MCH03
Ceramic capacitors
Multi-layer ceramic chip capacitors
MCH03 (0603 size, chip capacitor)
!External dimensions (Units : mm)
!Features
1) Small size (0.6 x 0.3 x 0.3 mm) makes it perfect
for lightweight portable devices.
2) Comes packed either in tape to enable automatic
mounting.
3) Precise uniformity of shape and dimensions facilitates
highly efficient automatic mounting.
4) Barrier layer and end terminations to improve
solderability.
0.1Min. 0.17Min.
0.3±0.03
0.3±0.03
0.3±0.03
0.6±0.03
0.3±0.03
!Structure
External electrode ΙΙΙ (coating layer)
Internal electrode
Ceramic element
External electrode ΙΙ (barrier layer)
External electrode Ι (thick membrane layer)
!Product designation
Basic ordening unit (pcs.)
Code Product thickness Packaging specifications
Reel
K
0.3mm
Paper tape (width 8 mm, pitch 2 mm) φ180mm (7in.)
15,000
Reel (φ180, φ330mm) : compatible with EIAJ ET-7200A
Part No.
M C H
Rated voltage
Code Voltage
2
25V
3
16V
5
50V
Packaging style
0 3
2
F N
1 0 3
Z
K
Nominal Capacitance tolerance
Capacitance-temperature characteristics
Code Code Operating temperature (°C) Temp. coefficient or percent change capacitance Code
tolerance
A CG(C0G)
0±30ppm/°C
−55~+125
C ± 0.25pF (0.5 ~ 5pF)
CN
R
−55~+125
±15%
D ± 0.5pF (5.1 ~ 10pF)
3-digit designation J ± 5% (11pF or more)
B
−25~+85
±10%
according to IEC
(X7R)
(−55~+125)
(±15%)
K
± 10%
FN
F
−25~+85
+30%,−80%
(Y5V)
(+22%,−82%)
(−30~+85)
Z + 80%, −20%
∗The design and specifications are subject to change without prior notice. Before ordering or using, please check the latest technical specification.
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MCH03
Ceramic capacitors
!Capacitance range
For thermal compensation
Part number
Capacitance (pF)
MCH03
Temperature
characteristics
Part number
A
(CG) (C0G)
Rated voltage
(V)
Tolerance
Capacitance (pF)
25V
Rated voltage
(V)
Tolerance
0.5
0.75
1
11
12
13
1.1
1.2
1.3
15
16
18
1.5
1.6
1.8
20
22
24
2
2.2
2.4
Temperature
characteristics
MCH03
A
(CG) (C0G)
25V
J ( ± 5%)
27
30
33
C ( ± 0.25pF)
2.7
3
3.3
36
39
43
3.6
3.9
4
47
4.3
4.7
5
Product thickness (mm) 0.3±0.03
5.1
5.6
6
6.2
6.8
7
D ( ± 0.5pF)
7.5
8
8.2
9
9.1
10
High dielectric constant
Part number
Capacitance (pF)
MCH03
Temperature
characteristics
CN (R) (B) (X7R)
FN (F) (Y5V)
Rated voltage (V)
25V
25V
Tolerance
K ( ±10%)
Z ( +80, −20%)
100
150
200
330
470
680
1,000
1,500
2,200
4,700
10,000
Product thickness (mm) 0.3±0.03
∗The design and specifications are subject to change without prior notice. Before ordering or using, please check the latest technical specification.
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MCH03
Ceramic capacitors
!Characteristics
Class 1 (For thermal compensation)
Temperature characteristics
A (CG) (C0G)
Item
Operating temperature
Test methods/conditions
(based on JIS C 5102)
−55°C ~ 125°C
Nominal capacitance (C)
Must be within the specified tolerance range.
Based on paragraph 7.8 and paragraph 9
Measured at room temperature and standard humidity,
Dissipation factor (tanδ)
100/(400+20C)% or less: Less than 30 pF
0.1% or less : 30 pF or larger
1000pF or less Measurement frequency : 1 ± 0.1MHz
Measurement voltage : 1 ± 0.1Vrms.
Over 1000pF Measurement frequency : 1 ± 0.1kHz
Measurement voltage : 1 ± 0.1Vrms.
Insulation resistance (IR)
Withstanding voltage
Temperature characteristics
Terminal adherence
Appearance
Resistance
to vibration
Rate of capacitance change
Dissipation factor (tanδ)
Appearance
Rate of capacitance change
There must be no mechanical damage.
Must be within initial tolerance.
Must satisfy initial specified value.
10,000MΩ or 500MΩ ⋅ µF,
whichever is smaller
The temperature coefficients in table 12, paragraph 7.12 are
calculated at 20°C and high temperature.
Based on paragraph 8.11. 2.
Apply 2N for 10 ± 1s in the
direction indicated by the arrow.
Chip is mounted to a board in the manner
shown on the right, subjected to vibration
(type A in paragraph 8.2), and measured
24 ± 2 hrs. later.
Pressure (2N)
Test board
Capacitor
Board
Based on paragraph 8.13
Soldering temperature : 235 ± 5°C
Soldering time
: 2 ± 0.5s
Based on paragraph 8.14.
Soldering temperature : 260 ± 5°C
Soldering time
: 5 ± 0.5s
Preheating
: 150 ± 10°C for 1 to 2 min.
The insulation must not be damaged.
± 2.5% or ± 0.25 pF, whichever is larger.
Must satisfy initial specified value.
Insulation resistance
10,000MΩ or 500MΩ ⋅ µF,
whichever is smaller
Rate of capacitance change
Based on paragraph 7.1
Apply 300% of the rated voltage for 1 to 5s then measure.
There must be no mechanical damage.
Dissipation factor (tanδ)
Appearance
Based on paragraph 7.6
Measurement is made after rated voltage is applied for 60 ± 5s.
There must be no mechanical damage.
± 2.5% or ± 0.25 pF, whichever is larger.
Insulation resistance
Rate of capacitance change
Hightemperature
load test
No detachment or signs of detachment.
Must satisfy initial specified value.
Appearance
Humidity load
test
Within 0 ± 30ppm/°C
Dissipation factor (tanδ)
Withstanding voltage
Temperature
cycling
The insulation must not be damaged.
At least 3/4 of the surface of the two terminals
must be covered with new solder.
Solderability
Resistance
to soldering
heat
10,000MΩ or 500MΩ ⋅ µF,
whichever is smaller
There must be no mechanical damage.
± 7.5% or ± 0.75 pF, whichever is larger.
Dissipation factor (tanδ)
0.5% or less
Insulation resistance
500MΩ or 25MΩ ⋅ µF,
whichever is smaller
Appearance
There must be no mechanical damage.
Rate of capacitance change
± 3.0% or ± 0.3 pF, whichever is larger.
Dissipation factor (tanδ)
0.3% or less
Insulation resistance
1,000MΩ or 50MΩ ⋅ µF,
whichever is smaller
Based on paragraph 9.3
Number of cycles : 5
Capacitance measured after 24 ± 2 hrs.
Based on paragraph 9.9
Test temperature : 40 ± 2°C
Relative humidity : 90% to 95%
Applied voltage : rated voltage
Test time
: 500 to 524 hrs.
Capacitance measured after 24 ± 2 hrs.
Based on paragraph 9.10
Test temperature : Max. operating temp.
Applied voltage : rated voltage × 200%
Test time
: 1,000 to 1,048 hrs.
Capacitance measured after 24 ± 2 hrs.
∗The design and specifications are subject to change without prior notice. Before ordering or using, please check the latest technical specification.
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MCH03
Ceramic capacitors
Class 2 (High dielectric constant)
Temperature characteristics
CN (R) (B) (X7R)
FN (F) (Y5V)
−55°C ~ +125°C
−30°C ~ +85°C
Item
Operating temperature
Nominal capacitance (C)
Dissipation factor (tanδ)
Insulation resistance (IR)
Withstanding voltage
Temperature characteristics
Terminal adherence
Appearance
Resistance
to vibration
Rate of capacitance change
Dissipation factor (tanδ)
Solderability
Rate of capacitance change
Resistance
to soldering
heat
Within ± 15%
+ 22, + 82%
No detachment or signs of detachment
There must be no mechanical damage.
Must be within initial tolerance.
Must satisfy initial specified value.
Within ± 5.0%
Within ± 20.0%
10,000MΩ or 500MΩ ⋅ µF, whichever is smaller
Rate of capacitance change
Within ± 7.5%
Within ± 20.0%
Must satisfy initial specified value.
10,000MΩ or 500MΩ ⋅ µF, whichever is smaller
Insulation resistance
Appearance
Rate of capacitance change
Dissipation factor (tanδ)
Insulation resistance
The temperature coefficients in paragraph 7.12,
table 8, condition B, are based on measurements
carried out at 20°C, with no voltage applied.
Based on paragraph 8. 11. 2.
Apply 2N for 10 ± 1s
in the direction indicated
by the arrow.
Pressure (2N)
Test board
Capacitor
Chip is mounted to a board in the
manner shown on the right, subjected
to vibration (type A in paragraph 8.2),
and measured 48 ± 4 hrs. later.
Board
Based on paragraph 8. 13
Soldering temperature : 235 ± 5°C
: 2 ± 0.5s
Soldering time
Based on paragraph 8. 14.
Soldering temperature : 260 ± 5°C
Soldering time
: 5 ± 0.5s
Preheating
: 150 ± 10°C for
1 to 2 min.
The insulation must not be damaged.
Insulation resistance
Dissipation factor (tanδ)
Based on paragraph 7.1
Apply 250% of the rated voltage for 1 to 5s then measure.
There must be no mechanical damage.
Dissipation factor (tanδ)
Appearance
Based on paragraph 7.6
Measurement is made after rated voltage
is applied for 60 ± 5s.
There must be no mechanical damage.
Insulation resistance
Rate of capacitance change
Hightemperature
load test
The insulation must not be damaged.
Must satisfy initial specified value.
Appearance
Humidity load
test
10,000MΩ or 500MΩ ⋅ µF, whichever is smaller
Dissipation factor (tanδ)
Withstanding voltage
Temperature
cycling
Based on paragraph 7.8
Measured at room temperature and standard humidity,
Measurement frequency: 1 ± 0.1 kHz
2.5% or less
5.0% or less
(when rated voltage is 16V: 3.5% or less) (when rated voltage is 16V: 7.5% or less) Measurement voltage : 1.0 ± 0.2 Vrms.
Must be within the specified tolerance range.
At least 3/4 of the surface of the two terminals must be covered with new solder.
Appearance
Test methods/conditions
(based on JIS C 5102)
There must be no mechanical damage.
± 12.5% or less
Within ± 30.0%
5.0% or less
7.5% or less
(when rated voltage is 16V: 10.0%)
500MΩ or 25MΩ ⋅ µF, whichever is smaller
Based on paragraph 9.3
Number of cycles : 5
Capacitance measured after 48 ± 4 hrs.
Based on paragraph 9.9
Test temperature : 40 ± 2°C
Relative humidity : 90% to 95%
Applied voltage : rated voltage
Test time
: 500 to 524 hrs.
Capacitance measured after 48 ± 4 hrs.
There must be no mechanical damage.
Within ± 10.0%
Within ± 30.0%
5.0% or less
7.5% or less
(when rated voltage is 16V: 10.0%)
Based on paragraph 9.10
Test temperature : Max. operating temp.
Applied voltage : rated voltage × 200%
Test time
: 1,000 to 1,048 hrs.
Capacitance measured after 48 ± 4 hrs.
1,000MΩ or 50MΩ ⋅ µF, whichever is smaller
∗The design and specifications are subject to change without prior notice. Before ordering or using, please check the latest technical specification.
4/6
MCH03
Ceramic capacitors
!Packaging specifications
(Units : mm)
Reel
φ180 mm plastic reel
φJ
9.0 ± 0.3
t
A
D
φ13 ± 0.2
E
C
B
11.4 ± 1.0
φ 60 + 1
0
0
φ180 −1.5
Taping
F
t1
H
C
Symbol
D
E
Label position
Pulling direction
(Paper taping)
F
H
J
t
t1
8.0
3.5 1.75 2.0 4.0 φ1.5 0.37 0.5
Dimensions
±0.3 ±0.05 ±0.1 ±0.05 ±0.1 +0.1
±0.02 MAX.
0
Symbol
Size
0603
A
B
0.37±0.03
0.67±0.03
∗The design and specifications are subject to change without prior notice. Before ordering or using, please check the latest technical specification.
5/6
MCH03
Ceramic capacitors
!Electrical characteristics
gA (C0G) Characteristics
1000000
RATE OF CAPACITANCE CHANGE : (%)
5
4
100000
3
10000
2
1
1000
IMPEDANCE (Ω)
0
−1
−2
−3
−4
−5
−50
0
50
0.5pF
100
10pF
10
1
0.1
100
1
10
100
1000
TEMPERATURE (°C)
FREQUENCY (MHz)
Fig.1 Capacitance-temperature
characteristics
Fig.2 Impedance-frequency
characteristics
10000
gCN (X7R) Characteristics
1000000
20
100000
10
0
10000
−10
−20
10
5
−80
−40
0
40
80
120
1000
IMPEDANCE (Ω)
−30
Dissipation factor (%)
CAPACITANCE CHANGE : (%)
30
100
10
0.1
160
1000pF
1
1
10
100
1000
10000
FREQUENCY (MHz)
TEMPERATURE : (°C)
Fig.4 Impedance-frequency
characteristics
Fig.3 Capacitance-temperature
characteristics
20
10
0
−10
−20
−30
−40
−50
−60
−70
−80
60
50
40
30
20
10
−80
−40
0
40
80
120
Dissipation factor (%)
CAPACITANCE CHANGE : (%)
gFN (Y5V) Characteristics
160
TEMPERATURE : (°C)
Fig.5 Capacitance-temperature
characteristics
∗The design and specifications are subject to change without prior notice. Before ordering or using, please check the latest technical specification.
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