BM2LC105FJ-C Revision History Date 23.Mar.2017 22.Sep.2017 Revision 001 002 www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 Changes New Release P1 P1 P2 P9 Line up was corrected. General Description was corrected. Block Dagrams was corrected. Electrical Characteristics ST Output Delay Time Detect and ST Output Delay Time Release conditions were corrected. P17 Measurement Circuit for Figjre 29, 30 was corrected. 23/23 TSZ02201-0GBG1BD00020-1-2 22.Sep.2017 Rev.002 Notice Precaution on using ROHM Products 1. (Note 1) If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001