Datasheet
Automotive IPD Series
2ch High Side Switch
BV2HM050EFV-C
General Description
Key Specifications
BV2HM050EFV-C is a 2ch high side switch for
automotive application. It has a built in hiccup mode
overcurrent protection function, thermal shutdown
protection function, open load detection function, under
voltage lockout function. It is equipped with diagnostic
output function for abnormality detection.
◼
◼
◼
◼
◼
Power Supply Voltage Operating Range: 6 V to 28 V
ON-Resistance (Tj = 25 °C):
50 mΩ (Typ)
Overcurrent Value:
5 A (Min)
Standby Current (Tj = 25 °C):
0.5 µA (Max)
Active Clamp Energy (Tj = 25 °C):
140 mJ
Package
Features
W (Typ) x D (Typ) x H (Max)
HTSSOP-B20
6.5 mm x 6.4 mm x 1.0 mm
◼ AEC-Q100 Qualified(Note 1)
◼ Built in Hiccup Mode Overcurrent Protection Function
(OCP)
◼ Built-in Thermal Shutdown Protection Function (TSD)
◼ Built-in Open Load Detection Function (OLD)
◼ Built-in Under Voltage Lockout Function (UVLO)
◼ Low On-Resistance RON = 50 mΩ (Typ)
◼ Monolithic Power Management IC with the Control
Block (CMOS) and Power MOSFET Mounted on a
Single Chip
(Note 1) Grade1
HTSSOP-B20
Application
◼ Resistance Load, Inductance Load and Capacitance
Load for Automotive Application
Typical Application Circuit
CVBB
ROLD1
OUT1
VBB
OUT1
+B
ROLD2
RIN1
IN1
OUT1
GND
OUT1
RGND
MCU
load1
GND
DI
RST1
ST1
OUT2
RST2
RIN2
ST2
OUT2
IN2
OUT2
OUT2
load2
Figure 1. Application Circuit
〇Product structure : Silicon integrated circuit
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Contents
General Description ........................................................................................................................................................................ 1
Features.......................................................................................................................................................................................... 1
Application ...................................................................................................................................................................................... 1
Key Specifications .......................................................................................................................................................................... 1
Package .......................................................................................................................................................................................... 1
Typical Application Circuit ............................................................................................................................................................... 1
Contents ......................................................................................................................................................................................... 2
Pin Configuration ............................................................................................................................................................................ 3
Pin Description................................................................................................................................................................................ 3
Block Diagram ................................................................................................................................................................................ 4
Definition ......................................................................................................................................................................................... 4
Absolute Maximum Ratings ............................................................................................................................................................ 5
Recommended Operating Conditions ............................................................................................................................................. 6
Thermal Resistance ........................................................................................................................................................................ 6
Electrical Characteristics............................................................................................................................................................... 10
Typical Performance Curves ......................................................................................................................................................... 11
Measurement Circuits ................................................................................................................................................................... 16
Measurement Conditions for Time Items ...................................................................................................................................... 19
Timing Chart ................................................................................................................................................................................. 20
Description of Blocks .................................................................................................................................................................... 20
Applications Example ................................................................................................................................................................... 23
I/O Equivalence Circuits................................................................................................................................................................ 24
Operational Notes ......................................................................................................................................................................... 25
Ordering Information ..................................................................................................................................................................... 27
Marking Diagram .......................................................................................................................................................................... 27
Physical Dimension and Packing Information ............................................................................................................................... 28
Revision History ............................................................................................................................................................................ 29
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Pin Configuration
(TOP VIEW)
VBB
1
20
OUT1
N.C.
2
19
OUT1
IN1
3
18
OUT1
GND
4
17
OUT1
GND
5
16
N.C.
ST1
6
15
N.C.
N.C.
7
14
OUT2
ST2
8
13
OUT2
IN2
9
12
OUT2
N.C.
10
11
OUT2
EXP-PAD
VBB
Figure 2. Pin Configuration
Pin Description
Pin No.
Pin Name
Function
1
VBB
Power input pin, switch input pin
2
N.C.
-
3
IN1
Channel 1 Input pin. Pull-down resistor is connected internally.
4
GND
Ground pin
5
GND
Ground pin
6
ST1
Channel 1 Self-diagnostic output pin
7
N.C.
-
8
ST2
Channel 2 Self-diagnostic output pin
9
IN2
Channel 2 Input pin. Pull-down resistor is connected internally.
10
N.C.
-
11 to 14
OUT2
15
N.C.
-
16
N.C.
-
17 to 20
OUT1
EXP-PAD
VBB
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Channel 2 Switch output pin
Channel 1 Switch output pin
Power input pin, switch input pin
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Block Diagram
VBB
Channel2
Channel1
Gate Control
IN1
CL K
IN2
Charge
Charge
Pump
Pump
Clamp
Gate
Gate
Driver
lnternal
supply
Protect
Control
Hiccup Control
for OCP
OUT2
OCP
ST1
OLD
OUT1
TSD
ST2
UVLO
GND
Figure 3. Block Diagram
Definition
IBB
VBB
IIN1 , I IN2
VDS1 , VDS2
IN1, IN2
OUT1, OUT2
IOUT1, IOUT2
VOUT1, V OUT2
IST1 , I ST2
VBB
ST1, ST2
VST1, V ST2
VIN1, V IN2
GND
IGND
Figure 4. Voltage and Current Definition
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Absolute Maximum Ratings (Ta = 25 °C)
Parameter
Symbol
Rating
VBB - OUT Voltage
VDS
Power Supply Voltage
VBB
-0.3 to +40
V
VIN1, VIN2
-0.3 to +7.0
V
IIN1, IIN2
-2.0 to +2.0
mA
VST1, VST2
-0.3 to +7.0
Input Voltage
Input Current
Diagnostic Output Voltage
Output Current
IOUT1, IOUT2
-0.3 to Internal
Unit
clamp(Note 1)
11.0 (Overcurrent Value IOC
V
V
)(Note 2)
A
Junction Temperature Width
Tj
-40 to +150
°C
Storage Temperature Range
Tstg
-55 to +150
°C
Tjmax
150
°C
EAS
140
mJ
EAS
65
mJ
VBBLIM
28
V
Maximum Junction Temperature
Active Clamp Energy(Note 3) (Note 4)
(Single Pulse, Tj = 25 °C)
Active Clamp Energy(Note 3) (Note 4)
(Single Pulse, Tj = 150 °C)
Supply Voltage for Short Circuit Protection
(Note 4) (Note 5)
(Note 1) Internally limited by output clamp voltage.
(Note 2) When overcurrent flows, output is turned off. (Output self-restarts after a certain time.)
(Note 3) Maximum active clamp energy using Single Pulse of IOUT(START) = 2 A and VBB = 14 V.
(Note 4) Not 100 % tested.
(Note 5) Maximum power supply voltage that can detect short circuit protection.
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
Caution 3: When IC turns off with an inductive load, reverse energy is generated. This energy can be calculated by the following equation:
𝐸𝐿 =
1
𝑉𝐵𝐵
)
× 𝐿 × 𝐼𝑂𝑈𝑇(𝑆𝑇𝐴𝑅𝑇) 2 × (1 −
2
𝑉𝐵𝐵 − 𝑉𝐷𝑆
Where:
𝐿 is the inductance of the inductive load.
𝐼𝑂𝑈𝑇(𝑆𝑇𝐴𝑅𝑇) is the output current at the time of turning off.
The BV2HM050EFV-C integrates the active clamp function to internally absorb the reverse energy EL which is generated when the inductive load is
turned off. When the active clamp operates, the thermal shutdown function does not work. Decide a load so that the reverse energy EL is active
clamp energy EAS (refer to Figure 5. Active Clamp Energy vs Output Current) or under when inductive load is used.
Active Clamp Energy : EAS [mJ]
1000
Tj(start) = 25 °C
100
Tj(start) = 150 °C
10
0.5
1.0
2.0
Output Current : IOUT [A]
4.0 5.0
Figure 5. Active Clamp Energy vs Output Current
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Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Operating Power Supply Voltage
VBB
6
14
28
V
Operating Temperature
Operating Frequency
(Input Voltage 50 % Duty)
Topr
-40
+25
+150
°C
fIN
-
-
1
kHz
Symbol
Typ
Unit
Condition
108.1
°C/W
1s(Note 2)
42.4
°C/W
2s(Note 3)
33.1
°C/W
2s2p(Note 4)
Thermal Resistance(Note 1)
Parameter
HTSSOP-B20
Between Junction and Surroundings Temperature
Thermal Resistance
θJA
(Note 1) The thermal impedance is based on JESD51-2A (Still-Air) standard. It is used the chip of BV2HM050EFV-C
(Note 2) JESD51-3 standard FR4 114.3 mm x 76.2 mm x 1.57 mm 1-layer (1s)
(Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper.)
(Note 3) JESD51-5 standard FR4 114.3 mm x 76.2 mm x 1.60 mm 2-layer (2s)
(Top copper foil: ROHM recommended Footprint + wiring to measure
Copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm, copper (top & reverse side) 2 oz.)
(Note 4) JESD51-5 / -7 standard FR4 114.3 mm x 76.2 mm x 1.60 mm 4-layers (2s2p)
(Top copper foil: ROHM recommended Footprint + wiring to measure
2 inner layers and copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm, copper (top & reverse side / inner layers) 2 oz / 1 oz.)
■
PCB Layout 1 layer (1s)
100 mm2
Footprint
600 mm2
1200 mm2
Figure 6. PCB Layout 1 layer (1s)
Dimension
Value
Board finish thickness
1.57 mm
Board dimension
76.2 mm x 114.3 mm
Board material
FR4
Copper thickness
0.070 mm (Cu: 2oz)
Copper foil area
Footprint / 100 mm2 / 600 mm2 / 1200 mm2
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Thermal Resistance – continued
■
PCB Layout 2 layers (2s)
Top Layer
Bottom Layer
Top Layer
Bottom Layer
via
Cross Section
Figure 7. PCB Layout 2 layers (2s)
Dimension
Value
Board finish thickness
1.60 mm
Board dimension
76.2 mm x 114.3 mm
Board material
FR4
Copper thickness (Top / Bottom layers)
0.070 mm (Cu: 1oz + Plating)
Thermal vias separation / diameter
1.2 mm / 0.3 mm
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Thermal Resistance – continued
■
PCB Layout 4 layers (2s2p)
Top Layer
2nd / Bottom Layer
3rd Layer
Top Layer
2nd Layer
3rd Layer
Bottom Layer
via
Isolation Clearance Diameter ≥ 0.6 mm
Cross Section
Figure 8. PCB Layout 4 layers (2s2p)
Dimension
Value
Board finish thickness
1.60 mm
Board dimension
76.2 mm x 114.3 mm
Board material
FR4
Copper thickness (Top / Bottom layers)
0.070 mm (Cu: 1oz + Plating)
Copper thickness (Inner layers)
0.035 mm
Thermal vias separation / diameter
1.2 mm / 0.3 mm
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Thermal Resistance – continued
■
Transient Thermal Resistance (Single Pulse)
1000
θJA [ºC/W]
100
10
1
1s_Footprint
0.1
2s
2s2p
0.01
0.0001
0.001
0.01
0.1
1
10
100
1000
Pulse Time [s]
Figure 9. Transient Thermal Resistance
■
Thermal Resistance (θJA vs Copper foil area- 1s)
120
100
θJA [ºC/W]
80
60
40
20
0
0
200
400
600
800
1000
1200
Copper Foil Area (1s) [mm2]
Figure 10. Thermal Resistance
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Electrical Characteristics (unless otherwise specified VBB = 6 V to 28 V, Tj = -40 °C to +150 °C)
Min
Limit
Typ
Max
IBBL1
-
-
IBBL2
-
IBBH
UVLO Detection Voltage
UVLO Hysteresis Voltage
High Level Input Voltage
Low Level Input Voltage
Parameter
Symbol
Unit
Conditions
0.5
μA
VBB = 14 V, VIN = 0 V,
VOUT = 0 V, Tj = 25 °C
-
20
μA
VBB = 14 V, VIN = 0 V,
VOUT = 0 V, Tj = 150 °C
-
5
10
mA
VBB = 14 V, VIN = 5 V,
VOUT = Open
VUVLO
-
-
5.0
V
VUVHYS
-
-
1.0
V
VINH
2.1
-
-
V
VINL
-
-
0.9
V
Input Hysteresis Voltage
VHYS
-
0.3
-
V
High Level Input Current
IINH
-
50
150
μA
VIN = 5 V
Low Level Input Current
IINL
-10
-
+10
μA
VIN = 0 V
RON1
-
50
65
mΩ
VBB = 8 V to 18 V, Tj = 25 °C
RON2
-
-
115
mΩ
VBB = 8 V to 18 V, Tj = 150 °C
RON3
-
-
90
mΩ
VBB = 6 V, Tj = 25 °C
IOUTL1
-
-
0.5
μA
VIN = 0 V, VOUT = 0 V, Tj = 25 °C
VIN = 0 V, VOUT = 0 V, Tj = 150 °C
[Power Supply]
Standby Current
Operating Current
[Input (VIN1, VIN2) ]
[Power MOS Output]
Output ON Resistance
Output Leak Current
IOUTL2
-
-
20
μA
Output Slew Rate when ON
SRON
0.05
0.20
0.50
V/μs
VBB = 14 V, RL = 6.5 Ω
Output Slew Rate when OFF
SROFF
0.05
0.20
0.50
V/μs
VBB = 14 V, RL = 6.5 Ω
Output Propagation Delay Time when ON
tOUTON
-
70
160
μs
VBB = 14 V, RL = 6.5 Ω
Output Propagation Delay Time when OFF
tOUTOFF
-
70
160
μs
VBB = 14 V, RL = 6.5 Ω
Output Clamp Voltage
VDSCLP
45
50
55
V
VIN = 0 V, IOUT = 10 mA
Diagnostic Output Low Voltage
VSTL
-
-
0.5
V
IST = 1 mA
Diagnostic Output Leak Current
Diagnostic Output Propagation Delay Time
when ON
Diagnostic Output Propagation Delay Time
when OFF
[Protection Circuit]
ISTL
-
-
10
µA
VST = 5 V
tSTON
10
50
100
µs
tSTOFF
125
300
500
µs
IOC
5
8
11
A
VOUT = 0 V
Overcurrent Detection ON Time
tOCON
-
10
40
µs
VOUT = 0 V
Overcurrent Detection OFF Time
tOCOFF
1.0
2.5
4.0
ms
Open Load Detection Voltage
VOLD
2.0
3.0
4.0
V
Open Load Detection Sink Current
Thermal Shutdown Detection Temperature
IOLD
-
20
60
µA
TTSDDET
160
185
210
°C
TTSDREL
150
-
-
°C
TTSDHYS
-
10
-
°C
[Diagnostics]
Overcurrent Value
(Note 1)
Thermal Shutdown Release Temperature
(Note 1)
Thermal Shutdown Hysteresis Temperature
(Note 1)
VIN = 0 V, VOUT = 5 V
(Note 1) Not 100 % tested.
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BV2HM050EFV-C
Typical Performance Curves
0.5
5
0.4
4
Standby Current : IBBL [µA]
Standby Current : IBBL [µA]
(Unless otherwise specified VBB = 14 V, VIN = 5 V, Tj = 25 °C)
0.3
0.2
0.1
3
2
1
0
0.0
0
5
10
15
20
25
30
35
-50
40
50
100
150
Junction Temperature : Tj [ºC]
Power Supply Voltage : VBB [V]
Figure 11. Standby Current vs Power Supply Voltage
Figure 12. Standby Current vs Junction Temperature
10
10
9
9
8
8
Operating Current : IBBH [mA]
Operating Current : IBBH [mA]
0
7
6
5
4
3
2
7
6
5
4
3
2
1
1
0
0
0
5
10
15
20
25
30
35
-50
40
50
100
150
Junction Temperature : Tj [ºC]
Power Supply Voltage : VBB [V]
Figure 13. Operating Current vs Power Supply Voltage
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Figure 14. Operating Current vs Junction Temperature
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Typical Performance Curves - continued
(Unless otherwise specified VBB = 14 V, VIN = 5 V, Tj = 25 °C)
High / Low Level Input Voltage : VINH, VINL [V]
UVLO Detection Voltage : VUVLO [V]
5
4
3
2
1
0
-50
0
50
100
2.0
1.8
VINH
1.6
1.4
1.2
VINL
1.0
0.8
0.6
0.4
0.2
0.0
-50
150
0
100
150
Junction Temperature : Tj [ºC]
Junction Temperature : Tj [ºC]
Figure 15. UVLO Detection Voltage vs Junction Temperature
Figure 16. High / Low Level Input Voltage
vs Junction Temperature
100
90
90
80
Output ON Resistance : RON [mΩ]
High Level Input Current : IINH [µA]
50
80
70
60
50
40
30
20
70
60
50
40
30
20
10
10
0
0
-50
0
50
100
150
Junction Temperature : Tj [ºC]
5
10
15
20
25
30
35
40
Power Supply Voltage : VBB [V]
Figure 17. High Level Input Current vs Junction Temperature
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Figure 18. Output ON Resistance vs Power Supply Voltage
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31.Jan.2023 Rev.003
BV2HM050EFV-C
Typical Performance Curves - continued
(Unless otherwise specified VBB = 14 V, VIN = 5 V, Tj = 25 °C)
100
5
Output Leak Current : IOUTL [µA]
Output ON Resistance : RON [mΩ]
90
80
70
60
50
40
30
20
4
3
2
1
10
0
0
-50
0
50
100
150
-50
Junction Temperature : Tj [ºC]
0.4
SROFF
0.2
SRON
0.1
0.0
0
50
100
150
Junction Temperature : Tj [ºC]
150
160
140
120
100
80
tOUTON
60
tOUTOFF
40
20
0
-50
0
50
100
150
Junction Temperature : Tj [ºC]
Figure 21. Output Slew Rate when ON / OFF
vs Junction Temperature
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100
Figure 20. Output Leak Current vs Junction Temperature
Output Propagation Delay Time when ON / OFF
: tOUTON, tOUTOFF [µs]
Output Slew Rate when ON / OFF
: SRON, SROFF [V/µs]
0.5
-50
50
Junction Temperature : Tj [ºC]
Figure 19. Output ON Resistance vs Junction Temperature
0.3
0
Figure 22. Output Propagation Delay Time when ON / OFF
vs Junction Temperature
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Typical Performance Curves - continued
(Unless otherwise specified VBB = 14 V, VIN = 5 V, Tj = 25 °C)
0.5
Diagnostic Output Low Voltage : VSTL [V]
Output Clamp Voltage : VDSCLP [V]
60
50
40
30
20
10
0.4
0.3
0.2
0.1
0.0
0
-50
0
50
100
-50
150
50
100
150
Junction Temperature : Tj [ºC]
Junction Temperature : Tj [ºC]
Figure 23. Output Clamp Voltage vs Junction Temperature
Figure 24. Diagnostic Output Low Voltage
vs Junction Temperature
100
500
Diagnostic Output Propagation Delay Time
when OFF : tSTOFF [µs]
Diagnostic Output Propagation Delay Time
when ON : tSTON [µs]
0
90
80
70
60
50
40
30
20
10
0
450
400
350
300
250
200
150
100
50
0
-50
0
50
100
150
Junction Temperature : Tj [ºC]
0
50
100
150
Junction Temperature : Tj [ºC]
Figure 25. Diagnostic Output Propagation Delay Time
when ON vs Junction Temperature
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Figure 26. Diagnostic Output Propagation Delay Time
when OFF vs Junction Temperature
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Typical Performance Curves - continued
(Unless otherwise specified VBB = 14 V, VIN = 5 V, Tj = 25 °C)
40
Overcurrent Detection ON Time : tOCON [µs]
12
Overcurrent Value : IOC [A]
10
8
6
4
2
0
35
30
25
20
15
10
5
0
-50
0
50
100
150
-50
Junction Temperature : Tj [ºC]
50
100
150
Junction Temperature : Tj [ºC]
Figure 27. Overcurrent Value vs Junction Temperature
Figure 28. Overcurrent Detection ON Time
vs Junction Temperature
4.0
4.0
Open Load Detection Voltage : VOLD [V]
Overcurrent Detection OFF Time : tOCOFF [ms]
0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0.0
-50
0
50
100
150
0
50
100
150
Junction Temperature : Tj [ºC]
Junction Temperature : Tj [ºC]
Figure 29. Overcurrent Detection OFF Time
vs Junction Temperature
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-50
Figure 30. Open Load Detection Voltage
vs Junction Temperature
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Measurement Circuits
VBB
VBB
VBB
VBB
IN1
(IN2)
IN1
(IN2)
ST1
(ST2)
OUT1
(OUT2)
VIN
OUT1
(OUT2)
VIN
VST
ST1
(ST2)
GND
GND
Figure 31. Standby Current
Low Level Input Current
Output Leak Current
Diagnostic Output Leak Current
Figure 32. Operating Current
VBB
VBB
VBB
VBB
IN1
(IN2)
VIN
IN1
(IN2)
ST1
(ST2)
OUT1
(OUT2)
GND
VIN
OUT1
(OUT2)
GND
1 kΩ
Figure 33. UVLO Detection / Hysteresis Voltage
High / Low Level Input Voltage
Input Hysteresis Voltage
High Level Input Current
Thermal Shutdown Detection
/ Release / Hysteresis Temperature
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ST1
(ST2)
Figure 34. Output ON Resistance
Output Clamp Voltage
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Measurement Circuits - continued
VBB
VBB
VBB
VBB
IN1
(IN2)
10 kΩ
ST1
(ST2)
Monitor
IN1
(IN2)
ST1
(ST2)
Monitor
IST
VIN
OUT1
(OUT2)
GND
OUT1
(OUT2)
VIN
VST
Monitor
GND
6.5 Ω
Figure 35. Output Slew Rate when ON / OFF
Output Propagation Delay Time when ON / OFF
Diagnostic Output Propagation Delay Time when ON
1 kΩ
Figure 36. Diagnostic Output Low Voltage
VBB
VBB
VBB
VBB
IN1
(IN2)
ST1
(ST2)
Monitor
IN1
(IN2)
10 kΩ
ST1
(ST2)
Monitor
10 kΩ
Monitor
Monitor
VIN
VIN
OUT1
(OUT2)
OUT1
(OUT2)
VST
VST
GND
GND
Figure 37. Diagnostic Output Propagation Delay Time when OFF
Figure 38. Overcurrent Value
Overcurrent Detection ON / OFF Time
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Measurement Circuits - continued
VBB
VBB
IN1
(IN2)
10 kΩ
ST1
(ST2)
VST
OUT1
(OUT2)
GND
VOUT
Figure 39. Open Load Detection Voltage
Open Load Detection Sink Current
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Measurement Conditions for Time Items
IN1
(IN2)
VINH
80 %
SRON = ΔV/t1
OUT1
(OUT2)
80 %
ΔV
SROFF = ΔV/t2
OUT1
(OUT2)
ΔV
20 %
20 %
t1
VINL
IN1
(IN2)
VINL
t2
tOUTON
tOUTOFF
ST1
(ST2)
ST1
(ST2)
10 %
10 %
tSTOFF
tSTON
Figure 40. Output Slew Rate when ON / OFF
Figure 41. Diagnostic Output Propagation Delay Time when OFF
Output Propagation Delay Time when ON / OFF
Diagnostic Output Propagation Delay Time when ON
IN1
(IN2)
OUT1
(OUT2)
ST1
(ST2)
IOC
IOUT1
(IOUT2 )
IOC (min)
tOCOFF
tOCON
tOCOFF
tOCON
tOCOFF
tOCON
Figure 42. Overcurrent Value
Overcurrent Detection ON / OFF Time
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Timing Chart
IN1
(IN2)
OUT1
(OUT2)
ST1
(ST2)
Normal
Open Load Detction
（OLD)
Normal
Low Voltage Output OFF
（UVLO)
Normal
Thermal Shutdown
（TSD)
Normal
Overcurrent Protection
（OCP)
Normal
Figure 43. Timing Chart
Description of Blocks
1. Protection Functions
Table 1. Detection and Release Conditions and Diagnostic Output of Each Protection Function(Note 1)
Input Voltage
Mode
Detection / Release Conditions
VINx
Normal
Condition
Diagnostic Output
VSTx
Standby
-
Low
High
Operating
-
High
Low
Detect VOUTx ≥ 3.0 V (Typ)
Low
Low
Release VOUTx ≤ 2.2 V (Typ)
Low
High
Detect VBB ≤ 5.0 V (Max)
High
High
Release VBB ≥ 6.0 V (Max)
High
Low
Detect Tj ≥ 185 °C (Typ)
High
High
Release Tj ≤ 175 °C (Typ)
High
Low
Detect IOUTx ≥ 6 A (Typ)
High
High
Release IOUTx < 6 A (Typ)
High
Low
Open Load Detect (OLD)
Under Voltage Lockout (UVLO)
Thermal Shutdown Protection
(TSD)(Note 2)
Overcurrent Protection (OCP)
(Note 1) x = 1, 2 and this is the same for x in the following sentence.
(Note 2) Thermal shutdown is automatically restored to normal operation.
This IC has a built-in protection detection function as mentioned above and outputs the condition with diagnostic output pin
STx.
In normal condition, when input voltage VINx is switched from Low to High, diagnostic output VSTx turns from High to Low.
Inversely, when VINx is switched from High to Low, VSTx turns from Low to High.
In protection function detected condition, VSTx is High when VINx is High, and VSTx is Low when VINx is Low. And after
detecting protection function, this IC self-restarts and operation becomes normal if above release condition is satisfied.
2. Overcurrent Protection (Output ground fault detection)
This IC has a built-in hiccup mode overcurrent protection function. When the output pin (OUTx) outputs overcurrent, the
output of Channel x is turned off and diagnostic output VSTx becomes High. After Overcurrent Detection OFF Time (tOCOFF)
from turn-off, output self-restarts and operation becomes normal if overcurrent doesn’t flow. When overcurrent flows after the
self-restart, output is turned off again. So, if the condition that causes overcurrent continues, output repeats ON and OFF
periodically. And in this time VSTx keeps High.
And output current can exceed Overcurrent Value IOC depending on the condition of impedance connected to VBB, OUT
pins.
3. Thermal Shutdown Protection
This IC has a built-in thermal shutdown protection function. When the chip temperature of POWER-MOS unit for Channel x
in this IC exceeds 185 °C (Typ), the output of Channel x is turned OFF and diagnostic output VSTx becomes High.
When the chip temperature of POWER-MOS unit for Channel x goes below 175 °C (Typ), output self-restarts and operation
becomes normal.
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Description of Blocks - continued
4. Open Load Detection
VBB
VBB
SOLD
OUT1, OUT2
5V
IN1, IN2
ROLD
Internal
supply
R1
ST1, ST2
R3
logic
RL
R2
Figure 44. Open Load Detection Block Diagram
This IC has a built-in Open Load Detection function. By connecting an external resistance ROLD between power supply pin
(VBB) and output pin (OUTx), when output load (RL) is disconnected during input voltage VINx is Low, diagnostic output VSTx
becomes Low.
To reduce the standby current of the system, inserting a switch SOLD is recommended.
The value of ROLD is decided based on below formula.
𝑅𝑂𝐿𝐷 < 𝑉𝐵𝐵𝑀𝐼𝑁 × 37.5 × 103 − 150 × 103 [Ω]
( = 𝑉𝐵𝐵𝑀𝐼𝑁 ×
𝑅𝑀𝐼𝑁
𝑉𝑂𝐿𝐷𝑀𝐴𝑋
− 𝑅𝑀𝐼𝑁 [Ω] )
Where:
𝑉𝐵𝐵𝑀𝐼𝑁 is the minimum value of power supply voltage (VBB).
𝑉OLDMAX is the maximum value of Open Load Detection Voltage (VOLD).
𝑅𝑀𝐼𝑁 is the minimum value of combined resistance of internal resistors R1, R2 and R3.
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Description of Blocks - continued
5. Other Protection
5.1 GND Open Protection
5V
VBB
Clamp
IN1, IN 2
Internal
supply
supply
Control
logic
ST1, ST 2
OUT1, OUT2
GND
Figure 45. GND Open Protection Block Diagram
When GND of the IC is open, the output is switched OFF regardless of the input voltage VINx. However, diagnostic output
VSTx is not flagged.
The active clamp operates when GND become open during driving inductive load.
5.2 MCU I/O Protection
VBB
5V
Internal
Internal
supply
supply
Clamp
IN1, IN2
MCU
ST1, ST2
Control
logic
OUT1, OUT2
GND
Figure 46. MCU I/O Protection Diagram
Negative surge voltage to input pin (IN1, IN2) or diagnostic output pin (ST1, ST2) may cause damage to the MCU's I/O
pins. In order to prevent those damages, it is recommended to insert limiting resistors between IC pins and MCU.
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Applications Example
RST2PU
RST1PU
CVBB
VBB
RIN1
ROLD1
IN1
ROLD2
OUT1
RIN2
IN2
RL1
MCU
BV2HM050EFV-C
COUT1
RST1
ST1
OUT2
RST2
ST2
GND
RL2
COUT2
RGND
DGND
Symbol
Value
Purpose
RIN1, RIN2
1 kΩ
Limit resistance for negative surge
RST1, RST2
1 kΩ
RST1PU, RST2PU
10 kΩ
CVBB
10 µF
Limit resistance for negative surge
Pull up resistance for diagnostic output
The ST1 and ST2 pins are open drain output and pull up
these pins to MCU power supply.
Filter for battery line voltage spike
RGND
1 kΩ
DGND
-
ROLD1, ROLD2
2 kΩ
COUT1, COUT2
1000 pF
RL1, RL2
-
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Current limit resistance for reverse battery connection
Protection diode for BV2HM050EFV-C against reverse
battery connection
Resistance for open load detection
Filter for radiation noise from outside of BV2HM050EFV-C
Output load
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I/O Equivalence Circuits
IN1, IN2
ST1, ST2
10 kΩ
IN1
IN2
150 Ω
ST1
ST2
100 kΩ
OUT1, OUT2
VBB
OUT1
OUT2
200 kΩ
500 kΩ
300 kΩ
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
Ground Voltage
Except for pins the output and the input of which were designed to go below ground, ensure that no pins are at a
voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
8.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
9.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
10. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
11. Thermal Shutdown Function (TSD)
This IC has a built-in thermal shutdown function that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD function that will turn OFF power output pins. When the
Tj falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD function operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD function be used in a set design or for any purpose other than protecting the IC from
heat damage.
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Operational Notes – continued
12. Over Current Protection Function (OCP)
This IC incorporates an integrated overcurrent protection function that is activated when the load is shorted. This
protection function is effective in preventing damage due to sudden and unexpected incidents. However, the IC
should not be used in applications characterized by continuous operation or transitioning of the protection function.
13. Active Clamp Operation
The IC integrates the active clamp function to internally absorb the reverse energy E L which is generated when the
inductive load is turned off. When the active clamp operates, the thermal shutdown function does not work. Decide a
load so that the reverse energy EL is active clamp energy EAS (refer to Figure 5. Active Clamp Energy vs Output
Current) or under when inductive load is used.
14. Open Power Supply Pin
When the power supply pin (VBB) becomes open at ON (IN = High), the output is switched to OFF regardless of input
voltage. If an inductive load is connected, the active clamp operates when VBB is open and becomes the same
potential as that on the ground. At this time, the output voltage drops down to -50 V (Typ).
15. Open GND Pin
When the GND pin becomes open at ON (IN = High), the output is switched to OFF regardless of input voltage. If an
inductive load is connected, the active clamp operates when the GND pin is open.
16. OUT Pin Voltage
Ensure that keep OUT pin voltage less than (VBB + 0.3 V) at any time, even during transient condition. And ensure
that OUT pin voltage is more than (GND - 0.3 V) when this IC is turned ON. Otherwise malfunction or other problems
can occur.
17. Same Pin Connection
Connect all VBB pins, GND pins, OUT1 pins, OUT2 pins to same line respectively.
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Ordering Information
B
V
2
H
M
0
5
0
Part Number
E
F
V
Package
EFV: HTSSOP-B20
-
CE2
Product Rank
C: Automotive product
Packaging and Forming Specification
E2: Embossed tape and reel
Marking Diagram
HTSSOP-B20 (TOP VIEW)
Part Number Marking
V 2 H M 5 0
LOT Number
Pin 1 Mark
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Physical Dimension and Packing Information
Package Name
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Revision History
Date
Revision
20.Jan.2022
001
31.Oct.2022
002
31.Jan.2023
003
Changes
New Release
Page 27 Ordering Information
The Description of “Part Number” is added.
Page 5 Absolute Maximum Ratings
Figure 5 is changed.
Page 9 Thermal Resistance
The vertical axis name in Figure 10 is corrected.
Page 26 Operational Notes
14.Open Power Supply Pin
The value of output clamp voltage is changed.
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Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
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