LMR1802G-LBTR

Datasheet Operational Amplifier Low Noise, Low Input Offset Voltage CMOS Operational Amplifier LMR1802G-LB Key Specifications General Description  Input Offset Voltage: 5 μV(Typ)  Input Referred Noise Voltage Density f=10Hz: 7.8 nV/√Hz(Typ) f=1kHz: 2.9 nV/√Hz(Typ)  Input Common Mode Voltage Range: VSS to VDD-1.0 V  Input Bias Current: 0.5 pA(Typ)  Operating Supply Voltage Range Single Supply: 2.5 V to 5.5 V Dual Supply: ±1.25 V to ±2.75 V  Operating Temperature Range: -40 °C to +125 °C This is the product guarantees long time support in Industrial market. And it is suitable for usage of industrial applications. LMR1802G-LB precision single CMOS operational amplifier features low noise, low input offset voltage and low input bias current that are suitable for equipment operating from battery power and using sensors that an amplifier. Features     Package Long Time Support Product for Industrial Applications. Low Input-Referred Noise Voltage Density Driving High Capacitive Load Full-Swing Output W(Typ) x D(Typ) x H(Max) 2.90 mm x 2.80 mm x 1.25 mm SSOP5 Applications        Industrial Equipment Sensor Amplifiers Battery-powered Equipment Current Monitoring Amplifier ADC front ends, Buffer Amplifier Photodiode Amplifier Amplifiers SSOP5 Typical Application Circuit CF = 10 pF RF = 10 kΩ VDD=+2.5 V RIN = 100 Ω VIN OUT 𝑽𝑶𝑼𝑻 = − 𝑹𝒇 𝑽 𝑹𝑰𝑵 𝑰𝑵 VSS=-2.5 V 〇Product structure : Silicon integrated circuit www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 〇This product has no designed protection against radioactive rays 1/19 TSZ02201-0GMG2G501020-1-2 31.Oct.2018 Rev.003 LMR1802G-LB Pin Configuration +IN 1 VSS 2 5 VDD 4 OUT + - -IN 3 (TOP VIEW) Pin Description Pin No. Pin Name Function 1 +IN Non-inverting input 2 VSS Negative power supply / Ground 3 -IN 4 OUT Output 5 VDD Positive power supply Inverting input Block Diagram +IN 1 VSS 2 5 VDD Iref 5 VDD 4 OUT + OPAMP -IN 3 OUT Description of Blocks 1. OPAMP: This block includes a full-swing output operational amplifier with class-AB output circuit and low-noise-ground-sense differential input stage. 2. Iref: This block supplies reference current to operate OPAMP block. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2/19 TSZ02201-0GMG2G501020-1-2 31.Oct.2018 Rev.003 LMR1802G-LB Absolute Maximum Ratings (Ta=25 °C) Parameter Supply Voltage Differential Input Voltage(Note 1) Common-mode Input Voltage Range Input Current Maximum Junction Temperature Storage Temperature Range Symbol Rating Unit VDD-VSS 7.0 V VID VDD - VSS V VICMR (VSS - 0.3) to (VDD + 0.3) V II ±10 mA Tjmax 150 °C Tstg - 55 to + 150 °C Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. (Note 1) The differential input voltage indicates the voltage difference between inverting input and non-inverting input. The input pin voltage is set to VSS or more. Thermal Resistance(Note 2) Parameter Symbol Thermal Resistance (Typ) 1s(Note 4) 2s2p(Note 5) Unit SSOP5 Junction to Ambient θJA 376.5 185.4 °C/W Junction to Top Characterization Parameter (Note 3) ΨJT 40 30 °C/W (Note 2) Based on JESD51-2A(Still-Air). (Note 3) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 4) Using a PCB board based on JESD51-3. (Note 5) Using a PCB board based on JESD51-7. Layer Number of Measurement Board Single Material Board Size FR-4 114.3 mm x 76.2 mm x 1.57 mmt Top Copper Pattern Thickness Footprints and Traces 70 μm Layer Number of Measurement Board Material Board Size 4 Layers FR-4 114.3 mm x 76.2 mm x 1.6 mmt Top 2 Internal Layers Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70 μm 74.2 mm x 74.2 mm 35 μm 74.2 mm x 74.2 mm 70 μm Recommended Operating Conditions Parameter Symbol Min Typ Max Unit Operating Supply Voltage VDD 2.5 ±1.25 5.0 ±2.5 5.5 ±2.75 V Operating Temperature Topr -40 +25 +125 °C www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3/19 TSZ02201-0GMG2G501020-1-2 31.Oct.2018 Rev.003 LMR1802G-LB Electrical Characteristics (Unless otherwise specified VDD=5 V, VSS=0 V, Ta=25 °C) Parameter Symbol Temperature Range Limit Unit Min Typ Max - 5 450 25 °C Input Offset Voltage (Note 1,2) Conditions μV VIO Full range - - 500 ΔVIO/ΔT Full range - 0.4 - μV/°C - Input Offset Current (Note 1) IIO 25 °C - 0.5 - pA - 25 °C - 0.5 220.0 Input Bias Current(Note 1,2) IB pA - Full range - - 3000 25 °C - 1100 1600 μA RL=∞, G=0 dB Full range - - 1650 Input Offset Voltage Temperature Drift(Note 1,2) Supply Current(Note 2) IDD - Output Voltage High VOH 25 °C - 7 50 mV RL=10 kΩ, VOH=VDD-VOUT Output Voltage Low VOL 25 °C - 5 50 mV RL=10 kΩ Large Signal Voltage Gain (Note 2) 25 °C 120 140 - AV dB RL=10 kΩ Full range 100 - - VICMR 25 °C 0 - 4 V VSS to VDD-1.0 V CMRR 25 °C 85 105 - dB - Power Supply Rejection Ratio PSRR 25 °C 90 125 - dB - 2.0 3.5 - Output Source Current(Note 1,3) IOH 25 °C Common-mode Input Voltage Range Common-mode Rejection Ratio Output Sink Current(Note 1,3) IOL VOUT=VDD-0.1 V mA 25 50 - 3 9 - 25 °C VOUT=VSS VOUT=VSS+0.1 V mA 25 50 - VOUT=VDD SR 25 °C - 1.1 - V/μs CL=25 pF GBW 25 °C - 3 - MHz G=40 dB θ 25 °C - 68 - deg G=40 dB Gain Margin Gm 25 °C - 12 - dB - Input-Referred Noise Voltage Density - 7.8 - Vn 25 °C Slew Rate Gain Bandwidth Product Phase Margin Total Harmonic Distortion + Noise THD+N f=10 Hz nV/√Hz 25 °C - 2.9 - - 0.0035 - f=1 kHz % VOUT=4 VP-P, f=1 kHz, LPF=80 kHz (Note 1) Absolute value (Note 2) Full range: Ta=-40 °C to +125 °C (Note 3) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. When the output pins are short-circuited continuously, the output current may decrease due to the temperature rise by the heat generation of inside the IC. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/19 TSZ02201-0GMG2G501020-1-2 31.Oct.2018 Rev.003 LMR1802G-LB Description of Terms in Electrical Characteristics Described below are descriptions of the relevant electrical terms used in this datasheet. Items and symbols generally used are also shown. Note that item names and symbols, and their meanings may differ from those on another manufacturer’s or general documents. 1. Absolute Maximum Ratings Absolute maximum rating items indicates the condition which must not be exceeded even if it is instantaneous. Applying of a voltage exceeding the absolute maximum ratings or use outside the temperature range which is provided in the absolute maximum ratings cause characteristic deterioration or destruction of the IC. 1.1 Supply Voltage (VDD-VSS) This indicates the maximum voltage that can be applied between the positive power supply pin and the negative power supply pin without deteriorating the characteristics of internal circuit or without destroying it. 1.2 Differential Input Voltage (VID) This indicates the maximum voltage that can be applied between the non-inverting input pin and the inverting input pin without deteriorating the characteristics of the IC or without destroying it. 1.3 Common-mode Input Voltage Range (VICM) This indicates the maximum voltage that can be applied to the non-inverting input pin and inverting input pin without deteriorating the characteristics of the IC or without destroying it. Common-mode Input Voltage Range of the maximum ratings does not assure normal operation of IC. For normal operation, use the IC within the Common-mode Input Voltage Range characteristics. 2. Electrical Characteristics 2.1 Input Offset Voltage (VIO) This indicates the voltage difference between non-inverting and inverting pins. It can be translated as the input voltage difference required for setting the output voltage at 0 V. 2.2 Input Offset Voltage Temperature Drift (ΔVIO/ΔT) Denotes the ratio of the input offset voltage fluctuation to the ambient temperature fluctuation. 2.3 Input Offset Current (IIO) This indicates the difference of input bias current between the non-inverting and inverting pins. 2.4 Input Bias Current (IB) This indicates the current that flows into or out from the input pin. It is defined by the average of input bias currents at the non-inverting and inverting pins. 2.5 Supply Current (IDD) This indicates the current of the IC itself flowing under the specified conditions and under no-load or steady-state conditions. 2.6 Output Voltage High / Output Voltage Low (VOH/VOL) This indicates the voltage range of the output under specified load condition. It is divided into output voltage High and low. Output voltage high indicates the upper limit of output voltage. Output voltage low indicates the lower limit. 2.7 Large Signal Voltage Gain (AV) This indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting pin and inverting pin. It is normally the amplifying rate (gain) with reference to DC voltage. AV = (Output voltage) / (Differential input voltage) 2.8 Common-mode Input Voltage Range (VICMR) This indicates the input voltage range where IC normally operates. 2.9 Common-mode Rejection Ratio (CMRR) This indicates the ratio of fluctuation of input offset voltage when Common-mode Input Voltage is changed. It is normally the fluctuation of DC. CMRR = (Change of Input common-mode voltage)/(Input offset fluctuation) 2.10 .Power Supply Rejection Ratio (PSRR) This indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. It is normally the fluctuation of DC. PSRR= (Change of power supply voltage)/(Input offset fluctuation) www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5/19 TSZ02201-0GMG2G501020-1-2 31.Oct.2018 Rev.003 LMR1802G-LB Description of Terms in Electrical Characteristics - continued 2.11 Output Source Current/ Output Sink Current (IOH / IOL) The maximum current that can be output from the IC under specific output conditions. The output source current indicates the current flowing out from the IC, and the output sink current indicates the current flowing into the IC. 2.12 Slew Rate (SR) This is a parameter representing the operational speed of the operational amplifier. This indicates the rate at which the output voltage can change in the specified unit time. 2.13 Gain Bandwidth (GBW) This indicates the product of an arbitrary frequency and its gain in the range of the gain slope of -6 dB/octave. 2.14 Phase Margin (θ) This indicates the margin of phase from the phase delay of 180 degree at the frequency which the gain of the operational amplifier is 1. 2.15. Gain Margin (Gm) This indicates the margin of Gain from 0 dB at the frequency which the phase delay of 180 degree. 2.16. Input-Referred Noise Voltage (Vn) Indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in series with input terminal. 2.17 Total Harmonic Distortion + Noise (THD+N) This indicates the content ratio of harmonic and noise components relative to the output signal. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 6/19 TSZ02201-0GMG2G501020-1-2 31.Oct.2018 Rev.003 LMR1802G-LB Typical Performance Curves 1400 1400 1300 1300 1200 Supply Current IDD [µA] Supply Current IDD [µA] 1200 +25 °C +125 °C 1100 1100 1000 1000 -40 °C 900 800 2.5 V 900 800 700 700 600 600 2 3 4 5 -50 6 -25 0 25 50 75 100 125 150 Ambient Temperature Ta [°C] Supply Voltage VDD [V] Figure 1. Supply Current vs Supply Voltage Figure 2. Supply Current vs Ambient Temperature 20 20 Output Voltage High VOH [mV] Output Voltage High VOH [mV] 5.0 V 3.0 V 15 10 +125 °C +25 °C 5 15 5.0 V 10 3.0 V 5 2.5 V -40 °C 0 0 2 3 4 5 Supply Voltage VDD [V] 6 -50 Figure 3. Output Voltage High vs Supply Voltage (RL=10 kΩ) www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 -25 0 25 50 75 100 125 Ambient Temperature Ta [°C] 150 Figure 4. Output Voltage High vs Ambient Temperature (RL=10 kΩ) 7/19 TSZ02201-0GMG2G501020-1-2 31.Oct.2018 Rev.003 LMR1802G-LB 20 20 15 15 Output Voltage Low VOL [mV] Output Voltage Low VOL [mV] Typical Performance Curves - continued 10 10 +25 °C +125 °C 5 5.0 V 3.0 V 5 -40 °C 0 2.5 V 0 2 3 4 5 6 -50 -25 Supply Voltage VDD [V] 25 50 75 100 125 150 Ambient Temperature Ta [°C] Figure 5. Output Voltage Low vs Supply Voltage (RL=10 kΩ) Figure 6. Output Voltage Low vs Ambient Temperature (RL=10 kΩ) 80 80 70 70 -40 °C 60 Output Sink Current IOL [mA] Output Source Current IOH [mA] 0 50 +25 °C 40 +125 °C 30 20 10 60 -40 °C 50 +25 °C 40 30 +125 °C 20 10 0 0 0 1 2 3 4 5 0 6 Output Voltage VOUT [V] 2 3 4 5 6 Output Voltage VOUT [V] Figure 7. Output Source Current vs Output Voltage (VDD=5 V) www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 1 Figure 8. Output Sink Current vs Output Voltage (VDD=5 V) 8/19 TSZ02201-0GMG2G501020-1-2 31.Oct.2018 Rev.003 LMR1802G-LB 500 500 400 400 300 300 200 Input Offset Voltage VIO [µV] Input Offset Voltage VIO [µV] Typical Performance Curves - continued +125 °C 100 0 -100 -40 °C 200 2.5 V 100 0 -100 +25 °C 3.0 V -300 -300 -400 -400 -500 -500 2 3 4 5 -50 6 Supply Voltage VDD [V] -25 0 25 50 75 100 125 150 Ambient Temperature Ta [°C] Figure 9. Input Offset Voltage vs Supply Voltage Figure 10. Input Offset Voltage vs Ambient Temperature 500 200 400 180 200 Large Signal Voltage Gain AV [dB] 300 Input Offset Voltage VIO [µV] 5.0 V -200 -200 +125 °C 100 0 -100 -40 °C +25 °C -200 -300 -400 160 -40 °C 140 120 +125 °C +25 °C 100 80 60 40 -500 -1 0 1 2 3 4 5 2 6 4 5 6 Supply Voltage VDD [V] Input Common Mode Voltage VICM [V] Figure 11. Input Offset Voltage vs Input Common Mode Voltage (VDD=5 V) www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3 Figure 12. Large Signal Voltage Gain vs Supply Voltage (RL=10 kΩ) 9/19 TSZ02201-0GMG2G501020-1-2 31.Oct.2018 Rev.003 LMR1802G-LB Typical Performance Curves - continued 200 Common Mode Rejection Ratio CMRR [dB] 160 Large Signal Voltage Gain AV [dB] 180 160 5.0 V 140 2.5 V 120 3.0 V 100 80 60 40 -50 -25 0 25 50 75 100 125 140 120 +125 °C 100 60 40 20 0 150 2 3 Ambient Temperature Ta [°C] 4 5 6 Supply Voltage VDD [V] Figure 13. Large Signal Voltage Gain vs Ambient Temperature Figure 14. Common Mode Rejection Ratio vs Supply Voltage 200 Power Supply Rejection Ratio PSRR [dB] 160 Common Mode Rejection Ratio CMRR [dB] +25 °C -40 °C 80 140 120 5.0 V 100 80 2.5 V 3.0 V 60 40 20 0 -50 -25 0 25 50 75 100 125 150 160 140 120 100 80 60 40 20 0 -50 -25 0 25 50 75 100 125 150 Ambient Temperature Ta [°C] Ambient Temperature Ta [°C] Figure 15. Common Mode Rejection Ratio vs Ambient Temperature www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 180 Figure 16. Power Supply Rejection Ratio vs Ambient Temperature 10/19 TSZ02201-0GMG2G501020-1-2 31.Oct.2018 Rev.003 LMR1802G-LB Typical Performance Curves - continued 800 Input-Referred Noise Voltage Density Vn [nV/√Hz] 20 700 Input Bias Current IB [pA] 600 500 400 300 200 100 0 0 25 50 75 100 125 150 15 10 5 0 10 100 4 4 3 3 2 Fall Rise 0 3 4 5 2 Fall Rise 1 0 -50 6 -25 0 25 50 75 100 125 150 Ambient Temperature Ta [°C] Supply Voltage VDD [V] Figure 19. Slew Rate vs Supply Voltage www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 100000 Figure 18. Input-Referred Noise Voltage Density vs Frequency (VDD=5 V) Slew Rate SR [V/µs] Slew Rate SR [V/µs] Figure 17. Input Bias Current vs Ambient Temperature (VDD=5 V) 2 10000 Frequency f [Hz] Ambient Temperature Ta [°C] 1 1000 Figure 20. Slew Rate vs Ambient Temperature (VDD=5 V) 11/19 TSZ02201-0GMG2G501020-1-2 31.Oct.2018 Rev.003 LMR1802G-LB 6 70 5 60 3.0 V 5.0 V Phase Margin θ [deg] Gain Bandwidth Product GBW [MHz] Typical Performance Curves - continued 4 2.5 V 3.0 V 3 2 1 2.5 V 50 40 5.0 V 30 20 10 0 0 -50 -25 0 25 50 75 100 125 150 10 100 Ambient Temperature Ta [°C] Load Capacitance CL [pF] Figure 21. Gain Bandwidth Product vs Ambient Temperature Figure 22. Phase Margin vs Load Capacitance (RF=10 kΩ, G=+40 dB) 240 80 1000 6 Phase 4 CL=500 pF 180 60 CL=600 pF 2 120 40 Gain 60 20 0 102 100 103 1000 0 104 1000001000000 105 106 10000000 107100000000 108 10000 Frequency f [Hz] 0 CL=0 pF -2 -4 -6 102 103 104 105 106 107 108 Frequency f [Hz] Figure 23. Voltage Gain, Phase vs Frequency (VDD=5 V) www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Voltage Gain G [dB] Phase θ [deg] Voltage Gain G [dB] CL=330 pF Figure 24. Voltage Gain vs Frequency (VDD=5 V, G=0 dB, VIN=180 mVPP) 12/19 TSZ02201-0GMG2G501020-1-2 31.Oct.2018 Rev.003 LMR1802G-LB Application Examples ○Voltage Follower Using this circuit, the output voltage (VOUT) is configured to be equal to the input voltage (VIN). This circuit also stabilizes the output voltage (VOUT) due to high input impedance and low output impedance. Computation for output voltage (VOUT) is shown below. VDD OUT 𝑽𝑶𝑼𝑻 = 𝑽𝑰𝑵 IN VSS Voltage Follower Circuit ○Inverting Amplifier RF For inverting amplifier, input voltage (VIN) is amplified by a voltage gain and depends on the ratio of RIN and RF. The out-of-phase output voltage is shown in the next expression. VDD VIN RIN OUT 𝑽𝑶𝑼𝑻 = − 𝑹𝒇 𝑽 𝑹𝑰𝑵 𝑰𝑵 This circuit has input impedance equal to RIN. VSS Inverting Amplifier Circuit ○Non-inverting Amplifier RIN RF For non-inverting amplifier, input voltage (VIN) is amplified by a voltage gain, which depends on the ratio of RIN and RF. The output voltage (VOUT) is in-phase with the input voltage (VIN) and is shown in the next expression. VDD OUT 𝑽𝑶𝑼𝑻 = (𝟏 + VIN 𝑹𝒇 )𝑽 𝑹𝑰𝑵 𝑰𝑵 Effectively, this circuit has high input impedance since its input side is the same as that of the operational amplifier. VSS Non-inverting Amplifier Circuit www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 13/19 TSZ02201-0GMG2G501020-1-2 31.Oct.2018 Rev.003 LMR1802G-LB I/O Equivalence Circuits Pin No. Pin Name Pin Description Equivalence Circuit 5 4 OUT Output 4 2 5 1 3 +IN -IN Input 1, 3 2 www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 14/19 TSZ02201-0GMG2G501020-1-2 31.Oct.2018 Rev.003 LMR1802G-LB Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Recommended Operating Conditions The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 8. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 9. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 15/19 TSZ02201-0GMG2G501020-1-2 31.Oct.2018 Rev.003 LMR1802G-LB Operational Notes – continued 10. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements Parasitic Elements GND GND N Region close-by Example of monolithic IC structure 11. Ceramic Capacitor When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 16/19 TSZ02201-0GMG2G501020-1-2 31.Oct.2018 Rev.003 LMR1802G-LB Ordering Information L M R 1 8 0 2 G - Package G: SSOP5 LBTR Product class LB for Industrial applications Packaging and forming specification TR: Embossed tape and reel Marking Diagram SSOP5(TOP VIEW) 9 T Part Number Marking LOT Number www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 17/19 TSZ02201-0GMG2G501020-1-2 31.Oct.2018 Rev.003 LMR1802G-LB Physical Dimension and Packing Information Package Name www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 SSOP5 18/19 TSZ02201-0GMG2G501020-1-2 31.Oct.2018 Rev.003 LMR1802G-LB Revision History Date Revision 07.May.2018 001 New Release 13.Jun.2018 002 Typical Application Circuit : Addition of CF Electrical Characteristics(Output Voltage High) : Addition to the condition column Electrical Characteristics(Input Offset Voltage Temperature Drift) : Addition of Note 2 31.Oct.2018 003 P4. Change Limits Typical Performance Curves change www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Changes 19/19 TSZ02201-0GMG2G501020-1-2 31.Oct.2018 Rev.003 Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001