QH8KB5
Datasheet
40V Nch+Nch Power MOSFET
l Outline
VDSS
40V
RDS(on)(Max.)
44mΩ
ID
±7.5A
PD
1.5W
l Features
1) Low on - resistance
2) Small Surface Mount Package (TSMT8)
3) Pb-free plating ; RoHS compliant
4) Halogen Free
TSMT8
l Inner circuit
l Packaging specifications
Embossed
Tape
180
8
3000
TCR
KB5
Packing
l Application
Switching
Type
Reel size (mm)
Tape width (mm)
Quantity (pcs)
Taping code
Marking
l Absolute maximum ratings (Ta = 25°C ,unless otherwise specified)
Parameter
Symbol
VDSS
ID*1
IDP*2
VGSS
Value
Unit
40
V
±7.5
A
±18
±20
4.5
A
V
A
mJ
Junction temperature
PD*5
Tj
1.6
1.5
1.1
150
Operating junction and storage temperature range
Tstg
-55 to +150
℃
Drain - Source voltage
Continuous drain current
Pulsed drain current
Gate - Source voltage
Avalanche current, single pulse
IAS*3
EAS*3
PD*4
Avalanche energy, single pulse
Power dissipation (total)
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1/11
W
℃
20210804 - Rev.005
QH8KB5
Datasheet
l Thermal resistance
Parameter
Values
Symbol
Thermal resistance, junction - ambient (total)
Unit
Min.
Typ.
Max.
RthJA*4
-
-
83.3
RthJA*5
-
-
113
℃/W
l Electrical characteristics (T a = 25°C)
Parameter
Symbol
Drain - Source breakdown
voltage
Breakdown voltage
temperature coefficient
V(BR)DSS VGS = 0V, ID = 1mA
ΔV(BR)DSS
Values
Conditions
ID = 1mA
Unit
Min.
Typ.
Max.
40
-
-
V
-
28.9
-
mV/℃
ΔTj
referenced to 25℃
Zero gate voltage
drain current
IDSS
VDS = 40V, VGS = 0V
-
-
1
μA
Gate - Source
leakage current
IGSS
VGS = ±20V, VDS = 0V
-
-
±100
nA
Gate threshold
voltage
VGS(th)
VDS = VGS, ID = 1mA
1.0
-
2.5
V
-
-4.6
-
mV/℃
VGS = 10V, ID = 4.5A
-
34
44
VGS = 4.5V, ID = 4.5A
-
44
74
-
2.7
-
Ω
1.7
-
-
S
Gate threshold voltage
temperature coefficient
Static drain - source
on - state resistance
ΔVGS(th) ID = 1mA
ΔTj
RDS(on)*6
Gate resistance
RG
Forward Transfer
Admittance
|Yfs| *6
referenced to 25℃
VDS = 5.0V, ID = 4.5A
mΩ
*1 Pw ≤ 1s, Mounted on a ceramic board (30×30×0.8mm), Limited only by maximum temperature allowed.
*2 Pw ≤ 10μs, Duty cycle ≤ 1%
*3 L ⋍ 0.1mH, V DD = 20V, RG = 25Ω, Starting Tj = 25℃ Fig.3-1,3-2
*4 Mounted on a ceramic board (30×30×0.8mm)
*5 Mounted on a FR4 (25×25×0.8mm)
*6 Pulsed
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2/11
20210804 - Rev.005
QH8KB5
Datasheet
l Electrical characteristics (Ta = 25°C)
Values
Parameter
Symbol
Conditions
Unit
Min.
Typ.
Max.
Input capacitance
Ciss
VGS = 0V
-
150
-
Output capacitance
Coss
VDS = 20V
-
85
-
Reverse transfer capacitance
Crss
f = 1MHz
-
10
-
VDD ⋍ 20V,VGS = 10V
-
5.0
-
tr*6
ID = 2.25A
-
4.4
-
td(off)*6
RL = 8.89Ω
-
11.0
-
tf*6
RG = 10Ω
-
2.7
-
Turn - on delay time
Rise time
td(on)*6
pF
ns
Turn - off delay time
Fall time
l Gate charge characteristics (Ta = 25°C)
Values
Parameter
Total gate charge
Symbol
Conditions
VGS = 10V
Qg*6
Gate - Source charge
Qgs*6
Gate - Drain charge
Qgd*6
VDD ⋍ 20V
ID = 4.5A
Unit
Min.
Typ.
Max.
-
3.5
-
-
1.8
-
-
1.1
-
-
0.3
-
nC
VGS = 4.5V
l Body diode electrical characteristics (Source-Drain) (Ta = 25°C)
Values
Parameter
Continuous forward current
Symbol
IS
Pulse forward current
ISP*2
Forward voltage
VSD*6
Reverse recovery time
trr*6
Reverse recovery charge
Qrr*6
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Conditions
Unit
Min.
Typ.
Max.
-
-
1.25
-
-
18
VGS = 0V, IS = 1.25A
-
-
1.2
V
IS = 4.5A, VGS = 0V
di/dt = 100A/μs
-
18
-
ns
-
11
-
nC
Ta = 25℃
3/11
A
20210804 - Rev.005
QH8KB5
Datasheet
l Electrical characteristic curves
Fig.1 Power Dissipation Derating Curve
Fig.2 Maximum Safe Operating Area
Fig.3 Normalized Transient Thermal
Resistance vs. Pulse Width
Fig.4 Single Pulse Maximum Power
Dissipation
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4/11
20210804 - Rev.005
QH8KB5
Datasheet
l Electrical characteristic curves
Fig.5 Typical Output Characteristics(I)
Fig.6 Typical Output Characteristics(II)
Fig.7 Breakdown Voltage vs.
Junction Temperature
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5/11
20210804 - Rev.005
QH8KB5
Datasheet
l Electrical characteristic curves
Fig.8 Typical Transfer Characteristics
Fig.9 Gate Threshold Voltage vs.
Junction Temperature
Fig.10 Forward Transfer Admittance vs.
Drain Current
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6/11
20210804 - Rev.005
QH8KB5
Datasheet
l Electrical characteristic curves
Fig.11 Drain Current Derating Curve
Fig.12 Static Drain - Source On - State
Resistance vs. Gate Source Voltage
Fig.13 Static Drain - Source On - State
Resistance vs. Junction Temperature
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7/11
20210804 - Rev.005
QH8KB5
Datasheet
l Electrical characteristic curves
Fig.14 Static Drain - Source On - State
Resistance vs. Drain Current (I)
Fig.15 Static Drain - Source On - State
Resistance vs. Drain Current (II)
Fig.16 Static Drain - Source On - State
Resistance vs. Drain Current (III)
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8/11
20210804 - Rev.005
QH8KB5
Datasheet
l Electrical characteristic curves
Fig.17 Typical Capacitances vs.
Drain - Source Voltage
Fig.18 Switching Characteristics
Fig.19 Typical Gate Charge
Fig.20 Source Current vs.
Source Drain Voltage
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9/11
20210804 - Rev.005
QH8KB5
Datasheet
l Measurement circuits
Fig.1-1 Switching Time Measurement Circuit
Fig.1-2 Switching Waveforms
Fig.2-1 Gate Charge Measurement Circuit
Fig.2-2 Gate Charge Waveform
Fig.3-1 Avalanche Measurement Circuit
Fig.3-2 Avalanche Waveform
l Notice
This product might cause chip aging and breakdown under the large electrified environment.
Please consider to design ESD protection circuit.
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10/11
20210804 - Rev.005
QH8KB5
Datasheet
l Dimensions
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© 2021 ROHM Co., Ltd. All rights reserved.
11/11
20210804 - Rev.005
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
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Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
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Rev.004
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001