Datasheet
IPD Series
Automotive 2ch 45 mΩ High-Side Switch
with Variable OCD and OCD Mask Function
BV2HC045EFU-C
General Description
Key Specifications
BV2HC045EFU-C is a 2-ch high-side switch for
automotive application. It has built-in over current
protection function, thermal shutdown protection function,
open load detection function and under voltage lockout
function. It is equipped with diagnostic output function for
abnormality detection. An external component can
arbitrarily set the over current limit and the time to limit to
achieve the optimum over current protection for the load.
Power Supply Voltage Operating Range: 6 V to 19 V
On Resistance (Tj=25°C):
45 mΩ (Typ)
Over Current Limit:
21 A (Min)
Standby Current (Tj=25°C):
0.5 μA (Max)
Active Clamp Tolerance (Tj(START )= 25 °C): 35 mJ
Package
W (Typ) x D (Typ) x H (Max)
4.90 mm x 6.00 mm x 1.70 mm
HSSOP-C16
Features
Dual TSD®(Note 1)
AEC-Q100 Qualified(Note 2)
Built-in Variable Over Current Limit Function
Built-in Variable Over Current Mask Time Setting
Function.
Built-in Open Load Detection Function.
Built-in Under Voltage Lockout Function (UVLO)
Built-in Diagnostic Output
Low On-Resistance RON = 45 mΩ (Typ)
Monolithic Power Management IC with Control Unit
(CMOS) and Power MOSFET on a Single Chip
Low Voltage Operation (VBB = 4.3 V)
HSSOP-C16
(Note 1) This IC has thermal shutdown (Junction temperature detect) and
ΔTj Protection (Power-MOS steep temperature rising detect).
(Note 2) Grade 1
Applications
Resistive Load, Inductive Load, Capacitive Load
Typical Application Circuit
RST1PU
RST2PU
VBB
RIN1
IN1
RIN2
IN2
RST1
ST1
RST2
ST2
CVBB
OUT1
MCU
RL
BV2HC045EFU-C
DLY
OUT2
SET
RL
CDLY
RSET
GND
RGND
DGND
“Dual TSD®” is a registered trademark of ROHM Co., Ltd.
〇Product structure : Silicon integrated circuit
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Table of Contents
General Description ................................................................................................................................................................ 1
Features ................................................................................................................................................................................. 1
Applications ............................................................................................................................................................................ 1
Key Specifications................................................................................................................................................................... 1
Package ................................................................................................................................................................................. 1
Typical Application Circuit ........................................................................................................................................................ 1
Table of Contents .................................................................................................................................................................... 2
Pin Configuration .................................................................................................................................................................... 3
Pin Description........................................................................................................................................................................ 3
Block Diagram ........................................................................................................................................................................ 3
Definition ................................................................................................................................................................................ 4
Absolute Maximum Ratings ..................................................................................................................................................... 5
Thermal Resistance ................................................................................................................................................................ 6
Recommended Operating Conditions ...................................................................................................................................... 8
Electrical Characteristics ......................................................................................................................................................... 9
Typical Performance Curves .................................................................................................................................................. 11
Measurement Circuit ............................................................................................................................................................. 16
Timing Chart (Propagation Delay Time) ................................................................................................................................. 18
Function Description ............................................................................................................................................................. 19
1.
2.
3.
4.
5.
Protection Function ................................................................................................................................................. 19
Over Current Protection ........................................................................................................................................... 20
Open Load Detection............................................................................................................................................... 25
Thermal Shutdown, ΔTj Protection Detection ............................................................................................................ 26
Other Protection ...................................................................................................................................................... 27
Applications Example ............................................................................................................................................................ 28
I/O Equivalence Circuits ........................................................................................................................................................ 29
Operational Notes ................................................................................................................................................................. 30
Ordering Information ............................................................................................................................................................. 32
Marking Diagram................................................................................................................................................................... 32
Physical Dimension and Packing Information ......................................................................................................................... 33
Revision History .................................................................................................................................................................... 34
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Pin Configuration
(TOP VIEW)
VBB
1
16
OUT1
SET
2
15
OUT1
DLY
3
14
OUT1
GND
4
13
OUT1
IN1
5
12
OUT2
ST1
6
11
OUT2
ST2
7
10
OUT2
IN2
8
9
OUT2
EXP-PAD
Pin Description
Pin No.
Pin Name
Function
1
VBB
Power supply pin
2
SET
Over current limit value setting pin
3
DLY
Over current mask time setting pin
4
GND
GND pin
5
IN1
Input pin1, with internal pull-down resistor
6
ST1
Diagnostic output pin1
7
ST2
Diagnostic output pin2
8
IN2
Input pin2, with internal pull-down resistor
9 to 12
OUT2
Output pin 2
13 to 16
OUT1
Output pin 1
-
EXP-PAD
The EXP-PAD is connected to VBB
Block Diagram
VBB
CH1
Internal
Supply
Charge
Pump
Active
Clamp
CH2
Gate
Driver
IN1
OCD
IN2
ST1
Over Current
Detection
OUT1
ΔTj Protection
Control
Logic
Thermal
Shutdown
ST2
Open Load
Detection
DLY
OCD
Variable
Over Current
Limit Mask
Time Setting
Internal Supply
OUT2
UVLO
GND SET
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Definition
IBB
I IN
VBB
VDS
IN1, IN2
VBB
IOUT
OUT1, OUT2
VOUT
ISET
ST1, ST2
SET
IST
VST
IDLY
VDLY
VS ET
VIN
DLY
GND
IGND
Figure 1. Voltage and Current Definition
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Absolute Maximum Ratings (Ta = 25 °C)
Parameter
Symbol
Rating
Unit
VBB - OUT Voltage
VDS
-0.3 to Internal clamp(Note 1)
V
Power Supply Voltage
VBB
-0.3 to +40
V
Set Voltage
VSET
-0.3 to VBB+0.3
V
VIN, VDLY
-0.3 to +7.0
V
VST
- 0.3 to +7.0
V
Input Voltage
Diagnostic Output Voltage
Output Current
IOUT
Diagnostic Output Current
IST
10
mA
Tstg
-55 to +150
°C
Tjmax
150
°C
Active Clamp Energy (Single Pulse)
Tj(START) = 25 °C, IOUT = 4 A(Note 3)(Note 4)
EAS (25 °C)
35
mJ
Active Clamp Energy (Single Pulse)
Tj(START) = 150 °C, IOUT = 4 A(Note 3)(Note 4)
EAS (150 °C)
20
mJ
VBBLIM
19
V
Storage Temperature Range
Maximum Junction Temperature
Supply Voltage
for Short Circuit Protection(Note 5)
Internal limit
(Note 2)
A
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 1) Internally limited by output clamp voltage.
(Note 2) Internally limited by fixed over current limit.
(Note 3) Maximum active clamp energy using single pulse of IOUT(START) = 4 A and VBB = 14 V.
When IC is turned off in the condition that inductive load is connected, the OUT pin is fell below 0 V. This energy is dissipated by BV2HC045EFU-C.
This energy can be calculated with following equation:
𝐸𝐴𝑆 = 𝑉𝐷𝑆 ×
𝑅𝐿 × 𝐼𝑂𝑈𝑇(𝑆𝑇𝐴𝑅𝑇)
𝐿
𝑉𝐵𝐵 − 𝑉𝐷𝑆
×[
× 𝑙𝑛 (1 −
) + 𝐼𝑂𝑈𝑇(𝑆𝑇𝐴𝑅𝑇) ]
𝑅𝐿
𝑅𝐿
𝑉𝐵𝐵 − 𝑉𝐷𝑆
Following equation simplifies under the assumption of RL = 0 Ω.
𝐸𝐴𝑆 =
1
𝑉𝐵𝐵
× 𝐿 × 𝐼𝑂𝑈𝑇(𝑆𝑇𝐴𝑅𝑇) 2 × ( 1 −
)
2
𝑉𝐵𝐵 − 𝑉𝐷𝑆
(Note 4) Not 100% tested.
(Note 5) Maximum power supply voltage that can detect short circuit protection.
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Thermal Resistance(Note 1)
Parameter
Thermal Resistance (Typ)
Symbol
Unit
1s(Note 3)
2s2p(Note 4)
θJA
142.3
29.0
°C/W
ΨJT
24
4
°C/W
HSSOP-C16
Junction to Ambient
Junction to Top Characterization Parameter
(Note 2)
(Note 1) Based on JESD51-2A(Still-Air). Using a BV2HC045EFU-C chip.
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3) Using a PCB board based on JESD51-3.
(Note 4) Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
Single
Material
Board Size
FR-4
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70 μm
Layer Number of
Measurement Board
Material
Board Size
4 Layers
FR-4
114.3 mm x 76.2 mm x 1.6 mmt
Top
Thermal Via(Note 5)
Pitch
Diameter
1.20 mm
Φ0.30 mm
2 Internal Layers
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70 μm
74.2 mm x 74.2 mm
35 μm
74.2 mm x 74.2 mm
70 μm
(Note 5) This thermal via connects with the copper pattern of all layers.
1. PCB Layout (1s)
Footprint Only
Figure 2. PCB Layout (1s)
Dimension
Value
Board finish thickness
1.57 mmt
Board dimension
114.3 mm x 76.2 mm
Board material
FR4
Copper thickness (Top/Bottom layers)
0.070 mm (Cu : 2 oz)
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Thermal Resistance – continued
2. PCB Layout (2s)
Top Layer
Bottom Layer
Cross section view
Top Layer
Bottom Layer
Figure 3. PCB Layout (2s)
Dimension
Value
Board finish thickness
1.60 mmt
Board dimension
114.3 mm x 76.2 mm
Board material
FR4
Copper thickness (Top/Bottom layers)
0.070 mm (Cu + plating)
3. PCB Layout (2s2p)
Top Layer
2nd Layer
3rd Layer
Bottom Layer
Cross section view
Top Layer
2nd/3rd/Bottom Layers
Figure 4. PCB Layout (2s2p)
Dimension
Value
Board finish thickness
1.60 mmt
Board dimension
114.3 mm x 76.2 mm
Board material
FR4
Copper thickness (Top/Bottom layers)
0.070 mm (Cu + plating)
Copper thickness (Inner layers)
0.035 mm
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Thermal Resistance – continued
4. Transient Thermal Resistance (Single Pulse)
1000
100
Zth [°C]
10
1
footprint
0.1
2s
2s2p
0.01
0.0001
0.001
0.01
0.1
1
Pulse Time [s]
10
100
1000
Figure 5. Transient Thermal Resistance
Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Power Supply Voltage Operating Range
VBB
6
14
19
V
Operating Temperature
Topr
-40
-
+150
°C
fIN
-
-
1
kHz
Input Frequency
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Electrical Characteristics (Unless otherwise specified 6 V ≤ VBB ≤ 19 V, -40 °C ≤ Tj ≤ +150 °C)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
-
-
0.5
µA
-
-
30
µA
IBBH
-
6
10
mA
UVLO Detection Voltage
VUVLO
-
-
4.3
V
UVLO Hysteresis Voltage
VUVHYS
0.2
0.3
0.4
V
High-Level Input Voltage
VINH
2.8
-
-
V
Low-Level Input Voltage
VINL
-
-
1.5
V
Input Voltage Hysteresis
VINHYS
-
0.3
-
V
High-Level Input Current
IINH
-
50
150
µA
VIN1 = VIN2 = 5 V
Low-Level Input Current
IINL
-10
-
+10
µA
VIN1 = VIN2 = 0 V
-
45
60
mΩ
VBB = 8 V to 19 V, Tj = 25 °C
-
-
100
mΩ
VBB = 8 V to 19 V, Tj = 150 °C
-
-
75
mΩ
VBB = 4.5 V, Tj = 25 °C
-
-
0.5
µA
-
-
10
µA
[Power Supply]
Standby Current
Operating Current
IBBL
VBB = 14 V, VIN1 = 0 V, VIN2 = 0 V
VOUT1 = VOUT2 = 0 V, Tj = 25 °C
VBB = 14 V, VIN1 = 0 V, VIN2 = 0 V
VOUT1 = VOUT2 = 0 V, Tj = 150 °C
VBB = 14 V, VIN1 = VIN2 = 5 V
VOUT1 = VOUT2 = open
[Input (VIN1, VIN2)]
[Output]
Output On Resistance
Output Leak Current
RON
IOUTL
Output ON Slew Rate
SRON
-
0.3
1
V/µs
Output OFF Slew Rate
SROFF
-
0.3
1
V/µs
Output ON Propagation Delay Time
tOUTON
-
70
175
µs
Output OFF Propagation Delay Time
tOUTOFF
-
50
125
µs
Output Clamp Voltage
VDSCLP
41
48
55
V
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VIN1 = VIN2 = 0 V,
VOUT1 = VOUT2 = 0 V, Tj = 25 °C
VIN1 = VIN2 = 0 V,
VOUT1 = VOUT2 = 0 V, Tj = 150 °C
VBB = 14 V, RL = 6.5 Ω
Tj = 25 °C
VBB = 14 V, RL = 6.5 Ω
Tj = 25 °C
VBB = 14 V, RL = 6.5 Ω
Tj = 25 °C
VBB = 14 V, RL = 6.5 Ω
Tj = 25 °C
VIN1 = VIN2 = 0 V,
IOUT1 = IOUT2 = 10 mA
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Electrical Characteristics (Unless otherwise specified 6 V ≤ VBB ≤ 19 V, -40 °C ≤ Tj ≤ +150 °C) - continued
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Diagnostic Output Low Voltage
VSTL
-
-
0.5
V
Diagnostic Output Leak Current
ISTL
-
-
10
μA
tSTON
-
100
250
μs
tSTOFF
-
50
125
μs
VDSDET
2
3
4
V
VIN1 = VIN2 = 5 V
ILIMH
21
30
40
A
VIN1 = VIN2 = 5 V
ILIMSET
2.8
4.1
5.4
A
VIN1 = VIN2 = 5 V, RSET = 47 kΩ
Open Load Detection Voltage
VOLD
2.0
3.0
4.0
V
VIN1 = VIN2 = 0 V
Open Load Detection Sink Current
IOLD
-30
-10
-
μA
VIN1 = VIN2 = 0 V,
VOUT1 = VOUT2 = 5 V
Thermal Shutdown(Note 1)
TTSD
150
175
200
°C
TTSDHYS
-
15
-
°C
TDTJ
-
120
-
°C
[Diagnostic Output]
Diagnostic Output ON
Propagation Delay Time
Diagnostic Output OFF
Propagation Delay Time
VIN1 = VIN2 = 5 V,
IST1 = IST2 = 1 mA
VIN1 = VIN2 = 0 V,
VST1 = VST2 = 5 V
VBB = 14 V, RL = 6.5 Ω
Tj = 25 °C
VBB = 14 V, RL = 6.5 Ω
Tj = 25 °C
[Diagnostic Function]
Output ON Detection Voltage(Note 1)
Fixed Over Current Limit
Variable Over Current Limit
Thermal Shutdown Hysteresis(Note 1)
ΔTj Protection Temperature(Note 1)
(Note 1) Not 100% tested.
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Typical Performance Curves
(Unless otherwise specified VBB = 14 V, VIN1 = VIN2 = 5 V, Tj = 25 °C)
30
0.3
VIN1 = VIN2 = 0V
25
Standby Current: IBBL [μA]
Standby Current: IBBL [μA]
0.2
0.1
0.0
-0.1
20
15
10
-0.2
5
-0.3
0
0
5
10
15
20
25
30
35
40
-50
Supply Voltage: VBB [V]
150
Figure 7. Standby Current vs Junction Temperature
10
10
9
9
8
8
Operating Current: IBBH [mA]
Operating Current: IBBH [mA]
Figure 6. Standby Current vs Supply Voltage
0
50
100
Junction Temperature: Tj [ºC]
7
6
5
4
3
2
7
6
5
4
3
2
1
1
0
0
0
5
10
15
20
25
30
Supply Voltage: VBB [V]
35
-50
40
Figure 8. Operating Current vs Supply Voltage
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0
50
100
Junction Temperature: Tj [°C]
150
Figure 9. Operating Current vs Junction Temperature
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Typical Performance Curves - continued
(Unless otherwise specified VBB = 14 V, VIN1 = VIN2 = 5 V, Tj = 25 °C)
4.0
3.5
4
Input Voltage: VINH, VINL [V]
UVLO Detection Voltage: VUVLO [V]
5
3
2
3.0
VINH
2.5
VINL
2.0
1.5
1.0
1
0.5
0
0.0
-50
0
50
100
Junction Temperature: Tj [°C]
150
-50
Figure 10. UVLO Detection Voltage vs Junction Temperature
150
Figure 11. Input Voltage vs Junction Temperature
150
75
Output ON Resistance: RON [mΩ]
125
Input Current:IINH,IINL [μA]
0
50
100
Junction Temperature: Tj [°C]
100
75
IINH
50
25
IINL
0
-50
0
50
100
Junction Temperature: Tj [°C]
55
45
35
25
150
0
Figure 12. Input Current vs Junction Temperature
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65
5
10
15
20
25
30
Supply Voltage: VBB [V]
35
40
Figure 13. Output ON Resistance vs Supply Voltage
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Typical Performance Curves - continued
(Unless otherwise specified VBB = 14 V, VIN1 = VIN2 = 5 V, Tj = 25 °C)
10
100
Output Leak Current: IOUTL [μA]
Output ON Resistance: RON [mΩ]
90
80
70
60
50
40
30
20
8
6
4
2
10
0
0
-50
0
50
100
-50
150
Junction Temperature: Tj [°C]
150
175
Output ON, OFF Propagation Delay Time:
tOUTON, tOUTOFF [μs]
Output Slew Rate: SRON,SROFF [V/μs]
100
Figure 15. Output leak Current vs Junction Temperature
1.0
0.8
0.6
SROFF
SRON
0.2
0.0
-50
50
Junction Temperature: Tj [°C]
Figure 14. Output ON Resistance vs Junction Temperature
0.4
0
150
125
100
tOUTON
75
tOUTOFF
50
25
0
0
50
100
Junction Temperature: Tj [ºC]
150
-50
Figure 16. Output Slew Rate vs Junction Temperature
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0
50
100
Junction Temperature: Tj [ºC]
150
Figure 17. Output ON, OFF Propagation Delay Time
vs Junction Temperature
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Typical Performance Curves - continued
(Unless otherwise specified VBB = 14 V, VIN1 = VIN2 = 5 V, Tj = 25 °C)
0.5
Diagnostic Output Low Voltage: VSTL [V]
Output Clamp Voltage: VDSCLP [V]
55
53
51
49
47
45
43
0
50
100
Junction Temperature: Tj [ºC]
0.3
0.2
0.1
0.0
-50
41
-50
0.4
150
Figure 18. Output Clamp Voltage vs Junction Temperature
6
Variable Over Current Limit: ILIMSET [A]
Diagnostic Output ON, OFF Proragtion
Delay TIme: tSTON,tSTOFF [μs]
150
Figure 19. Diagnostic Output Low Voltage
vs Junction Temperature
250
200
150
tSTON
100
tSTOFF
50
0
-50
0
50
100
Junction Temperature: Tj [ºC]
0
50
100
Junction Temperature: Tj [ºC]
4
3
2
1
0
-50
150
Figure 20. Diagnostic Output ON, OFF
Propagation Delay Time vs Junction Temperature
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5
0
50
100
Junction Temperature: Tj [ºC]
150
Figure 21. Variable Over Current Limit
vs Junction Temperature
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Typical Performance Curves - continued
(Unless otherwise specified VBB = 14 V, VIN1 = VIN2 = 5 V, Tj = 25 °C)
1000
4
Active Clamp Energy:EAS [mJ]
Open Load Detection Voltage: VOLD [V]
5
3
2
1
100
Tj(START)=25ºC
Tj(START)=150ºC
10
0
-50
0
50
100
Junction Temperature: Tj [ºC]
0.1
150
Figure 22. Open Load Detection Voltage
vs Junction Temperature
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1.0
Output Current: IOUT[A]
10.0
Figure 23. Active Clamp Energy vs Output Current
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Measurement Circuit
VBB
VBB
VBB
VBB
IN1, IN2
IN1, IN2
ST1, ST2
ST1, ST2
SET
VIN
DLY
SET
VIN
VST
OUT1, OUT2
DLY
GND
OUT1, OUT2
GND
Figure 24. Standby Current
Low-Level Input Current
Output Leak Current
Diagnostic Output Leak Current
Figure 25.Operating Current
VBB
VBB
VBB
IN1, IN2
VIN
VBB
IN1, IN2
ST1, ST2
SET
SET
DLY
ST1, ST2
VIN
OUT1, OUT2
GND
0.1 μF
1 kΩ
Figure 26. UVLO Detection Voltage
UVLO Hysteresis Voltage
High-Level Input Voltage
Low-Level Input Voltage
Input Voltage Hysteresis
High-Level Input Current
Thermal Shutdown
Thermal Shutdown Hysteresis
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47 kΩ
DLY
OUT1, OUT2
GND
IOUT
Figure 27. Output ON Resistance
Output Clamp Voltage
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Measurement Circuit - continued
VBB
VBB
VBB
VBB
IN1, IN2
IN1, IN2
10 kΩ
ST1, ST2
ST1, ST2
Monitor
Monitor
SET
SET
IST
VIN
47 kΩ
DLY
0.1 μF
OUT1, OUT2
VIN
VST
Monitor
GND
GND
6.5 Ω
Figure 28. Output ON Slew Rate
Output OFF Slew Rate
Output ON Propagation Delay Time
Output OFF Propagation Delay Time
Diagnostic Output ON Propagation Delay Time
Diagnostic Output OFF Propagation Delay Time
Figure 29. Diagnostic Output Low Voltage
VBB
VBB
IN1, IN2
ST1, ST2
IN1, IN2
10 kΩ
47 kΩ
DLY
0.1 μF
ST1, ST2
10 kΩ
SET
SET
Monitor
1 kΩ
VBB
VBB
VIN
OUT1, OUT2
DLY
OUT1, OUT2
VST
DLY
OUT1, OUT2
VST
GND
GND
Figure 30. Fixed Over Current Limit
Variable Over Current Limit
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Figure 31. Open Load Detection Voltage
Open Load Detection Sink Current
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Timing Chart (Propagation Delay Time)
VBB
IN1, IN 2
VINH
VINL
t OUTOFF
SRON
80%
80%
20%
OUT1, OUT2
20%
tOUTON
SROFF
ST1, ST2
tSTON
tSTOFF
Figure 32. Timing Chart
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Function Description
1.
Protection Function
Table 1. Detection and Release Conditions of Each Protection Function and Diagnostic Output
Mode
Normal
Condition
Conditions
IN1, IN2
ST1, ST2
Standby
-
Low
High
Operating
-
High
Low
Detect VOUT ≥ 3.0 V (Typ)
Low
Low
Release VOUT ≤ 2.6 V (Typ)
Low
High
Detect VBB ≤ 4.3 V (Max)
High
High
Release VBB ≥ 4.7 V (Max)
High
Low
Detect Tj ≥ 175 °C (Typ)
High
High
Latch Release Tj ≤ 160 °C (Typ)
Low
High
Detect ΔTj ≥ 120 °C (Typ)
High
High
Release ΔTj ≤ 80 °C (Typ)
High
Low
Detect IOUT ≥ ILIMSET
High
High
Release IOUT < ILIMSET
High
Low
Open Load Detect (OLD)
Low Voltage Output OFF
(UVLO)
Thermal Shutdown (TSD)(Note 1)
ΔTj Protection(Note 2)
Over Current Protection (OCP)
(Note 1) When thermal shutdown is detected, output is turned OFF and latch. Latch is released when input (IN1, IN2) of TSD detected channel becomes Low.
(Note 2) Protect function by detecting PowerMOS sharp increase of temperature difference with control circuit.
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Function Description – continued
2.
Over Current Protection
2.1 Over Current Limiting Operation in one side channel
This IC has two over current limiting functions, fixed over current limit (I LIMH) for protecting the IC and variable over
current limit (ILIMSET) for protecting the load. The variable over current limit (I LIMSET) can be set by connecting an
external resistor to the SET pin. It is also possible to set the variable over current mask time (tDLY) by connecting an
external capacitor to the DLY pin.
Timing chart for switching from fixed over current setting (ILIMH) to variable over current limit (ILIMSET) are shown at
Figure 33.
IN1, IN 2
VSET = 1 V (Typ )
SET
0V
①
②
③
ILIMH
I LIMSET
Normal Current
I OUT1, I OUT2
tDLY
VDLY = 0.8 V (Typ)
0V
DLY
ST1, ST2
Figure 33. Over Current Detection in One Side Channel Timing Chart
①
When the load current (IOUT1, IOUT2) rises and exceeds variable over current limit (ILIMSET), external capacitor CDLY
is charged by 5 μA (Typ).
②
When the DLY pin voltage VDLY reaches 0.8 V (Typ) (after tDLY), CDLY is discharged. IOUT1, IOUT2 is limited to
variable over current limit value (ILIMSET) and ST1, ST2 = High indicating an abnormal condition.
③
When output current IOUT1, IOUT2 becomes less than the variable over current limit value ( LIMSET), the diagnostic
output pin (ST1, ST2) is turned to low.
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Function Description – continued
2.2 Over Current Detection in Both Outputs
This IC can detect over current in both outputs OUT1 and OUT2 independently and limit IOUT1 and IOUT2 respectively.
Variable current limit value (ILIMSET) and variable over current mask time (t DLY) set by external components of the SET
pin and the DLY pin are the same for OUT1 and OUT2.
Figure 34 shows the timing chart when over current are detected at both outputs.
IN1
IN2
VSET = 1 V (Typ)
SET
0V
①
②
ILIMH
ILIMSET
IOUT1
③
ILIMH
④
I LIMSET
IOUT2
VDLY = 0.8 V (Typ)
DLY
tDLY
tDLY
0V
ST1
ST2
Figure 34. Timing Chart for Over Current Detection in Both Outputs
①
When load current (IOUT1) of channel 1 rises and exceeds variable over current limit (I LIMSET), external capacitor
CDLY is charged by 5 μA (Typ).
②
When DLY pin voltage VDLY reaches 0.8 V (Typ) (after tDLY), CDLY is discharged. IOUT1 is limited to variable over
current limit value (ILIMSET) and ST1 = High indicating an abnormal condition.
③
When load current (IOUT2) of channel 2 rises and exceeds variable over current limit (I LIMSET), external capacitor
CDLY is charged by 5 μA (Typ).
④
When VDLY = 0.8 V (Typ) (after tDLY), CDLY is discharged. IOUT2 is limited to variable over current limit value (ILIMSET)
and ST2 = High indicating an abnormal condition.
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Function Description – continued
2.3 Over Current Detection by Other Channel while CDLY is Charging (tDLY)
When one side channel is detected over current detection, CDLY is charged. When the other channel detects over
current while CDLY is charged, it is charged again after tDLY and CDLY is discharged. After tDLY has passed again since
charging is started, the other channel is limited to the variable over current limit value (ILIMSET). In this case, the
variable over current mask time of the channel which detected later is maximum 2tDLY + tDISC.
Figure 35 shows the timing chart.
IN1
IN2
VSET = 1 V (Typ )
SET
0V
①
②③ ④
⑤
I LIMH
ILIMSET
IOUT1
I LIMH
ILIMSET
tDLY
IOUT2
tDLY
VDLY = 0.8 V (Typ)
0V
DLY
tDISC
ST1
ST2
Figure 35. Timing Chart for Over Current Detected by Other Channel during CDLY Charging (tDLY)
①
When load current (IOUT1) of channel 1 rises and exceeds variable over current limit (I LIMSET), external capacitor
CDLY is charged by 5 μA (Typ).
②
While CDLY is charging, load current (IOUT2) of channel 2 rises and exceeds variable over current limit (I LIMSET)
③
When the DLY pin voltage VDLY reaches 0.8 V (Typ) (after tDLY), CDLY is discharged. IOUT1 is limited to variable
over current limit value (ILIMSET) and ST1 = High indicating an abnormal condition.
④
When IOUT2 is continuously maintained at over current detection after the tDISC (0.2 μs Typ) set internally in the IC,
the external capacitor CDLY is charged again by 5 μA (Typ).
⑤
When VDLY = 0.8 V (Typ) (after tDLY), CDLY is discharged. IOUT2 is limited to variable over current limit value (ILIMSET)
and ST2 = High indicating an abnormal condition.
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Function Description – continued
2.4 Setting of Variable Overcurrent Limit Value
There are two values in the over current limit of this IC; fixed over current limit value (ILIMH) and the variable over
current limit value (ILIMSET) that can be set by external resistance RSET. The variable over current limit value (ILIMSET)
set for the value of RSET is as follows. RSET should be set within the range of 7.5 kΩ to 330 kΩ.
Table 3. Variable Over Current Limit for RSET
7.5
Variable Over Current Limit (ILIMSET) [A]
Min
Typ
Max
7.78
11.39
15.00
10
6.95
10.17
13.39
20
4.82
7.06
9.30
33
3.50
5.13
6.76
47
2.80
4.10
5.40
75
1.98
2.90
3.81
100
1.61
2.36
3.10
150
1.19
1.74
2.29
220
0.78
1.30
1.82
330
0.51
1.01
1.52
RSET [kΩ]
Variable Over Current Limit: ILIMSET [A]
100
Max
Typ
Min
10
1
0.1
1
10
RSET [kΩ]
100
1000
Figure 36. Variable Over Current Limit vs RSET
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Function Description – continued
2.5 Variable Over Current Limit Mask Time Setting
The variable over current mask time (tDLY) can be set by using external capacitor CDLY. tDLY is the switching time from
the over current detected timing until the over current limit value (ILIMSET) set by RSET.
The approximate expressions for variable over current mask time (t DLY) are shown below.
𝐶
𝑡𝐷𝐿𝑌_𝑀𝑎𝑥 = 0.28 × 10𝐷𝐿𝑌
−6
𝐶
𝑡𝐷𝐿𝑌_𝑇𝑦𝑝 = 0.20 × 10𝐷𝐿𝑌
−6
𝐶
𝑡𝐷𝐿𝑌_𝑀𝑖𝑛 = 0.12 × 10𝐷𝐿𝑌
−6
[s]
[s]
[s]
CDLY: External Capacitor Value
tDLY: Variable Over Current Mask Time
Variable Over Current Mask Time: tDLY [s]
0.1
0.01
Max
Typ
Min
0.001
0.0001
0.001
0.01
0.1
1
CDLY [µF]
Figure 37. Variable Over Current Mask Time vs CDLY
2.6 The SET Pin and the DLY Pin Setting
The DLY pin can be used by GND short or Open.
DLY = GND: The variable over current limit is disabled and only fixed over current limit is operational.
In this case, please set the SET pin OPEN or connect a resistor with 7.5 kΩ or above.
DLY = OPEN: Variable over current mask time is 10 μs or less.
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Function Description – continued
3.
Open Load Detection
VBB
Internal
Supply
V BB
Clamp
IN1, IN2
SOLD
Gate
Driver
ROLD
OUT1, OUT2
Control
Logic
ST1, ST2
VOLD
R1
SW1
R2
VREF
RPD
RL
GND
Figure 38. Open Load Detection Block Diagram
Open load can be detected by connecting an external resistance ROLD between power supply VBB and output (the OUT1 pin
and the OUT2 pin).
When output load is disconnected during input (the IN1 pin or the IN2 pin) is low, diagnostic output (the ST1 pin or the ST2
pin) is turned to low to indicate abnormality. To reduce the standby current of the system, an open load resistance switch
SOLD is recommended.
When the SW1 is OFF (the OUT1 pin and the OUT2 pin no longer pulled down by the load), voltage of the OUT1pin and
OUT2 pin does not fall to GND level. Because, when the IN1 pin and the IN2 pin are low, the voltage of the OUT1 pin and
OUT2 pin does not become under or equal to the Output ON Detection Voltage (VDSDET). To pulled down the OUT1 pin and
the OUT2 pin, pulled down resistance RPD is recommended. The resistance RPD is 4.3 kΩ or less for outflow current from the
OUT1 pin and the OUT2 pin.
3.1 When the OUT1, OUT2 is pulled down by the load (Normal function)
The value of external resistance ROLD is decided based on used minimum power supply voltage (VBB), internal
resistance R1 and R2 and open detection voltage VOLD. External resistance RPD is unnecessary.
The equation for calculating the ROLD value is shown below.
𝑅𝑂𝐿𝐷 <
𝑉𝐵𝐵 ×( 𝑅1(𝑀𝑖𝑛) +𝑅2(𝑀𝑖𝑛) )
𝑉𝑂𝐿𝐷(Max)
− ( 𝑅1(𝑀𝑖𝑛) + 𝑅2(𝑀𝑖𝑛) ) [Ω]
The above formula is summarized as follows.
𝑅𝑂𝐿𝐷 < 𝑉𝐵𝐵 × 75 × 103 − 300 × 103 [Ω]
ROLD value is fell below the above calculated result.
3.2 If the SW1 is OFF, the output is no longer pulled down by the load
The value of external resistance ROLD is decided based on used minimum power supply voltage (VBB), external
resistance RPD and open detection voltage VOLD.
The equation for calculating the ROLD value is shown below.
𝑉
𝑅𝑂𝐿𝐷 < 𝑉 𝐵𝐵
×𝑅𝑃𝐷
𝑂𝐿𝐷(Max)
− 𝑅𝑃𝐷 [Ω]
When RPD is 4.3 kΩ, the above formula is summarized as follows.
𝑅𝑂𝐿𝐷 < 𝑉𝐵𝐵 × 1.075 × 103 − 4.3 × 103 [Ω]
ROLD value is fell below the above calculated result.
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Function Description – continued
4.
Thermal Shutdown, ΔTj Protection Detection
4.1 Thermal Shutdown Protection
This IC has a built-in thermal shutdown protection function. When the IC temperature is 175 °C (Typ) or more, the
output is latched OFF. Diagnostic output (ST1, ST2) outputs High. When the IC temperature becomes 160 °C (Typ) or
less, output latch can release by setting IN1, IN2 to Low or by setting VBB voltage fall below voltage lockout detection
threshold.
4.2 ΔTj Protection
This IC has a built-in ΔTj protection function that turns OFF the output when the temperature difference (TDTJ)
between the POWER-MOS unit (TPOWER-MOS) and the control unit (TAMB) in the IC is 120 °C (Typ) or more. ΔTj
protection also has a built-in hysteresis (TDTJHYS) that returns the output to normal state when the temperature
difference becomes 80 °C (Typ) or less.
Figure 39 shows the timing chart of thermal shutdown protection and ΔTj protection during output short to GND fault.
IN1, IN 2
I LIMH
I OUT1, I OUT2
T TSD
T POWER-MOS
T AMB
T DTJ
TDTJHYS
ΔTj Protection Operation
ST1, ST2
Output OFF Latc h
Latch Release
(Note 1)
Figure 39. Thermal Shutdown Protection and ΔTj Protection Timing Chart
(Note 1) When output voltage falls to output ON detection voltage (VDSDET) or less at the output to GND is shorted or rare short, IC is judged that the
output voltage is abnormal. Hence, ST1, ST2 may not be able to turn low.
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Function Description – continued
5.
Other Protection
5.1 GND Open Protection
VBB
Internal
Supply
V BB
Clamp
IN1, IN2
ROLD
Gate
Driver
OUT1, OUT2
Control
Logic
ST1, ST2
R1
RL
R2
VOLD
GND
Figure 40. GND Open Protection Block Diagram
When the GND of the IC is open, the output switches OFF regardless of IN1, IN2 voltage.
(However, the self-diagnosis output ST1, ST2 is invalid.)
When an inductive load is connected, active clamp operates when the GND pin becomes open.
5.2 MCU I/O Protection
VBB
Internal
Supply
Clamp
IN1, IN2
Gate
Driver
ST1, ST2
OUT1, OUT 2
Control
Logic
R1
MCU
R2
VOLD
GND
Figure 41. MCU I/O Protection
Negative surge voltage to the IN1 pin, the IN2 pin, the ST1 pin and the ST2 pin may cause damage to the MCU's I/O
pins. In order to prevent those damages, it is recommended to insert limiting resistors between IC pins and MCU.
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Applications Example
RST1PU
RST2PU
VBB
RIN1
IN1
RIN2
IN2
RST1
ST1
RST2
ST2
CVBB
ROLD
OUT1
MCU
RPD
RL
BV2HC045EFU-C
DLY
OUT2
SET
RL
CDLY
GND
RSET
RGND
Symbol
Value
DGND
Purpose
RIN1, RIN2
4.7 kΩ
Limit resistance for negative surge
RST1, RST2
4.7 kΩ
Limit resistance for negative surge
RST1PU, RST2PU
10 kΩ
RSET
47 kΩ
Pull up ST1 / ST2 pin to MCU power supply,
these pins are open drain output
For variable over current limit value
CVBB
10 µF
For battery line voltage spike filter
CDLY
0.1 µF
For variable over current mask time
RGND
1 kΩ
DGND
-
RPD
4.3 kΩ
For output pulled down
ROLD
2 kΩ
For open load detection
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For current limit for reverse battery connection
BV2HC045EFU-C protection for reverse battery connection
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I/O Equivalence Circuits
SET
DLY
VBB
DLY
SET
20 Ω
IN1, IN2
IN1
IN2
ST1, ST2
9 kΩ
150 Ω
ST1
ST2
91 kΩ
OUT1, OUT2
VBB
OUT1
OUT2
193 kΩ
307 kΩ
Resistance values shown in the diagrams above are typical values.
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
Ground Voltage
Except for pins the output and the input of which were designed to go below ground, ensure that no pins are at a
voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
8.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
10. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
11. Thermal Shutdown Function (TSD)
This IC has a built-in thermal shutdown function that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD function that will turn OFF power output pins. The IC
should be powered down and turned ON again to resume normal operation because the TSD function keeps the
outputs at the OFF state even if the Tj falls below the TSD threshold.
Note that the TSD function operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD function be used in a set design or for any purpose other than protecting the IC from
heat damage.
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Operational Notes – continued
12. Over Current Protection Function (OCP)
This IC incorporates an integrated overcurrent protection function that is activated when the load is shorted. This
protection function is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection function.
13. Active Clamp Operation
The IC integrates the active clamp function to internally absorb the reverse energy which is generated when the
inductive load is turned off. When the active clamp operates, the thermal shutdown function does not work. Decide a
load so that the reverse energy is active clamp tolerance (refer to Figure 23. Active Clamp Energy vs Output Current)
or under when inductive load is used.
14. Open Power Supply Pin
When the power supply pin (VBB) becomes open at ON (IN = High), the output is switched to OFF regardless of
input voltage. If an inductive load is connected, the active clamp operates when VBB is open and becomes the same
potential as that on the ground. At this time, the output voltage drops down to -48 V (Typ).
15. Open GND Pin
When the GND pin becomes open at ON (IN = High), the output is switched to OFF regardless of input voltage. If an
inductive load is connected, the active clamp operates when the GND pin is open.
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BV2HC045EFU-C
Ordering Information
B
V
2
H
C
0
4
5
E
F
U
Package
EFU: HSSOP-C16
-
C
E2
Product Rank
C: Automotive product
Packaging and Forming Specification
E2: Embossed tape and reel
Marking Diagram
HSSOP-C16 (TOP VIEW)
Part Number Marking
2 H C 4 5
LOT Number
Pin 1 Mark
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Physical Dimension and Packing Information
Package Name
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HSSOP-C16
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BV2HC045EFU-C
Revision History
Date
Revision
15.Mar.2019
001
Changes
New Release
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Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
