Datasheet
Operational Amplifiers
Ground Sense Operational Amplifiers
LM358xxx
LM324xxx
LM2904xxx
LM2902xxx
General Description
Key Specifications
◼ Operating Supply Voltage (Single Supply):
3.0V to 32.0V
◼ Operating Temperature Range:
LM358xxx:
-40°C to +85°C
LM324xxx:
-40°C to +85°C
LM2904xxx:
-40°C to +125°C
LM2902xxx:
-40°C to +125°C
◼ Input Offset Voltage:
4.5mV (Max)
◼ Input Bias Current:
20nA (Typ)
LM358xxx and LM2904xxx series are dual ground
sense operational amplifiers. LM324xxx
and
LM2902xxx series are quad. These have features of
low current consumption and wide operating voltage
range from 3V to 32V (single power supply).
Features
◼ Operable with a Single Power Supply
◼ Wide Operating Supply Voltage Range
◼ Input/output Ground Sense
◼ High Large Signal Voltage Gain
Packages
W(Typ) x D(Typ) x H(Max)
SOP8
SOP-J8
SSOP-B8
TSSOP-B8
TSSOP-B8J
MSOP8
SOP14
SOP-J14
SSOP-B14
TSSOP-B14J
Applications
◼ Current Sense Application
◼ Buffer Application Amplifier
◼ Active Filter
◼ Consumer Electronics
5.00mm x 6.20mm x 1.71mm
4.90mm x 6.00mm x 1.65mm
3.00mm x 6.40mm x 1.35mm
3.00mm x 6.40mm x 1.20mm
3.00mm x 4.90mm x 1.10mm
2.90mm x 4.00mm x 0.90mm
8.70mm x 6.20mm x 1.71mm
8.65mm x 6.00mm x 1.65mm
5.00mm x 6.40mm x 1.35mm
5.00mm x 6.40mm x 1.20mm
Pin Configuration
LM358F, LM2904F
LM358FJ, LM2904FJ
LM358FV, LM2904FV
LM358FVT, LM2904FVT
LM358FVJ, LM2904FVJ
LM358FVM, LM2904FVM
OUT1
-IN1
: SOP8
: SOP-J8
: SSOP-B8
: TSSOP-B8
: TSSOP-B8J
: MSOP8
1
2
8
CH1
-
+IN1 3
7
+
+
CH2
+
VEE
OUT2
6
-IN2
5
+IN2
-
4
VCC
○Product structure：Silicon monolithic integrated circuit
Pin Name
1
OUT1
2
-IN1
3
+IN1
4
VEE
5
+IN2
6
-IN2
7
OUT2
8
VCC
○This product has no designed protection against radioactive rays.
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LM358xxx
LM324xxx
LM324F, LM2902F
LM324FJ, LM2902FJ
LM324FV, LM2902FV
LM324FVJ, LM2902FVJ
LM2904xxx
: SOP14
: SOP-J14
: SSOP-B14
: TSSOP-B14J
OUT1 1
-IN1 2
Datasheet
LM2902xxx
14 OUT4
CH1
- +
CH4
+ -
13 -IN4
Pin No.
Pin Name
1
OUT1
2
-IN1
3
+IN1
4
VCC
+IN1 3
12 +IN4
5
+IN2
VCC 4
11 VEE
6
-IN2
7
OUT2
+IN2 5
10 +IN3
8
OUT3
9
-IN3
10
+IN3
-IN2 6
- +
CH2
+ CH
3
OUT2 7
9 -IN3
8 OUT3
11
VEE
12
+IN4
13
-IN4
14
OUT4
Absolute Maximum Ratings (TA=25°C)
Supply Voltage
Power Dissipation
LM358xxx
Rating
LM324xxx LM2904xxx
36
SOP8
0.68(Note 1,9)
-
0.68(Note 1,9)
-
SOP-J8
0.67(Note 2,9)
-
0.67(Note 2,9)
-
SSOP-B8
0.62(Note 3,9)
-
0.62(Note 3,9)
-
TSSOP-B8
0.62(Note 3,9)
-
0.62(Note 3,9)
-
TSSOP-B8J
0.58(Note 4,9)
-
0.58(Note 4,9)
-
MSOP8
0.58(Note 4,9)
-
0.58(Note 4,9)
-
SOP14
-
0.56(Note 5,9)
-
0.56(Note 5,9)
SOP-J14
-
1.02(Note 6,9)
-
1.02 (Note 6,9)
SSOP-B14
-
0.87(Note 7,9)
-
0.87(Note 7,9)
-
0.85(Note 8,9)
-
0.85(Note 8,9)
Symbol
Parameter
VCC-VEE
PD
TSSOP-B14J
LM2902xxx
Unit
V
W
Differential Input Voltage (Note 10)
VID
36
V
Input Common-mode Voltage Range
VICM
V
mA
V
Current(Note 11)
II
(VEE-0.3) to (VEE+36)
±10
Operating Supply Voltage
Vopr
3.0 to 32.0
Operating Temperature Range
Topr
Storage Temperature Range
Tstg
-55 to +150
°C
Maximum Junction Temperature
Tjmax
150
°C
Input
-40 to +85
-40 to +125
°C
(Note 1) Reduce by 5.5mW per 1°C above 25C.
(Note 2) Reduce by 5.4mW per 1°C above 25°C.
(Note 3) Reduce by 5.0mW per 1°C above 25°C.
(Note 4) Reduce by 4.7mW per 1°C above 25°C.
(Note 5) Reduce by 4.5mW per 1°C above 25°C.
(Note 6) Reduce by 8.2mW per 1°C above 25°C.
(Note 7) Reduce by 7.0mW per 1°C above 25°C.
(Note 8) Reduce by 6.8mW per 1°C above 25°C.
(Note 9) Mounted on an FR4 glass epoxy PCB 70mm×70mm×1.6mm (Copper foil area less than 3%).
(Note 10) Differential Input Voltage is the voltage difference between the inverting and non-inverting inputs.
The input pin voltage is set to more than VEE.
(Note 11) An excessive input current will flow when input voltages of less than VEE-0.6V are applied.
The input current can be set to less than the rated current by adding a limiting resistor.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
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LM358xxx
LM324xxx
LM2904xxx
Datasheet
LM2902xxx
Electrical Characteristics
○LM358xxx, LM2904xxx (Unless otherwise specified VCC=+5V, VEE=0V)
Parameter
Symbol
Input Offset Voltage(Note 12,13)
Input Offset Voltage Drift(Note 12)
Input Offset Current(Note 12,13)
Input Bias Current(Note 12,13)
Supply Current(Note 13)
Min
Typ
Max
25°C
-
1
4.5
Unit
VIO
ΔVIO/ΔT
(Low)(Note 13)
Large Signal Voltage Gain
Condition
VOUT=1.4V
mV
Full Range
-
-
5
-
-
6
-
25°C
-
2
50
Full Range
-
-
200
25°C
-
20
250
Full Range
-
-
300
25°C
-
0.6
1.2
Full Range
-
-
1.5
25°C
3.5
-
-
IIO
IB
ICC
Maximum Output Voltage (High)(Note 13)
Maximum Output Voltage
Limits
Temperature
Range
VOH
VCC=5 to 30V, VOUT=1.4V
μV/°C VOUT=1.4V
nA
VOUT=1.4V
nA
VOUT=1.4V
mA
RL=∞, All Op-Amps
RL=2kΩ
V
Full Range
27
28
-
VOL
Full Range
-
5
20
25
100
-
AV
25°C
88
100
-
mV
VCC=30V, RL=10kΩ
RL=∞
V/mV R ≧2kΩ, V =15V
L
CC
dB VOUT=1.4 to 11.4V
Input Common-mode Voltage Range
VICM
25°C
0
-
3.5
V
VICM=VEE to (VCC-1.5V)
VOUT=1.4V
Input Common-mode Voltage Range
(VEE side) (Note 14)
VICM
Full Range
-
0.1
-
V
VOUT=1.4V
Common-mode Rejection Ratio
CMRR
25°C
70
80
-
dB
VOUT=1.4V
Power Supply Rejection Ratio
PSRR
25°C
65
100
-
dB
VCC=5 to 30V
Output Source Current(Note 13,15)
25°C
20
30
-
ISOURCE
mA
V+IN=1V, V-IN=0V
VOUT=0V, Short Current
mA
V+IN=0V, V-IN=1V
VOUT=5V, Short Current
Output Sink
Current(Note 13,15)
ISINK
Full Range
10
-
-
25°C
20
27
-
Full Range
5
-
-
25°C
20
50
-
μA
V+IN=0V, V-IN=1V
VOUT=200mV
dB
f=1kHz, Input Referred
Channel Separation
CS
25°C
-
120
-
Slew Rate
SR
25°C
-
0.3
-
GBW
25°C
-
0.8
-
Phase Margin
θ
25°C
-
80
-
deg
Input Referred Noise Voltage
VN
25°C
-
40
-
nV/ Hz
Gain Bandwidth
VCC=15V, Av=0dB
RL=2kΩ, CL=100pF
VCC=15V, VEE=-15V
MHz
RL=2kΩ, CL=100pF
V/μs
Av=40dB
VCC=15V, VEE=-15V
RS=100Ω, VIN=0V, f=1kHz
(Note 12) Absolute value
(Note 13) LM358xxx Full Range: TA=-40C to +85C, LM2904xxx Full Range: TA=-40C to +125C
(Note 14) LM2904xxx only.
(Note 15) Consider the power dissipation of the IC under high temperature when selecting the output current value.
There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC.
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LM358xxx
LM324xxx
LM2904xxx
Datasheet
LM2902xxx
Electrical Characteristics - continued
○LM324xxx, LM2902xxx (Unless otherwise specified VCC=+5V, VEE=0V)
Parameter
Symbol
Input Offset Voltage(Note 16,17)
Input Offset Voltage Drift(Note 17)
Input Offset Current(Note 16,17)
Input Bias Current(Note 16,17)
Supply Current(Note 17)
Min
Typ
Max
25°C
-
1
4.5
Unit
VIO
ΔVIO/ΔT
(Low)(Note 17)
Large Signal Voltage Gain
Condition
VOUT=1.4V
mV
Full Range
-
-
5
-
-
6
-
25°C
-
2
50
Full Range
-
-
200
25°C
-
20
250
Full Range
-
-
300
25°C
-
1
2
Full Range
-
-
2.5
25°C
3.5
-
-
IIO
IB
ICC
Maximum Output Voltage (High)(Note 17)
Maximum Output Voltage
Limits
Temperature
Range
VOH
VCC=5 to 30V, VOUT=1.4V
μV/°C VOUT=1.4V
nA
VOUT=1.4V
nA
VOUT=1.4V
mA
RL=∞, All Op-Amps
RL=2kΩ
V
Full Range
27
28
-
VOL
Full Range
-
5
20
25
100
-
AV
25°C
88
100
-
mV
VCC=30V, RL=10kΩ
RL=∞
V/mV R ≧2kΩ, V =15V
L
CC
dB VOUT=1.4 to 11.4V
Input Common-mode Voltage Range
VICM
25°C
0
-
3.5
V
VICM=VEE to (VCC-1.5V)
VOUT=1.4V
Input Common-mode Voltage Range
(VEE side) (Note 18)
VICM
Full Range
-
0.1
-
V
VOUT=1.4V
Common-mode Rejection Ratio
CMRR
25°C
70
80
-
dB
VOUT=1.4V
Power Supply Rejection Ratio
PSRR
25°C
65
100
-
dB
VCC=5 to 30V
Output Source Current(Note 17,19)
25°C
20
30
-
ISOURCE
mA
V+IN=1V, V-IN=0V
VOUT=0V, Short Current
mA
V+IN=0V, V-IN=1V
VOUT=5V, Short Current
Output Sink
Current(Note 17,19)
ISINK
Full Range
10
-
-
25°C
20
27
-
Full Range
5
-
-
25°C
20
50
-
μA
V+IN=0V, V-IN=1V
VOUT=200mV
dB
f=1kHz, Input Referred
Channel Separation
CS
25°C
-
120
-
Slew Rate
SR
25°C
-
0.3
-
GBW
25°C
-
0.8
-
Phase Margin
θ
25°C
-
80
-
deg
Input Referred Noise Voltage
VN
25°C
-
40
-
nV/ Hz
Gain Bandwidth
VCC=15V, Av=0dB
RL=2kΩ, CL=100pF
VCC=15V, VEE=-15V
MHz
RL=2kΩ, CL=100pF
V/μs
Av=40dB
VCC=15V, VEE=-15V
RS=100Ω, VIN=0V, f=1kHz
(Note 16) Absolute value
(Note 17) LM324xxx Full Range: TA=-40C to +85C, LM2902xxx Full Range: TA=-40C to +125C
(Note 18) LM2902xxx only.
(Note 19) Consider the power dissipation of the IC under high temperature when selecting the output current value.
There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC.
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LM358xxx
LM324xxx
LM2904xxx
Datasheet
LM2902xxx
Description of Electrical Characteristics
Below are the descriptions of the relevant electrical terms used in this datasheet. Items and symbols used are also shown.
Note that item names, symbols, and their meanings may differ from those of another manufacturer’s document or general
document.
1. Absolute Maximum Ratings
Absolute maximum rating items indicate the conditions which must not be exceeded. Application of voltage in excess of the
absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of
electrical characteristics.
(1) Supply Voltage (VCC/VEE)
Indicates the maximum voltage that can be applied between the VCC pin and VEE pin without deterioration of
characteristics of internal circuit.
(2) Differential Input Voltage (VID)
Indicates the maximum voltage that can be applied between the non-inverting and inverting pins without damaging
the IC.
(3) Input Common-mode Voltage Range (VICM)
Indicates the maximum voltage that can be applied to the non-inverting and inverting pins without deterioration or
destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure
normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics.
(4) Power Dissipation (PD)
Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25°C
(normal temperature). As for package product, PD is determined by the temperature that can be permitted by the IC in
the package (maximum junction temperature) and the thermal resistance of the package.
2. Electrical Characteristics
(1) Input Offset Voltage (VIO)
Indicates the voltage difference between non-inverting pin and inverting pin. It can be translated to the input voltage
difference required for setting the output voltage to 0V.
(2) Input Offset Voltage Drift (ΔVIO/ΔT)
Denotes the ratio of the input offset voltage fluctuation to the ambient temperature fluctuation.
(3) Input Offset Current (IIO)
Indicates the difference of input bias current between the non-inverting and inverting pins.
(4) Input Bias Current (IB)
Indicates the current that flows into or out of the input pin. It is defined by the average of input bias currents at the
non-inverting and inverting pins.
(5) Supply Current (ICC)
Indicates the current that flows within the IC under specified no-load conditions.
(6) Maximum Output Voltage (High) / Maximum Output Voltage (Low) (VOH/VOL)
Indicates the voltage range of the output under specified load condition. It is typically divided into maximum output
voltage high and low. Maximum output voltage high indicates the upper limit of output voltage. Maximum output
voltage low indicates the lower limit.
(7) Large Signal Voltage Gain (AV)
Indicates the amplification rate (gain) of output voltage against the voltage difference between non-inverting pin and
inverting pin. It is normally the amplification rate (gain) with reference to DC voltage.
Av = (Output Voltage) / (Differential Input Voltage)
(8) Input Common-mode Voltage Range (VICM)
Indicates the input voltage range at which IC normally operates.
(9) Common-mode Rejection Ratio (CMRR)
Indicates the ratio of fluctuation of input offset voltage when the input common-mode voltage is changed. It is normally
the fluctuation of DC.
CMRR = (Change of Input Common-mode Voltage)/(Input Offset Fluctuation)
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LM358xxx
LM324xxx
LM2904xxx
Datasheet
LM2902xxx
(10) Power Supply Rejection Ratio (PSRR)
Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed.
It is normally the fluctuation of DC.
PSRR= (Change of Power Supply Voltage)/( Input Offset Fluctuation)
(11) Output Source Current/ Output Sink Current (ISOURCE / ISINK)
The maximum current that the IC can output under specific output conditions. The output source current indicates the
current flowing out from the IC, and the output sink current indicates the current flowing into the IC.
(12) Channel Separation (CS)
Indicates the fluctuation in the output voltage of the driven channel with reference to the change of output voltage of
the channel which is not driven.
(13) Slew Rate (SR)
Indicates the rate of the change of the output voltage with time when a step input signal is applied.
(14) Gain Bandwidth (GBW)
The product of the open-loop voltage gain and the frequency at which the voltage gain decreases 6dB/octave.
(15) Phase Margin (θ)
Indicates the margin of phase from 180 degree phase lag at unity gain frequency.
(16) Input Referred Noise Voltage (VN)
Indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in
series with input pin.
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LM358xxx
LM324xxx
LM2904xxx
Datasheet
LM2902xxx
Typical Performance Curves
1.6
1.6
1.2
1.2
Supply Current [mA]
Supply Current [mA]
○LM358xxx, LM2904xxx
25°C
85°C
0.8
-40°C
125°C
0.8
5V
3V
0.4
0.4
0.0
0.0
0
10
20
30
-50
40
-25
0
25
50
75
100
125
Supply Voltage [V]
Ambient Temperature [°C]
Figure 1. Supply Current vs Supply Voltage
Figure 2. Supply Current vs Ambient
Temperature
150
5
Maximum Output Voltage High [V]
40
Maximum Output Voltage High [V]
36V
125°C
30
85°C
25°C
20
-40°C
10
4
3
2
1
0
0
0
10
20
30
40
-50
-25
Supply Voltage [V]
0
25
50
75
100 125 150
Ambient Temperature [°C]
Figure 3. Maximum Output Voltage (High) vs
Supply Voltage (RL=10kΩ)
Figure 4. Maximum Output Voltage (High) vs
Ambient Temperature (VCC=5V, RL=10kΩ)
(*) The above data are measurement value of typical sample, they are not guaranteed.
LM358xxx: -40°C to +85°C
LM2904xxx: -40°C to 125°C
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LM324xxx
LM2904xxx
Datasheet
LM2902xxx
Typical Performance Curves - continued
5
50
4
40
Output Source Current [mA]
Maximum Output Voltage High [V]
○LM358xxx, LM2904xxx
3
2
1
-40°C
25°C
30
20
85°C
125°C
10
0
0
-50
-25
0
25
50
75
100
125
150
0
1
Figure 5. Maximum Output Voltage (High) vs
Ambient Temperature (VCC=5V, RL=2kΩ)
4
5
Figure 6. Output Source Current vs
Output Voltage (VCC=5V)
50
50
40
40
Output Sink Current [mA]
Output Source Current [mA]
3
Output Voltage [V]
Ambient Temperature [°C]
30
5V
36V
2
3V
20
10
25°C
30
85°C
125°C
20
-40°C
10
0
0
-50
-25
0
25
50
75
100
125
150
0
Ambient Temperature [°C]
1
2
3
4
5
Output Voltage [V]
Figure 7. Output Source Current vs
Ambient Temperature (VOUT=0V)
Figure 8. Output Sink Current vs
Output Voltage (VCC=5V)
(*) The above data are measurement value of typical sample, they are not guaranteed.
LM358xxx: -40°C to +85°C
LM2904xxx: -40°C to 125°C
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LM358xxx
LM324xxx
LM2904xxx
Datasheet
LM2902xxx
Typical Performance Curves - continued
○LM358xxx, LM2904xxx
102
100
50
36V
30
Low Level Sink Current [mA]
Output Sink Current [mA]
40
5V
20
3V
10
0
-50
1
10
10
125°C
1010
85°C
25°C
100-1
-40°C
100-2
100-3
-25
0
25
50
75
100
125
150
0
0.5
Ambient Temperature [°C]
1.5
2
Output Voltage [V]
Figure 9. Output Sink Current vs Ambient
Temperature (VOUT=VCC)
Figure 10. Low Level Sink Current vs
Output Voltage (VCC=5V)
1010
80
Low Level Sink Current [µA]
Low Level Sink Current [mA]
1
125°C
25°C
85°C
100-1
-40°C
100-2
36V
60
5V
3V
40
20
0
0
0.25
0.5
0.75
-50
1
-25
Output Voltage [V]
0
25
50
75
100
125
150
Ambient Temperature [°C]
Figure 12. Low Level Sink Current vs Ambient
Temperature (VOUT=200mV)
Figure 11. Low Level Sink Current vs
Output Voltage (Enlarged view)
(VCC=5V)
(*) The above data are measurement value of typical sample, they are not guaranteed.
LM358xxx: -40°C to +85°C
LM2904xxx: -40°C to 125°C
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LM358xxx
LM324xxx
LM2904xxx
Datasheet
LM2902xxx
Typical Performance Curves - continued
4
4
3
3
2
2
Input Offset Voltage [mV]
Input Offset Voltage [mV]
○LM358xxx, LM2904xxx
1
85°C
125°C
0
-1
25°C
-40°C
-2
1
36V
0
-1
5V
3V
-2
-3
-3
-4
-4
0
10
20
30
-50
40
-25
0
25
50
75
100
125
150
Ambient Temperature [°C]
Supply Voltage [V]
Figure 13. Input Offset Voltage vs Supply
Voltage (VICM=VCC/2, EK=-VCC/2)
Figure 14. Input Offset Voltage vs Ambient
Temperature (VICM=VCC/2, EK=-VCC/2)
100
50
90
80
-40°C
Input Bias Current [nA]
Input Bias Current [nA]
40
30
25°C
20
85°C
70
60
50
40
3V
30
5V
20
10
125°C
36V
10
0
0
0
10
20
30
40
-50
-25
0
25
50
75
100
125
150
Ambient Temperature [°C]
Supply Voltage [V]
Figure 16. Input Bias Current vs Ambient
Temperature (VICM=VCC/2, EK=-VCC/2)
Figure 15. Input Bias Current vs Supply
Voltage (VICM=VCC/2, EK=-VCC/2)
(*) The above data are measurement value of typical sample, they are not guaranteed.
LM358xxx: -40°C to +85°C
LM2904xxx: -40°C to 125°C
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LM358xxx
LM324xxx
LM2904xxx
Datasheet
LM2902xxx
Typical Performance Curves - continued
○LM358xxx, LM2904xxx
100
4
90
3
2
Input Offset Voltage [mV]
Input Bias Current [nA]
80
70
60
50
40
30
1
0
-1
25°C
-40°C
-2
20
-3
10
0
-4
-50
-25
0
25
50
75
100
125
150
-1
1
2
3
4
Common-mode Input Voltage [V]
Figure 17. Input Bias Current vs Ambient
Temperature (VCC=30V, VICM=28V, EK=-1.4V)
Figure 18. Input Offset Voltage vs
Common-mode Input Voltage (VCC=5V)
10
10
8
8
6
6
4
0
Ambient Temperature [°C]
-40°C
85°C
Input Offset Current [nA]
Input Offset Current [nA]
125°C
85°C
125°C
2
0
-2
25°C
-4
4
2
5V
36V
0
3V
-2
-4
-6
-6
-8
-8
-10
5
-10
0
10
20
30
40
-50
-25
Supply Voltage [V]
0
25
50
75
100
125
150
Ambient Temperature [°C]
Figure 20. Input Offset Current vs Ambient
Temperature (VICM=VCC/2, EK=-VCC/2)
Figure 19. Input Offset Current vs Supply
Voltage (VICM=VCC/2, EK=-VCC/2)
(*) The above data are measurement value of typical sample, they are not guaranteed.
LM358xxx: -40°C to +85°C
LM2904xxx: -40°C to 125°C
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LM358xxx
LM324xxx
LM2904xxx
Datasheet
LM2902xxx
Typical Performance Curves - continued
0.6
0.6
0.5
0.5
Slew Rate Fall [V/us]
125°C
85°C
0.4
0.3
25°C
-40°C
0.2
85°C
0.3
25°C
0.1
0.0
0.0
10
20
30
0
40
10
20
30
40
Supply Voltage [V]
Supply Voltage [V]
Figure 21. Slew Rate Rise vs Supply Voltage
(RL=2kΩ, Low to High)
Figure 22. Slew Rate Fall vs Supply Voltage
(RL=2kΩ, High to Low)
100
80
80
240
Phase
60
Voltage Gain [dB]
Input Referred Noise Voltage [nV/√Hz]
-40°C
0.2
0.1
0
125°C
0.4
60
40
180
Gain
40
120
20
20
0
101
60
0
102
103
104
0
10
2
Frequency [Hz]
Figure 23. Input Referred Noise Voltage vs
Frequency (VCC=5V)
Phase [deg]
Slew Rate Rise [V/us]
○LM358xxx, LM2904xxx
10
3
4
5
10
10
10
Frequency [Hz]
6
10
7
10
8
Figure 24. Voltage Gain, Phase vs Frequency
(VCC=30V, RL=2kΩ, CL=100pF)
(*) The above data are measurement value of typical sample, they are not guaranteed.
LM358xxx: -40°C to +85°C
LM2904xxx: -40°C to 125°C
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LM358xxx
LM324xxx
LM2904xxx
Datasheet
LM2902xxx
Typical Performance Curves - continued
○LM358xxx, LM2904xxx
140
Large Signal Voltage Gain [dB]
Large Signal Voltage Gain [dB]
140
85°C
120
25°C
125°C
100
-40°C
80
36V
120
5V
100
3V
80
60
60
0
10
20
30
40
-50
-25
Supply Voltage [V]
25
50
75
100
125
150
Ambient Temperature [°C]
Figure 25. Large Signal Voltage Gain vs
Supply Voltage (RL=2kΩ)
Figure 26. Large Signal Voltage Gain vs
Ambient Temperature (RL=2kΩ)
120
Common-mode Rejection Ratio [dB]
120
Common-mode Rejection Ratio [dB]
0
100
-40°C
25°C
80
85°C
125°C
60
100
36V
80
5V
3V
60
40
40
0
10
20
30
-50
40
-25
0
25
50
75
100
125
150
Supply Voltage [V]
Ambient Temperature [°C]
Figure 27. Common-mode Rejection Ratio vs
Supply Voltage
Figure 28. Common-mode Rejection Ratio vs
Ambient Temperature
(*) The above data are measurement value of typical sample, they are not guaranteed.
LM358xxx: -40°C to +85°C
LM2904xxx: -40°C to 125°C
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LM358xxx
LM324xxx
LM2904xxx
LM2902xxx
Datasheet
Typical Performance Curves - continued
○LM358xxx, LM2904xxx
Power Supply Rejection Ratio [dB]
140
120
100
80
60
-50
-25
0
25
50
75
100
125
150
Ambient Temperature [°C]
Figure 29. Power Supply Rejection Ratio vs
Ambient Temperature
(*) The above data are measurement value of typical sample, they are not guaranteed.
LM358xxx: -40°C to +85°C
LM2904xxx: -40°C to 125°C
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LM358xxx
LM324xxx
LM2904xxx
Datasheet
LM2902xxx
Typical Performance Curves - continued
○LM324xxx, LM2902xxx
2.0
2.0
36V
25°C
1.6
1.6
Supply Current [mA]
Supply Current [mA]
85°C
1.2
-40°C
0.8
125°C
5V
1.2
3V
0.8
0.4
0.4
0.0
0.0
0
10
20
30
-50
40
-25
25
50
75
100 125 150
Ambient Temperature [°C]
Supply Voltage [V]
Figure 31. Supply Current vs Ambient
Temperature
Figure 30. 回路電流－電源電圧特性
5
Maximum Output Voltage High [V]
40
Maximum Output Voltage High [V]
0
125°C
30
85°C
25℃
20
-40°C
10
4
3
2
1
0
0
0
10
20
30
40
-50
-25
Supply Voltage [V]
0
25
50
75
100 125 150
Ambient Temperature [°C]
Figure 33. Maximum Output Voltage (High) vs
Ambient Temperature (VCC=5V, RL=10kΩ)
Figure 32. Maximum Output Voltage (High) vs
Supply Voltage (RL=10kΩ)
(*) The above data are measurement value of typical sample, they are not guaranteed.
LM324xxx: -40°C to +85°C
LM2902xxx: -40°C to 125°C
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LM358xxx
LM324xxx
LM2904xxx
Datasheet
LM2902xxx
Typical Performance Curves - continued
5
50
4
40
Output Source Current [mA]
Maximum Output Voltage High [V]
○LM324xxx, LM2902xxx
3
2
1
-40°C
25°C
30
20
85°C
125°C
10
0
0
-50
-25
0
25
50
75
100
125
150
0
1
Ambient Temperature [°C]
50
40
40
Output Sink Current [mA]
Output Source Current [mA]
4
5
Figure 35. Output Source Current vs Output
Voltage (VCC=5V)
50
30
5V
36V
3
Output Voltage [V]
Figure 34. Maximum Output Voltage (High) vs
Ambient Temperature (VCC=5V, RL=2kΩ)
3V
20
2
10
25°C
30
85°C
125°C
20
-40°C
10
0
0
-50
-25
0
25
50
75
100
125
150
0
1
Ambient Temperature [°C]
2
3
4
5
Output Voltage [V]
Figure 36. Output Source Current vs Ambient
Temperature (VOUT=0V)
Figure 37. Output Sink Current vs Output
Voltage (VCC=5V)
(*) The above data are measurement value of typical sample, they are not guaranteed.
LM324xxx: -40°C to +85°C
LM2902xxx: -40°C to 125°C
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LM358xxx
LM324xxx
LM2904xxx
Datasheet
LM2902xxx
Typical Performance Curves - continued
○LM324xxx, LM2902xxx
102
100
50
36V
30
Low Level Sink Current [mA]
Output Sink Current [mA]
40
5V
20
3V
10
0
-50
1
10
10
125°C
1010
85°C
25°C
100-1
-40°C
100-2
100-3
-25
0
25
50
75
100
125
150
0
0.5
Ambient Temperature [°C]
1.5
2
Output Voltage [V]
Figure 38. Output Sink Current vs Ambient
Temperature (VOUT=VCC)
Figure 39. Low Level Sink Current vs
Output Voltage (VCC=5V)
1010
80
Low Level Sink Current [µA]
Low Level Sink Current [mA]
1
125°C
25°C
85°C
10-1
0
-40°C
100-2
0
0.25
0.5
0.75
5V
3V
40
20
0
-50
1
36V
60
-25
Output Voltage [V]
0
25
50
75
100
125
150
Ambient Temperature [°C]
Figure 41. Low Level Sink Current vs Ambient
Temperature (VOUT=200mV)
Figure 40. Low Level Sink Current vs
Output Voltage (Enlarged view)
(VCC=5V)
(*) The above data are measurement value of typical sample, they are not guaranteed.
LM324xxx: -40°C to +85°C
LM2902xxx: -40°C to 125°C
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LM358xxx
LM324xxx
LM2904xxx
Datasheet
LM2902xxx
Typical Performance Curves - continued
4
4
3
3
2
2
Input Offset Voltage [mV]
Input Offset Voltage [mV]
○LM324xxx, LM2902xxx
1
85°C
125°C
0
-1
25°C
-40°C
-2
1
36V
0
-1
3V
5V
-2
-3
-3
-4
-4
0
10
20
30
-50
40
-25
0
25
50
75
100
125
Supply Voltage [V]
Ambient Temperature [°C]
Figure 42. Input Offset Voltage vs Supply
Voltage (VICM=VCC/2, EK=-VCC/2)
Figure 43. Input Offset Voltage vs Ambient
Temperature (VICM=VCC/2, EK=-VCC/2)
150
100
50
90
80
-40°C
Input Bias Current [nA]
Input Bias Current [nA]
40
30
25°C
20
85°C
70
60
50
40
3V
5V
30
20
10
125°C
36V
10
0
0
0
10
20
30
40
-50
-25
0
25
50
75
100
125
Supply Voltage [V]
Ambient Temperature [°C]
Figure 44. Input Bias Current vs Supply
Voltage (VICM=VCC/2, EK=-VCC/2)
Figure 45. Input Bias Current vs Ambient
Temperature (VICM=VCC/2, EK=-VCC/2)
150
(*) The above data are measurement value of typical sample, they are not guaranteed.
LM324xxx: -40°C to +85°C
LM2902xxx: -40°C to 125°C
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LM358xxx
LM324xxx
LM2904xxx
Datasheet
LM2902xxx
Typical Performance Curves - continued
○LM324xxx, LM2902xxx
100
4
90
3
2
Input Offset Voltage [mV]
Input Bias Current [nA]
80
70
60
50
40
30
1
125°C
85°C
0
-1
25°C
-40°C
-2
20
-3
10
0
-4
-50
-25
0
25
50
75
100
125
150
-1
0
Ambient Temperature [°C]
8
8
6
6
Input Offset Current [nA]
Input Offset Current [nA]
10
85°C
3
4
5
Figure 47. Input Offset Voltage vs
Common-mode Input Voltage (VCC=5V)
10
-40°C
2
Common-mode Input Voltage [V]
Figure 46. Input Bias Current vs Ambient
Temperature (VCC=30V, VICM=28V, EK=-1.4V)
4
1
125°C
2
0
-2
25°C
-4
4
2
36V
5V
0
3V
-2
-4
-6
-6
-8
-8
-10
-10
0
10
20
30
-50
40
-25
Supply Voltage [V]
0
25
50
75
100
125
150
Ambient Temperature [°C]
Figure 49. Input Offset Current vs Ambient
Temperature (VICM=VCC/2, EK=-VCC/2)
Figure 48. Input Offset Current vs Supply
Voltage (VICM=VCC/2, EK=-VCC/2)
(*) The above data are measurement value of typical sample, they are not guaranteed.
LM324xxx: -40°C to +85°C
LM2902xxx: -40°C to 125°C
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LM358xxx
LM324xxx
LM2904xxx
Datasheet
LM2902xxx
Typical Performance Curves - continued
0.6
0.6
0.5
0.5
Slew Rate Fall [V/us]
125°C
85°C
0.4
0.3
25°C
-40°C
0.2
0.4
125°C
0.3
25°C
-40°C
0.2
0.1
0.1
0.0
0.0
0
10
20
30
0
40
10
20
30
40
Supply Voltage [V]
Supply Voltage [V]
Figure 50. Slew Rate Rise vs Supply Voltage
(RL=2kΩ, Low to High)
Figure 51. Slew Rate Fall vs Supply Voltage
(RL=2kΩ, High to Low)
100
80
80
240
Phase
60
Voltage Gain [dB]
Input Referred Noise Voltage [nV/√Hz]
85°C
60
40
180
Gain
40
120
20
20
0
60
0
101
102
103
104
0
10
2
Frequency [Hz]
Figure 52. Input Referred Noise Voltage vs
Frequency (VCC=5V)
Phase [deg]
Slew Rate Rise [V/us]
○LM324xxx, LM2902xxx
10
3
4
5
10
10
10
Frequency [Hz]
6
10
7
10
8
Figure 53. Voltage Gain, Phase vs Frequency
(VCC=30V, RL=2kΩ, CL=100pF)
(*) The above data are measurement value of typical sample, they are not guaranteed.
LM324xxx: -40°C to +85°C
LM2902xxx: -40°C to 125°C
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LM358xxx
LM324xxx
LM2904xxx
Datasheet
LM2902xxx
Typical Performance Curves - continued
○LM324xxx, LM2902xxx
140
Large Signal Voltage Gain [dB]
Large Signal Voltage Gain [dB]
140
85°C
120
25°C
125°C
100
-40°C
80
36V
120
5V
100
3V
80
60
60
0
10
20
30
40
-50
-25
Supply Voltage [V]
25
50
75
100
125
150
Ambient Temperature [°C]
Figure 54. Large Signal Voltage Gain vs
Supply Voltage (RL=2kΩ)
Figure 55. Large Signal Voltage Gain vs
Ambient Temperature (RL=2kΩ)
120
Common-mode Rejection Ratio [dB]
120
Common-mode Rejection Ratio [dB]
0
100
-40°C
25°C
80
85°C
125°C
60
100
36V
80
5V
3V
60
40
40
0
10
20
30
-50
40
-25
0
25
50
75
100
125
150
Ambient Temperature [°C]
Supply Voltage [V]
Figure 57. Common-mode Rejection Ratio vs
Ambient Temperature
Figure 56. Common-mode Rejection Ratio vs
Supply Voltage
(*) The above data are measurement value of typical sample, they are not guaranteed.
LM324xxx: -40°C to +85°C
LM2902xxx: -40°C to 125°C
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LM358xxx
LM324xxx
LM2904xxx
LM2902xxx
Datasheet
Typical Performance Curves - continued
○LM324xxx, LM2902xxx
Power Supply Rejection Ratio [dB]
140
120
100
80
60
-50
-25
0
25
50
75
100
125
150
Ambient Temperature [°C]
Figure 58. Power Supply Rejection Ratio vs
Ambient Temperature
(*) The above data are measurement value of typical sample, they are not guaranteed.
LM324xxx: -40°C to +85°C
LM2902xxx: -40°C to 125°C
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LM358xxx
LM324xxx
LM2904xxx
Datasheet
LM2902xxx
Application Information
NULL method condition for Test Circuit 1
VCC, VEE, EK, VICM Unit: V
Parameter
VF
SW1
SW2
SW3
VCC
VEE
EK
VICM
Calculation
Input Offset Voltage
VF1
ON
ON
OFF
5 to 30
0
-1.4
0
1
Input Offset Current
VF2
OFF
OFF
OFF
5
0
-1.4
0
2
VF3
OFF
ON
OFF
5
0
-1.4
0
3
VF4
ON
OFF
ON
ON
ON
15
0
0
4
Input Bias Current
VF5
-1.4
Large Signal Voltage Gain
VF6
Common-mode Rejection Ratio
(Input Common-mode Voltage Range)
-11.4
VF7
0
ON
ON
OFF
5
0
-1.4
VF8
5
3.5
VF9
5
Power Supply Rejection Ratio
ON
ON
OFF
0
VF10
-1.4
0
6
30
- Calculation 1. Input Offset Voltage (VIO)
VIO =
|VF1|
1 + RF/RS
[V]
2. Input Offset Current (IIO)
IIO =
|VF2 - VF1|
RI x (1 + RF/RS)
3. Input Bias Current (IB)
IB =
|VF4 - VF3|
2 x RI x (1 + RF/RS)
4. Large Signal Voltage Gain (AV)
Av = 20Log
5. Common-mode Rejection Ratio (CMRR)
[A]
EK × (1+RF/RS)
|VF6 - VF5|
CMRR = 20Log
6. Power Supply Rejection Ratio (PSRR)
[A]
PSRR = 20Log
[dB]
VICM × (1+RF/RS)
|VF8 - VF7|
VCC × (1+ RF/RS)
|VF10 - VF9|
[dB]
[dB]
0.1μF
RF=50kΩ
SW1
RS=50Ω
500kΩ
VCC
15V
EK
RI=10kΩ
0.1μF
VOUT
500kΩ
DUT
SW3
RS=50Ω
1000pF
RI=10kΩ
NULL
RL
VICM
50kΩ
V VF
SW2
-15V
VEE
Figure 59. Test Circuit 1 (One Channel Only)
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LM358xxx
LM324xxx
LM2904xxx
Datasheet
LM2902xxx
Application Information – continued
Switch Condition for Test Circuit 2
Parameter
SW1
SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12 SW13
Supply Current
OFF
OFF OFF
ON
OFF
ON
OFF OFF OFF OFF OFF OFF OFF
Maximum Output Voltage(High)
OFF
OFF
ON
OFF OFF
ON
OFF OFF
OFF OFF
ON
OFF
Maximum Output Voltage(Low)
OFF
OFF
ON
OFF OFF
ON
OFF OFF OFF OFF OFF
ON
OFF
Output Source Current
OFF
OFF
ON
OFF OFF
ON
OFF OFF OFF OFF OFF OFF
ON
Output Sink Current
OFF
OFF
ON
OFF OFF
ON
OFF OFF OFF OFF OFF OFF
ON
Slew Rate
OFF
OFF OFF
ON
ON
ON
OFF OFF OFF
Gain Bandwidth Product
OFF
ON
OFF OFF
ON
ON
OFF OFF
ON
ON
OFF OFF OFF
Input Referred Noise Voltage
ON
OFF OFF OFF
ON
ON
OFF OFF OFF OFF
ON
OFF OFF OFF
ON
ON
OFF OFF
SW4
R2
SW5
●
VCC
－
SW1
SW2
SW3
＋
SW6
RS
SW7
SW9
SW8
SW10
SW11
SW12
SW13
R1
VEE
C
RL
V-IN
CL
V+IN
VOUT
Figure 60. Test Circuit 2 (Each Op-Amp)
Output Voltage
Input Voltage
SR=V/t
VH
VH
90%
V
10%
VL
VL
t
t
t
Input Wave
Output Wave
Figure 61. Slew Rate Input and Output Wave
VCC
VCC
R1//R2
R1// R2
VEE
VEE
R1
VIN
R2
V
VOUT1
= 1VRMS
R1
CS = 20 × log
R2
V
VOUT2
100 × VOUT1
VOUT2
Figure 62. Test Circuit 3 (Channel Separation)
(R1=1kΩ,R2=100kΩ)
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Application Information – continued
1.
Unused Circuits
It is recommended to apply the connection (see Figure 63) and set the
non-inverting input pin at a potential within the Input Common-mode
Voltage Range (VICM) for any unused circuit.
Keep this potential
2.
Input Voltage
Regardless of the supply voltage, applying VEE+36V to the input pin is
possible without causing deterioration of the electrical characteristics or
destruction. However, this does not ensure normal circuit operation.
Please note that the circuit operates normally only when the input
voltage is within the common mode input voltage range of the electric
characteristics.
in VICM
VCC
VICM
VEE
Figure 63. The Example of Application
Circuit for Unused Op-amp
3.
Power Supply (Single/Dual)
The operational amplifiers operate when the voltage supplied is between VCC pin and VEE pin. Therefore, the single
supply operational amplifiers can be used as dual supply operational amplifiers as well.
4.
IC Handling
When pressure is applied to the IC through warp on the printed circuit board, the characteristics may fluctuate due to
the piezo effect. Be careful with the warp on the printed circuit board.
5.
The IC Destruction Caused by Capacitive Load
The IC may be damaged when VCC pin and VEE pin is shorted with the charged output pin capacitor. When IC is used
as an operational amplifier or as an application circuit where oscillation is not activated by an output capacitor, output
capacitor must be kept below 0.1µF in order to prevent the damage mentioned above.
I/O Equivalent Circuit
Symbol
Pin No.
+IN
-IN
LM358xxx, LM2904xxx: 2,3,5,6
LM324xxx, LM2902xxx:
2,3,5,6,9,10,12,13
Equivalent Circuit
VCC
OUT
LM358xxx, LM2904xxx: 1,7
LM324xxx, LM2902xxx: 1,7,8,14
OUT
VEE
VCC
VCC
LM358xxx, LM2904xxx: 8
LM324xxx, LM2902xxx: 4
VEE
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Examples of Circuit
○Voltage Follower
Voltage gain is 0dB.
VCC
Using this circuit, the output voltage (VOUT) is configured
to be equal to the input voltage (VIN). This circuit also
stabilizes the output voltage (VOUT) due to high input
impedance and low output impedance. Computation for
output voltage (VOUT) is shown below.
VOUT
VIN
VOUT=VIN
VEE
Figure 64. Voltage Follower Circuit
○Inverting Amplifier
R2
For inverting amplifier, input voltage (VIN) is amplified by
a voltage gain and depends on the ratio of R1 and R2.
The out-of-phase output voltage is shown in the next
expression
VCC
R1
VIN
VOUT
VOUT=-(R2/R1)・VIN
This circuit has input impedance equal to R1.
R1//R2
VEE
Figure 65. Inverting Amplifier Circuit
○Non-inverting Amplifier
R1
R2
For non-inverting amplifier, input voltage (VIN) is
amplified by a voltage gain, which depends on the ratio
of R1 and R2. The output voltage (VOUT) is in-phase with
the input voltage (VIN) and is shown in the next
expression.
VCC
VOUT
VIN
VOUT=(1 + R2/R1)・VIN
Effectively, this circuit has high input impedance since its
input side is the same as that of the operational amplifier.
VEE
Figure 66. Non-inverting Amplifier Circuit
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Power Dissipation
Power dissipation (total loss) indicates the power that the IC can consume at TA=25°C (normal temperature). As the IC
consumes power, it heats up, causing its temperature to rise above the ambient temperature. The allowable temperature that
the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and consumable power.
Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the thermal
resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the
maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold
resin or lead frame of the package. Thermal resistance, represented by the symbol θJA°C/W, indicates this heat dissipation
capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance.
Figure 67(a) shows the model of the thermal resistance of a package. The equation below shows how to compute for the
Thermal resistance (θJA), given the ambient temperature (TA), maximum junction temperature (Tjmax), and power dissipation
(PD).
θJA = (Tjmax－TA) / PD
°C/W
The Derating Curve in Figure 67(b) indicates the power that the IC can consume with reference to ambient temperature.
Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal resistance
(θJA), which depends on the chip size, power consumption, package, ambient temperature, package condition, wind velocity,
etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a reference value
measured at a specified condition. Figures 67(c) to (f) show the examples of derating curves for LM358xxx, LM2904xxx,
LM324xxx, and LM2902xxx respectively.
Power Dissipation of LSI [W]
PDmax
Power dissipation of IC
θJA=(Tjmax-TA)/ PD °C/W
Ambient Temperature, TA [ °C ]
P2
θJA2 < θJA1
θJA2
P1
Tjmax
θJA1
0
Chip Surface Temperature, TJ [ °C ]
25
50
100
125
150
(b) Derating Curve
(a) Thermal Resistance
1.0
1.0
0.8
0.8
LM358F (Note 20)
Power Dissipation [W]
Power Dissipation [W]
75
Ambient Temperature, TA [ °C ]
LM358FJ (Note 21)
0.6
LM358FVT (Note 22)
LM358FV (Note 22)
0.4
LM358FVJ (Note 23)
LM358FVM (Note 23)
0.2
LM2904FVT (Note 22)
LM2904FV (Note 22)
0.6
LM2904F (Note 20)
LM2904FJ (Note 21)
0.4
LM2904FVJ(Note 23)
LM2904FVM (Note 23)
0.2
0.0
0
25
50
75 85 100
125
Ambient Temperature [°C]
0.0
150
(c) LM358xxx
25
50
75
100
125
Ambient Temperature [°C]
150
(d) LM2904xxx
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1.5
1.5
1.2
1.2
LM2902FJ (Note 25)
Power Dissipation [W]
Power Dissipation [W]
LM324FJ (Note 25)
0.9
LM324FV (Note 26)
LM324FVJ (Note 27)
0.6
LM324F (Note 24)
0.3
25
LM2902FV (Note 26)
LM2902FVJ (Note 27)
0.6
LM2902F (Note 24)
0.3
0.0
0
0.9
0.0
85
50
75
100
125
Ambient Temperature [°C]
(e) LM324xxx
150
0
25
50
75
100
125
Ambient Temperature [°C]
(f) LM2902xxx
150
Note 20
Note 21
Note 22
Note 23
Note 24
Note 25
Note 26
Note 27
Unit
5.5
5.4
5.0
4.7
4.5
8.2
7.0
6.8
mW/°C
When using the unit above TA=25°C, subtract the value above per Celsius degree.
Power dissipation is the value when FR4 glass epoxy board 70mm×70mm×1.6mm (copper foil area below 3%) is mounted.
Figure 67. Thermal Resistance and Derating Curve
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the PD stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,
increase the board size and copper area to prevent exceeding the P D rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
In-rush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
10.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
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Operational Notes – continued
11.
Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
Figure 68. Example of monolithic IC structure
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Physical Dimensions, Tape and Reel Information
Package Name
SOP8
(Max 5.35 (include.BURR))
(UNIT : mm)
PKG : SOP8
Drawing No. : EX112-5001-1
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Package Name
SOP-J8
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Package Name
SSOP-B8
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Package Name
TSSOP-B8
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Package Name
TSSOP-B8J
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Package Name
MSOP8
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Datasheet
Physical Dimensions, Tape and Reel Information – continued
Package Name
SOP14
(UNIT : mm)
PKG : SOP14
Drawing No. : EX113-5001
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Package Name
SOP-J14
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Package Name
SSOP-B14
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Package Name
TSSOP-B14J
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Ordering Information
L
M
x
x
x
Part Number
LM358F
LM358FJ
LM358FV
LM358FVT
LM358FVJ
LM358FVM
LM324F
LM324FJ
LM324FV
LM324FVJ
LM2904F
LM2904FJ
LM2904FV
LM2904FVT
LM2904FVJ
LM2904FVM
LM2902F
LM2902FJ
LM2902FV
LM2902FVJ
x
x
x
-
x
Package
F
: SOP8
: SOP14
FJ
: SOP-J8
: SOP-J14
FV
: SSOP-B8
: SSOP-B14
FVT
: TSSOP-B8
FVJ
: TSSOP-B8J
: TSSOP-B14J
FVM
: MSOP8
x
Packaging and forming specification
E2: Embossed tape and reel
(SOP8/SOP-J8/SSOP-B8/
TSSOP-B8/ SOP14/SOP-J14/
SSOP-B14/TSSOP-B14J)
TR: Embossed tape and reel
(MSOP8)
Line-up
Operating Temperature Range
Channel
2ch
-40°C to +85°C
4ch
2ch
-40°C to +125°C
4ch
Package
Reel of 2500
LM358F-E2
SOP-J8
Reel of 2500
LM358FJ-E2
SSOP-B8
Reel of 2500
LM358FV-E2
TSSOP-B8
Reel of 3000
LM358FVT-E2
TSSOP-B8J
Reel of 2500
LM358FVJ-E2
MSOP8
Reel of 3000
LM358FVM-TR
SOP14
Reel of 2500
LM324F-E2
SOP-J14
Reel of 2500
LM324FJ-E2
SSOP-B14
Reel of 2500
LM324FV-E2
TSSOP-B14J
Reel of 2500
LM324FVJ-E2
SOP8
Reel of 2500
LM2904F-E2
SOP-J8
Reel of 2500
LM2904FJ-E2
SSOP-B8
Reel of 2500
LM2904FV-E2
TSSOP-B8
Reel of 3000
LM2904FVT-E2
TSSOP-B8J
Reel of 2500
LM2904FVJ-E2
MSOP8
Reel of 3000
LM2904FVM-TR
SOP14
Reel of 2500
LM2902F-E2
SOP-J14
Reel of 2500
LM2902FJ-E2
SSOP-B14
Reel of 2500
LM2902FV-E2
TSSOP-B14J
Reel of 2500
LM2902FVJ-E2
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Marking Diagram
SOP8(TOP VIEW)
SOP-J8(TOP VIEW)
TSSOP-B8(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
SSOP-B8(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
SOP14(TOP VIEW)
1PIN MARK
TSSOP-B8J(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
SOP-J14(TOP VIEW)
Part Number Marking
1PIN MARK
MSOP8(TOP VIEW)
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
SSOP-B14(TOP VIEW)
Part Number Marking
TSSOP-B14J (TOP VIEW)
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
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Marking Diagram – continued
Product Name
Package Type
Marking
F
SOP8
FJ
SOP-J8
FV
SSOP-B8
FVT
TSSOP-B8
FVJ
TSSOP-B8J
FVM
MSOP8
F
SOP14
LM324F
FJ
SOP-J14
LM324FJ
FV
SSOP-B14
FVJ
TSSOP-B14J
F
SOP8
FJ
SOP-J8
FV
SSOP-B8
FVT
TSSOP-B8
FVJ
TSSOP-B8J
FVM
MSOP8
F
SOP14
LM2902F
FJ
SOP-J14
LM2902FJ
FV
SSOP-B14
FVJ
TSSOP-B14J
LM358
358L
LM324
324L
2904L
04L
LM2904
2904L
LM2902
2902L
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Revision History
Date
Revision
Changes
10.Jul.2015
001
New Release
09.Oct.2015
002
LM358FJ, LM358FV, LM358FVT, and LM324F are added
10.Feb.2016
003
LM2904xxx (F, FJ, FV, FVT, FVM, FVJ), and LM358xxx (FVM, FVJ) are added
06.Jun.2016
004
LM324xxx (FJ, FV, FVJ), and LM2902xxx (F, FJ, FV, FVJ) are added
01.Aug.2016
005
Correction of erroneous description (P.4
Delete Land Pattern Data(P.44)
11.Dec.2020
006
P.44-2, 44-3, Updated packages and part numbers.
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Ordering Information
L
M
Part Number
LM324
3
2
4
F
Package
F: SOP14K
-
G
Z
G: Halogen free
Package
E
2
Packaging and forming specification
E2: Embossed tape and reel
Production site
Z: Added
Marking Diagram
SOP14K (TOP VIEW)
LM324F
Part Number
Marking
LOT
Number
Pin 1 Mark
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Package Name
SOP14K
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Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
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