Datasheet
Operational Amplifiers
Low Noise Operational Amplifier
LM4559xxx
Key Specifications
Operating Supply Voltage:
Temperature Range:
Voltage Gain:
Unity Gain Bandwidth:
Slew Rate:
Input Referred Noise Voltage:
General Description
The LM4559xxx are low noise operational amplifiers
with high gain and wide bandwidth. They have good
performance of input referred noise voltage (5 nV/ Hz )
and total harmonic distortion (0.0003%). These are
suitable for audio applications and active filter.
Features
High Voltage Gain
High Slew Rate
Low Noise Voltage
Low Total Harmonic Distortion
Low Power Consumption
Package
SOP-8
SOP-J8
SSOP-B8
TSSOP-B8
MSOP8
TSSOP-B8J
Application
Audio Application
Consumer Equipment
Active Filter
±4V to ±18V
-40°C to +85°C
110dB (Typ)
3.3MHz (Typ)
3.5V/µs (Typ)
5 nV/ Hz (Typ)
W(Typ) xD(Typ) xH(Max)
5.00mm x 6.20mm x 1.71mm
4.90mm x 6.00mm x 1.65mm
3.00mm x 6.40mm x 1.35mm
3.00mm x 6.40mm x 1.20mm
2.90mm x 4.00mm x 0.90mm
3.00mm x 4.90mm x 1.10mm
Simplified Schematic
Figure 1. Simplified Schematic (1 channel only)
○Product structure：Silicon monolithic integrated circuit
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Datasheet
LM4559xxx
Pin Configuration
LM4559F
LM4559FJ
LM4559FV
LM4559FVT
LM4559FVM
LM4559FVJ
: SOP8
: SOP-J8
: SSOP-B8
: TSSOP-B8
: MSOP8
: TSSOP-B8J
2
+IN1
3
Symbol
1
OUT1
8 VCC
OUT1 1
-IN1
Pin No.
CH1
- +
CH2
2
-IN1
7
OUT2
3
+IN1
6
-IN2
4
VEE
5
+IN2
6
-IN2
7
OUT2
8
VCC
+ -
VEE
5 +IN2
4
Ordering Information
L
M
4
5
5
Part Number
LM4559xxx
9
x
x
x
Package
F
: SOP8
FJ
: SOP-J8
FV
: SSOP-B8
FVT : TSSOP-B8
FVM : MSOP8
FVJ : TSSOP-B8J
-
x
x
Packaging and forming specification
E2: Embossed tape and reel
(SOP8/SOP-J8/SSOP-B8/TSSOP-B8/TSSOP-B8J)
TR: Embossed tape and reel
(MSOP8)
Line-up
Topr
Package
Operable Part Number
SOP8
Reel of 2500
LM4559F-E2
SOP-J8
Reel of 2500
LM4559FJ-E2
SSOP-B8
Reel of 2500
LM4559FV-E2
TSSOP-B8
Reel of 3000
LM4559FVT-E2
MSOP8
Reel of 3000
LM4559FVM-TR
TSSOP-B8J
Reel of 2500
LM4559FVJ-E2
-40°C to +85°C
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Datasheet
LM4559xxx
Absolute Maximum Ratings (TA=25°C)
Parameter
Supply Voltage
Symbol
Rating
Unit
VCC – VEE
+36
V
(Note 1,5)
SOP8
Power Dissipation
PD
(Note 6)
0.68
SOP-J8
0.67(Note 2,5)
SSOP-B8
0.62(Note 3,5)
TSSOP-B8
0.62(Note 3,5)
MSOP8
0.58(Note 4,5)
TSSOP-B8J
0.58(Note 4,5)
W
Differential Input Voltage
Input Common-mode
Voltage Range
Operating Supply Voltage
VID
+36
V
VICM
(VEE - 0.3) to (VEE + 36)
V
Vopr
±4 to ±18
V
Operating Temperature
Topr
-40 to +85
°C
Storage Temperature
Maximum
Junction Temperature
Tstg
-55 to +150
°C
TJmax
+150
°C
(Note 1) When used at temperature above TA =25°C, reduce by 5.5mW/°C.
(Note 2) When used at temperature above TA =25°C, reduce by 5.4mW/°C.
(Note 3) When used at temperature above TA =25°C, reduce by 5.0mW/°C.
(Note 4) When used at temperature above TA =25°C, reduce by 4.7mW/°C.
(Note 5) Mounted on a FR4 glass epoxy PCB(70mm×70mm×1.6mm).
(Note 6) The differential input voltage is the voltage difference between inverting input and non-inverting input.
Input terminal voltage is set to more than VEE.
Caution: Absolute maximum rating of each item indicates the condition which must not be exceeded.
Application of voltage in excess of absolute maximum rating or usage out of absolute maximum rated
temperature environment may cause deterioration of characteristics.
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Datasheet
LM4559xxx
Electrical Characteristics:
○LM4559xxx (Unless otherwise specified VCC=+15V, VEE=-15V)
Parameter
Symbol
Limit
Temperature
Range
Min
Typ
Max
Unit
Conditions
Input Offset Voltage (Note 7)
VIO
25°C
-
0.5
1.5
mV
OUT=0V
Input Offset Current (Note 7)
IIO
25°C
-
5
100
nA
OUT=0V
Input Bias Current (Note 7)
IB
25°C
-
40
250
nA
OUT=0V
Supply Current (Note 8)
ICC
mA
RL=∞, All Op-Amps
Large Signal Voltage Gain
AV
Maximum Output Voltage
VOM
25°C
Maximum Output Swing
Bandwidth
BOM
Input Common-mode Voltage
Range
25°C
-
3.3
5.0
Full range
-
-
6.5
25°C
20
300
-
V/mV
25°C
86
110
-
dB
±12
±13
-
±11
±12.5
-
25°C
-
32
-
kHz
OUT=20VP-P, RL=2kΩ
VICM
25°C
±12
±13
-
V
－
Common-mode Rejection Ratio
CMRR
25°C
80
100
-
dB
OUT=0V
Power Supply Rejection Ratio
PSRR
25°C
82
100
-
dB
OUT=0V
SR
25°C
1.5
3.5
-
V/µs
RL=2kΩ, CL=100pF
fT
25°C
-
3.3
-
MHz
RL=2kΩ
GBW
25°C
-
4
-
MHz
RL=2kΩ, f=1MHz
θ
25°C
-
50
-
deg
RL=2kΩ
-
0.7
-
µVrms
AV= 40dB, RS=1kΩ
f=20Hz to 20kHz
-
5
-
nV/ Hz
AV= 40dB, VICM=0V
f=1kHz
Slew Rate
Unity Gain Frequency
Gain Bandwidth
Phase Margin
Input Referred Noise Voltage
Total Harmonic Distortion + Noise
Channel Separation
VN
V
OUT=±10V, RL=2kΩ
RL≥2kΩ
RL=600Ω
25°C
THD+N
25°C
-
0.0003
-
%
Av= 20dB
f=1kHz, RL=2kΩ
OUT= 5Vrms
CS
25°C
-
110
-
dB
AV=40dB, f=1kHz
OUT=1Vrms
(Note 7) Absolute value.
(Note 8) Full range: TA=-40°C to +85°C
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Datasheet
LM4559xxx
Description of Electrical Characteristics
Described here are the terms of electric characteristics used in this datasheet. Items and symbols used are also shown.
Note that item name, symbol and their meaning may differ from those on other manufacturer’s document or general
documents.
1. Absolute maximum ratings
Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of absolute
maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics.
(1) Supply Voltage (VCC/VEE)
Indicates the maximum voltage that can be applied between the positive power supply terminal and negative power
supply terminal without deterioration or destruction of characteristics of internal circuit.
(2) Differential Input Voltage (VID)
Indicates the maximum voltage that can be applied between non-inverting and inverting terminals without damaging
the IC.
(3) Input Common-mode Voltage Range (VICM)
Indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deterioration
or destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure
normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics.
(4) Power dissipation (PD)
Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25℃
(normal temperature). As for package product, Pd is determined by the temperature that can be permitted by the IC in
the package (maximum junction temperature) and the thermal resistance of the package.
2. Electrical characteristics item
(1) Input Offset Voltage (VIO)
Indicates the voltage difference between non-inverting terminal and inverting terminals. It can be translated into the
input voltage difference required for setting the output voltage at 0 V.
(2) Input Offset Current (IIO)
Indicates the difference of input bias current between the non-inverting and inverting terminals.
(3) Input Bias Current (IB)
Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias currents at
the non-inverting and inverting terminals.
(4) Input Common-mode Voltage Range (VICM)
Indicates the input voltage range where IC operates normally.
(5) Maximum Output Voltage (VOM)
Indicates the voltage range that the IC can output under specified load condition. It is typically divided into high-level
output voltage and low-level output voltage. High-level output voltage indicates the upper limit of output voltage.
Low-level output voltage indicates the lower limit.
(6) Large Signal Voltage Gain (AV)
Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal
and inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage.
Av = (Output voltage) / (Differential Input voltage)
(7) Supply Current (ICC)
Indicates the current that flows within the IC under specified no-load conditions.
(8) Output Source Current/ Output Sink Current (Isource / Isink)
The maximum current that can be output from the IC under specific output conditions. The output source current
indicates the current flowing out from the IC, and the output sink current indicates the current flowing into the IC.
(9) Unity Gain Frequency (fT)
Indicates a frequency where the voltage gain of operational amplifier is 1.
(10) Gain Bandwidth (GBW)
Indicates to multiply by the frequency and the gain where the voltage gain decreases 6dB/octave.
(11) Phase Margin (θ)
Indicates the margin of phase from 180 degree phase lag at unity gain frequency.
(12) Common-mode Rejection Ratio (CMRR)
Indicates the ratio of fluctuation of input offset voltage when the input common-mode voltage is changed. It is
normally the fluctuation of DC.
CMRR = (Change of Input common-mode voltage)/(Input offset fluctuation)
(13) Power Supply Rejection Ratio (PSRR)
Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed.
It is normally the fluctuation of DC.
PSRR= (Change of power supply voltage)/(Input offset fluctuation)
(14) Input Referred Noise Voltage (VN)
Indicates a noise voltage generated inside the operational amplifier reflected back to an ideal voltage source
connected in series with the input terminal.
(15) Total Harmonic Distortion + Noise (THD+N)
Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage
of driven channel.
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Datasheet
LM4559xxx
(16) Channel Separation (CS)
Indicates the fluctuation in the output voltage of the driven channel with reference to the change of output voltage of
the channel which is not driven.
(17) Slew Rate (SR)
Indicates the ratio of the change in output voltage with time when a step input signal is applied.
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Datasheet
LM4559xxx
Typical Performance Curves
○LM4559xxx
4.5
1.0
-40°C
4.0
3.5
LM4559F
Supply Current [mA]
Power Dissipation [W]
0.8
LM4559FJ
0.6
LM4559FV
LM4559FVT
LM4559FVM
LM4559FVJ
0.4
3.0
25°C
2.5
85°C
2.0
1.5
1.0
0.2
0.5
0.0
0.0
85
0
25
50
75
100
125
±0
150
±5
Ambient Temperature [°C]
±10
±15
±20
Supply Voltage [V]
Figure 2.
Power Dissipation vs Ambient Temperature
(Derating Curve)
Figure 3.
Supply Current vs Supply Voltage
4.5
20
4.0
15
-40°C
25°C
10
Maximum Output Voltage [V]
Supply Current [mA]
3.5
3.0
2.5
2.0
1.5
1.0
0.5
85°C
5
0
85°C
-5
25°C
-40°C
-10
-15
-20
0.0
-50
-25
0
25
50
75
Ambient Temperature [°C]
±0
100
Figure 4.
Supply Current vs Ambient Temperature
(VCC/VEE=±15V)
±5
±10
±15
Supply Voltage [V]
±20
Figure 5.
Maximum Output Voltage vs Supply Voltage
(RL=2kΩ)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Datasheet
LM4559xxx
Typical Performance Curves (Reference data) – continued
○LM4559xxx
20
30
Maximum Output Voltage Swing [V]
Maximum Output Voltage [V] .
15
10
5
0
-5
-10
-15
-20
25
20
15
10
5
0
-50
-25
0
25
50
75
Ambient Temperature [℃]
3
10
100
4
4
Input Offset Voltage [mV]
Input Offset Voltage [mV]
6
2
0
-2
0
85°C
-6
75
100
25°C
-2
-6
50
108
-40°C
-4
25
107
2
-4
0
106
Figure 7.
Maximum Output Voltage Swing vs Frequency
(VCC/VEE=±15V, TA=25°C, RL=2kΩ)
6
-25
105
Frequency [Hz]
Figure 6.
Maximum Output Voltage vs Ambient Temperature
(VCC/VEE=±15V, RL=2kΩ)
-50
104
-15
Ambient Temperature [°C]
-10
-5
0
5
10
Input Common-mode Voltage [V]
15
Figure 9.
Input Offset Voltage vs Input Common-mode Voltage
(VCC/VEE=±15V)
Figure 8.
Input Offset Voltage vs Ambient Temperature
(VCC/VEE=±15V)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Datasheet
LM4559xxx
Typical Performance Curves (Reference data) – continued
○LM4559xxx
150
140
Common Mode Rejection Ratio [dB]
Large Signal Voltage Gain [dB] .
.
160
130
120
110
100
150
140
130
120
110
100
90
-50
-25
0
25
50
75
Ambient Temperature [℃]
-50
100
Figure 10.
Large Signal Voltage Gain vs Ambient Temperature
(VCC/VEE=±15V, RL=2kΩ)
-25
0
25
50
75
Ambient Temperature [°C]
100
Figure 11.
Common Mode Rejection Ratio vs Ambient Temperature
(VCC/VEE=±15V)
120
6
5
110
Slew Rate L-H [V/µs]
Power Supply Rejection Ratio [dB]
115
105
100
95
4
3
2
90
1
85
0
80
-50
-25
0
25
50
75
-50
100
-25
0
25
50
75
100
Ambient Temperature [°C]
Ambient Temperature [°C]
Figure 13.
Slew Rate L-H vs Ambient Temperature
(VCC/VEE=±15V, RL=2kΩ, CL=100pF)
Figure 12.
Power Supply Rejection Ratio vs Ambient Temperature
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Datasheet
LM4559xxx
Typical Performance Curves (Reference data) - continued
○LM4559xxx
6
100
200
Phase
80
160
60
120
3
Gain
40
20
1
0
40
0
-50
-25
0
25
50
75
3
10
1.E+00
100
104
1.E+01
Ambient Temperature [°C]
125
20
Input Offset Current [nA]
30
100
75
50
0
8
10
1.E+05
0
-10
-20
0
-30
0
25
50
75
Ambient Temperature [°C]
107
1.E+04
10
25
-25
106
1.E+03
Figure 15.
Voltage Gain・Phase vs Frequency
(VCC/VEE=±15V, RL=2kΩ)
150
-50
105
1.E+02
Frequency [Hz]
Figure 14.
Slew Rate H-L vs Ambient Temperature
(VCC/VEE=±15V, RL=2kΩ, CL=100pF)
Input Bias Current [nA]
80
2
100
-50
Figure 16.
Input Bias Current vs Ambient Temperature
(VCC/VEE=±15V)
-25
0
25
50
75
Ambient Temperature [°C]
100
Figure 17.
Input Offset Current vs Ambient Temperature
(VCC/VEE=±15V)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Phase [deg]
4
Gain[dB]
Slew Rate H-L [V/µs]
5
Datasheet
LM4559xxx
Typical Performance Curves (Reference data) - continued
○LM4559xxx
60
Equivalent Input Noise Voltage [nV/√Hz]
0.1
0.01
20Hz
0.001
20kHz
1kHz
50
40
30
20
10
0.0001
0
0.01
0.1
1
10
Output Voltage [Vrms]
100
1
10
2
10
103
104
105
Frequency [Hz]
Figure 18.
Total Harmonic Distortion vs Output Voltage
(VCC/VEE=±15V, RL=2kΩ)
Figure 19.
Equivalent Input Noise Voltage vs Frequency
(VCC/VEE=±15V, TA=25°C, AV=40dB)
1.0
Input Referred Noise Voltage [µVrms]
Total Harmonic Distortion [%]
1
0.8
0.6
0.4
0.2
0.0
±0
±5
±10
±15
Supply Voltage [V]
±20
Figure 20.
Equivalent Input Noise Voltage vs Supply Voltage
(Ta=25°C, DIN AUDIO)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Datasheet
LM4559xxx
Application Information
NULL method condition for Test Circuit 1
VCC, VEE, EK, VICM Unit:V
Parameter
Input Offset Voltage
VF
S1
S2
S3
VCC
VEE
EK
VICM
Calculation
VF1
ON
ON
OFF
15
-15
0
0
1
ON
ON
ON
15
-15
0
2
VF2
-10
Large Signal Voltage Gain
VF3
10
VF4
Common Mode Rejection Ratio
(Input Common-mode Voltage Range)
-10
ON
ON
OFF
15
-15
0
3
VF5
10
VF6
Power Supply Rejection Ratio
ON
ON
4
-4
18
-18
OFF
VF7
0
0
4
－ Calculation－
1. Input Offset Voltage (VIO)
VIO =
2. Large Signal Voltage Gain (AV)
AV
|VF1|
[V]
1+RF/RS
= 20Log
∆EK × (1+RF/RS)
[dB]
|VF2-VF3|
3. Common Mode Rejection Ratio (CMRR)
∆V × (1+RF/RS)
CMRR = 20Log ICM
|VF4 - VF5|
4. Power Supply Rejection Ratio (PSRR)
PSRR = 20Log
∆VCC × (1+ RF/RS)
[dB]
[dB]
|VF6 - VF7|
0.1µF
RF=50kΩ
0.1µF
500kΩ
SW1
VCC
EK
RS=50Ω
15V
VO
RI=10kΩ
500kΩ
0.1µF
0.1µF
DUT
NULL
SW3
RS=50Ω
RI=10kΩ
1000pF
VICM
50kΩ
VF
RL
VEE
VRL
-15V
Figure 21. Test Circuit 1
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Datasheet
LM4559xxx
Switch Condition for Test Circuit 2
SW No.
SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12
Supply Current
OFF OFF
ON
OFF
ON
OFF OFF OFF OFF OFF OFF OFF
Maximum Output Voltage RL=2kΩ
OFF
OFF OFF
ON
OFF OFF
Slew Rate
OFF OFF
Unity Gain Frequency
ON
ON
ON
ON
OFF OFF
ON
OFF
OFF
ON
OFF OFF
ON
OFF OFF OFF
ON
OFF OFF
ON
OFF OFF OFF
OFF OFF
ON
ON
ON
Input voltage
SW3
VH
R2 100kΩ
SW4
●
VCC=30V
VL
－
t
SW1
SW2
Input wave
＋
SW5
SW6
SW8
SW7
SW9
SW10
SW11
Output voltage
SW12
R1
1kΩ
VIN-
90% SR=ΔV/Δt
VH
VEE
RL
VIN+
CL
ΔV
VO
10%
VL
Δt
t
Output wave
Figure 22. Test Circuit2
Figure 23. Slew Rate Input Output Wave
R2=100kΩ
R2=100kΩ
VCC
R1=1kΩ
VIN
R1//R2
VEE
VCC
R1=1kΩ
OUT1
=1Vrms
OUT2
R1//R2
VEE
CS=20Log
100×OUT1
OUT2
Figure 24. Test Circuit 3 (Channel Separation)
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LM4559xxx
Application Example
○Voltage follower
VCC
OUT
Voltage gain is 0dB.
Using this circuit, the output voltage (OUT) is controlled
to be equal to the input voltage (IN). This circuit also
stabilizes OUT due to high input impedance and low
output impedance. Computation for OUT is shown
below.
OUT=IN
IN
VEE
Figure 25. Voltage Follower
○Inverting amplifier
For inverting amplifier, IN is amplified by a voltage gain
decided by the ratio of R1 and R2. The out-of-phase
output voltage is shown in the next expression.
OUT=-(R2/R1)・IN
This circuit has input impedance equal to R1.
R2
VCC
R1
IN
OUT
R1//R2
VEE
Figure 26. Inverting Amplifier Circuit
○Non-inverting amplifier
R1
For non-inverting amplifier, IN is amplified by a voltage
gain decided by the ratio of R1 and R2. OUT is in-phase
with IN and is shown in the next expression.
OUT=(1+R2/R1)・IN
Effectively, this circuit has high input impedance since its
input side is the same as that of the operational
amplifier.
R2
VCC
OUT
IN
VEE
Figure 27. Non-inverting Amplifier Circuit
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Power Dissipation
Power dissipation (total loss) indicates the power that the IC can consume at TA=25°C (normal temperature). As the IC
consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable
temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and
consumable power.
Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the
thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the
maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold
resin or lead frame of the package. Thermal resistance, represented by the symbol θJA°C/W, indicates this heat dissipation
capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance.
Figure 28 (a) shows the model of the thermal resistance of a package. The equation below shows how to compute for the
Thermal resistance (θJA), given the ambient temperature (TA), maximum junction temperature (TJmax), and power dissipation
(PD).
・・・・・ (Ⅰ)
θJA = (TJmax－TA) / PD °C/W
The derating curve in Figure 28 (b) indicates the power that the IC can consume with reference to ambient temperature.
Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal
resistance (θJA), which depends on the chip size, power consumption, package, ambient temperature, package condition,
wind velocity, etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a
reference value measured at a specified condition. Figure 28 (c) shows an example of the derating curve for LM4559xxx.
LSIの 消 費
力 [W]
Power Dissipation
of電
LSI
P
Dmax
Pd
(max)
θJA=(TJmax-TA)/ PD °C/W
θθja2
< θθja1
JA2 <
JA1
Power Dissipation of IC
P2
Ambient temperature TA [ °C ]
θ’
θ'JA2
ja2
P1
Chip surface temperature TJ [ °C ]
0
25
θJA2
θ
ja2
TTjJmax
J’max
(max)
Tj T
' (max)
θ’θ'JA1
ja1
θθJA1
ja1
50
75
100
125
150
TA [℃
Ambient temperature
] ]
[ °C
周 囲 温 度 Ta
(a) Thermal Resistance
(b) Derating Curve
1
Power Dissipation [W]
0.8
LM4559F (Note 9)
0.6
LM4559FJ (Note 10)
LM4559FV (Note 11)
LM4559FVT (Note 11)
0.4
LM4559FVM (Note 12)
LM4559FVJ (Note 12)
0.2
0
85
0
25
50
75
100
125
150
Ambient Temperature [°C]
(c) LM4559xxx
(9)
(10)
(11)
(12)
Unit
5.5
5.4
5.0
4.7
mW/°C
When using the unit above TA=25°C, subtract the value above per °C. Permissible dissipation is the value
when FR4 glass epoxy board 70mm×70mm×1.6mm (copper foil area below 3%) is mounted
Figure 28. Thermal Resistance and Derating Curve
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the PD stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the PD rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
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Operational Notes – continued
11. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Figure 30. Example of monolithic IC structure
12. Unused Circuits
It is recommended to apply the connection (see Figure 29.) and set the
non-inverting input terminal at a potential within the Input Common-mode
Voltage Range (VICM) for any unused circuit.
Keep this potential
in VICM
13. Input Voltage
Applying VEE +36V to the input terminal is possible without causing
deterioration of the electrical characteristics or destruction, regardless of
the supply voltage. However, this does not ensure normal circuit operation.
Please note that the circuit operates normally only when the input voltage
is within the common mode input voltage range of the electric
characteristics.
VCC
VICM
VEE
Figure 31. The Example of
Application Circuit for Unused Op-amp
14. Power Supply(single/dual)
The voltage comparator operates if a certain level of voltage is applied
between VCC and VEE. Therefore, the operational amplifier can be
operated under single power supply or split power supply.
15. IC Handling
When pressure is applied to the IC through warp on the printed circuit board, the characteristics may fluctuate due to
the piezo effect. Be careful with the warp on the printed circuit board.
16. The IC Destruction Caused by Capacitive Load
The IC may be damaged when VCC terminal and VEE terminal is shorted with the charged output terminal capacitor.
When IC is used as an operational amplifier or as an application circuit where oscillation is not activated by an output
capacitor, output capacitor must be kept below 0.1μF in order to prevent the damage mentioned above.
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LM4559xxx
Physical Dimensions Tape and Reel Information
Package Name
SOP8
(Max 5.35 (include.BURR))
(UNIT : mm)
PKG : SOP8
Drawing No. : EX112-5001-1
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
Direction of feed
1pin
Reel
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LM4559xxx
Physical Dimension Tape and Reel Information - continued
Package Name
SOP-J8
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
Direction of feed
1pin
Reel
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LM4559xxx
Physical Dimension Tape and Reel Information - continued
Package Name
SSOP-B8
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
Direction of feed
1pin
Reel
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LM4559xxx
Physical Dimension Tape and Reel Information - continued
Package Name
TSSOP-B8
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
Direction of feed
1pin
Reel
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LM4559xxx
Physical Dimension Tape and Reel Information - continued
Package Name
MSOP8
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
)
1pin
Direction of feed
Reel
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LM4559xxx
Physical Dimension Tape and Reel Information - continued
Package Name
TSSOP-B8J
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
Direction of feed
1pin
Reel
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LM4559xxx
Marking Diagram
SOP8(TOP VIEW)
TSSOP-B8(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
SOP-J8(TOP VIEW)
MSOP8(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
TSSOP-B8J(TOP VIEW)
SSOP-B8(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
Product Name
F
LM4559
Package Type
Marking
SOP8
4559
FJ
SOP-J8
L4559
FV
SSOP-B8
4559
FVT
TSSOP-B8
L4559
FVM
MSOP8
L4559
FVJ
TSSOP-B8J
L4559
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Datasheet
LM4559xxx
Land Pattern Data
All dimensions in mm
Land length
Land width
≥ℓ 2
b2
PKG
Land pitch
e
Land space
MIE
SOP8
1.27
4.60
1.10
0.76
SOP-J8
1.27
3.90
1.35
0.76
SSOP-B8
0.65
4.60
1.20
0.35
TSSOP-B8
0.65
4.60
1.20
0.35
MSOP8
0.65
2.62
0.99
0.35
TSSOP-B8J
0.65
3.20
1.15
0.35
b2
e
MIE
ℓ 2
Revision History
Date
Revision
30.Nov.2012
001
New Release
28.Aug.2013
002
Added LM4559FV, LM4559FJ,LM4559FVT,LM4559FVM,LM4559FVJ
04.Dec.2013
003
Changed Input Bias Current(Max value)
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Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
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