Fast recovery diodes
RF1601T2D
Applications General rectification Dimensions (Unit : mm)
4.5±0.3 0.1 10.0±0.3 0.1 2.8±0.2 0.1
Structure
1.2 1.3 0.8
5.0±0.2
Features 1) Cathode common type. (TO-220) 2) Ultra Low V F 3) Very fast recovery 4) Low switching loss
(1) (2) (3)
8.0±0.2 12.0±0.2 15.0±0.4 0.2 13.5MIN 8.0
①
Construction Silicon epitaxial planar
(1) (2) (3)
0.7±0.1 0.05
2.6±0.5
ROHM : TO220FN ① Manufacture Date
Absoslute maximum ratings (Ta=25C) Parameter Symbol Reverse voltage (repetitive peak) Reverse voltage (DC) Average rectified forward current (*1) Forward current surge peak (60Hz/1cyc) Junction temperature Storage temoerature
Limits
200 VRM 200 VR 16 Io 80 IFSM 150 Tj -55 to +150 Tstg (*1)Business frequency, Rating of R-load, Tc=120C. 1/2 Io per diode
Unit V V A A C C
Electrical characteristic (Ta=25C) Parameter Forward voltage Reverse current Reverse recovery time
Symbol VF IR trr
Min. -
Typ. -
Max. 0.93 10 30
Unit V μA ns
Conditions IF=8A VR=200V IF=0.5A,IR=1A,Irr=0.25*I R
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1/3
2010.02 - Rev.D
RF1601T2D
Electrical characteristics curves
Data Sheet
10 Ta=150 C
10000
Ta=150 C Ta=125 C
1000 f=1MHz CAPACITANCE BETWEEN TERMINALS:Ct(pF)
1 Ta=125 C 0.1 Ta=75 C Ta=-25 C 0.01 Ta=25 C
REVERSE CURRENT:IR(nA)
FORWARD CURRENT:IF(A)
1000 Ta=75 C 100 Ta=25 C 10 Ta=-25 C 1
100
10
0.001 0 100 200 300 400 500 600 700 800 900 100 0 FORWARD VOLTAGE:VF(mV) VF-IF CHARACTERISTICS 0.1 0 50 100 150 REVERSE VOLTAGE:V R(V) VR-IR CHARACTERISTICS 200 1 0 5 10 15 20 25 30 REVERSE VOLTAGE:V R(V) VR-Ct CHARACTERISTICS
890 Ta=25 C IF=8A n=30pcs
100 90 REVERSE CURRENT:IR(nA) 80 70 60 50 40 30 20 10 AVE:11.6nA Ta=25 C VR=200V n=30pcs
320 315 CAPACITANCE BETWEEN TERMINALS:Ct(pF) 310 305 300 295 290 285 280 275 270 AVE:293.4pF Ta=25 C f=1MHz VR=0V n=10pcs
FORWARD VOLTAGE:V F(mV)
880
870
860 AVE:862.3mV
850
840
0
VF DISPERSION MAP
IR DISPERSION MAP
Ct DISPERSION MAP
300 RESERVE RECOVERY TIME:trr(ns) PEAK SURGE FORWARD CURRENT:IFSM(A) 250 200 150 100 50 AVE:210.0A 0 Ifsm 1cyc 8.3ms
30 25 20 15 10 5 AVE:18.3ns 0 trr DISPERSION MAP IFSM DISPERSION MAP Ta=25 C IF=0.5A IR=1A Irr=0.25*IR n=10pcs
1000 Ifsm PEAK SURGE FORWARD CURRENT:IFSM(A) 8.3ms 100 8.3ms
1cyc
10
1 1 10 NUMBER OF CYCLES IFSM-CYCLE CHARACTERISTICS 100
1000 Ifsm t
100 TRANSIENT THAERMAL IMPEDANCE:Rth ( C/W)
30 Mounted on epoxy board
IM=100mA
PEAK SURGE FORWARD CURRENT:IFSM(A)
IF=8A FORWARD POWER DISSIPATION:Pf(W)
25 D=1/2 DC
10
1ms
tim
Rth(j-a)
20 Sin(=180) 15
300us
100
1
Rth(j-c)
10
5
10 1 10 TIME:t(ms) IFSM-t CHARACTERISTICS 100
0 0.1 0.001 0 0.01 0.1 1 10 100 1000 AVERAGE RECTIFIED FORWARD CURRENT:Io(A) Io-Pf CHARACTERISTICS TIME:t(s) Rth-t CHARACTERISTICS 5 10 15 20 25 30 35 40
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2/3
2010.02 - Rev.D
RF1601T2D
Data Sheet
40 AVERAGE RECTIFIED FORWARD CURRENT:Io(A) AVERAGE RECTIFIED FORWARD CURRENT:Io(A) 35 30 25 20 15 10 5 0 0 25 50 75 100 125 150 Sin(=180) D=1/2 DC 0A 0V t T Io VR D=t/T VR=100V Tj=150 C
40 35 30 25 20 15 10 5 0 0 25 50 Sin(=180) D=1/2 DC
0A 0V t T
Io VR ELECTROSTATIC DISCHARGE TEST ESD(KV) D=t/T VR=100V Tj=150 C
30 No break at 30kV 25 20 15 10 5 0 C=200pF R=0 C=100pF R=1.5k No break at 30kV
75
100
125
150
AMBIENT TEMPERATURE:Ta( C) Derating Curve"(Io-Ta)
CASE TEMPARATURE:Tc( C) Derating Curve"(Io-Tc)
ESD DISPERSION MAP
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3/3
2010.02 - Rev.D
Notice
Notes
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