QS5U34
Transistors
1.8V Drive Nch+SBD MOSFET
QS5U34
zDimensions (Unit : mm)
zStructure
Silicon N-channel MOSFET
Schottky Barrier DIODE
TSMT5
1.0MAX
2.9
1.9
0.95 0.95
(5)
(4)
(2)
(3)
0.7
1.6
2.8
zFeatures
1) The QS5U34 combines Nch MOSFET with a
Schottky barrier diode in a single TSMT5 package.
2) Low on-state resistance with fast switching.
3) Low voltage drive (1.8V).
4) The Independently connected Schottky barrier diode
has low forward voltage.
0.85
0~0.1
0.3~0.6
(1)
0.4
0.16
Each lead has same dimensions
Abbreviated symbol : U34
zApplications
Load switch, DC / DC conversion
zEquivalent circuit
zPackaging specifications
Package
Type
Code
Quantity (pcs)
Taping
(5)
(4)
TR
3000
QS5U34
∗2
∗1
(1)
(2)
∗1 ESD protection diode
∗2 Body diode
(3)
(1)Gate
(2)Source
(3)Anode
(4)Cathode
(5)Drain
20190527-Rev.002 1/4
QS5U34
Transistors
zAbsolute maximum ratings (Ta=25°C)
Symbol
VDSS
VGSS
ID
IDP ∗1
IS
ISP ∗1
Tch
PD ∗3
Limits
20
10
±1.5
±3.0
0.6
2.4
150
0.9
Unit
V
V
A
A
A
A
°C
W/ELEMENT
Repetitive peak reverse voltage
Reverse voltage
Forward current
Forward current surge peak
Junction temperature
Power dissipation
VRM
VR
IF
IFSM
Tj
PD
30
20
0.5
2.0
150
0.7
V
V
A
A
°C
W/ELEMENT
Total power dissipation
Range of Storage temperature
PD ∗3
Tstg
Parameter
Drain-source voltage
Gate-source voltage
Drain current
Source current
(Body diode)
Continuous
Pulsed
Continuous
Pulsed
Channel temperature
Power dissipation
∗2
∗3
1.25
−55 to +150
W / TOTAL
°C
∗1 Pw≤10µs, Duty cycle≤1% ∗2 60Hz•1cyc. ∗3 Mounted on a ceramic board
zElectrical characteristics (Ta=25°C)
Symbol
Parameter
Gate-source leakage
IGSS
Drain-source breakdown voltage V(BR) DSS
Zero gate voltage drain current
IDSS
Gate threshold voltage
VGS (th)
Static drain-source on-state
resistance
Forward transfer admittance
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Total gate charge
Gate-source charge
Gate-drain charge
RDS (on) ∗
Yfs
Ciss
Coss
Crss
td (on)
tr
td (off)
tf
Qg
Qgs
Qgd
∗
∗
∗
∗
∗
∗
∗
∗
Min.
−
20
−
0.3
−
−
−
1.6
−
−
−
−
−
−
−
−
−
−
Typ.
−
−
−
−
130
170
220
−
110
18
15
5
5
20
3
1.8
0.3
0.3
Max.
10
−
1
1.3
180
240
310
−
−
−
−
−
−
−
−
2.5
−
−
Unit
µA
V
µA
V
mΩ
mΩ
mΩ
S
pF
pF
pF
ns
ns
ns
ns
nC
nC
nC
Conditions
VGS=10V / VDS=0V
ID=1mA, / VGS=0V
VDS=20V / VGS=0V
VDS=10V / ID=1mA
ID=1.5A, VGS=4.5V
ID=1.5A, VGS=2.5V
ID=0.8A, VGS=1.8V
VDS=10V, ID=1.5A
VDS=10V
VGS=0V
f=1MHz
ID=1.0A
VDD 10V
VGS=4.5V
RL=10Ω
RG=10Ω
VDD 10V
VGS=4.5V
ID=1.5A
−
−
1.2
V
IS=0.6A / VGS=0V
−
−
−
−
−
−
0.36
0.47
100
V
V
µA
IF=0.1A
IF=0.5A
VR=20V
∗Pulsed
Body diode (source-drain)
VSD
Forward voltage
Forward voltage
VF
Reverse current
IR
20190527-Rev.002 2/4
QS5U34
Transistors
zElectrical characteristic curves
1000
Ta=25°C
VDD=10V
VGS=4.5V
RG=10Ω
Pulsed
SWITCHING TIME : t (ns)
Ciss
100
100
tf
td(off)
10
td(on)
tr
Coss
Crss
0.1
1
10
1
0.01
100
0.1
1
STATIC DRAIN-SOURCE
ON-STATE RESISTANCE : RDS(on) (mΩ)
VDS=10V
Pulsed
Ta=125°C
75°C
25°C
−25°C
0.1
0.01
0.001
0.0001
0.0
0.5
1.0
1.5
2.0
STATIC DRAIN-SOURCE
ON-STATE RESISTANCE : RDS (on) (mΩ)
VGS=1.8V
Pulsed
100
0.1
1
DRAIN CURRENT : ID (A)
Fig.7 Static Drain-Source
On-State Resistance
vs. Drain Current ( Ι )
10
0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
Fig.3 Dynamic Input Characteristics
10
350
VGS=0V
Pulsed
300
ID=1.5A
250
200
ID=0.8A
100
Ta=125°C
75°C
1
25°C
−25°C
0.1
50
0
0
1
2
3
4
5
6
7
8
9
10
0.01
0.0
0.5
VGS=2.5V
Pulsed
Ta=125°C
75°C
25°C
−25°C
100
10
0.01
0.1
1
DRAIN CURRENT : ID (A)
Fig.8 Static Drain-Source
On-State Resistance
vs. Drain Current ( ΙΙ )
1.5
Fig.6 Source Current vs.
Source-Drain Voltage
Fig.5 Static Drain-Source
On-State Resistance vs.
Gate-source Voltage
1000
1.0
SOURCE-DRAIN VOLTAGE : VSD (V)
GATE-SOURCE VOLTAGE : VGS (V)
25°C
−25°C
10
0.01
0
0.0 0.2
Ta=25°C
Pulsed
Fig.4 Typical Transfer Characteristics
Ta=125°C
75°C
1
Fig.2 Switching Characteristics
400
GATE-SOURCE VOLTAGE : VGS (V)
1000
2
TOTAL GATE CHARGE : Qg (nC)
450
150
3
10
500
STATIC DRAIN-SOURCE
ON-STATE RESISTANCE : RDS (on) (mΩ)
DRAIN CURRENT : ID (A)
10
Ta=25°C
VDD=10V
ID=1.5A
4 RG=10Ω
Pulsed
DRAIN CURRENT : ID (A)
DRAIN-SOURCE VOLTAGE : VDS (V)
Fig.1 Typical Capacitance
vs. Drain-Source Voltage
1
SOURCE CURRENT : IS (A)
10
0.01
5
10
STATIC DRAIN-SOURCE
ON-STATE RESISTANCE : RDS (on) (mΩ)
CAPACITANCE : C (pF)
Ta=25°C
f=1MHz
VGS=0V
GATE-SOURCE VOLTAGE : VGS (V)
1000
1000
VGS=4.5V
Pulsed
Ta=125°C
75°C
25°C
−25°C
100
10
0.01
0.1
1
10
DRAIN CURRENT : ID (A)
Fig.9 Static Drain-Source
On-State Resistance
vs. Drain Current ( ΙΙΙ )
20190527-Rev.002 3/4
QS5U34
Transistors
100
Ta=125 C
75 C
25 C
−25 C
100
Reverse Current : IR[mA]
Forward Current : IF [mA]
1000
10
125°C
10
1
75°C
0.1
25°C
0.01
1
−25°C
0.001
0.1
0.0001
0
0.1
0.2
0.3
0.4
0.5
0.6
Forward Voltage :VF [V]
Fig.10 Forward Temperature Characteristics
0
10
20
30
40
Reverse Voltage : VR[V]
Fig.11 Reverse Temperature Characteristics
20190527-Rev.002 4/4
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
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serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
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a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
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[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
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When disposing Products please dispose them properly using an authorized industry waste company.
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All information and data including but not limited to application example contained in this document is for reference
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Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
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3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
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4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001