Datasheet
Automotive IPD 1ch Low-Side Switch
with Slew Rate Control and Output
Diagnostic Function
BV1LF080EFJ-C
Features
Key Specifications
AEC-Q100 Qualified (Note 1)
Built-in Dual TSD (Note 2)
Built-in Over Current Protection Function (OCP)
Built-in Thermal Shutdown Function (TSD)
Built-in Active Clamp Function
Built-in Diagnostic Function
Built-in Slew Rate Control Function
Directly Controllable from CMOS logic ICs
On-Resistance RDS(ON) = 80mΩ (Typ)
(VDD = 5 V, IOUT = 1.0 A, Tj = 25 °C)
Monolithic Power Management IC with Control
Unit (CMOS) and Power MOSFET on a Single
Chip
On-state Resistance (Tj = 25 °C, Typ)
Over Current Limitation Level
(Tj = 25 °C, Typ)
Output Clamp Voltage (Min)
Active Clamp Energy (Tj(START) = 25 °C)
Package
HTSOP-J8
80 mΩ
7.5 A
42 V
200 mJ
W (Typ) x D (Typ) x H (Max)
4.9 mm x 6.0 mm x 1.0 mm
(Note 1) Grade 1
(Note 2) This IC has thermal shutdown (Junction temperature
detect) and ΔTj Protection (Power-MOS steep temperature rising
detect).
General Description
BV1LF080EFJ-C is a 1ch low-side switch for
automotive application. Output slew rate are
variably controlled by external resistance of the SR
terminal. It has built-in OCP, Dual TSD and Active
Clamp function. It is equipped with output
diagnostic function for TSD
Application
Driving Resistive, Inductive and Capacitive Loads
Block Diagram
VDD
STBY
Supply
Unit
OUT
Active
Clamp
IN
SR
GATE
Control
Dual TSD
ST
ST
Contorol
OCP
GND
〇Product structure : Silicon integrated circuit
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〇This product has no designed protection against radioactive rays.
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BV1LF080EFJ-C
Contents
Features ......................................................................................................................................................................................... 1
General Description ...................................................................................................................................................................... 1
Key Specifications ........................................................................................................................................................................ 1
Package ......................................................................................................................................................................................... 1
Application..................................................................................................................................................................................... 1
Block Diagram .............................................................................................................................................................................. 1
Contents ........................................................................................................................................................................................ 2
Pin Configuration .......................................................................................................................................................................... 3
Pin Description .............................................................................................................................................................................. 3
Definition ....................................................................................................................................................................................... 3
Absolute Maximum Ratings ........................................................................................................................................................ 4
Recommended Operating Condition .......................................................................................................................................... 4
Thermal Resistance...................................................................................................................................................................... 5
Electrical Characteristics ............................................................................................................................................................. 9
Typical Performance Curves ..................................................................................................................................................... 12
Measurement Circuit .................................................................................................................................................................. 19
Truth Table .................................................................................................................................................................................. 21
Timing Chart ............................................................................................................................................................................... 21
Function Description .................................................................................................................................................................. 23
I/O Equivalent Circuit ................................................................................................................................................................ 26
Operational Notes ...................................................................................................................................................................... 27
Ordering Information ................................................................................................................................................................. 31
Marking Diagram ........................................................................................................................................................................ 31
Physical Dimension and Packing Information......................................................................................................................... 32
Revision History .......................................................................................................................................................................... 33
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Pin Configuration
HTSOP-J8
(TOP VIEW)
VDD
1
8
GND
STBY
2
7
GND
IN
3
6
GND
5
SR
OUT
EXP-PAD
ST
4
Pin Description
Pin No.
Pin Name
Function
1
VDD
Power supply pin.
2
STBY
Input pin. Pull-down resistor is internally connected
3
IN
Input pin. Pull-down resistor is internally connected
4
ST
Self-diagnostic output pin.
5
SR
Slew rate control pin
6
GND
Ground pin.
7
GND
Ground pin.
8
GND
Ground pin.
EXP-PAD
OUT
Output pin. When output pin is shorted to power supply and the output current is
limited to protect IC.
Definition
VBAT
VDD
VBAT
IDD
RST
VDD
RL, ZL
VDD
VSTBY
VIN
STBY
VSTBY
OUT
IOUT
IN
VIN
ST
IST
VST
VOUT
SR
GND
RSR
VSR
GND
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Absolute Maximum Ratings (Tj = 25 °C)
Parameters
Symbol
Rating
Unit
VDD
-0.3 to +7
V
VOUT
-0.3 to +42
V
VSR
-0.3 to VDD + 0.3
V
VIN
-0.3 to +7
V
VSTBY
-0.3 to +7
V
Output Current
IOUT
5 (internal limit)
Diagnostic Output Voltage
VST
-0.3 to +7
V
Diagnostic Output Current
IST
10
mA
Active Clamp Energy (Single Pulse)
Tj(START) = 25 °C (Note 2)
EAS(25 °C)
200
Active Clamp Energy (Single Pulse)
Tj(START) = 150 °C (Note 2) (Note 3)
EAS(150 °C)
80
Tj
-40 to +150
°C
Tstg
-55 to +150
°C
Tjmax
150
°C
Power Supply Voltage
Output Voltage
Input Voltage
Operating Temperature Range
Storage Temperature Range
Maximum Junction Temperature
(Note 1)
A
mJ
Caution 1:
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between
pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures,
such as adding a fuse, in case the IC is operated over the absolute maximum ratings.
Caution 2:
Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result
in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal
resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction
temperature rating.
(Note 1) Internally limited by over current protection function.
(Note 2) Active clamp energy (Single Pulse), at the condition IOUT(START) = 1.0 A, VBAT = 16 V.
𝐸𝐴𝑆 =
1
𝑉𝐵𝐴𝑇
𝐿𝐼𝑂𝑈𝑇(𝑆𝑇𝐴𝑅𝑇) 2 × (1 −
)
2
𝑉𝐵𝐴𝑇 − 𝑉𝑂𝑈𝑇(𝐶𝐿)
(Note 3) Not 100 % tested.
Recommended Operating Condition
Parameters
Power Supply Voltage
Operating Temperature
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TSZ22111 • 15 • 001
Symbol
Min
Typ
Max
Unit
VDD
3.5
5.0
6.5
V
Tj
-40
+25
+150
°C
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BV1LF080EFJ-C
Thermal Resistance
(Note 1)
Parameter
Symbol
Typ
Unit
Condition
126.5
°C/W
1s
(Note 2)
37.8
°C/W
2s
(Note 3)
25.3
°C/W
2s2p
(Note 4)
BV1LF080EFJ-C
Between Junction and Surroundings Temperature
Thermal Resistance
θJA
(Note 1) The thermal impedance is based on JESD51-2A (Still-Air) standard. It is used the chip of BV1LF080EFJ-C
(Note 2) JESD51-3 standard FR4 114.3 mm x 76.2 mm x 1.57 mm 1-layer (1s)
(Top copper foil: ROHM recommended Footprint + wiring to measure, 2 oz. copper.)
(Note 3) JESD51-5 standard FR4 114.3 mm x 76.2 mm x 1.60 mm 2-layers (2s)
(Top copper foil: ROHM recommended Footprint + wiring to measure/
Copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm,
copper (top & reverse side) 2 oz.)
(Note 4) JESD51-5/- 7 standard FR4 114.3 mm x 76.2 mm x 1.60 mm 4-layers (2s2p)
(Top copper foil: ROHM recommended Footprint + wiring to measure/
2 inner layers and copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm,
copper (top & reverse side/inner layers) 2 oz./1 oz.)
PCB Layout 1 Layer (1s)
Footprint
100 mm 2
600 mm 2
1200 mm 2
Dimension
Value
Board Finish Thickness
1.57 mm ± 10 %
Board Dimension
76.2 mm x 114.3 mm
Board Material
FR4
Copper Thickness (Top Layer)
0.070 mm (Cu:2 oz)
Copper Foil Area Dimension
Footprint / 100 mm 2 / 600 mm 2 / 1200 mm 2
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Thermal Resistance － continued
PCB Layout 2 Layers (2s)
Bottom Layer
Top Layer
Top Layer
Bottom Layer
via
Isolation Clearance Diameter : ≥ 0.6 mm
Cross Section
Dimension
Value
Board Finish Thickness
1.60 mm ± 10 %
Board Dimension
76.2 mm x 114.3 mm
Board Material
FR4
Copper Thickness (Top/Bottom Layers)
0.070 mm (Cu +Plating)
Thermal Vias Separation/Diameter
1.2 mm / 0.3 mm
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Thermal Resistance － continued
PCB Layout 4 Layers (2s2p)
2nd / Bottom Layers
Top Layer
3rd Layer
Top Layer
2nd Layer
3rd Layer
Bottom Layer
via
Isolation Clearance Diameter : ≥ 0.6 mm
Cross Section
Dimension
Value
Board Finish Thickness
1.60 mm ± 10 %
Board Dimension
76.2 mm x 114.3 mm
Board Material
FR4
Copper Thickness (Top/Bottom Layers)
0.070 mm (Cu +Plating)
Thermal Vias Separation/Diameter
1.2 mm / 0.3 mm
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Thermal Resistance － continued
Transient Thermal Resistance (Single Pulse)
Thermal Resistance (θJA vs. Copper Foil Area – (1s))
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Electrical Characteristics
(Unless otherwise specified, -40 °C ≤ Tj ≤ +150 °C, VDD = 5 V）
Parameters
Symbol
Limit
Unit
Condition
Min
Typ
Max
IVDD(S)
-
0
10
μA
IVDD
-
200
500
μA
VUVLOR
-
2.5
3.0
V
VUVLOHYS
-
0.2
0.4
V
High Level Input Voltage
VSTBY(H)
3.0
-
-
V
Low Level Input Voltage
VSTBY(L)
-
-
1.5
V
Input hysteresis Voltage
VSTBY(HYS)
-
0.2
-
V
High Level Input Current
ISTBY(H)
-
50
150
μA
VSTBY = 5 V
Low Level Input Current
ISTBY(L)
-1
0
+1
μA
VSTBY = 0 V
High Level Input Voltage
VINH
3.0
-
-
V
Low Level Input Voltage
VINL
-
-
1.5
V
Input hysteresis Voltage
VINHYS
-
0.2
-
V
High Level Input Current
IINH
-
50
150
μA
VIN = 5 V
Low Level Input Current
IINL
-1
0
+1
μA
VIN = 0 V
Power Supply
Standby Current
Operating Current
Under Voltage Release Voltage
Under Voltage Hysteresis Voltage
VDD =
RSR =
VDD =
RSR =
5 V, VSTBY = VIN = 0 V
68 kΩ
VSTBY = VIN = 5 V
68 kΩ
VDD Sweep up
Input (STBY)
Input (IN)
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Electrical Characteristics – Continued
(Unless otherwise specified, -40 °C ≤ Tj ≤ +150 °C, VDD = 5 V)
Parameters
Symbol
Limit
Unit
Min
Typ
Max
-
80
104
mΩ
-
150
180
mΩ
-
0.0
0.5
μA
-
1
20
μA
Condition
Power MOS Output
On-state Resistance
Leak Current
RDS(ON)
IOUT(L)
Output Clamp Voltage
VOUT(CL)
42
48
52
V
Turn-ON Delay Time 1
tONDLY1
-
38
60
μs
Turn-OFF Delay Time 1
tOFFDLY1
-
95
145
μs
Fall Time 1
tF1
28
40
52
μs
Rise Time 1
tR1
28
40
52
μs
Slew Rate ON 1
SRON1
0.138
0.180
0.257
V/μs
Slew Rate OFF 1
SROFF1
0.138
0.180
0.257
V/μs
Turn-ON Delay Time 2
tONDLY2
-
105
155
μs
Turn-OFF Delay Time 2
tOFFDLY2
-
266
410
μs
Fall Time 2
tF2
78
113
147
μs
Rise Time 2
tR2
78
113
147
μs
Slew Rate ON 2
SRON2
0.049
0.064
0.092
V/μs
Slew Rate OFF 2
SROFF2
0.049
0.064
0.092
V/μs
Turn-ON Delay Time 3
tONDLY3
-
230
335
μs
Turn-OFF Delay Time 3
tOFFDLY3
-
585
904
μs
Fall Time 3
tF3
174
249
324
μs
Rise Time 3
tR3
174
249
324
μs
Slew Rate ON 3
SRON3
0.022
0.029
0.041
V/μs
Slew Rate OFF 3
SROFF3
0.022
0.029
0.041
V/μs
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VDD = 5 V, IOUT =
Tj = 25 °C
VDD = 5 V, IOUT =
Tj = 150 °C
VSTBY = 0 V, VOUT
Tj = 25 °C
VSTBY = 0 V, VOUT
Tj = 150 °C
1.0 A,
1.0 A,
= 18 V,
= 18 V,
VIN = 0 V, IOUT = 1 mA
VDD = 5 V,
RL = 10 Ω,
RSR = 24 kΩ
VBAT = 12 V
VDD = 5 V,
RL = 10 Ω,
RSR = 68 kΩ
VBAT = 12 V
VDD = 5 V,
RL = 10 Ω,
RSR = 150 kΩ
VBAT = 12 V
TSZ02201-0GYG1G400100-1-2
28.Oct.2020 Rev.002
BV1LF080EFJ-C
Electrical Characteristics – Continued
(Unless otherwise specified, -40 °C ≤ Tj ≤ +150 °C, VDD = 5 V)
Parameters
Symbol
Limit
Unit
Condition
Min
Typ
Max
VSR
0.95
1.00
1.05
V
VDD = VSTBY = 5 V, RSR = 68 kΩ
VST(L)
-
-
0.5
V
IST = 1 mA
IST(L)
-
-
1
μA
tSTDET
-
-
65
µs
tSTREL
-
-
10
µs
IOUT(LIM)
5.0
7.5
10.0
A
TTSDD
150
175
-
°C
TTSDR
135
160
-
°C
TTSDHYS
-
15
-
°C
TDTJD
-
93
-
°C
TDTJR
-
43
-
°C
TDTJHYS
-
50
-
°C
SR Pin
SR Output Voltage
Diagnostic Output
ST Low Voltage
(Note 1)
ST Leak Current
ST Detection Delay Time
ST Release Delay Time
(Note 1)
(Note 1)
VST = 5 V
Protection Function
Over Current Limitation Level
Thermal Shutdown
Detected Temperature (Note 1)
Thermal Shutdown
Released Temperature (Note 1)
Thermal Shutdown
Hysteresis Temperature (Note 1)
ΔTj Protection Detected
Temperature (Note 1)
ΔTj Protection Released
Temperature (Note 1)
ΔTj Protection Hysteresis
Temperature (Note 1)
Tj = 25 °C
(Note 1): Not 100 % tested.
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500
500
450
450
400
400
VDD Input Current: I VDD [μA]
VDD Input Current1: IVDD [μA]
Typical Performance Curves
(Unless otherwise specified, Tj = 25 °C, VDD = 5 V)
350
300
250
200
350
300
250
200
150
150
100
100
3.0
4.0
5.0
6.0
-40
7.0
40
80
120
150
Tj [°C]
Junction Temperature: Tj[℃]
VDD Voltage: VVDD [V]
Figure 1. Operating Current vs VDD Input Voltage
Figure 2. Operating Current vs Junction Temperature
3.0
3.0
2.9
2.8
2.7
VUVLO(R)
2.9
VUVLO(D)
2.8
High Level Input Voltage
/ Low Level Input Voltage (STBY): VSTBY [V]
Under Voltage Detection (Release) Voltage: VUVLO[V]
0
2.6
2.5
2.4
2.3
2.2
2.1
2.0
1.9
1.8
1.7
VSTBY(H)
VSTBY(L)
2.7
2.6
2.5
2.4
2.3
2.2
2.1
2.0
1.9
1.8
1.7
1.6
1.6
1.5
1.5
-40
0
40
80
120
150
Tj [°C]
Junction Temperature: Tj[℃]
-40
0
40
80
120
150
[°C]
Junction Temperature: Tj
Tj[℃]
Figure 3. Under Voltage Detection (Release) Voltage
Figure 4. High Level Input Voltage / Low Level Input
vs Junction Temperature
Voltage (STBY) vs Junction Temperature
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Typical Performance Curves - Continued
(Unless otherwise specified, Tj = 25 °C, VDD = 5 V)
3.0
150
High Level Input Voltage
/ Low Level Input Voltage (IN): VIN[V]
2.8
VIN(H)
140
VIN(L)
130
High Level Input Current
/ Low Level Input Current (STBY): I STBY[μA]
2.9
2.7
2.6
2.5
2.4
2.3
2.2
2.1
2.0
1.9
1.8
1.7
ISTBY(H)
ISTBY(L)
120
110
100
90
80
70
60
50
40
30
20
10
1.6
0
1.5
-40
0
40
80
120
-40
150
0
40
80
120
150
Junction Temperature: Tj[℃]
Tj [°C]
Tj [°C]
Junction Temperature: Tj[℃]
Figure 5. High Level Input Voltage / Low Level Input
Figure 6. High Level Input Current / Low Level Input
Voltage (IN) vs Junction Temperature
Current (STBY) vs Junction Temperature
200
150
180
IIN(H)
130
IIN(L)
120
On-state Resistance: RDS(ON) [mΩ]
High Level Input Current
/ Low Level Input Current (IN): IIN[μA]
140
110
100
90
80
70
60
50
40
30
20
160
140
120
100
80
60
40
20
10
0
-40
0
40
80
120
150
Junction Temperature: Tj[℃]
Tj [°C]
0
3
4
5
6
7
VDD Input Voltage: VVDD [V]
Figure 7. High Level Input Current / Low Level Input
Figure 8. On-state Resistance vs Input Voltage
Current (IN) vs Junction Temperature
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Typical Performance Curves - Continued
(Unless otherwise specified, Tj = 25 °C, VDD = 5 V)
0.5
180
VDD = 3.5 V
160
VDD = 5 V
0.4
Leak Current: I OUT(L) [μA]
On-state Resistance: RDS(ON) [mΩ]
200
140
120
100
80
60
40
0.3
0.2
0.1
20
0
-40
0
40
80
120
0.0
150
0
2
4
[°C]
Junction Temperature: Tj
Tj[℃]
20
52
18
51
16
50
14
12
10
8
6
4
14
16
18
47
46
45
44
0
42
80
12
48
43
40
10
49
2
0
8
Figure 10. Leak Current vs OUT Voltage
Output Clamp Voltage: VOUT(CL) [V]
Leak Current : IOUT(L) [μA]
Figure 9. On-state Resistance vs Junction Temperature
-40
6
Out Voltage: VOUT [V]
120
150
-40
0
40
80
120
150
Junction Temperature: Tj[℃]
Tj [°C]
Tj [°C]
Junction Temperature: Tj[℃]
Figure 11. Leak Current vs Junction Temperature
Figure 12. Output Clamp Voltage vs
Junction Temperature
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BV1LF080EFJ-C
160
160
140
140
Turn-ON Delay TIME2: t ONDLY2 [μs]
Turn-ON Delay TIME2: t ONDLY2 [μs]
Typical Performance Curves - Continued
(Unless otherwise specified, Tj = 25 °C, VDD = 5 V)
120
100
80
60
40
120
100
80
60
40
3
4
5
6
7
-40
0
40
80
120
Tj [°C]
Junction Temperature: Tj[℃]
VDD Input Voltage: VVDD [V]
Figure 13. Turn-ON Delay Time2 vs VDD Input Voltage
Figure 14. Turn-ON Delay Time2 vs Junction
(RSR = 68 kΩ)
Temperature (RSR = 68 kΩ)
400
400
350
350
Turn-OFF Delay TIME2: t OFDLY2 [μs]
Turn-OFF Delay TIME2: t OFFDLY2 [μs]
150
300
250
200
150
100
300
250
200
150
100
50
50
0
0
3
4
5
6
7
-40
0
40
80
120
VDD Input Voltage: VVDD [V]
Figure 15. Turn-OFF Delay Time2 vs VDD Input
Figure 16. Turn-OFF Delay Time2 vs Junction
Voltage (RSR = 68 kΩ)
Temperature (RSR = 68 kΩ)
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150
Junction Temperature: Tj[℃]
Tj [°C]
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BV1LF080EFJ-C
150
150
140
140
130
130
Fall Time2: t F2 [μs]
Fall Time2: t F2 [μs]
Typical Performance Curves - Continued
(Unless otherwise specified, Tj = 25 °C, VDD = 5 V)
120
120
110
110
100
100
90
90
80
80
70
70
3
4
5
6
-40
7
0
40
80
120
150
Tj [°C]
Junction Temperature: Tj[℃]
VDD Input Voltage: VVDD [V]
Figure 18. Output Fall Time2 vs Junction Temperature
(RSR = 68 kΩ)
(RSR = 68 kΩ)
150
150
140
140
130
130
Rise Time2: t R2 [μs]
Rise Time2: t R2 [μs]
Figure 17. Output Fall Time2 vs VDD Input Voltage
120
120
110
110
100
100
90
90
80
80
70
70
3
4
5
6
7
-40
0
40
80
120
150
Tj [°C]
Junction Temperature: Tj[℃]
VDD Input Voltage: VVDD [V]
Figure 19. Rise Time2 vs VDD Input Voltage
Figure 20. Rise Time2 vs Junction Temperature
(RSR = 68 kΩ)
(RSR = 68 kΩ)
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0.10
0.10
0.09
0.09
Slew Rate ON2: SRON2 [V/μs]
Slew Rate ON2: SRON2 [V/μs]
Typical Performance Curves - Continued
(Unless otherwise specified, Tj = 25 °C, VDD = 5 V)
0.08
0.07
0.06
0.05
0.08
0.07
0.06
0.05
0.04
0.04
3
4
5
6
-40
7
0
VDD Input Voltage: VVDD [V]
80
120
150
Figure 21. Slew Rate ON2 vs VDD Input Voltage
Figure 22. Slew Rate ON2 vs Junction Temperature
(RSR = 68 kΩ)
(RSR = 68 kΩ)
0.10
0.10
0.09
0.09
Slew Rate OFF2: SROFF2 [V/μs]
Slew Rate OFF2: SROFF2 [V/μs]
40
Tj [°C]
Junction Temperature: Tj[℃]
0.08
0.07
0.06
0.05
0.08
0.07
0.06
0.05
0.04
0.04
3
4
5
6
7
-40
0
40
80
120
150
Junction Temperature: Tj[℃]
Tj [°C]
VDD Input Voltage: VVDD [V]
Figure 23. Slew Rate OFF2 vs VDD Input Voltage
Figure 24. Slew Rate OFF2 vs Junction Temperature
(RSR = 68 kΩ)
(RSR = 68 kΩ)
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Typical Performance Curves - Continued
(Unless otherwise specified, Tj = 25 °C, VDD = 5 V)
10000
Active Clamp Energy (Single Pulse): EAS[mJ]
Over Current Limit Value: IOUT(LIM) [A]
10
9
Tj(START) = 25 ℃
Tj(START) = 150 ℃
1000
8
7
6
5
-40
0
40
80
120
100
10
150
Tj [°C]
Junction Temperature: Tj[℃]
0.5
1.0
1.5
2.0
2.5
Figure 25. Over Current Limit Value
Figure 26. Active Clamp Energy (Single Pulse)
vs Junction Temperature
vs Output Current (Start)
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3.0
Output Current (Start): I OUT(START)[A]
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Measurement Circuit
V DD
V DD
VDD
IN
VDD
R L = 10 Ω
OUT
VIN
= 5V
ST
Measurement Circuit for Figure 3
VDD
= 5V
OUT
VDD
R L = 10 Ω
IN
V BAT = 12 V
SR
ST
VBAT = 12 V
SR
GND
Measurement Circuit for Figure 5
VDD
=5V
OUT
VDD
R L = 10 Ω
IN
V BAT = 12 V
VIN
= 0V
or 5 V
STBY
SR
ST
GND
VDD
IN
R SR=
68 kΩ
RL = 10 Ω
STBY
Measurement Circuit for Figure 4
V STBY
= 0V
or 5 V
OUT
V IN
STBY
V DD
= 5V
ST
GND
VDD
IN
RSR
= 68 kΩ
VBAT = 12 V
SR
GND
Measurement Circuit for Figure 1 and Figure 2
V STBY
R L = 10 Ω
STBY
SR
V DD
= 5V
OUT
VIN
= 5V
STBY
R SR=
68 kΩ
IN
V BAT = 12 V
ST
R SR =
68k Ω
GND
Measurement Circuit for Figure 6
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OUT
RL = 10 Ω
VBAT = 12 V
STBY
SR
ST
GND
Measurement Circuit for Figure 7
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Measurement Circuit – Continued
VDD
VDD
= 5V
VDD
IN
VDD
IN
OUT
OUT
VOUT = 18 V
I OUT = 1.0 A
R DS(ON)
= VOUT/I OUT
STBY
SR
STBY
SR
ST
ST
GND
GND
Measurement Circuit for Figure 8 and Figure 9
Measurement Circuit for Figure 10 and Figure 11
V IN = 0 V to 5 V or 5 V to 0 V
VDD = 5 V
VDD
= 5V
VDD
IN
VDD
OUT
IN
I OUT = 1 mA
OUT
Monitor
STBY
RL = 10 Ω
Monitor
VBAT = 12 V
STBY
SR
ST
GND
RSR
Measurement Circuit for Figure 12
SR
ST
GND
Measurement Circuit for
Figure 13, Figure 14, Figure 15, Figure 16, Figure 17,
Figure 18, Figure 19, Figure 20, Figure 21, Figure 22,
Figure 23 and Figure 24
VDD
= 5V
VDD
IN
OUT
VOUT ＝ 12 V
STBY
SR
ST
GND
Measurement Circuit for Figure 25
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Truth Table
OUT Output and Diagnostic Output Function
Performs diagnostic test to check for any abnormal conditions and output to the ST pin. Once Thermal
Shutdown is detected, the ST pin is latched Low. ST pin Low latch is released by setting the STBY pin to
Low or set VDD voltage to “Low Voltage Detection (VUVLO-VUVLOHYS)”
STBY Pin
Voltage
Power
Supply
(VDD)
Under
Voltage
Detection
IN Pin
Voltage
TSD
ΔTj
OCP
Low
*
*
*
*
High
Detected
*
*
High
Undetected
Low
High
Undetected
High
Output State
OUT Pin
ST Pin
*
OFF
High
*
*
OFF
High
*
*
*
OFF
High
High
Detected
*
*
OFF
Low
Undetected
High
Undetected
Detected
*
OFF
High
High
Undetected
High
Undetected
Undetected
No Limit
ON
High
High
Undetected
High
Undetected
Undetected
Limited
Current
Limitation
High
Timing Chart
VDD [V]
VDD and VSTBY can be input simultaneously
VDD VUVLOR
VUVLOHYS
VUVLOD
t
0
VSTBY [V]
VSTBY
VSTBY(H)
VSTBY(L)
t
0
VIN [V]
tSETUP ≥ 100 [µs]
VIN
VIN(H)
VIN(L)
0
t
VOUT [V]
tONDLY [µs]
tOFFDLY [µs]
≈ VBAT
80 %
VOUT
0
≈0V
20 %
tF [µs]
( SR ON [V/µs ])
t
tR [µs]
( SROFF [V/µs ])
Figure 27. Definition of Turn-ON TIME, Turn-OFF TIME, Fall TIME (Slew Rate ON), and Rise TIME (Slew Rate OFF)
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Timing Chart ― Continued
VIN [V]
VIN(H)
VIN
VIN(L)
0
t
VOUT [V]
VOUT(CL)
VOUT
VBAT
IOUT x RDS(ON)
0
t
IOUT [A]
VBAT
ZL + RDS(ON)
IOUT
t
0
Figure 28. Inductive Load Operation
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Function Description
■
Over Current Protection Function
This IC built-in over current protection function. Following is shown that the timing chart of over current
protection function.
Occurrence of Over Current
Dissolution of Over Current
①
②
V DD
V STBY
V IN
V OUT
IOUT(LIM)
IOUT
Normal Current
V ST
Figure 29. Timing Chart of OCP Function
① When an overcurrent occurs, IOUT is controlled by the overcurrent limit level (IOUT(LIM)) and VOUT rises.
IOUT(LIM) is 7.5 A (Typ). The VST does not change at this time.
② When the overcurrent disappears, the over current limit is released.
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Function Description – Continued
■
Dual TSD Function
This IC has a built-in TSD function and ΔTj protection function. Following is shown that the timing chart of
Dual TSD function.
① ②
① ②
① ②
③ ④③ ④ ③ ④ ③
⑤
V DD
V STBY
V IN
V OUT
TTSDD
TTSDR
TPOWER-MO S
Tj
TDTJD
T DTJR
TAMB
t STDET
t STREL
V ST
ΔTj Protection
Thermal Shutdown
Figure 30. Timing Chart of Dual TSD Function
①
②
③
④
⑤
The temperature of Power MOS FET part and the control part in his IC is each T POWER-MOS, TAMB. When the
temperature difference becomes 93 °C (Typ) or more, the output turns OFF. This temperature defines as ΔTj
Protection Detected Temperature (TDTJD). At This time, the VST does not change.
When the temperature difference of TPOWER-MOS and TAMB becomes 43 °C (Typ) or less, the output turns
automatically ON. This temperature defines as ΔTj Protection Released Temperature (TDTJR).
The output is turned off when the temperature of the IC reaches Thermal Shutdown Detected Temperature
(TTSDD) = 175 °C (Typ) or more. At this time, the VST latches Low.
The output returns to its normal state when the temperature of the IC becomes Thermal Shutdown Released
Temperature (TTSDR) = 160 °C (Typ) or less. VST keeps latching Low.
the VST become High after tSTREL when the VSTBY become Low.
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Function Description ― Continued
Slew rate control function
This IC can variably adjust the rise time (Slew Rate ON) and fall time (Slew Rate OFF) of OUT output voltage
by setting the SR pin external resistor (RSR).
The approximate expression when VBAT = 12V is as follows.
(1.636 × 𝑅𝑆𝑅 )
⁄
Rise time: 𝑡𝑅 =
1000 + 3.73 [µs]
(1.636 × 𝑅𝑆𝑅 )
⁄
Fall time: 𝑡𝐹 =
1000 + 3.73 [µs]
(𝑉𝐵𝐴𝑇 × 0.8 − 𝑉𝐵𝐴𝑇 × 0.2)⁄
Slew Rate ON: 𝑆𝑅𝑂𝑁 =
𝑡 𝐹 [V / µs]
(𝑉𝐵𝐴𝑇 × 0.8 − 𝑉𝐵𝐴𝑇 × 0.2)⁄
Slew Rate OFF: 𝑆𝑅𝑂𝐹𝐹 =
𝑡 𝑅 [V / µs]
RSR recommended range: 24 kΩ to 150 kΩ
(Calculation example)
(1.636 × 150𝑘) ⁄
Rise time 3: 𝑡𝑅3 =
1000 + 3.73 = 249 [µs]
(12 × 0.8 − 12 × 0.2)⁄
Slew Rate OFF 3: 𝑆𝑅𝑂𝐹𝐹3 =
249 = 0.029 [V / µs]
400
VBAT = 12V
350
Rise Time: tR [μs]
Fall Time: tF [μs]
300
250
200
Max
150
Typ
100
Min
50
0
0
50
100
150
SR Resistor: RSR [kΩ]
Figure 31. Output rise (fall) time vs The SR pin resistance
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I/O Equivalent Circuit
VDD
ST
100 Ω
VDD
ST
100 Ω
IN
SR
IN
39 kΩ
SR
46 kΩ
15 kΩ
STBY
OUT
STBY
41 kΩ
OUT
47 k Ω
12 k Ω
Resistor values in the figure are typical values.
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse
polarity when connecting the power supply, such as mounting an external diode between the power supply
and the IC’s power supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to
ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value
when using electrolytic capacitors.
3.
Ground Voltage
Except for pins the output and the input of which were designed to go below ground, ensure that no pins
are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed
separately but connected to a single ground at the reference point of the application board to avoid
fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of
external components do not cause variations on the ground voltage. The ground lines must be as short and
thick as possible to reduce line impedance.
5.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended
operating conditions. The characteristic values are guaranteed only under the conditions of each item
specified by the electrical characteristics.
6.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin
may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s
power supply should always be turned off completely before connecting or removing it from the test setup
during the inspection process. To prevent damage from static discharge, ground the IC during assembly
and use similar precautions during transport and storage.
8.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting
may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power
supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets
(in very humid environment) and unintentional solder bridge deposited in between pins during assembly to
name a few.
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Operational Notes ― Continued
9. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
10. Thermal Shutdown Function (TSD)
This IC has a built-in thermal shutdown function that prevents heat damage to the IC. Normal operation
should always be within the IC’s maximum junction temperature rating. If however the rating is exceeded
for a continued period, the junction temperature (Tj) will rise which will activate the TSD function that will
turn OFF power output pins. When the Tj falls below the TSD threshold, the circuits are automatically
restored to normal operation.
Note that the TSD function operates in a situation that exceeds the absolute maximum ratings and therefore,
under no circumstances, should the TSD function be used in a set design or for any purpose other than
protecting the IC from heat damage.
11. Over Current Protection Function (OCP)
This IC incorporates an integrated overcurrent protection function that is activated when the load is shorted.
This protection function is effective in preventing damage due to sudden and unexpected incidents. However,
the IC should not be used in applications characterized by continuous operation or transitioning of the
protection function.
12. Active Clamp Operation
The IC integrates the active clamp function to internally absorb the reverse energy EL which is generated
when the inductive load is turned off. When the active clamp operates, the thermal shutdown function does
not work. Decide a load so that the reverse energy EL is active clamp tolerance EAS (refer to Figure 26.
Active Clamp Energy (Single Pulse) vs Output Current (Start)) or under when inductive load is used.
13. Negative Current of Output
When the OUT pin (DRAIN) becomes lower than the GND pin (SOURCE) voltage, a current flow from power
supply pin (VDD) and the input pins (the STBY pin and the IN pin) to the OUT pin through a parasitic
transistor. When the power supply pin is high, as shown in Figure 32, when the input pins are high, as
shown in Figure 33, a current flow from the power supply pin and the input pins of connected parts (LDO,
MCU, etc.) to the OUT pin. When the power supply pin is low, as shown in Figure 34, and when the input
pins are low, as shown in Figure 35, a current flow from the power supply pin and the GND of parts (LDO,
MCU, etc.) that connected to the input pins to the OUT pin.
Therefore, set the OUT pin (DRAIN) is -0.3 V or higher. When the OUT pin becomes lower than -0.3 V, add
a restriction resistance 82 Ω or higher to the VDD pin, a restriction resistance 1k Ω or higher to the STBY
pin and a restriction resistance 1k Ω or higher to the IN pin. However, set the value of restriction resistance
in consideration of the voltage descent caused by power supply pin and input pins currents.
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13. Negative Current of Output ― Continued
LDO, and so on
GND
(SOURCE)
Restriction
resistance
Power supply pin
N+
N+
N+
P-
P+
N+
N+
P-
Parasitic Element
N-epi
N+sub
OUT
(DRAIN)
Figure 32. Negative Current Path (when the power supply pin is High)
MCU, and so on
GND
(SOURCE)
Restriction
resistance
Input pin
N+
N+
N+
P-
P+
N+
N+
P-
Parasitic Element
N-epi
N+sub
OUT
(DRAIN)
Figure 33. Negative Current Path (when the input pins are High)
LDO, and so on
GND
(SOURCE)
Restriction
resistance
Power supply pin
N+
N+
N+
P-
N+
P+
N+
P-
Parasitic Element
N-epi
N+sub
OUT
(DRAIN)
Figure 34. Negative Current Path (when the power supply pin is Low)
MCU, and so on
GND
(SOURCE)
Restriction
resistance
Input pin
N+
N+
N+
P-
P+
N+
N+
P-
Parasitic Element
N-epi
N+sub
OUT
(DRAIN)
Figure 35. Negative Current Path (when the input pins are Low)
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Operational Notes ― Continued
14. Power Supply Steep Fluctuation
If the voltage of the power supply pin (VDD) falls sharply, the output pin (OUT) may temporarily turn off as
shown in Figure 36. If the power supply pin is expected to fall sharply, take measures such as inserting a
capacitor between the power supply pin and the ground pin so that it falls within the recommended usage
range shown in Figure 37.
2.5
VDD [V]
2.0
Deprecated use range
VDD(FALL )
VDD
0
VDD(FALL) [V]
tVDD(FALL)
t
VOUT[V]
0.5
VOUT
≈0V
1.0
Recommended use range
≈ VBAT
0
1.5
t
0.0
0
10
20
30
t VDD(FALL) [μs]
Figure 36. Output OFF Operation when Power
Supply Fluctuates Sharply
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Figure 37. Recommended Use Range
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28.Oct.2020 Rev.002
BV1LF080EFJ-C
Ordering Information
B
V
1
L
F
0
8
0
E
F
J
Package
EFJ: HTSOP-J8
C
E
2
Product Grade
C: For Automotive
Packaging and Forming Specification
E2: Embossed Tape and Reel
Marking Diagram
HTSOP-J8 (TOP VIEW)
Part Number Marking
V 1 L F 8 0
LOT Number
Pin 1 Mark
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Physical Dimension and Packing Information
Package Name
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HTSOP-J8
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Revision History
Date
Revision
Changes
24.Jun.2020
001
New release
28.Oct.2020
002
Page 25. Updated slew rate control function formula.
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Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
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