RF4C100BC
Pch -20V -10A Middle Power MOSFET
Datasheet
l Outline
VDSS
-20V
RDS(on)(Max.)
15.6mΩ
ID
±10A
PD
2W
HUML2020L8
l Inner circuit
l Features
1) Low on - resistance.
2) High Power small mold Package
(HUML2020L8).
3) Pb-free lead plating ; RoHS compliant.
4) Halogen Free.
l Packaging specifications
Packing
l Application
Type
Switching
Load switch
Reel size (mm)
Tape width (mm)
Basic ordering unit (pcs)
Taping code
Marking
Embossed
Tape
180
8
3000
TCR
KH
l Absolute maximum ratings (Ta = 25°C)
Parameter
Symbol
VDSS
ID
ID,pulse*2
VGSS
EAS*3
IAS*3
PD*4
Tj
Tstg
Drain - Source voltage
Continuous drain current
Pulsed drain current
Gate - Source voltage
Avalanche energy, single pulse
Avalanche current
Power dissipation
Junction temperature
Range of storage temperature
Value
Unit
-20
±10
±36
±8
15.2
-2.0
2
150
-55 to +150
V
A
A
V
mJ
A
W
℃
℃
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© 2015 ROHM Co., Ltd. All rights reserved.
1/11
20150411 - Rev.001
RF4C100BC
Datasheet
l Thermal resistance
Parameter
Symbol
Values
Min.
Typ.
Max.
-
-
62.5
RthJA*4
Thermal resistance, junction - ambient
Unit
℃/W
l Electrical characteristics (T a = 25°C)
Parameter
Symbol
Drain - Source breakdown
voltage
Breakdown voltage
temperature coefficient
Conditions
V(BR)DSS VGS = 0V, ID = -1mA
Values
Unit
Min.
Typ.
Max.
-20
-
-
V
-
-10.3
-
mV/℃
ΔV(BR)DSS ID = -1mA
ΔTj referenced to 25℃
Zero gate voltage
drain current
IDSS
VDS = -20V, VGS = 0V
-
-
-1
μA
Gate - Source leakage current
IGSS
VGS = ±8V, VDS = 0V
-
-
±100
nA
VGS(th)
VDS = VGS, ID = -1mA
-0.5
-
-1.2
V
-
1.7
-
mV/℃
VGS = -4.5V, ID = -10A
-
12.0
15.6
RDS(on)*5 VGS = -2.5V, ID = -10A
-
15.4
20.0
VGS = -1.8V, ID = -2.5A
-
23.5
37.6
RG
f=1MHz, open drain
-
4.2
-
Ω
|Yfs| *5
VDS = -5V, ID = -10A
12
-
-
S
Gate threshold voltage
Gate threshold voltage
temperature coefficient
ΔVGS(th) ID = -1mA
ΔTj referenced to 25℃
Static drain - source
on - state resistance
Gate input resistance
Forward Transfer
Admittance
mΩ
*1 Vgs≧2.5V
*2 Pw ≦ 10μs, Duty cycle ≦ 1%
*3 Tr1: L ⋍ 5mH, V DD = -10V, RG = 25Ω, STARTING Tj = 25℃ Fig.3-1,3-2
*4 MOUNTED ON 40mm×40mm×0.8mm Cu BOARD
*5 Pulsed
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© 2015 ROHM Co., Ltd. All rights reserved.
2/11
20150411 - Rev.001
RF4C100BC
Datasheet
l Electrical characteristics (Ta = 25°C)
Values
Parameter
Symbol
Conditions
Unit
Min.
Typ.
Max.
Input capacitance
Ciss
VGS = 0V
-
1660
-
Output capacitance
Coss
VDS = -10V
-
320
-
Reverse transfer capacitance
Crss
f = 1MHz
-
280
-
VDD ⋍ -10V,VGS = -4.5V
-
16
-
tr*5
ID = -5.0A
-
43
-
td(off)*5
RL ⋍ 2.0Ω
-
110
-
tf*5
RG = 10Ω
-
86
-
Turn - on delay time
Rise time
Turn - off delay time
Fall time
td(on)*5
pF
ns
l Gate charge characteristics (Ta = 25°C)
Values
Parameter
Symbol
Total gate charge
Qg*5
Gate - Source charge
Qgs*5
Gate - Drain charge
Qgd*5
Conditions
VDD ⋍ -10V,
ID = -10A,
VGS = -4.5V
Unit
Min.
Typ.
Max.
-
23.5
-
-
2.6
-
-
8.0
-
nC
l Body diode electrical characteristics (Source-Drain) (Ta = 25°C)
Values
Parameter
Body diode continuous
forward current
Symbol
Conditions
IS
Unit
Min.
Typ.
Max.
-
-
-1.67
A
-
-
-36
A
-
-
-1.2
V
Ta = 25℃
Body diode
pulse current
ISP*2
Forward voltage
VSD*5
VGS = 0V, IS = -1.67A
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© 2015 ROHM Co., Ltd. All rights reserved.
3/11
20150411 - Rev.001
RF4C100BC
Datasheet
l Electrical characteristic curves
Fig.1 Power Dissipation Derating Curve
Fig.2 Maximum Safe Operating Area
Fig.3 Normalized Transient Thermal
Resistance vs. Pulse Width
Fig.4 Single Pulse Maximum Power
dissipation
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© 2015 ROHM Co., Ltd. All rights reserved.
4/11
20150411 - Rev.001
RF4C100BC
Datasheet
l Electrical characteristic curves
Fig.5 Typical Output Characteristics(I)
Fig.6 Typical Output Characteristics(II)
Fig.7 Breakdown Voltage vs. Junction
Temperature
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© 2015 ROHM Co., Ltd. All rights reserved.
5/11
20150411 - Rev.001
RF4C100BC
Datasheet
l Electrical characteristic curves
Fig.8 Typical Transfer Characteristics
Fig.9 Gate Threshold Voltage vs. Junction
Temperature
Fig.10 Transconductance vs. Drain Current
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© 2015 ROHM Co., Ltd. All rights reserved.
6/11
20150411 - Rev.001
RF4C100BC
Datasheet
l Electrical characteristic curves
Fig.11 Drain Current Derating Curve
Fig.12 Static Drain - Source On - State
Resistance vs. Gate Source Voltage
Fig.13 Static Drain - Source On - State
Resistance vs. Junction Temperature
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© 2015 ROHM Co., Ltd. All rights reserved.
7/11
20150411 - Rev.001
RF4C100BC
Datasheet
l Electrical characteristic curves
Fig.14 Static Drain - Source On - State
Resistance vs. Drain Current(I)
Fig.15 Static Drain - Source On - State
Resistance vs. Drain Current(II)
Fig.16 Static Drain - Source On - State
Resistance vs. Drain Current(III)
Fig.17 Static Drain - Source On - State
Resistance vs. Drain Current(Ⅳ)
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© 2015 ROHM Co., Ltd. All rights reserved.
8/11
20150411 - Rev.001
RF4C100BC
Datasheet
l Electrical characteristic curves
Fig.18 Typical Capacitance vs. Drain Source Voltage
Fig.19 Switching Characteristics
Fig.20 Dynamic Input Characteristics
Fig.21 Source Current vs. Source Drain
Voltage
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© 2015 ROHM Co., Ltd. All rights reserved.
9/11
20150411 - Rev.001
RF4C100BC
Datasheet
l Measurement circuits
Fig.1-1 Switching Time Measurement Circuit
Fig.1-2 Switching Waveforms
Fig.2-1 Gate Charge Measurement Circuit
Fig.2-2 Gate Charge Waveform
Fig.3-1 Avalanche Measurement Circuit
Fig.3-2 Avalanche Waveform
l Notice
This product might cause chip aging and breakdown under the large electrified environment.
Please consider to design ESD protection circuit.
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© 2015 ROHM Co., Ltd. All rights reserved.
10/11
20150411 - Rev.001
RF4C100BC
Datasheet
l Dimensions
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© 2015 ROHM Co., Ltd. All rights reserved.
11/11
20150411 - Rev.001
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