R5205CNDTL

R5205CND 　　Nch 525V 5A Power MOSFET 　　 Datasheet l Outline TO-252 RDS(on)(Max.) 1.6Ω SC-63 ID ±5A CPT3 PD 65W 　 　 or 500V e N co ew m m D es en ig de ns d f VDSS 　 　 　 　 　 　 l Inner circuit l Features 1) Low on-resistance. 2) Fast switching speed. 3) Gate-source voltage (VGSS) guaranteed 　　to be ±30V. 4) Drive circuits can be simple. 5) Parallel use is easy. 6) Pb-free lead plating ; RoHS compliant l Packaging specifications Packing l Application Type Switching Power Supply Reel size (mm) Tape width (mm) Basic ordering unit (pcs) Taping code Marking Embossed Tape 330 16 2500 TL R5205C R l Absolute maximum ratings (Ta = 25°C ,unless otherwise specified) ot Parameter Drain - Source voltage TC = 25°C TC = 100°C N Continuous drain current Symbol VDSS ID*1 ID*1 IDP*2 VGSS IAS*3 EAS*3 EAR*4 PD Tj Tstg Pulsed drain current Gate - Source voltage Avalanche current, single pulse Avalanche energy, single pulse Avalanche energy, repetitive Power dissipation (Tc = 25°C) Junction temperature Operating junction and storage temperature range Reverse diode dv/dt dv/dt Value 500 ±5 ±2.4 ±20 ±30 2.5 1.6 1.3 65 150 -55 to +150 15 Unit V A A A V A mJ mJ W ℃ ℃ V/ns 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. 1/13 20160324 - Rev.003 　 　 　 　 　 　　 　 R5205CND 　　　　　　　　 Datasheet l Absolute maximum ratings Symbol Drain - Source voltage slope Conditions Unit 50 V/ns VDS = 400V, ID = 5A dv/dt Tj = 125℃ 　 l Thermal resistance Parameter Values 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 or Parameter Values Symbol Unit Typ. Max. e N co ew m m D es en ig de ns d f Min. Thermal resistance, junction - case RthJC - - 1.91 ℃/W Thermal resistance, junction - ambient RthJA - - 100 ℃/W Soldering temperature, wavesoldering for 10s Tsold - - 265 ℃ l Electrical characteristics (Ta = 25°C) Parameter Symbol Values Conditions Unit Min. Typ. Max. 500 - - V V V(BR)DSS VGS = 0V, ID = 1mA Drain - Source avalanche breakdown voltage V(BR)DS VGS = , ID = - - - VDS = 500V, VGS = 0V 　 　 　 Tj = 25°C - - 100 Tj = 125°C - - - IGSS VGS = ±25V, VDS = 0V - - ±10 μA VGS(th) VDS = 10V, ID = 1mA 2.5 - 4.5 V VGS = 10V, ID = 2.5A 　 　 　 Tj = 25°C - 1.3 1.6 Tj = 125°C - 2.85 - f = 1MHz, open drain - 7.4 - R Drain - Source breakdown voltage ot Zero gate voltage drain current Gate - Source leakage current N Gate threshold voltage Static drain - source on - state resistance Gate resistance IDSS RDS(on)*6 RG 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　　 　 　 　 　　 　 　 　 　 　 　 　 www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. 2/13 　 μA Ω Ω 　 　 　 　 　 　　 　 　 　 　 　 　 　 　 　 　 20160324 - Rev.003 　 　 　 　　 　 R5205CND 　　　　　　　　 Datasheet l Electrical characteristics (Ta = 25°C) Symbol Values Conditions Min. Typ. Max. 1.5 2.5 - Forward Transfer Admittance |Yfs| *6 Input capacitance Ciss VGS = 0V - Output capacitance Coss VDS = 25V - Crss Effective output capacitance, energy related Co(er) Effective output capacitance, time related Co(tr) Turn - on delay time td(on)*6 Turn - off delay time Fall time 320 - 180 - e N co ew m m D es en ig de ns d f Reverse transfer capacitance Rise time VDS = 10V, ID = 2.5A f = 1MHz VGS = 0V, VDS = 0V to 400V Unit S or Parameter - 15 - - 15.5 - pF pF - 43.1 - VDD ⋍ 250V, VGS = 10V - 20 - tr*6 ID = 2.5A - 25 - td(off)*6 RL ⋍ 100Ω - 40 80 tf*6 RG = 10Ω - 20 40 ns l Gate charge characteristics (Ta = 25°C) Parameter Symbol Values Conditions Min. Typ. Max. Qg*6 VDD ⋍ 250V - 10.8 - Gate - Source charge Qgs*6 ID = 5A - 3.2 - Gate - Drain charge Qgd*6 VGS = 10V - 4.4 - Gate plateau voltage V(plateau) VDD ⋍ 250V, ID = 5A - 6.5 - nC V ot R Total gate charge Unit N *1 Limited only by maximum temperature allowed. *2 Pw ≤ 10μs, Duty cycle ≤ 1% *3 L⋍500μH, VDD=50V, RG=25Ω, starting Tj=25°C *4 L⋍500μH, VDD=50V, RG=25Ω, starting Tj=25°C, f=10kHz *5 Reference measurement circuits Fig.5-1. *6 Pulsed 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　　 　 　 　 　 　 　 　 　 www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. 3/13 　 　 　 　 　 　　 　 　 　 　 　 　 　 　 　 　 20160324 - Rev.003 　　　　　　 R5205CND 　　　　　　　　 Datasheet l Body diode electrical characteristics (Source-Drain) (Ta = 25°C) Parameter Symbol Continuous forward current IS*1 Pulse forward current ISP*2 Forward voltage VSD*6 Conditions Values Min. Typ. Max. - - 5 Unit A - - 20 A - 1.5 V - 300 - ns - 1.94 - μC - 12.9 - A - e N co ew m m D es en ig de ns d f VGS = 0V, IS = 5A or TC = 25℃ Reverse recovery time trr*6 Reverse recovery charge Qrr*6 Peak reverse recovery current Irrm*6 IS = 5A di/dt = 100A/μs l Typical transient thermal characteristics Symbol Rth1 Rth2 Rth3 Unit Symbol Value Cth1 0.00171 Cth2 0.0108 21.6 Cth3 0.133 45.1 Cth4 1.23 1.22 2.27 K/W Unit Ws/K N ot R Rth4 Value 　　　　　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. 4/13 20160324 - Rev.003 　　　　　　 R5205CND 　　　　　　　　 Datasheet l Electrical characteristic curves Fig.2 Maximum Safe Operating Area e N co ew m m D es en ig de ns d f or Fig.1 Power Dissipation Derating Curve N ot R Fig.3 Normalized Transient Thermal 　　　　 　　　　Resistance vs. Pulse Width 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. 5/13 20160324 - Rev.003 　　　　　　 R5205CND 　　　　　　　　 Datasheet l Electrical characteristic curves Fig.5 Avalanche Power Losses e N co ew m m D es en ig de ns d f or Fig.4 Avalanche Current vs. Inductive Load N ot R Fig.6 Avalanche Energy Derating Curve 　 　　　　　　　vs. Junction Temperature 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. 6/13 20160324 - Rev.003 　　　　　　 R5205CND 　　　　　　　　 Datasheet l Electrical characteristic curves Fig.8 Typical Output Characteristics(II) e N co ew m m D es en ig de ns d f or Fig.7 Typical Output Characteristics(I) Fig.10 Tj = 150°C Typical Output 　　　　　　 　　Characteristics (II) N ot R Fig.9 Tj = 150°C Typical Output 　　　　　　 　　Characteristics (I) 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. 7/13 20160324 - Rev.003 　　　　　　 R5205CND 　　　　　　　　 Datasheet l Electrical characteristic curves Fig.12 Typical Transfer Characteristics e N co ew m m D es en ig de ns d f or Fig.11 Breakdown Voltage vs. 　　　　　　　 　Junction Temperature Fig.14 Transconductance vs. Drain Current N ot R Fig.13 Gate Threshold Voltage vs. 　Junction Temperature 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. 8/13 20160324 - Rev.003 　　　　　　 R5205CND 　　　　　　　　 Datasheet l Electrical characteristic curves Fig.16 Static Drain - Source On - State 　Resistance vs. Junction Temperature e N co ew m m D es en ig de ns d f or Fig.15 Static Drain - Source On - State 　Resistance vs. Gate Source Voltage N ot R Fig.17 Static Drain - Source On - State 　Resistance vs. Drain Current 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. 9/13 20160324 - Rev.003 　　　　　　 R5205CND 　　　　　　　　 Datasheet l Electrical characteristic curves Fig.19 Coss Stored Energy e N co ew m m D es en ig de ns d f or Fig.18 Typical Capacitance vs. Drain 　Source Voltage Fig.21 Dynamic Input Characteristics N ot R Fig.20 Switching Characteristics 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. 10/13 20160324 - Rev.003 　　　　　　 R5205CND 　　　　　　　　 Datasheet l Electrical characteristic curves Fig.23 Reverse Recovery Time vs. 　Inverse Diode Forward Current N ot R e N co ew m m D es en ig de ns d f or Fig.22 Inverse Diode Forward Current vs. 　Source - Drain Voltage 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. 11/13 20160324 - Rev.003 　　　　　　 R5205CND 　　　　　　　　 Datasheet l Measurement circuits Fig.1-2 Switching Waveforms e N co ew m m D es en ig de ns d f or Fig.1-1 Switching Time Measurement Circuit Fig.2-2 Gate Charge Waveform Fig.3-1 Avalanche Measurement Circuit Fig.3-2 Avalanche Waveform Fig.4-1 dv/dt Measurement Circuit Fig.4-2 dv/dt Waveform N ot R Fig.2-1 Gate Charge Measurement Circuit Fig.5-1 di/dt Measurement Circuit Fig.5-2 di/dt Waveform 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. 12/13 20160324 - Rev.003 　　　　　　 R5205CND 　　　　　　　　 Datasheet N ot R e N co ew m m D es en ig de ns d f or l Dimensions 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. 13/13 20160324 - Rev.003 Notice Precaution on using ROHM Products Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. or 1. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. 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If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. ot R 2. N e N co ew m m D es en ig de ns d f (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic or 1. e N co ew m m D es en ig de ns d f This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. 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The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: ROHM Semiconductor: R5205CNDTL