Data Sheet
10V Drive Nch MOSFET
R6008FNJ
Structure Silicon N-channel MOSFET Dimensions (Unit : mm)
LPTS
10.1 4.5 1.3
2) Low on-resistance. 3) Fast switching speed. 4) Gate-source voltage VGSS garanteed to be ±30V . 5) Drive circuits can be simple. 6) Parallel use is easy.
3.0
1.0
Features 1) Fast reverse recovery time (trr)
13.1 9.0
1.24
0.78
(3)
5.08
(1) (2)
2.7
Application Switching
Inner circuit
Packaging specifications Type R6008FNJ Package Code Basic ordering unit (pieces) Taping TL 1000
(1) Gate (2) Drain (3) Source
(1)
(2)
1.2
2.54
0.4
∗1
(3)
1 BODY DIODE
Absolute maximum ratings (Ta 25°C) Parameter Symbol Drain-source voltage Gate-source voltage Drain current Source current (Body Diode) Avalanche Current Avalanche Energy Power dissipation (Tc=25℃) Channel temperature Range of storage temperature
*1 Pw10s, Duty cycle1% *2 L≒ 500H, VDD=50V, Rg=25 , starting Tch=25 ℃ *3 Limited only by maximum temperature allowed.
Limits 600 30
Unit V V A A A A A mJ W C C
VDSS VGSS Continuous Pulsed Continuous Pulsed ID IDP IS ISP IAS EAS PD Tch Tstg
*3 *1 *3 *1 *2 *2
8 32 8 32 4 4.3 50 150 55 to 150
Thermal resistance Parameter Channel to Case Symbol Rth (ch-c) Limits 2.5 Unit C / W
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1/5
2011.10 - Rev.A
R6008FNJ
Electrical characteristics (Ta = 25C) Parameter Gate-source leakage Zero gate voltage drain current Gate threshold voltage Static drain-source on-state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Total gate charge Gate-source charge Gate-drain charge
*Pulsed
Symbol IGSS IDSS VGS (th) RDS (on) * l Yfs l* Ciss Coss Crss td(on) * tr * td(off) * tf * Qg * Qgs * Qgd * Min. 600 2.0 2.5 Typ. 0.73 5.0 580 450 25 20 25 60 30 20 5 10 Max. 100 100 4.0 0.95 Unit nA V A V S pF pF pF ns ns ns ns nC nC nC Conditions VGS=±30V, VDS=0V ID=1mA, V GS=0V VDS=600V, VGS=0V VDS=10V, ID=1mA ID=4A, VGS=10V ID=4A, VDS=10V VDS=25V VGS=0V f=1MHz ID=4A, VDD 300V VGS=10V RL=75 RG=10 ID=8A, VDD 300V VGS=10V
Data Sheet
Drain-source breakdown voltage V(BR)DSS
Body diode characteristics (Source-Drain) (Ta = 25C) Parameter Forward Voltage Reverse Recovery Time
*Pulsed
Symbol VSD * trr *
Min. -
Typ. 67
Max. 1.5 -
Unit V ns
Conditions Is=8A, VGS=0V Is=8A, di/dt=100A/s
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2/5
2011.10 - Rev.A
R6008FNJ
Electrical characteristic curves
100 PW =100us DRAIN CURRENT : ID (A) 10 DRAIN CURRENT : ID [A]
Operation in this area is limited by RDS(ON)
Data Sheet
1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0.1 1 10 100 1000 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 DRAIN-SOURCE VOLTAGE : VDS [V] Fig.2 Typical Output Characteristics (Ⅰ) Ta=25℃ pulsed VGS=10.0V VGS=8.0V VGS=7.0V VGS=6.5V VGS=6.0V VGS=5.0V DRAIN CURRENT : ID [A] VGS=4.5V
8 7 6 5 4 3 2 1 0 0 1 2 3 4 5 6 7 8 9 10 DRAIN-SOURCE VOLTAGE : VDS [V] Fig.3 Typical Output Characteristics (Ⅱ) VGS=4.5V VGS=5.0V VGS=10.0V VGS=8.0V VGS=7.0V VGS=6.5V VGS=6.0V Ta=25℃ pulsed
1
PW =1ms Pw=10ms
0.1 T a = 25℃ Single Pulse 0.01 DRAIN-SOURCE VOLTAGE: VDS (V) Fig.1 Maximum Safe Operating Area
GATE THRESHOLD VOLTAGE: VGS(th) (V)
100 VDS= 10V Pulsed DRAIN CURRENT :: IID ((A) DRAIN CURRENT D A) 10 Ta=125℃ T a= 75℃ T a= 25℃ Ta= -25℃
6 5 4 3 2 1 0 -50 VDS= 10V ID= 1mA
10 Static Drain-Source On-State Resistance RDS(on) [Ω] Ta=125℃ T a= 75℃ T a= 25℃ Ta= -25℃ VGS=10V pulsed
1
1
0.1
0.01
0.001 0.0 1.5 3.0 4.5 6.0 GATE-SOURCE VOLTAGE : VGS (V) Fig.4 Typical Transfer Characteristics
0.1 0.1 1 10 100 Drain Current : ID [A] Fig.6 Static Drain-Source On-State Resistance vs. Drain Current
0
50
100
150
CHANNEL TEMPERATURE: Tch (℃) Fig.5 Gate Threshold Voltage vs. Channel Temperature
2 STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on) (Ω) STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on) (Ω) Ta=25℃ pulsed 1.5
3 FORWARD TRANSFER ADMITTANCE : |Yfs| (S) 2.5 2 1.5 1 0.5 0 -50 ID= 4.0A VGS= 10V Pulsed
100 VDS= 10V Pulsed 10
1
ID= 8.0A
ID= 8.0A
1 Ta=125℃ T a= 75℃ T a= 25℃ Ta= -25℃
0.5
ID= 4.0A
0.1
0 0 5 10 15
0
50
100
150
0.01 0.01
0.1
1
10
100
GATE-SOURCE VOLTAGE : VGS (V) Fig.7 Static Drain-Source On-State Resistance vs. Gate Source Voltage
CHANNEL TEMPERATURE: Tch (℃) Fig.8 Static Drain-Source On-State Resistance vs. Channel Temperature
DRAIN CURRENT : ID (A) Fig.9 Forward Transfer Admittance vs. Drain Current
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3/5
2011.10 - Rev.A
R6008FNJ
Data Sheet
100 VGS= 0V Pulsed SOURCE CURRENT : IS (A) CAPACITANCE : C (pF) 10
10000 GATE-SOURCE VOLTAGE : VGS (V)
15
1000
Ciss Coss
10
1 Ta=125℃ T a= 75℃ T a= 25℃ Ta= -25℃
100 Crss 10
5
0.1
Ta= 25℃ f= 1MHz VGS= 0V 0.01 0.1 1 10 100 1000
Ta= 25℃ VDD= 300V ID= 8.0A RG= 10Ω Pulsed 0 10 20 30
0.01 0 0.5 1 1.5 2 SOURCE-DRAIN VOLTAGE : VSD (V) Fig.10 Source Current vs. Sourse-Drain Voltage
1
0 TOTAL GATE CHARGE : Qg (nC) Fig.12 Dynamic Input Characteristics
DRAIN-SOURCE VOLTAGE : VDS (V) Fig.11 Typical Capacitance vs. Drain-Source Voltage
1000 REVERSE RECOVERY TIME: trr (ns) Ta= 25℃ di / dt= 100A / μs VGS= 0V Pulsed
10000 Ta= 25℃ VDD= 300V VGS= 10V RG= 10Ω Pulsed
SWITCHING TIME : t (ns)
1000 tf
100
100 td(off)
10 td(on) tr
10 0.1 1 10 100
1 0.1 1 10 100
REVERSE DRAIN CURRENT : IS (A) Fig.13 Reverse Recovery Time vs. Source Current
DRAIN CURRENT : ID (A) Fig.14 Switching Characteristics
10 NORMARIZED TRANSIENT THERMAL RESISTANCE : r (t) Ta= 25℃ Single Pulse Rth(ch-a) (t) = r(t)×Rth(ch-a) Rth(ch-a) = 49.7℃/W
1
0.1
0.01
0.001
0.0001 0.0001
0.001
0.01
0.1
1
10
100
1000
PULSE WIDTH : Pw(s) Fig.15 Normalized Transient Thermal Resistance vs. Pulse Width
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4/5
2011.10 - Rev.A
R6008FNJ
Measurement circuits
Data Sheet
Pulse width
VGS ID RL D.U.T. RG VDD VDS
VGS VDS
50% 10% 10% 90% td(on) ton tr
90%
50% 10% 90%
td(off) toff
tf
Fig.1-1 Switching Time Measurement Circuit
Fig.1-2 Switching Waveforms
VG
VGS ID RL IG(Const.) D.U.T. VDD VDS
Qg VGS Qgs Qgd
Charge
Fig.2-1 Gate Charge Measurement Circuit
Fig.2-2 Gate Charge Waveform
VGS
IAS L
VDS
V(BR)DSS
D.U.T. RG
IAS VDD EAS = 1 2 L IAS
2
VDD
V(BR)DSS V(BR)DSS - VDD
Fig.3-1 Avalanche Measurement Circuit
Fig.3-2 Avalanche Waveform
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5/5
2011.10 - Rev.A
Notice
Notes
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R1120A
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