RGS30TSX2D
Datasheet
1200V 15A Field Stop Trench IGBT
lOutline
VCES
1200V
15A
1.7V
267W
IC (100°C)
VCE(sat) (Typ.)
PD
TO-247N
(1) (2)(3)
lInner Circuit
(2)
lFeatures
1) Low Collector - Emitter Saturation Voltage
(1) Gate
(2) Collector
(3) Emitter
*1
(1)
2) Short Circuit Withstand Time 10μs
*1 Built in FRD
3) Built in Very Fast & Soft Recovery FRD
(3)
4) Pb - free Lead Plating ; RoHS Compliant
lPackaging Specifications
Packaging
lApplication
General Inverter
UPS
Type
PV Inverter
Power Conditioner
Tube
Reel Size (mm)
-
Tape Width (mm)
-
Basic Ordering Unit (pcs)
450
Packing Code
C11
Marking
RGS30TSX2D
lAbsolute Maximum Ratings (at TC = 25°C unless otherwise specified)
Parameter
Symbol
Value
Unit
Collector - Emitter Voltage
VCES
1200
V
Gate - Emitter Voltage
VGES
±30
V
TC = 25°C
IC
30
A
TC = 100°C
IC
15
A
ICP*1
45
A
TC = 25°C
IF
30
A
TC = 100°C
IF
15
A
IFP*1
45
A
TC = 25°C
PD
267
W
TC = 100°C
PD
133
W
Tj
-40 to +175
°C
Tstg
-55 to +175
°C
Collector Current
Pulsed Collector Current
Diode Forward Current
Diode Pulsed Forward Current
Power Dissipation
Operating Junction Temperature
Storage Temperature
*1 Pulse width limited by Tjmax.
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1/11
2020.06 - Rev.A
Datasheet
RGS30TSX2D
lThermal Resistance
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Thermal Resistance IGBT Junction - Case
Rθ(j-c)
-
-
0.56
C/W
Thermal Resistance Diode Junction - Case
Rθ(j-c)
-
-
1.10
C/W
lIGBT Electrical Characteristics (at Tj = 25°C unless otherwise specified)
Parameter
Collector - Emitter Breakdown
Voltage
Symbol
Conditions
Values
Unit
Min.
Typ.
Max.
1200
-
-
V
Tj = 25℃
-
-
10
μA
Tj = 175℃*2
-
1
-
mA
VGE = ±30V, VCE = 0V
-
-
±500
nA
5.0
6.0
7.0
V
-
1.70
2.10
V
-
2.20
-
V
BVCES IC = 10μA, VGE = 0V
VCE = 1200V, VGE= 0V
Collector Cut - off Current
Gate - Emitter Leakage
Current
Gate - Emitter Threshold
Voltage
ICES
IGES
VGE(th) VCE = 5V, IC = 2.3mA
IC = 15A, VGE = 15V
Collector - Emitter Saturation
Voltage
VCE(sat) Tj = 25°C
Tj = 175°C
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2/11
2020.06 - Rev.A
Datasheet
RGS30TSX2D
lIGBT Electrical Characteristics (at Tj = 25°C unless otherwise specified)
Parameter
Symbol
Values
Conditions
Min.
Typ.
Max.
Input Capacitance
Cies
VCE = 30V
-
1272
-
Output Capacitance
Coes
VGE = 0V
-
66
-
Reverse transfer Capacitance
Cres
f = 1MHz
-
7.6
-
Total Gate Charge
Qg
VCE = 500V
-
41
-
Gate - Emitter Charge
Qge
IC = 15A
-
11
-
Gate - Collector Charge
Qgc
VGE = 15V
-
17
-
Turn - on Delay Time
td(on)
-
30
-
-
8.5
-
-
70
-
-
128
-
-
0.74
-
-
0.6
-
-
29
-
-
10
-
-
69
-
-
120
-
-
0.81
-
-
0.65
-
tr
Rise Time
Turn - off Delay Time
td(off)
tf
Fall Time
Turn-on Switching Loss
Eon
Turn-off Switching Loss
Eoff
Turn - on Delay Time
td(on)
tr
Rise Time
Turn - off Delay Time
td(off)
tf
Fall Time
Turn-on Switching Loss
Eon
Turn-off Switching Loss
Eoff
IC = 15A, VCC = 600V,
VGE = 15V, RG = 10Ω,
Tj = 25°C
Inductive Load
*Eon include diode
reverse recovery
IC = 15A, VCC = 600V,
VGE = 15V, RG = 10Ω,
Tj = 175°C
Inductive Load
*Eon include diode
reverse recovery
Unit
pF
nC
ns
mJ
ns
mJ
IC = 45A, VCC = 1050V
Reverse Bias
Safe Operating Area
RBSOA Vp = 1200V, VGE = 15V
FULL SQUARE
-
RG = 50Ω, Tj = 175°C
Short Circuit Withstand Time
tsc
VCC ≤ 600V
VGE = 15V, Tj = 25°C
10
-
-
μs
Short Circuit Withstand Time
tsc*2
VCC ≤ 600V
VGE = 15V, Tj = 150°C
8
-
-
μs
*2 Design assurance without measurement
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3/11
2020.06 - Rev.A
Datasheet
RGS30TSX2D
lFRD Electrical Characteristics (at Tj = 25°C unless otherwise specified)
Parameter
Symbol
Conditions
Values
Unit
Min.
Typ.
Max.
Tj = 25°C
-
1.65
2.10
Tj = 175°C
-
1.85
-
-
157
-
ns
-
12.8
-
A
-
1.2
-
μC
IF = 15A
Diode Forward Voltage
VF
V
Diode Reverse Recovery
Time
trr
Diode Peak Reverse
Recovery Current
Irr
Diode Reverse Recovery
Charge
Qrr
Diode Reverse Recovery
Energy
Err
-
281
-
μJ
Diode Reverse Recovery
Time
trr
-
257
-
ns
Diode Peak Reverse
Recovery Current
Irr
-
15.4
-
A
Diode Reverse Recovery
Charge
Qrr
-
2.4
-
μC
Diode Reverse Recovery
Energy
Err
-
775
-
μJ
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IF = 15A
VCC = 600V
diF/dt = 500A/μs
Tj = 25°C
IF = 15A
VCC = 600V
diF/dt = 500A/μs
Tj = 175°C
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2020.06 - Rev.A
Datasheet
RGS30TSX2D
lElectrical Characteristic Curves
Fig.2 Collector Current
vs. Case Temperature
40
Collector Current : IC [A]
Power Dissipation : PD [W]
Fig.1 Power Dissipation
vs. Case Temperature
400
300
200
100
30
20
10
Tj ≤ 175ºC
VGE ≥ 15V
0
0
0
25
50
0
75 100 125 150 175
Case Temperature : TC [°C ]
50
75 100 125 150 175
Case Temperature : TC [°C ]
Fig.3 Forward Bias Safe Operating Area
Fig.4 Reverse Bias Safe Operating Area
60
100
Collector Current : IC [A]
1000
Collector Current : IC [A]
25
10μs
10
100μs
1
0.1
45
30
15
Tj ≤ 175ºC
VGE = 15V
TC = 25ºC
Single Pulse
0
0.01
1
10
100
1000
10000
Collector To Emitter Voltage : VCE [V]
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0
300
600
900
1200 1500
Collector To Emitter Voltage : VCE [V]
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2020.06 - Rev.A
Datasheet
RGS30TSX2D
lElectrical Characteristic Curves
Fig.5 Typical Output Characteristics
Fig.6 Typical Output Characteristics
45
45
Tj = 25ºC
VGE = 12V
35
VGE = 20V
30
25
VGE = 15V
20
VGE = 10V
15
10
5
35
VGE = 20V
30
VGE = 15V
25
20
VGE = 12V
VGE = 10V
15
10
VGE = 8V
5
VGE = 8V
0
0
0
1
2
3
4
5
0
Collector To Emitter Voltage : VCE [V]
VGE = 15V
VCE = 10V
Collector To Emitter Saturation
Voltage : VCE(sat) [V]
35
30
25
20
15
10
5
2
Tj = 175ºC
3
4
5
Fig.8 Typical Collector To Emitter Saturation
Voltage vs. Junction Temperature
4
45
40
1
Collector To Emitter Voltage : VCE [V]
Fig.7 Typical Transfer Characteristics
Collector Current : IC [A]
Tj = 175ºC
40
Collector Current : IC [A]
Collector Current : IC [A]
40
IC = 30A
3
IC = 15A
2
IC = 7.5A
1
Tj = 25ºC
0
0
0
2
4
6
8
10 12 14 16
25
Gate To Emitter Voltage : VGE [V]
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50
75
100 125 150 175
Junction Temperature : Tj [°C ]
6/11
2020.06 - Rev.A
Datasheet
RGS30TSX2D
lElectrical Characteristic Curves
Fig.9 Typical Collector To Emitter Saturation
Voltage vs. Gate To Emitter Voltage
10
Fig.10 Typical Collector To Emitter Saturation
Voltage vs. Gate To Emitter Voltage
10
Tj = 175ºC
Collector To Emitter Saturation
Voltage : VCE(sat) [V]
Collector To Emitter Saturation
Voltage : VCE(sat) [V]
Tj = 25ºC
8
IC = 30A
6
IC = 15A
IC = 7.5A
4
2
0
8
IC = 30A
6
IC = 15A
IC = 7.5A
4
2
0
5
10
15
20
5
Gate To Emitter Voltage : VGE [V]
15
20
Gate To Emitter Voltage : VGE [V]
Fig.11 Typical Switching Time
vs. Collector Current
1000
Fig.12 Typical Switching Time
vs. Gate Resistance
1000
tf
Switching Time [ns]
Switching Time [ns]
10
100
td(off)
td(on)
10
tr
tf
100
td(off)
td(on)
10
tr
VCC = 600V, IC = 15A,
VGE = 15V, Tj = 175ºC
Inductive load
VCC = 600V, VGE = 15V,
RG = 10Ω, Tj = 175ºC
Inductive load
1
1
0
10
20
30
0
20
30
40
50
Gate Resistance : RG [Ω]
Collecter Current : IC [A]
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10
7/11
2020.06 - Rev.A
Datasheet
RGS30TSX2D
lElectrical Characteristic Curves
Fig.14 Typical Switching Energy Losses
vs. Gate Resistance
10
Switching Energy Losses [mJ]
Switching Energy Losses [mJ]
Fig.13 Typical Switching Energy Losses
vs. Collector Current
10
Eon
1
Eoff
0.1
VCC = 600V, VGE = 15V,
RG = 10Ω, Tj = 175ºC
Inductive load
0.01
Eon
1
Eoff
0.1
VCC = 600V, VGE = 15V,
IC = 15A, Tj = 175ºC
Inductive load
0.01
0
10
20
30
0
Fig.15 Typical Capacitance
vs. Collector To Emitter Voltage
10000
100
Coes
f = 1MHz
VGE = 0V
Tj = 25ºC
1
0.01
30
40
50
Cres
Fig.16 Typical Gate Charge
15
Gate To Emitter Voltage : V GE [V]
Capacitance [pF]
Cies
10
20
Gate Resistance : RG [Ω]
Collector Current : IC [A]
1000
10
VCC = 300V
10
VCC = 500V
5
IC = 15A
Tj = 25ºC
0
0.1
1
10
100
0
Collector To Emitter Voltage : VCE [V]
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15
30
45
Gate Charge : QG [nC]
8/11
2020.06 - Rev.A
Datasheet
RGS30TSX2D
lElectrical Characteristic Curves
Fig.17 Typical Diode Forward Current
vs. Forward Voltage
45
Fig.18 Typical Diode Reverce Recovery Time
vs. Forward Current
500
Reverse Recovery Time : trr [ns]
Forward Current : IF [A]
40
35
30
25
20
15
10
Tj = 175ºC
5
400
300
Tj = 175ºC
200
100
Tj = 25ºC
Tj = 25ºC
0
0
0
0.5
1
1.5
2
2.5
3
0
Forward Voltage : VF [V]
20
30
Fig.20 Typical Diode Reverse Recovery
Energy Losses vs. Forward Current
2
Reverse Recovery Energy Losses
: Err [mJ]
20
Tj = 175ºC
15
10
Tj = 25ºC
5
10
Forward Current : IF [A]
Fig.19 Typical Diode Reverse Recovery
Current vs. Forward Current
25
Reverse Recovery Current : Irr [A]
VCC = 600V
diF/dt = 500A/μs
Inductive load
VCC = 600V
diF/dt = 500A/μs
Inductive load
0
VCC = 600V
Tj = 175℃
Inductive load
1.5
RG = 10Ω
1
RG = 30Ω
RG = 50Ω
0.5
0
0
10
20
30
0
Forward Current : IF [A]
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10
20
30
Forward Current : IF [A]
9/11
2020.06 - Rev.A
Datasheet
RGS30TSX2D
lElectrical Characteristic Curves
Fig.21 IGBT Transient Thermal Impedance
1
0.2
Transient Thermal Impedance
: Zθ(j-c) [°C/W]
0.1
D = 0.5
0.1
Single Pulse
0.01
PDM
0.02
0.01
t1
0.05
t2
Duty = t1/t2
Peak Tj = PDM×Zθ(j-c)+TC
C1
400.8u
0.001
1E-5
1E-4
1E-3
C2
2.510m
C3
12.89m
1E-2
R1
81.52m
R2
263.0m
1E-1
R3
215.5m
1E+0
Pulse Width : t1 [s]
Fig.22 Diode Transient Thermal Impedance
Transient Thermal Impedance
: Zθ(j-c) [°C/W]
10
1
0.1
0.2
D = 0.5
PDM
t1
0.1
t2
Duty = t1/t2
Peak Tj = PDM×Zθ(j-c)+TC
Single Pulse
0.01
0.02
C1
403.9u
0.05
0.01
1E-5
1E-4
1E-3
C2
1.415m
1E-2
C3
13.77m
R1
226.9m
R2
482.3m
1E-1
R3
390.8m
1E+0
Pulse Width : t1 [s]
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10/11
2020.06 - Rev.A
Datasheet
RGS30TSX2D
●Inductive Load Switching Circuit and Waveform
D.U.T.
Gate Drive Time
D.U.T.
90%
VGE
VG
10%
Fig.23 Inductive Load Circuit
90%
IC
td(on)
tr
trr , Qrr
IF
ton
td(off)
10%
tf
toff
VCE
diF/dt
10%
Irr
Eon
Fig.24 Diode Reverce Recovery Waveform
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Eoff
VCE(sat)
Fig.25 Inductive Load Waveform
11/11
2020.06 - Rev.A
Notice
Notes
1) The information contained herein is subject to change without notice.
2) Before you use our Products, please contact our sales representative and verify the latest specifications.
3) Although ROHM is continuously working to improve product reliability and quality, semiconductors can break down and malfunction due to various factors.
Therefore, in order to prevent personal injury or fire arising from failure, please take safety
measures such as complying with the derating characteristics, implementing redundant and
fire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no
responsibility for any damages arising out of the use of our Poducts beyond the rating specified by
ROHM.
4) Examples of application circuits, circuit constants and any other information contained herein are
provided only to illustrate the standard usage and operations of the Products. The peripheral
conditions must be taken into account when designing circuits for mass production.
5) The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly,
any license to use or exercise intellectual property or other rights held by ROHM or any other
parties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use of
such technical information.
6) The Products specified in this document are not designed to be radiation tolerant.
7) For use of our Products in applications requiring a high degree of reliability (as exemplified
below), please contact and consult with a ROHM representative : transportation equipment (i.e.
cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety
equipment, medical systems, servers, solar cells, and power transmission systems.
8) Do not use our Products in applications requiring extremely high reliability, such as aerospace
equipment, nuclear power control systems, and submarine repeaters.
9) ROHM shall have no responsibility for any damages or injury arising from non-compliance with
the recommended usage conditions and specifications contained herein.
10) ROHM has used reasonable care to ensure the accuracy of the information contained in this
document. However, ROHM does not warrants that such information is error-free, and ROHM
shall have no responsibility for any damages arising from any inaccuracy or misprint of such
information.
11) Please use the Products in accordance with any applicable environmental laws and regulations,
such as the RoHS Directive. For more details, including RoHS compatibility, please contact a
ROHM sales office. ROHM shall have no responsibility for any damages or losses resulting
non-compliance with any applicable laws or regulations.
12) When providing our Products and technologies contained in this document to other countries,
you must abide by the procedures and provisions stipulated in all applicable export laws and
regulations, including without limitation the US Export Administration Regulations and the Foreign
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R1107 B