LAP

Solder Profile and Pattern 1) Dip Types (LA, LB ,LAP,LBP series) Please keep the preheat and peak temperatures with dip units as low as possible and the times as short as is feasible, since the products are susceptible to heat during flow soldering. As a guide, ensure that the internal temperature of the LED numeric display does not exceed 100°C. Soldering Example 300 3s or less Temperature °C 250 200 150 100 50 0 Preheat 30s or less Conditions General flow conditions A single wave is better than a double wave, while stationary flow method is the best. Solder Pattern Example LA-301 series φ1.5 +0.1 0 land shape 260°C or less After soldering, immediately lower the temperature of the substrate φ0.8 +0.1 0 hole shape Other series φ2.0 +0.1 0 land shape 0 20 40 60 80 Time (s) 100 120 140 φ1.0 +0.1 0 hole shape Item Solder dip Conditions At least 2mm from the base of the lead pin. Solder Temperature Preheat temperature must be no greater than 80°C. Process Duration 30 seconds or less 3 seconds or less 3 seconds or less No more than 260°C. No more than 300°C. Solder iron Reflow At least 2mm from the base of the lead pin. Power: No more than 30W. Reflow cannot be used. (other than the LF-301 series) ∗Please use a resin-based flux, since flux that is acidic or highly alkaline could cause corrosion. 2) Surface Mount Type (LF-301 series) Please refer to the following reflow soldering profile and pattern examples for surface mount units. Reflow Soldering Example Substrate Surface Temperature (°C) D: Peak Temperature Solder Pattern Example LF-301 A/K series 1.8 250 200 150 100 C: Heat Slope 2 B: Preheat A: Heat Slope 1 50 1.8 0 0 50 100 150 Time (s) C (Heat Slope 2) 4°C/s max. 200 250 300 (10.4) E: 200°C + range 14 10-0.6 D (Peak temperature, peak time) 250°C max, 5s max. E (200°C + range) 50s max. P=1.27 Type LF-301A/K series A (Heat Slope 1) 4°C/s max B (Preheat) 140 to 160°C (1 min. or less)