R6008FNX

10V Drive Nch MOSFET R6008FNX Structure Silicon N-channel MOSFET Dimensions (Unit : mm) TO-220FM 10.0 φ3.2 4.5 2.8 Features 1) Fast reverse recovery time. 2) Low on-resistance. 3) Fast switching speed. 4) Gate-source voltage (VGSS) guaranteed to be ±30V. 5) Drive circuits can be simple. 6) Parallel use is easy. 15.0 12.0 8.0 2.5 1.3 1.2 14.0 0.8 (1) Gate (2) Drain (3) Source 2.54 (1) (2) (3) 2.54 0.75 2.6 Applications Switching Inner circuit ∗1 Packaging specifications Package Type Basic ordering unit (pieces) Bulk 500 (1) (2) (3) (1) Gate (2) Drain (3) Source R6008FNX ∗1 Body Diode Absolute maximum ratings (Ta=25°C) Parameter Drain-source voltage Gate-source voltage Drain current Source current (Body Diode) Avalanche current Avalanche energy Total power dissipation (Tc=25°C) Channel temperature Range of storage temperature ∗1 Pw≤10µs, Duty cycle≤1% ∗2 L 500µH, VDD=50V, RG=25Ω, Starting, Tch=25°C ∗3 Limited only by maximum temperature allowed Symbol VDSS VGSS Continuous Pulsed Continuous Pulsed ID IDP IS ISP IAS EAS PD Tch Tstg ∗3 ∗1 ∗3 ∗1 ∗2 ∗2 Limits 600 ±30 ±8 ±32 8 32 4 4.3 50 150 −55 to +150 Unit V V A A A A A mJ W °C °C Thermal resistance Parameter Channel to case Symbol Rth(ch-c) Limits 2.5 Unit °C/W www.rohm.com c ○ 2009 ROHM Co., Ltd. All rights reserved. 1/5 2009.03 - Rev.A R6008FNX Electrical characteristics (Ta=25°C) Parameter Gate-source leakage Drain-source breakdown voltage Zero gate voltage drain current Gate threshold voltage Static drain-source on-state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Total gate charge Gate-source charge Gate-drain charge ∗ Pulsed Data Sheet Symbol IGSS V(BR)DSS IDSS VGS(th) RDS(on) | Yfs | Ciss Coss Crss td(on) tr td(off) tf Qg Qgs Qgd ∗ ∗ ∗ ∗ ∗ ∗ ∗ ∗ ∗ Min. − 600 − 2.0 − 2.5 − − − − − − − − − − Typ. − − − − 0.73 − 580 450 25 20 25 60 30 20 5 10 Max. ±100 − 100 4.0 0.95 − − − − − − − − − − − Unit nA V µA V Ω S pF pF pF ns ns ns ns nC nC nC Conditions VGS=±30V, VDS=0V ID=1mA, VGS=0V VDS=600V, VGS=0V VDS=10V, ID=1mA ID=4A, VGS=10V VDS=10V, ID=4A VDS=25V VGS=0V f=1MHz VDD 300V, ID=4A VGS=10V RL=75Ω RG=10Ω VDD 300V ID=8A VGS=10V RL=37.5Ω / RG=10Ω Body diode characteristics (Source-drain) (Ta=25°C) Parameter Forward voltage Forward recovery time ∗ Pulsed Symbol VSD ∗ trr ∗ Min. − 47 Typ. − 67 Max. 1.5 87 Unit V ns Conditions IS= 8A, VGS=0V IF= 8A, di/dt=100A/µs www.rohm.com c ○ 2009 ROHM Co., Ltd. All rights reserved. 2/5 2009.03 - Rev.A R6008FNX Electrical characteristic curves 100 PW=100u 15 Ta= 25°C Pulsed 8.0V 10V 10 8 Ta= 25°C Pulsed 8.0V 6 4 7.0V 6.5V 6.0V Data Sheet DRAIN CURRENT : ID (A) DRAIN CURRENT: ID (A) 10 7.0V 10 6.5V 6.0V 5.5V 5 5.0V VGS= 4.5V 0 DRAIN CURRENT: ID (A) 10V 5.5V 1 Operation in this area is limited 0.1 by RDS(ON) PW=1ms Tc = 25°C DC operation Single Pulse 0.1 1 10 100 1000 5.0V VGS= 4.5V 2 0 0.01 0 10 20 30 40 50 0 1 2 3 4 5 DRAIN-SOURCE VOLTAGE: VDS (V) DRAIN-SOURCE VOLTAGE : VDS ( V ) Fig.1 Maximum Safe Operating Aera Fig.2: Typical output characteristics(Ⅰ) DRAIN-SOURCE VOLTAGE: VDS (V) Fig.3: Typical output GATE THRESHOLD VOLTAGE: VGS(th) (V) 100 VDS= 10V Pulsed Ta= 125°C Ta= 75°C Ta= 25°C Ta= -25°C 6 5 4 3 2 1 0 -50 10 DRAIN CURRENT :ID (A) 10 STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on) (Ω) VDS= 10V ID= 1mA VGS= 10V Pulsed 1 1 0.1 0.1 0.01 Ta= 125°C Ta= 75°C Ta= 25°C Ta= -25°C 0.001 0.0 1.5 3.0 4.5 6.0 0.01 0.1 1 10 100 0 50 100 150 GATE-SOURCE VOLTAGE : VGS (V) Fig.4 Typical Transfer Characteristics CHANNEL TEMPERATURE: Tch (°C) Fig.5 Gate Threshold Voltage vs. Channel Temperature DRAIN CURRENT : ID (A) Fig.6 Static Drain-Source On-State Resistance vs. Drain Current STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on) (Ω) 2.5 2 1.5 1 1.5 ID= 8.0A 1 FORWARD TRANSFER ADMITTANCE : |Yfs| (S) Ta=25°C Pulsed STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on) (Ω) 2 3 VGS= 10V Pulsed 100 VDS= 10V Pulsed 10 ID= 8.0A 1 Ta= -25°C Ta= 25°C Ta= 75°C Ta= 125°C 0.5 ID= 4.0A ID= 4.0A 0.5 0 -50 0.1 0 0 5 10 15 0.01 0.01 0.1 1 10 100 0 50 100 150 GATE-SOURCE VOLTAGE : VGS (V) Fig.7 Static Drain-Source On-State Resistance vs. Gate Source CHANNEL TEMPERATURE: Tch (°C) Fig.8 Static Drain-Source On-State Resistance vs. Channel Tem perature DRAIN CURRENT : ID (A) Fig.9 Forward Transfer Admittance vs. Drain Current www.rohm.com c ○ 2009 ROHM Co., Ltd. All rights reserved. 3/5 2009.03 - Rev.A R6008FNX Data Sheet REVERSE DRAIN CURRENT : IDR (A) CAPACITANCE : C (pF) 10 VGS= 0V Pulsed 1000 Ciss GATE-SOURCE VOLTAGE : VGS (V) 100 10000 15 10 Ta= 25°C VDD= 300V ID= 8.0A RG= 10Ω Pulsed Coss 100 Crss 10 Ta= 25°C f= 1MHz VGS= 0V 1 Ta= 125°C Ta= 75°C Ta= 25°C Ta= -25°C 5 0.1 0.01 0 0.5 1 1.5 2 1 0.01 0.1 1 10 100 1000 0 0 10 20 30 SOURCE-DRAIN VOLTAGE : VSD (V) Fig.10 Reverse Drain Current vs. Sourse-Drain Voltage DRAIN-SOURCE VOLTAGE : VDS (V) Fig.11 Typical Capacitance vs. Drain-Source Voltage TOTAL GATE CHARGE : Qg (nC) Fig.12 Dynamic Input Characteristics REVERSE RECOVERY TIME: trr (ns) 1000 Ta= 25°C di / dt= 100A / µs VGS= 0V Pulsed 100 10000 Ta= 25°C VDD= 300V VGS= 10V RG= 10Ω Pulsed SWITCHING TIME : t (ns) 1000 tf 100 td(off) 10 tr 1 td(on) 10 0.1 1 10 100 0.1 1 10 100 REVERSE DRAIN CURRENT : IDR (A) Fig.13 Reverse Recovery Time vs.Reverse Drain Current DRAIN CURRENT : ID (A) Fig.14 Switching　Characteristics NORMARIZED TRANSIENT THERMAL RESISTANCE : r (t) 10 1 0.1 Ta = 25°C Single Pulse : 1Unit Rth（ch-a）（t） = ｒ（t）×Rth（ch-a） Rth（ch-a） = 49.7°C/W 0.01 0.001 0.0001 0.0001 0.001 0.01 0.1 1 10 100 1000 PULSE WIDTH : Pw(s) Fig.15 Normalized Transient Thermal Resistance vs. Pulse Width www.rohm.com c ○ 2009 ROHM Co., Ltd. All rights reserved. 4/5 2009.03 - Rev.A R6008FNX Switching characteristics measurement circuit Data Sheet Fig.1-1 Switching time measurement circuit Fig.1-2 Switching waveforms IG(Const.) Fig.2-1 Gate charge measurement circuit Fig.2-2 Gate charge waveform Fig.3-1 Avalanche measurement circuit Fig.3-2 Avalanche waveform www.rohm.com c ○ 2009 ROHM Co., Ltd. All rights reserved. 5/5 2009.03 - Rev.A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. R0039A