Data Sheet
10V Drive Nch MOSFET
R8008ANX
Structure Silicon N-channel MOSFET Dimensions (Unit : mm)
TO-220FM
10.0
φ3.2
4.5 2.8
Features 1) Low on-resistance. 2) Low input capacitance. 3) High ESD.
15.0
12.0
8.0
(1) Gate (2) Drain (3) Source
14.0
2.5
1.3
1.2
0.8 2.54
(1) (2) (3)
2.54
0.75
2.6
Application Switching
Packaging specifications Type R8008ANX Package Code Basic ordering unit (pieces) Bulk 500
Inner circuit
∗1
Absolute maximum ratings (Ta = 25C) Symbol Parameter Drain-source voltage Gate-source voltage Drain current Source current (Body Diode) Avalanche current Avalanche energy Power dissipation Channel temperature Range of storage temperature
*1 Pw10s, Duty cycle1% *2 L 500H, VDD=50V, RG=25 , T ch=25°C
(1) Gate (2) Drain (3) Source
(1)
(2)
(3)
1 BODY DIODE
Limits 800 30 8 32 8 32 4 4.2 50 150 55 to 150
Unit V V A A A A A mJ W C C
VDSS Continuous Pulsed Continuous Pulsed VGSS ID *3 IDP IS ISP
AS
*1 *3 *1
IAS *2 E *2 PD *4 Tch Tstg
*3 Limited only by maximum channel temperature allowed. *4 TC=25°C
Thermal resistance Parameter Channel to Case Symbol Rth (ch-c) Limits 2.5 Unit C / W
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1/5
2011.10 - Rev.A
R8008ANX
Electrical characteristics (Ta = 25 C) Parameter Gate-source leakage Zero gate voltage drain current Gate threshold voltage Static drain-source on-state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Total gate charge Gate-source charge Gate-drain charge
*Pulsed
Symbol IGSS IDSS VGS (th) RDS (on) * l Yfs l* Ciss Coss Crss td(on) * tr * td(off) * tf * Qg * Qgs * Qgd * Min. 800 3.0 2.0 Typ. 0.79 1080 480 32 32 50 85 30 39 8.7 23 Max. 100 100 5.0 1.03 Unit nA V A V S pF pF pF ns ns ns ns nC nC nC Conditions VGS=30V, VDS=0V ID=1mA, VGS=0V VDS=800V, VGS=0V VDS=10V, ID=1mA ID=4.0A, VGS=10V VDS=10V, ID=4.0A VDS=25V VGS=0V f=1MHz VDD 400V, ID=4.0A VGS=10V RL=100 RG=10 VDD 400V ID=8.0A VGS=10V
Data Sheet
Drain-source breakdown voltage V(BR)DSS
Body diode characteristics (Source-Drain) Parameter Forward Voltage
*Pulsed
Symbol VSD *
Min. -
Typ. -
Max. 1.5
Conditions Unit V IS=8.0A, VGS=0V
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2/5
2011.10 - Rev.A
R8008ANX
Electrical characteristic curves (Ta=25C)
Fig.1 Typical Output Characteristics (Ⅰ) 2 Ta=25°C pulsed
Data Sheet
Fig.2 Typical Output Characteristics (Ⅱ) 8 Ta=25°C pulsed VGS=10.0V
6 VGS=10.0V Drain Current : ID [A] VGS=8.0V VGS=7.0V 1 VGS=6.5V VGS=6.0V Drain Current : ID [A] VGS=8.0V
4 VGS=7.0V VGS=6.5V VGS=6.0V VGS=5.5V 0
2 VGS=5.5V VGS=5.0V 0 0 0.2 0.4 0.6 0.8 1 Drain-Source Voltage : VDS [V] 0 2 4 6
8
10
Drain-Source Voltage : VDS [V]
Fig.3 Typical Transfer Characteristics 10 VDS=10V pulsed 6
Fig.4 Gate Threshold Voltage vs. Channel Temperature
VDS=10V ID=1mA pulsed Gate Threshold Voltage : VGS(th) [V] 4 5 6 7 8 5
1 Drain Currnt : ID [A] Ta=125°C Ta=75°C Ta=25°C Ta=-25°C
0.1
4
0.01
3
0.001 2 3 Gate-Source Voltage : VGS [V]
2 -50 0 50 100 150 Channel Temperature : T ch [℃]
Fig.5 Static Drain-Source On-State Resistance vs. Drain Current 10 Ta=125°C Ta=75°C Ta=25°C Ta=-25°C
Fig.6 Static Drain-Source On-State Resistance vs. Channel Temperature 2.5 Static Drain-Source On-State Resistance : RDS(on) [Ω]
VGS=10V pulsed Static Drain-Source On-State Resistance RDS(on) [Ω]
VGS=10V pulsed 2
1.5 ID=8A
1
1 ID=4A
0.5
0.1 0.01
0 0.1 1 10 -50 0 50 100 150 Drain Current : ID [A] Channel Temperature : T ch [℃]
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3/5
2011.10 - Rev.A
R8008ANX
Data Sheet
Fig.7 Forward Transfer Admittance vs. Drain Current 10 VDS=10V pulsed 10
Fig.8 Source Current vs. Source-Drain Voltage
VGS=0V pulsed Ta=125°C Ta=75°C Ta=25°C Ta=-25°C
Forward Transfer Admittance Yfs [S]
1 Source Current : Is [A] 1 10 1
0.1
0.01
Ta=125°C Ta=75°C Ta=25°C Ta=-25°C
0.1
0.001 0.001
0.01 0.01 0.1 Drain Current : ID [A] 0 0.5 1 1.5 Source-Drain Voltage : VSD [V]
Fig.9 Static Drain-Source On-State Resistance vs. Gate-Source Voltage 3 Ta=25°C pulsed Static Drain-Source On-State Resistance RDS(on) [Ω]
2
ID=8.0A 1 ID=4.0A
0 0 5 10 15 20 Gate-Source Voltage : VGS [V]
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4/5
2011.10 - Rev.A
R8008ANX
Measurement circuits
Data Sheet
Pulse width
VGS ID RL D.U.T. RG VDD VDS
VGS VDS
50% 10% 10% 90% td(on) ton tr
90%
50% 10% 90%
td(off) toff
tf
Fig.1-1 Switching Time Measurement Circuit
Fig.1-2 Switching Waveforms
VG
VGS ID RL IG(Const.) D.U.T. VDD VDS
Qg VGS Qgs Qgd
Charge
Fig.2-1 Gate Charge Measurement Circuit
Fig.2-2 Gate Charge Waveform
VGS
IAS L
VDS
V(BR)DSS
D.U.T. RG
IAS VDD EAS = 1 2 L IAS
2
VDD
V(BR)DSS V(BR)DSS - VDD
Fig.3-1 Avalanche Measurement Circuit
Fig.3-2 Avalanche Waveform
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5/5
2011.10 - Rev.A
Notice
Notes
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