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QS8J12TCR

QS8J12TCR

  • 厂商:

    ROHM(罗姆)

  • 封装:

    SMD8

  • 描述:

    Mosfet Array 2 P-Channel (Dual) 12V 4.5A 550mW Surface Mount TSMT8

  • 数据手册
  • 价格&库存
QS8J12TCR 数据手册
QS8J12   -12V Pch+Pch Middle Power MOSFET    Datasheet l Outline             RDS(on)(Max.) 29mΩ ID ±4.5A   e N co ew m m D es en ig de ns d f -12V or TSMT8 VDSS PD 1.5W               l Features                   l Inner circuit 1) Low on - resistance. 2) -1.5V Drive. 3) Built-in G-S Protection Diode. 4) Small Surface Mount Package (TSMT8). 5) Pb-free lead plating ; RoHS compliant l Packaging specifications Packing l Application Switching Type Reel size (mm) 180 Tape width (mm) 8 Basic ordering unit (pcs) R Embossed Tape 3000 Taping code TR Marking J12 ot l Absolute maximum ratings (Ta = 25°C) Parameter N Drain - Source voltage Continuous drain current Pulsed drain current Gate - Source voltage total Power dissipation Symbol Value Unit VDSS -12 V ID ±4.5 A ID,pulse*1 ±18 A VGSS 0~-8 V PD*2 element total Junction temperature Range of storage temperature 1.5 1.25 W PD*3 0.7 Tj 150 ℃ Tstg -55 to +150 ℃                                                                                           www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. 1/11 20150730 - Rev.001                         Datasheet                                     l Thermal resistance Parameter Symbol total Thermal resistance, junction - ambient RthJA*2 element RthJA*3 total Values Min. Typ. Max. - - 83.3 - - 100 - - 178 or QS8J12 e N co ew m m D es en ig de ns d f l Electrical characteristics (T a = 25°C) Parameter Symbol Drain - Source breakdown voltage Breakdown voltage temperature coefficient Conditions V(BR)DSS VGS = 0V, ID = -1mA ΔV(BR)DSS   ΔTj ID = -1mA   referenced to 25℃ Values Unit ℃/W     Unit Min. Typ. Max. -12 - - V - -5.0 - mV/℃ Zero gate voltage drain current IDSS VDS = -12V, VGS = 0V - - -10 μA Gate - Source leakage current IGSS VDS = 0V, VGS = -8V - - -10 μA Gate threshold voltage VGS(th) VDS = -6V, ID = -1mA -0.3 - -1.0 V - 2.7 - mV/℃ VGS = -4.5V, ID = -4.5A - 21 29 VGS = -2.5V, ID = -2.2A - 27 38 VGS = -1.8V, ID = -2.2A - 37 55 VGS = -1.5V, ID = -0.9A - 49 98 RG f = 1MHz, open drain - 20 - Ω |Yfs| *4 VDS = -6V, ID = -4.5A 5.5 - - S Gate threshold voltage temperature coefficient ΔVGS(th) ID = -1mA   ΔTj ot R Static drain - source on - state resistance Gate input resistance N Forward Transfer Admittance RDS(on)*4   referenced to 25℃                                                   www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. 2/11   mΩ                                            20150730 - Rev.001        QS8J12          Datasheet l Electrical characteristics (Ta = 25°C) Parameter Symbol Conditions Values Min. Typ. Max. Ciss VGS = 0V - 4200 - Output capacitance Coss VDS = -6V - 350 - Reverse transfer capacitance Crss f = 1MHz - VDD ⋍ -6V,VGS = -4.5V - Rise time Turn - off delay time Fall time td(on)*4 330 - 16 - e N co ew m m D es en ig de ns d f Turn - on delay time pF or Input capacitance Unit tr*4 ID = -2.2A - 60 - td(off)*4 RL = 2.7Ω - 400 - tf*4 RG = 10Ω - 150 - ns l Gate charge characteristics (Ta = 25°C) Parameter Symbol Conditions Values Min. Typ. Max. Total gate charge Qg*4 VDD ⋍ -6V - 40 - Gate - Source charge Qgs*4 ID = -4.5A - 6.5 - Gate - Drain charge Qgd*4 VGS = -4.5V - 6.0 - Unit nC l Body diode electrical characteristics (Source-Drain) (Ta = 25°C) R Parameter ot Body diode continuous forward current Symbol IS Values Min. Typ. Max. - - -1 Ta = 25℃ Body diode pulse current ISP*1 Forward voltage VSD*4 N Conditions VGS = 0V, IS = -4.5A Unit A - - -18 - - -1.2 V *1 Pw≦10μs , Duty cycle≦1% *2 Mounted on a ceramic board (30×30×0.8mm) *3 Mounted on a FR4 (20×20×0.8mm) *4 Pulsed                                                                                             www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. 3/11 20150730 - Rev.001        QS8J12          Datasheet l Electrical characteristic curves Fig.2 Maximum Safe Operating Area e N co ew m m D es en ig de ns d f or Fig.1 Power Dissipation Derating Curve Fig.4 Single Pulse Maximum Power     dissipation N ot R Fig.3 Normalized Transient Thermal     Resistance vs. Pulse Width                                                                                             www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. 4/11 20150730 - Rev.001        QS8J12          Datasheet l Electrical characteristic curves Fig.6 Typical Output Characteristics(II) e N co ew m m D es en ig de ns d f or Fig.5 Typical Output Characteristics(I) Fig.8 Typical Transfer Characteristics N ot R Fig.7 Breakdown Voltage vs.      Junction Temperature                                                                                             www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. 5/11 20150730 - Rev.001        QS8J12          Datasheet l Electrical characteristic curves Fig.10 Forward Transfer Admittance vs.      Drain Current e N co ew m m D es en ig de ns d f or Fig.9 Gate Threshold Voltage vs.      Junction Temperature Fig.12 Static Drain - Source On - State    Resistance vs. Gate Source Voltage N ot R Fig.11 Drain Current Derating Curve                                                                                             www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. 6/11 20150730 - Rev.001        QS8J12          Datasheet l Electrical characteristic curves Fig.14 Static Drain - Source On - State      Resistance vs. Drain Current (I) N ot R e N co ew m m D es en ig de ns d f or Fig.13 Static Drain - Source On - State    Resistance vs. Junction Temperature                                                                                             www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. 7/11 20150730 - Rev.001        QS8J12          Datasheet l Electrical characteristic curves Fig.16 Static Drain - Source On - State      Resistance vs. Drain Current (IlI) e N co ew m m D es en ig de ns d f or Fig.15 Static Drain - Source On - State      Resistance vs. Drain Current (II) Fig.18 Static Drain - Source On - State      Resistance vs. Drain Current (V) N ot R Fig.17 Static Drain - Source On - State      Resistance vs. Drain Current (IV)                                                                                             www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. 8/11 20150730 - Rev.001        QS8J12          Datasheet l Electrical characteristic curves Fig.20 Switching Characteristics e N co ew m m D es en ig de ns d f or Fig.19 Typical Capacitance vs.       Drain - Source Voltage Fig.22 Source Current vs.       Source Drain Voltage N ot R Fig.21 Dynamic Input Characteristics                                                                                             www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. 9/11 20150730 - Rev.001        QS8J12          Datasheet l Measurement circuits Fig. 1-2 SWITCHING WAVEFORMS e N co ew m m D es en ig de ns d f or Fig. 1-1 SWITCHING TIME MEASUREMENT CIRCUIT Fig. 2-1 GATE CHARGE MEASUREMENT CIRCUIT l Notice Fig. 2-2 GATE CHARGE WAVEFORM N ot R This product might cause chip aging and breakdown under the large electrified environment. Please consider to design ESD protection circuit.                                                                                             www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. 10/11 20150730 - Rev.001        QS8J12          Datasheet N ot R e N co ew m m D es en ig de ns d f or l Dimensions                                                                                             www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. 11/11 20150730 - Rev.001 N R or e N co ew m m D es en ig de ns d f ot
QS8J12TCR 价格&库存

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QS8J12TCR
    •  国内价格 香港价格
    • 1+5.456521+0.66052
    • 10+4.4769410+0.54194
    • 50+2.9144750+0.35280
    • 100+2.76874100+0.33516
    • 500+2.32348500+0.28126
    • 1000+2.242521000+0.27146
    • 2000+2.088702000+0.25284
    • 4000+2.064414000+0.24990

    库存:30