Datasheet
Comparators
Ground Sense Comparators
LM393xxx
LM339xxx
LM2903xxx
LM2901xxx
General Description
Key Specifications
Operating Supply Voltage Range
Single Supply
Dual Supply
Operating Temperature Range:
LM393xxx:
LM339xxx:
LM2903xxx:
LM2901xxx:
Input Offset Voltage
LM393xxx and LM2903xxx series are two-channel
ground sense comparator. LM339xxx and LM2901xxx
series are quad. These have features of wide operating
voltage that ranges from 3V to 32V with low supply
current. These products are suitable for various
applications.
Features
Wide Operating Supply Voltage
Ground-sensed Input and Output
Open Collector Output
Wide Operating Temperature
Low Offset Voltage
Packages
General Purpose
Current Monitor
Battery Monitor
Multivibrators
-40°C to +85°C
-40°C to +85°C
-40°C to +125°C
-40°C to +125°C
4.5mV (Max)
W(Typ) x D(Typ) x H(Max)
SOP8
SOP-J8
SSOP-B8
TSSOP-B8
TSSOP-B8J
MSOP8
SOP14
SOP-J14
SSOP-B14
TSSOP-B14J
Application
+3.0V to +32.0V
±1.5V to ±16.0V
5.00mm x 6.20mm x 1.71mm
4.90mm x 6.00mm x 1.65mm
3.00mm x 6.40mm x 1.35mm
3.00mm x 6.40mm x 1.20mm
3.00mm x 4.90mm x 1.10mm
2.90mm x 4.00mm x 0.90mm
8.70mm x 6.20mm x 1.71mm
8.65mm x 6.00mm x 1.65mm
5.00mm x 6.40mm x 1.35mm
5.00mm x 6.40mm x 1.20mm
Pin Configuration
LM393F, LM2903F
LM393FJ, LM2903FJ
LM393FV, LM2903FV
LM393FVT, LM2903FVT
LM393FVJ, LM2903FVJ
LM393FVM, LM2903FVM
: SOP8
: SOP-J8
: SSOP-B8
: TSSOP-B8
: TSSOP-B8J
: MSOP8
OUT1 1
-IN1 2
+IN1
CH1
- +
3
CH22
8
VCC
7
OUT2
6
-IN2
5
+IN2
+ -
VEE
4
○Product structure：Silicon monolithic integrated circuit
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TSZ22111 • 14 • 001
Pin No.
Pin Name
1
OUT1
2
-IN1
3
+IN1
4
VEE
5
+IN2
6
-IN2
7
OUT2
8
VCC
○This product has no designed protection against radioactive rays.
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LM393xxx
LM339xxx
LM339F, LM2901F
LM339FJ, LM2901FJ
LM339FV, LM2901FV
LM339FVJ, LM2901FVJ
OUT2
LM2903xxx
: SOP14
: SOP-J14
: SSOP-B14
: TSSOP-B14J
1
2
13
OUT4
VCC
3
12
VEE
+IN1
5
-IN2
6
CH1
－ ＋
CH4
－ ＋
CH2
－ ＋
+IN2
CH3
Pin No.
Pin Name
1
OUT2
2
OUT1
3
VCC
4
-IN1
5
+IN1
6
-IN2
7
+IN2
OUT3
14
OUT1
-IN1 4
Datasheet
LM2901xxx
11
+IN4
10
-IN4
9
+IN3
8
-IN3
－ ＋
7
8
-IN3
9
+IN3
10
-IN4
11
+IN4
12
VEE
13
OUT4
14
OUT3
Absolute Maximum Ratings (TA=25°C)
Symbol
Parameter
Supply Voltage
Rating
LM339xxx LM2903xxx
+36
-
0.68
(Note 1,9)
-
0.67
(Note 2,9)
-
0.62
(Note 3,9)
-
VCC-VEE
Power Dissipation
PD
0.68
SOP-J8
0.67
(Note 2,9)
0.62
(Note 3,9)
TSSOP-B8
0.62
(Note 3,9)
-
0.62
(Note 3,9)
TSSOP-B8J
0.58
(Note 4,9)
-
0.58
(Note 4,9)
-
0.58
(Note 4,9)
0.58
(Note 4,9)
-
MSOP8
Common-mode Input Voltage range
(Note 11)
Input Current
Operating Supply Voltage
-
-
SOP14
-
0.56
(Note 5,9)
-
0.56
(Note 5,9)
SOP-J14
-
1.02
(Note 6,9)
-
1.02
(Note 6,9)
SSOP-B14
-
0.87
(Note 7,9)
-
0.87
(Note 7,9)
0.85
(Note 8,9)
-
0.85
(Note 8,9)
-
W
VID
+36
V
VICM
(VEE-0.3) to (VEE+36)
-10
V
mA
II
Vopr
-
Unit
V
SOP8
TSSOP-B14J
(Note 10)
LM2901xxx
(Note 1,9)
SSOP-B8
Differential Input Voltage
LM393xxx
Single Supply
+3.0 to +32.0
Dual Supply
±1.5 to ±16.0
V
Operating Temperature Range
Topr
Storage Temperature Range
Tstg
-55 to +150
°C
Maximum Junction Temperature
Tjmax
+150
°C
-40 to +85
-40 to +125
°C
(Note 1)
(Note 2)
(Note 3)
(Note 4)
(Note 5)
(Note 6)
(Note 7)
(Note 8)
(Note 9)
(Note 10)
(Note 11)
Reduce 5.5mW per 1°C above 25°C.
Reduce 5.4mW per 1°C above 25°C.
Reduce 5.0mW per 1°C above 25°C.
Reduce 4.7mW per 1°C above 25°C.
Reduce 4.5mW per 1°C above 25°C.
Reduce 8.2mW per 1°C above 25°C.
Reduce 7.0mW per 1°C above 25°C.
Reduce 6.8mW per 1°C above 25°C.
Mounted on an FR4 glass epoxy PCB 70mm×70mm×1.6mm (Copper foil area less than 3%).
Differential Input Voltage is the voltage difference between the inverting and non-inverting inputs. The input pin voltage is set to more than VEE.
An excessive input current will flow when input voltages of less than VEE-0.6V are applied.
The input current can be set to less than the rated current by adding a limiting resistor.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
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LM393xxx
LM339xxx
LM2903xxx
Datasheet
LM2901xxx
Electrical Characteristics
○LM393xxx, LM2903xxx (Unless otherwise specified VCC=+5V, VEE=0V, TA=25°C)
Limit
Temperature
Parameter
Symbol
Range
Min
Typ
Max
Input Offset Voltage
Input Offset Current
(Note 12,13)
(Note 12,13)
(Note 12,13)
Input Bias Current
Input Common-mode Voltage
Range
Large Signal Voltage Gain
Supply Current
(Note 13)
Output Sink Current
25°C
-
Full range
-
-
5
25°C
-
5
50
Full range
-
-
200
25°C
-
50
250
Full range
-
-
500
VICM
25°C
0
-
VCC-1.5
31
1000
-
AV
25°C
90
120
-
VIO
IIO
IB
ICC
(Note 14)
ISINK
(Note 13)
Output Saturation Voltage
(Low Level Output Voltage)
VOL
(Note 13)
Output Leakage Current
(High Level Output Current)
Response Time
4.5
mV
VOUT=1.4V
V
0.6
1
-
-
1.5
25°C
8
16
-
25°C
-
80
200
Full range
-
-
400
25°C
-
0.1
-
nA
Full range
-
-
1
μA
-
1
-
mV
μs
-
-
V/mV VCC=15V,
VOUT=1.4 to 11.4V,
dB
RL=15kΩ, VRL=15V
VOUT=Open
mA
VOUT=Open, VCC=32V
V+IN=0V, V-IN=1V,
mA
VOUT=1.5V
-
0.4
VCC=5 to 32V, VOUT=1.4V
nA
25°C
25°C
VOUT=1.4V
VOUT=1.4V
ILEAK
tRE
Condition
nA
Full range
(Note 12)
(Note 13)
(Note 14)
1
Unit
V+IN=0V, V-IN= 1V
ISINK=4mA
V+IN=1V, V-IN=0V,
VOUT=5V
V+IN=1V, V-IN=0V,
VOUT=32V
RL=5.1kΩ, VRL=5V,
VIN=100mVP-P,
Overdrive=5mV
RL=5.1kΩ, VRL=5V,
VIN=TTL,
Logic Swing, VREF=1.4V
Absolute value
LM393xxx Full range: TA=-40°C to +85°C, LM2903xxx Full range: TA=-40°C to +125°C.
Consider the power dissipation of the IC under high temperature when selecting the output current value.
There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC.
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LM393xxx
LM339xxx
LM2903xxx
Datasheet
LM2901xxx
Electrical Characteristics - continued
○LM339xxx, LM2901xxx (Unless otherwise specified VCC=+5V, VEE=0V, TA=25°C)
Limit
Temperature
Parameter
Symbol
Range
Min
Typ
Max
Input Offset Voltage
(Note 15,16)
Input Offset Current
(Note 15,16)
(Note 15,16)
Input Bias Current
Input Common-mode Voltage
Range
Large Signal Voltage Gain
Supply Current
(Note 16)
Output Sink Current
VIO
Response Time
4.5
-
5
-
5
50
-
-
200
25°C
-
50
250
Full range
-
-
500
VICM
25°C
0
-
VCC-1.5
31
1000
-
AV
25°C
90
120
-
25°C
-
1.2
2
Full range
-
-
2.5
25°C
8
16
-
IB
ISINK
VOL
(Note 16)
Output Leakage Current
(High Level Output Current)
1
-
25°C
(Note 16)
Output Saturation Voltage
(Low Level Output Voltage)
-
Full range
IIO
ICC
(Note 17)
25°C
Full range
mV
VOUT=1.4V
V
80
200
-
-
400
25°C
-
0.1
-
nA
Full range
-
-
1
μA
-
1
-
mV
μs
-
-
V/mV VCC=15V,
VOUT=1.4 to 11.4V,
dB
RL=15kΩ, VRL=15V
VOUT=Open
mA
VOUT=Open, VCC=32V
V+IN=0V, V-IN=1V,
mA
VOUT=1.5V
-
0.4
VCC=5 to 32V, VOUT=1.4V
nA
25°C
25°C
VOUT=1.4V
VOUT=1.4V
ILEAK
tRE
Condition
nA
Full range
(Note 15)
(Note 16)
(Note 17)
Unit
V+IN=0V, V-IN= 1V
ISINK=4mA
V+IN=1V, V-IN=0V,
VOUT=5V
V+IN=1V, V-IN=0V,
VOUT=32V
RL=5.1kΩ, VRL=5V,
VIN=100mVP-P,
Overdrive=5mV
RL=5.1kΩ, VRL=5V,
VIN=TTL,
Logic Swing, VREF=1.4V
Absolute value
LM339xxx Full range: TA=-40°C to +85°C, LM2901xxx Full range: TA=-40°C to +125°C.
Consider the power dissipation of the IC under high temperature when selecting the output current value.
There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC.
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LM393xxx
LM339xxx
LM2903xxx
Datasheet
LM2901xxx
Description of Electrical Characteristics
The relevant electrical terms used in this datasheet are described below. Items and symbols used are also shown. Note
that item names, symbols, and their meanings may differ from those of another manufacturer’s document or general
document.
1. Absolute Maximum Ratings
Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of the
absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of
electrical characteristics.
(1) Supply Voltage (VCC/VEE)
Indicates the maximum voltage that can be applied between the VCC pin and VEE pin without deterioration of
characteristics of internal circuit.
(2) Differential Input Voltage (VID)
Indicates the maximum voltage that can be applied between the non-inverting and inverting pins without damaging
the IC.
(3) Input Common-mode Voltage Range (VICM)
Indicates the maximum voltage that can be applied to the non-inverting and inverting pins without deterioration or
destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure
normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics.
(4) Power Dissipation (PD)
Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25°C
(normal temperature). As for package product, PD is determined by the temperature that can be permitted by the IC in
the package (maximum junction temperature) and the thermal resistance of the package.
2. Electrical Characteristics
(1) Input Offset Voltage (VIO)
Indicates the voltage difference between non-inverting pin and inverting pin. It can be translated to the input voltage
difference required for setting the output voltage to 0V.
(2) Input Offset Current (IIO)
Indicates the difference of input bias current between the non-inverting and inverting pins.
(3) Input Bias Current (IB)
Indicates the current that flows into or out of the input pin. It is defined by the average of input bias currents at the
non-inverting and inverting pins.
(4) Input Common-mode Voltage Range (VICM)
Indicates the input voltage range at which IC normally operates.
(5) Large Signal Voltage Gain (AV)
Indicates the amplification rate (gain) of output voltage against the voltage difference between non-inverting pin and
inverting pin. It is normally the amplification rate (gain) with reference to DC voltage.
Av = (Output Voltage) / (Differential Input Voltage)
(6) Supply Current (ICC)
Indicates the current that flows within the IC under specified no-load conditions.
(7) Output Sink Current (ISINK)
The maximum current that the IC can output under specific output conditions
(8) Output Saturation Voltage, Low Level Output Voltage (VOL)
Signifies the voltage range that can be output under specific output conditions.
(9) Output Leakage Current, High Level Output Current (ILEAK)
Indicates the current that flows into the IC under specific input and output conditions.
(10) Response Time (tRE)
Response time indicates the delay time between the input and output signal which is determined by the time
difference from the fifty percent of input signal swing to the fifty percent of output signal swing.
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LM393xxx
LM339xxx
LM2903xxx
Datasheet
LM2901xxx
Typical Performance Curves
○LM393xxx, LM2903xxx
1.6
1.6
1.4
1.4
Supply Current [mA]
Supply Current [mA]
1.2
-40°C
25°C
1.0
0.8
85°C
0.6
1.2
36V
1.0
5V
0.8
0.6
3V
0.4
0.4
125°C
0.2
0.2
0.0
0.0
0
10
20
30
-50
40
-25
Supply Voltage [V]
125
150
Figure 2. Supply Current vs Ambient Temperature
Figure 1. Supply Current vs Supply Voltage
200
200
125°C
Output Saturation Voltage [mV]
Output Saturation Voltage [mV]
0
25
50
75 100
Ambient Temperature [°C]
150
85°C
25°C
100
-40°C
50
0
150
3V
5V
100
36V
50
0
0
10
20
30
Supply Voltage [V]
40
-50
Figure 3. Output Saturation Voltage vs
Supply Voltage (ISINK=4mA)
-25
0
25
50
75 100
Ambient Temperature [°C]
125
150
Figure 4. Output Saturation Voltage vs
Ambient Temperature (ISINK=4mA)
(*) The above data are measurement values of a typical sample, it is not guaranteed.
LM393xxx: -40°C to +85°C
LM2903xxx: -40°C to +125°C
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LM393xxx
LM339xxx
LM2903xxx
Datasheet
LM2901xxx
Typical Performance Curves - continued
○LM393xxx, LM2903xxx
2
80
Output Sink Current [mA]
1.5
Output Voltage [V]
85°C
-40°C
1
25°C
125°C
0.5
60
36V
40
5V
20
3V
0
0
0
4
8
12
16
Output Sink Current [mA]
20
-50
4
4
3
3
2
2
1
25℃
85℃
125℃
0
-40℃
-1
0
25
50
75 100
Ambient Temperature [°C]
125
150
Figure 6. Output Sink Current vs Ambient
Temperature (VOUT=VCC)
Input Offset Voltage [mV]
Input Offset Voltage [mV]
Figure 5. Output Voltage vs Output Sink Current
(VCC=5V)
-25
-2
1
36V
3V
0
-1
5V
-2
-3
-3
-4
-4
0
10
20
30
-50
40
Supply Voltage [V]
Figure 7. Input Offset Voltage vs Supply Voltage
-25
0
25
50
75 100
Ambient Temperature [°C]
125
150
Figure 8. Input Offset Voltage vs Ambient
Temperature
(*) The above data are measurement values of a typical sample, it is not guaranteed.
LM393xxx: -40°C to +85°C
LM2903xxx: -40°C to +125°C
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LM393xxx
LM339xxx
LM2903xxx
Datasheet
LM2901xxx
Typical Performance Curves - continued
160
160
140
140
120
Input Bias Current [nA]
Input Bias Current [nA]
○LM393xxx, LM2903xxx
-40℃
100
25℃
80
85℃
60
40
120
3V
100
80
60
40
125℃
20
20
0
0
0
10
20
30
40
-50
-25
Supply Voltage [V]
50
40
40
30
30
Input Offset Current [nA]
50
20
10
85℃
-40℃ 125℃
0
25℃
-10
0
25
50
75 100
Ambient Temperature [°C]
125
150
Figure 10. Input Bias Current vs Ambient
Temperature
Figure 9. Input Bias Current vs Supply Voltage
Input Offset Current [nA]
36V
5V
-20
20
10
5V
0
3V
-10
-20
-30
-30
-40
-40
-50
36V
-50
0
10
20
30
Supply Voltage [V]
40
-50
-25
0
25
50
75 100
Ambient Temperature [°C]
125
150
Figure 12. Input Offset Current vs Ambient
Temperature
Figure 11. Input Offset Current vs Supply Voltage
(*) The above data are measurement values of a typical sample, it is not guaranteed.
LM393xxx: -40°C to +85°C
LM2903xxx: -40°C to +125°C
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LM393xxx
LM339xxx
LM2903xxx
Datasheet
LM2901xxx
Typical Performance Curves - continued
○LM393xxx, LM2903xxx
140
140
125°C
130
85°C
Large Signal Voltage Gain [dB]
Large Signal Voltage Gain [dB]
130
120
110
-40°C
25°C
100
90
80
36V
120
5V
110
100
3V
90
80
70
70
60
60
0
10
20
30
Supply Voltage [V]
-50
40
-25
0
25
50
75 100
Ambient Temperature [°C]
125
150
Figure 14. Large Signal Voltage Gain vs Ambient
Temperature (RL=15kΩ)
Figure 13. Large Signal Voltage Gain vs Supply
Voltage (RL=15kΩ)
4
2.5
Response Time (Low to High) [μs]
Input Offset Voltage [mV]
3
2
1
85°C
125°C
0
-1
-40°C
25°C
-2
2.0
1.5
125°C
1.0
85°C
0.5
-3
-40°C
0.0
-100
-4
-1
0
1
2
3
Input Voltage [V]
4
5
25°C
-80
-60
-40
Overdrive Voltage [mV]
-20
0
Figure 16. Response Time (Low to High) vs
Overdrive Voltage (VCC=5V, VRL=5V, RL=5.1kΩ)
Figure 15. Input Offset Voltage vs Input Voltage
(VCC=5V)
(*) The above data are measurement values of a typical sample, it is not guaranteed.
LM393xxx: -40°C to +85°C
LM2903xxx: -40°C to +125°C
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LM393xxx
LM339xxx
LM2903xxx
Datasheet
LM2901xxx
Typical Performance Curves - continued
○LM393xxx, LM2903xxx
2.0
Response Time (High to Low) [μs]
Response Time (Low to High) [μs]
2.5
2.0
1.5
5mV Overdrive
1.0
20mV Overdrive
0.5
1.6
1.2
0.8
0.4
100mV Overdrive
0.0
-50
125°C
85°C
-40°C
25°C
0.0
-25
0
25
50
75 100
Ambient Temperature [°C]
125
150
0
20
40
60
Overdrive Voltage [mV]
80
100
Figure 18. Response Time (High to Low) vs
Overdrive Voltage (VCC=5V, VRL=5V, RL=5.1kΩ)
Figure 17. Response Time (Low to High) vs Ambient
Temperature (VCC=5V, VRL=5V, RL=5.1kΩ)
Response Time (High to Low) [μs]
2.0
1.6
1.2
5mV Overdrive
0.8
20mV Overdrive
0.4
100mV Overdrive
0.0
-50
-25
0
25
50
75 100
Ambient Temperature [°C]
125
150
Figure 19. Response Time (High to Low) vs Ambient
Temperature (VCC=5V, VRL=5V, RL=5.1kΩ)
(*) The above data are measurement values of a typical sample, it is not guaranteed.
LM393xxx: -40°C to +85°C
LM2903xxx: -40°C to +125°C
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Typical Performance Curves - continued
○LM339xxx, LM2901xxx
2.5
2.5
-40°C
2.0
25°C
36V
Supply Current [mA]
Supply Current [mA]
2.0
1.5
85°C
1.0
1.5
1.0
3V
125°C
0.5
0.5
0.0
0.0
Supply Voltage [V]
0
25
50
75 100
Ambient Temperature [°C]
Figure 20. Supply Current vs Supply Voltage
Figure 21. Supply Current vs Ambient Temperature
0
10
20
30
-50
40
200
-25
125
150
200
125°C
Output Saturation Voltage [mV]
Output Saturation Voltage [mV]
5V
150
85°C
25°C
100
-40°C
50
150
3V
5V
100
0
36V
50
0
0
10
20
30
Supply Voltage [V]
40
-50
Figure 22. Output Saturation Voltage vs
Supply Voltage (ISINK=4mA)
-25
0
25
50
75 100
Ambient Temperature [°C]
125
150
Figure 23. Output Saturation Voltage vs
Ambient Temperature (ISINK=4mA)
(*) The above data are measurement values of a typical sample, it is not guaranteed.
LM339xxx: -40°C to +85°C
LM2901xxx: -40°C to +125°C
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Typical Performance Curves - continued
○LM339xxx, LM2901xxx
2
80
Output Sink Current [mA]
1.5
Output Voltage [V]
85°C
-40°C
1
25°C
125°C
0.5
60
36V
40
5V
20
3V
0
0
0
4
8
12
16
Output Sink Current [mA]
20
-50
4
4
3
3
2
2
1
25℃
85℃
125℃
0
-40℃
-1
-2
0
25
50
75 100
Ambient Temperature [°C]
125
150
Figure 25. Output Sink Current vs Ambient
Temperature (VOUT=VCC)
Input Offset Voltage [mV]
Input Offset Voltage [mV]
Figure 24. Output Voltage vs Output Sink Current
(VCC=5V)
-25
1
36V
3V
0
-1
5V
-2
-3
-3
-4
-4
0
10
20
30
-50
40
Supply Voltage [V]
Figure 26. Input Offset Voltage vs Supply Voltage
-25
0
25
50
75 100
Ambient Temperature [°C]
125
150
Figure 27. Input Offset Voltage vs Ambient
Temperature
(*) The above data are measurement values of a typical sample, it is not guaranteed.
LM339xxx: -40°C to +85°C
LM2901xxx: -40°C to +125°C
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Typical Performance Curves - continued
160
160
140
140
120
Input Bias Current [nA]
Input Bias Current [nA]
○LM339xxx, LM2901xxx
-40℃
100
25℃
80
85℃
60
120
3V
100
40
80
60
40
125℃
20
20
0
0
0
10
20
30
40
-50
-25
Supply Voltage [V]
50
40
40
30
30
Input Offset Current [nA]
50
20
10
85℃
-40℃ 125℃
0
25℃
-10
-20
0
25
50
75 100
Ambient Temperature [°C]
125
150
Figure 29. Input Bias Current vs Ambient
Temperature
Figure 28. Input Bias Current vs Supply Voltage
Input Offset Current [nA]
36V
5V
20
10
5V
0
3V
-10
-20
-30
-30
-40
-40
-50
36V
-50
0
10
20
30
Supply Voltage [V]
40
-50
-25
0
25
50
75 100
Ambient Temperature [°C]
125
150
Figure 31. Input Offset Current vs Ambient
Temperature
Figure 30. Input Offset Current vs Supply Voltage
(*) The above data are measurement values of a typical sample, it is not guaranteed.
LM339xxx: -40°C to +85°C
LM2901xxx: -40°C to +125°C
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Typical Performance Curves - continued
○LM339xxx, LM2901xxx
140
140
125°C
130
85°C
Large Signal Voltage Gain [dB]
Large Signal Voltage Gain [dB]
130
120
110
-40°C
25°C
100
90
80
36V
120
5V
110
100
3V
90
80
70
70
60
60
0
10
20
30
Supply Voltage [V]
-50
40
-25
0
25
50
75 100
Ambient Temperature [°C]
125
150
Figure 33. Large Signal Voltage Gain vs Ambient
Temperature (RL=15kΩ)
Figure 32. Large Signal Voltage Gain vs Supply
Voltage (RL=15kΩ)
4
2.5
Response Time (Low to High) [μs]
Input Offset Voltage [mV]
3
2
1
85°C
125°C
0
-1
-40°C
25°C
-2
2.0
1.5
125°C
1.0
85°C
0.5
-3
-40°C
0.0
-100
-4
-1
0
1
2
3
Input Voltage [V]
4
5
25°C
-80
-60
-40
Overdrive Voltage [mV]
-20
0
Figure 35. Response Time (Low to High) vs
Overdrive Voltage (VCC=5V, VRL=5V, RL=5.1kΩ)
Figure 34. Input Offset Voltage vs Input Voltage
(VCC=5V)
(*) The above data are measurement values of a typical sample, it is not guaranteed.
LM339xxx: -40°C to +85°C
LM2901xxx: -40°C to +125°C
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Typical Performance Curves - continued
○LM339xxx, LM2901xxx
2.0
Response Time (High to Low) [μs]
Response Time (Low to High) [μs]
2.5
2.0
1.5
5mV Overdrive
1.0
20mV Overdrive
0.5
1.6
1.2
0.8
0.4
100mV Overdrive
0.0
-50
125°C
85°C
-40°C
25°C
0.0
-25
0
25
50
75 100
Ambient Temperature [°C]
125
150
0
20
40
60
Overdrive Voltage [mV]
80
100
Figure 37. Response Time (High to Low) vs
Overdrive Voltage (VCC=5V, VRL=5V, RL=5.1kΩ)
Figure 36. Response Time (Low to High) vs Ambient
Temperature (VCC=5V, VRL=5V, RL=5.1kΩ)
Response Time (High to Low) [μs]
2.0
1.6
1.2
5mV Overdrive
0.8
20mV Overdrive
0.4
100mV Overdrive
0.0
-50
-25
0
25
50
75 100
Ambient Temperature [°C]
125
150
Figure 38. Response Time (High to Low) vs Ambient
Temperature (VCC=5V, VRL=5V, RL=5.1kΩ)
(*) The above data are measurement values of a typical sample, it is not guaranteed.
LM339xxx: -40°C to +85°C
LM2901xxx: -40°C to +125°C
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Application Information
NULL method condition for Test Circuit 1
VCC, VEE, EK, VICM, VRL Unit: V; RL Unit: Ohms
Parameter
VF
SW1
SW2
SW3
VCC
VEE
EK
VICM
VRL
RL
Calculation
Input Offset Voltage
VF1
ON
ON
ON
5 to 32
0
-1.4
0
5 to 32
5.1k
1
Input Offset Current
VF2
OFF
OFF
ON
5
0
-1.4
0
5
10k
2
VF3
OFF
ON
ON
5
0
-1.4
0
5
10k
3
VF4
ON
OFF
ON
ON
ON
15
0
0
15
15k
4
Input Bias Current
VF5
Large Signal Voltage Gain
-1.4
VF6
-11.4
- Calculation 1. Input Offset Voltage (VIO)
VIO =
2. Input Offset Current (IIO)
3. Input Bias Current (IB)
4. Large Signal Voltage Gain (AV)
|VF1|
1 + RF/RS
[V]
IIO =
|VF2 - VF1|
RI x (1 + RF/RS)
IB =
|VF4 - VF3|
2 x RI x (1 + RF/RS)
Av = 20Log
[A]
[A]
EK × (1+RF/RS)
|VF6 - VF5|
[dB]
RF=50kΩ
SW1
RS=50Ω
500kΩ
VCC
15V
EK
RI=10kΩ
0.01μF (Note 18)
VOUT
500kΩ
0.01uF
0.01uF
DUT
SW3
RS=50Ω
RI=10kΩ
RL
VICM
50kΩ
V VF
SW2
VEE
(Note 18)
NULL
1000pF (Note 18)
VRL
-15V
Use 1uF capacitor for Input Bias Current and Input Offset Current
Figure 39. Test Circuit 1 (One Channel Only)
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Application Information – continued
Switch Condition for Test Circuit 2
Parameter
SW1
SW2
SW3
SW4
SW5
SW6
SW7
Supply Current
ON
ON
OFF
OFF
OFF
OFF
OFF
VOUT=1.5V
ON
ON
OFF
OFF
OFF
OFF
ON
Output Saturation Voltage ISINK=4mA
ON
ON
OFF
OFF
ON
ON
OFF
Output Leakage Current
VOUT=32V
ON
ON
OFF
OFF
OFF
OFF
ON
Response Time
RL=5.1kΩ, VRL=5V
ON
OFF
ON
ON
OFF
OFF
OFF
Output Sink Current
VCC
＋
－
SW4
SW1
SW2
SW5
SW6
SW7
SW3
VEE
RL
VRL
V+IN
V-IN
VOUT
Figure 40. Test Circuit 2 (One Channel Only)
Input Voltage
Input Voltage
1.5V
1.405V
VREF=1.4V
Δov=5mV
Overdrive Voltage
Overdrive Voltage
VREF=1.4V
Δov=5mV
1.395V
1.3V
t
t
Input Wave
Input Wave
Output Voltage
Output Voltage
VCC
VCC
VCC/2
VCC/2
0V
0V
tRE (Low to High)
tRE (High to Low)
t
Output Wave
t
Output Wave
Figure 41. Response Time
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Application Information – continued
1.
Unused Circuits
It is recommended to apply the connection (see Figure 42) and set the non-inverting input pin at a potential within the
Input Common-mode Voltage Range (VICM) for any unused circuit.
VVCC
CC
Keep this potential in VICM
VICM
+
-
OPEN
VVEE
EE
Figure 42. Example of Application Circuit for Unused Comparator
2.
Input Pin Voltage
Regardless of the supply voltage, applying V EE+32V to the input pin is possible without causing deterioration of the
electrical characteristics or destruction. However, this does not ensure normal circuit operation. Please note that the
circuit operates normally only when the input voltage is within the common mode input voltage range of the electric
characteristics.
3.
Power Supply (Single/Dual)
The comparators operate when the voltage supplied is between VCC pin and VEE pin. Therefore, the single supply
comparators can be used as dual supply comparators as well.
4.
IC Handling
When pressure is applied to the IC through warp on the printed circuit board, the characteristics may fluctuate due to the
piezoelectric effect. Be careful of warps on the printed circuit board.
I/O Equivalent Circuit
Symbol
Pin No.
+IN
-IN
LM393xxx, LM2903xxx: 2,3,5,6
LM339xxx, LM2901xxx:
4,5,6,7,8,9,10,11
OUT
LM393xxx, LM2903xxx: 1,7
LM339xxx, LM2901xxx: 1,2,13,14
Equivalent Circuit
VCC
VCC
LM393xxx, LM2903xxx: 8
LM339xxx, LM2901xxx: 3
VEE
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Example of Circuit
V+IN
○Reference voltage is V-IN
VCC
VRL
VREF
RL
+
V+IN
VOUT
Reference
VREF
Voltage
Time
VEE
VOUT
High
When the input voltage is bigger than reference voltage,
output voltage is high. When the input voltage is smaller than
reference voltage, output voltage is low.
Low
Time
○Reference voltage is V+IN
V-IN
VCC
Reference
Voltage
VRL
VREF
RL
+
VOUT
-
VREF
Time
V-IN
VEE
VOUT
High
When the input voltage is smaller than reference voltage,
output voltage is high. When the input voltage is bigger than
reference voltage, output voltage is low.
Low
Time
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Power Dissipation
Power dissipation (total loss) indicates the power that the IC can consume at TA=25°C (normal temperature). As the IC
consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable temperature
that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and consumable power.
Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the thermal
resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the
maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold
resin or lead frame of the package. Thermal resistance, represented by the symbol θJA°C/W, indicates this heat dissipation
capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance.
Figure 43(a) shows the model of the thermal resistance of a package. The equation below shows how to compute for the
Thermal resistance (θJA), given the ambient temperature (TA), maximum junction temperature (Tjmax), and power dissipation
(PD).
θJA = (Tjmax－TA) / PD
°C/W
The Derating curve in Figure 43(b) indicates the power that the IC can consume with reference to ambient temperature.
Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal resistance
(θJA), which depends on the chip size, power consumption, package, ambient temperature, package condition, wind velocity,
etc. This may also vary even when the same package is used. Thermal reduction curve indicates a reference value
measured at a specified condition. Figure 43(c) to (f) show the examples of the derating curves for LM393xxx, LM2903xxx,
LM339xxx, and LM2901xxx respectively.
Power dissipation of LSI [W]
PDmax
θJA=(Tjmax-TA)/ PD °C/W
Power dissipation of IC
P2
Ambient temperature TA [ °C ]
θJA2 < θJA1
θJA2
P1
Tjmax
θJA1
0
25
50
100
125
Ambient temperature TA [ °C ]
(a) Thermal Resistance
(b) Derating Curve
150
1.0
1.0
LM393F(Note 19)
LM2903F(Note 19)
0.8
0.8
LM393FJ(Note 20)
0.6
Power Dissipation [W]
Power Dissipation [W]
75
Chip surface temperature Tj [ °C ]
LM393FVT(Note 21)
LM393FV(Note 21)
0.4
(Note 22)
LM393FVJ
LM393FVM(Note 22)
LM2903FJ(Note 20)
0.6
LM2903FVT(Note 21)
LM2903FV(Note 21)
0.4
LM2903FVJ(Note 22)
LM2903FVM(Note 22)
0.2
0.2
0.0
0
25
50
75 85 100
125
Ambient Temperature [°C]
0.0
0
150
(c) LM393xxx
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50
75
100
125
Ambient Temperature [°C]
150
(d) LM2903xxx
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1.5
1.5
1.2
1.2
LM2901FJ (Note 24)
Power Dissipation [W]
Power Dissipation [W]
LM339FJ (Note 24)
0.9
LM339FV (Note 25)
LM339FVJ (Note 26)
0.6
LM339F (Note 23)
0.3
25
LM2901FV (Note 25)
LM2901FVJ (Note 26)
0.6
LM2901F (Note 23)
0.3
0.0
0
0.9
0.0
85
50
75
100
125
Ambient Temperature [°C]
150
0
25
50
75
100
125
Ambient Temperature [°C]
(e) LM339xxx
150
(f) LM2901xxx
Note 19
Note 20
Note 21
Note 22
Note 23
Note 24
Note 25
Note 26
Unit
5.5
5.4
5.0
4.7
4.5
8.2
7.0
6.8
mW/°C
Reduce the value above per 1°C above 25°C.
Power dissipation is the value when the IC mounted on FR4 glass epoxy board 70mm ×70mm ×1.6mm (cooper foil area below 3%) is mounted.
Figure 43. Thermal Resistance and Derating Curve
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
terminals.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply lines
of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the
analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature
and aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current GND traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the GND traces of external components do not cause variations on
the GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the
IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,
increase the board size and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of
connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground. Inter-pin shorts could be due to
many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge
deposited in between pins during assembly to name a few.
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Operational Notes – continued
11. Regarding Input Pins of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
N
P
N
P+
N
Parasitic
Element
N
P+
N P
N
P+
B
N
C
E
Parasitic
Element
P Substrate
P Substrate
GND
Parasitic
Element
Pin B
B
GND
GND
Parasitic
Element
GND
Parasitic element
or Transistor
Figure 44. Example of Monolithic IC Structure
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Physical Dimension Tape and Reel Information
Package Name
SOP8
(Max 5.35 (include.BURR))
(UNIT : mm)
PKG : SOP8
Drawing No. : EX112-5001-1
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LM2901xxx
Datasheet
Physical Dimensions, Tape and Reel Information – continued
Package Name
www.rohm.com
©2015 ROHM Co., Ltd. All rights reserved.
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SOP-J8
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Datasheet
Physical Dimensions, Tape and Reel Information – continued
Package Name
www.rohm.com
©2015 ROHM Co., Ltd. All rights reserved.
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SSOP-B8
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Datasheet
Physical Dimensions, Tape and Reel Information – continued
Package Name
www.rohm.com
©2015 ROHM Co., Ltd. All rights reserved.
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TSSOP-B8
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Datasheet
Physical Dimensions, Tape and Reel Information – continued
Package Name
www.rohm.com
©2015 ROHM Co., Ltd. All rights reserved.
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TSSOP-B8J
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Datasheet
Physical Dimensions, Tape and Reel Information – continued
Package Name
www.rohm.com
©2015 ROHM Co., Ltd. All rights reserved.
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MSOP8
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LM339xxx
LM2903xxx
LM2901xxx
Datasheet
Physical Dimensions, Tape and Reel Information – continued
Package Name
SOP14
(UNIT : mm)
PKG : SOP14
Drawing No. : EX113-5001
www.rohm.com
©2015 ROHM Co., Ltd. All rights reserved.
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LM2901xxx
Datasheet
Physical Dimensions, Tape and Reel Information – continued
Package Name
www.rohm.com
©2015 ROHM Co., Ltd. All rights reserved.
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SOP-J14
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LM2901xxx
Datasheet
Physical Dimensions, Tape and Reel Information – continued
Package Name
www.rohm.com
©2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
SSOP-B14
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LM339xxx
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LM2901xxx
Datasheet
Physical Dimensions, Tape and Reel Information – continued
Package Name
www.rohm.com
©2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSSOP-B14J
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LM339xxx
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Datasheet
LM2901xxx
Ordering Information
L
M
x
x
x
Part Number
LM393F
LM393FJ
LM393FV
LM393FVT
LM393FVJ
LM393FVM
LM339F
LM339FJ
LM339FV
LM339FVJ
LM2903F
LM2903FJ
LM2903FV
LM2903FVT
LM2903FVJ
LM2903FVM
LM2901F
LM2901FJ
LM2901FV
LM2901FVJ
x
x
x
-
x
Package
F
: SOP8
: SOP14
FJ
: SOP-J8
: SOP-J14
FV
: SSOP-B8
: SSOP-B14
FVT
: TSSOP-B8
FVJ
: TSSOP-B8J
: TSSOP-B14J
FVM
: MSOP8
x
Packaging and forming specification
E2: Embossed tape and reel
(SOP8/SOP-J8/SSOP-B8/
TSSOP-B8/SOP14/SOP-J14/
SSOP-B14/TSSOP-B14J)
TR: Embossed tape and reel
(MSOP8)
Line-up
Operating Temperature Range
Channel
2ch
-40°C to +85°C
4ch
2ch
-40°C to +125°C
4ch
www.rohm.com
©2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
Package
Orderable Part Number
SOP8
Reel of 2500
LM393F-E2
SOP-J8
Reel of 2500
LM393FJ-E2
SSOP-B8
Reel of 2500
LM393FV-E2
TSSOP-B8
Reel of 3000
LM393FVT-E2
TSSOP-B8J
Reel of 2500
LM393FVJ-E2
MSOP8
Reel of 3000
LM393FVM-TR
SOP14
Reel of 2500
LM339F-E2
SOP-J14
Reel of 2500
LM339FJ-E2
SSOP-B14
Reel of 2500
LM339FV-E2
TSSOP-B14J
Reel of 2500
LM339FVJ-E2
SOP8
Reel of 2500
LM2903F-E2
SOP-J8
Reel of 2500
LM2903FJ-E2
SSOP-B8
Reel of 2500
LM2903FV-E2
TSSOP-B8
Reel of 3000
LM2903FVT-E2
TSSOP-B8J
Reel of 2500
LM2903FVJ-E2
MSOP8
Reel of 3000
LM2903FVM-TR
SOP14
Reel of 2500
LM2901F-E2
SOP-J14
Reel of 2500
LM2901FJ-E2
SSOP-B14
Reel of 2500
LM2901FV-E2
TSSOP-B14J
Reel of 2500
LM2901FVJ-E2
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LM393xxx
LM339xxx
LM2903xxx
Datasheet
LM2901xxx
Marking Diagram
SOP8(TOP VIEW)
SOP-J8(TOP VIEW)
TSSOP-B8(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
SSOP-B8(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
SOP14(TOP VIEW)
1PIN MARK
TSSOP-B8J(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
SOP-J14(TOP VIEW)
Part Number Marking
1PIN MARK
MSOP8(TOP VIEW)
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
SSOP-B14(TOP VIEW)
Part Number Marking
TSSOP-B14J (TOP VIEW)
Part Number Marking
LOT Number
LOT Number
1PIN MARK
www.rohm.com
©2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
1PIN MARK
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Datasheet
LM2901xxx
Marking Diagram – continued
Product Name
LM393
Package Type
Marking
F
SOP8
FJ
SOP-J8
FV
SSOP-B8
FVT
TSSOP-B8
FVJ
TSSOP-B8J
FVM
MSOP8
F
SOP14
LM339F
FJ
SOP-J14
LM339FJ
FV
SSOP-B14
FVJ
TSSOP-B14J
F
SOP8
FJ
SOP-J8
FV
SSOP-B8
FVT
TSSOP-B8
FVJ
TSSOP-B8J
FVM
MSOP8
F
SOP14
LM2901F
FJ
SOP-J14
LM2901FJ
FV
SSOP-B14
FVJ
TSSOP-B14J
393L
LM339
339L
2903L
03L
LM2903
2903L
LM2901
2901L
www.rohm.com
©2015 ROHM Co., Ltd. All rights reserved.
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Datasheet
LM2901xxx
Revision History
Date
Revision
8.Dec.2015
001
15.Jul.2016
002
www.rohm.com
©2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
Changes
New Release
Add LM393xxx (FJ, FV, FVT, FVM, FVJ), LM339xxx (F, FJ, FV, FVJ)
LM2903xxx (F, FJ, FV, FVT, FVM, FVJ), LM2901xxx (F, FJ, FV, FVJ)
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Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
