RGW00TK65D
Datasheet
650V 50A Field Stop Trench IGBT
Outline
VCES
650V
IC (100℃)
26A
VCE(sat) (Typ.)
1.5V@IC=50A
PD
89W
Features
TO-3PFM
(1)(2)(3)
Inner Circuit
1) Low Collector - Emitter Saturation Voltage
(2)
(1) Gate
(2) Collector
(3) Emitter
2) High Speed Switching
*1
3) Low Switching Loss & Soft Switching
(1)
4) Built in Very Fast & Soft Recovery FRD
*1 Built in FRD
(3)
5) Pb - free Lead Plating ; RoHS Compliant
Applications
Packaging Specifications
PFC
Packaging
UPS
Reel Size (mm)
-
Tape Width (mm)
-
Welding
Type
Solar Inverter
IH
Tube
Basic Ordering Unit (pcs)
450
Packing Code
C11
Marking
RGW00TK65D
Absolute Maximum Ratings (at TC = 25°C unless otherwise specified)
Parameter
Symbol
Value
Unit
Collector - Emitter Voltage
VCES
650
V
Gate - Emitter Voltage
VGES
30
V
TC = 25°C
IC
45
A
TC = 100°C
IC
26
A
200
A
Collector Current
Pulsed Collector Current
Diode Forward Current
ICP
TC = 25°C
IF
34
A
TC = 100°C
IF
19
A
IFP*1
200
A
TC = 25°C
PD
89
W
TC = 100°C
PD
44
W
Tj
40 to +175
°C
Tstg
55 to +175
°C
Diode Pulsed Forward Current
Power Dissipation
*1
Operating Junction Temperature
Storage Temperature
*1 Pulse width limited by Tjmax.
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1/11
2017.10 - Rev.A
Datasheet
RGW00TK65D
Thermal Resistance
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Thermal Resistance IGBT Junction - Case
Rθ(j-c)
-
-
1.67
°C/W
Thermal Resistance Diode Junction - Case
Rθ(j-c)
-
-
2.29
°C/W
IGBT Electrical Characteristics (at Tj = 25°C unless otherwise specified)
Parameter
Collector - Emitter Breakdown
Voltage
Symbol
BVCES
Conditions
IC = 10μA, VGE = 0V
Values
Unit
Min.
Typ.
Max.
650
-
-
V
Collector Cut - off Current
ICES
VCE = 650V, VGE = 0V
-
-
10
μA
Gate - Emitter Leakage Current
IGES
VGE = 30V, VCE = 0V
-
-
200
nA
VGE(th)
VCE = 5V, IC = 33.0mA
5.0
6.0
7.0
V
Tj = 25°C
-
1.5
1.9
V
Tj = 175°C
-
1.85
-
Gate - Emitter Threshold
Voltage
IC = 50A, VGE = 15V
Collector - Emitter Saturation
Voltage
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VCE(sat)
2/11
2017.10 - Rev.A
Datasheet
RGW00TK65D
IGBT Electrical Characteristics (at Tj = 25°C unless otherwise specified)
Parameter
Symbol
Conditions
Values
Min.
Typ.
Max.
Input Capacitance
Cies
VCE = 30V
-
4200
-
Output Capacitance
Coes
VGE = 0V
-
104
-
Reverse Transfer Capacitance
Cres
f = 1MHz
-
79
-
Total Gate Charge
Qg
VCE = 400V
-
141
-
Gate - Emitter Charge
Qge
IC = 50A
-
30
-
Gate - Collector Charge
Qgc
VGE = 15V
-
52
-
Turn - on Delay Time
td(on)
IC = 50A, VCC = 400V
-
52
-
tr
VGE = 15V, RG = 10Ω
-
21
-
Tj = 25°C
-
180
-
Inductive Load
-
33
-
Rise Time
Turn - off Delay Time
Fall Time
td(off)
tf
Turn - on Switching Loss
Eon
*Eon includes diode
-
1.18
-
Turn - off Switching Loss
Eoff
reverse recovery
-
0.96
-
Turn - on Delay Time
td(on)
IC = 50A, VCC = 400V
-
49
-
tr
VGE = 15V, RG = 10Ω
-
23
-
Tj = 175°C
-
201
-
Inductive Load
-
72
-
Rise Time
Turn - off Delay Time
Fall Time
td(off)
tf
Turn - on Switching Loss
Eon
*Eon includes diode
-
1.18
-
Turn - off Switching Loss
Eoff
reverse recovery
-
1.18
-
Unit
pF
nC
ns
mJ
ns
mJ
IC = 200A, VCC = 520V
Reverse Bias Safe Operating
Area
RBSOA VP = 650V, VGE = 15V
FULL SQUARE
-
RG = 100Ω, Tj = 175°C
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3/11
2017.10 - Rev.A
Datasheet
RGW00TK65D
FRD Electrical Characteristics (at Tj = 25°C unless otherwise specified)
Parameter
Symbol
Conditions
Values
Unit
Min.
Typ.
Max.
Tj = 25°C
-
1.45
1.9
Tj = 175°C
-
1.55
-
-
95
-
ns
-
8.1
-
A
-
0.42
-
μC
IF = 30A
Diode Forward Voltage
VF
V
Diode Reverse Recovery Time
trr
Diode Peak Reverse Recovery
Current
Irr
Diode Reverse Recovery
Charge
Qrr
Diode Reverse Recovery Energy
Err
-
19.3
-
μJ
Diode Reverse Recovery Time
trr
-
155
-
ns
Diode Peak Reverse Recovery
Current
Irr
-
10.4
-
A
Diode Reverse Recovery
Charge
Qrr
-
0.95
-
μC
Diode Reverse Recovery Energy
Err
-
62.5
-
μJ
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IF = 30A
VCC = 400V
diF/dt = 200A/μs
Tj = 25°C
IF = 30A
VCC = 400V
diF/dt = 200A/μs
Tj = 175°C
4/11
2017.10 - Rev.A
Datasheet
RGW00TK65D
Electrical Characteristic Curves
Fig.2 Collector Current vs. Case Temperature
110
50
100
45
90
40
Collector Current : IC [A]
Power Dissipation: PD [W]
Fig.1 Power Dissipation vs. Case Temperature
80
70
60
50
40
30
20
35
30
25
20
15
10
Tj≦175ºC
VGE≧15V
5
10
0
0
0
25
50
75
100
125
150
0
175
Case Temperature : TC [ºC]
50
75
100
125
150
175
Case Temperature : TC [ºC]
Fig.3 Forward Bias Safe Operating Area
Fig.4 Reverse Bias Safe Operating Area
1000
240
1µs
220
200
100
10µs
Collector Current : IC [A]
Collector Current : IC [A]
25
10
100µs
1
0.1
Tc=25ºC
Single Pulse
180
160
140
120
100
80
60
40
Tj≦175ºC
VGE≧15V
20
0
0.01
1
10
100
0
1000
Collector To Emitter Voltage : VCE[V]
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200
400
600
800
Collector To Emitter Voltage : VCE[V]
5/11
2017.10 - Rev.A
Datasheet
RGW00TK65D
Electrical Characteristic Curves
Fig.5 Typical Output Characteristics
Fig.6 Typical Output Characteristics
200
180
Tj=25ºC
160
VGE=20V
VGE=12V
120
VGE=10V
100
80
VGE=8V
60
40
20
140
VGE=12V
VGE=15V
120
VGE=10V
100
80
60
VGE=8V
40
20
0
0
0
1
2
3
4
0
5
1
2
3
4
5
Collector To Emitter Voltage : VCE [V]
Collector To Emitter Voltage : VCE [V]
Fig.7 Typical Transfer Characteristics
Fig.8 Typical Collector To Emitter Saturation
Voltage vs. Junction Temperature
100
4
Collector To Emitter Saturation Voltage
: VCE (sat) [V]
VCE=10V
90
Collector Current : IC [A]
VGE=20V
160
140
VGE=15V
Tj=25ºC
180
Collector Current : IC [A]
Collector Current : IC [A]
200
80
70
60
50
40
30
20
Tj=175ºC
Tj=25ºC
10
0
0
2
4
6
8
10
12
3
IC=100A
2
IC=50A
IC=25A
1
0
25
Gate to Emitter Voltage : VGE [V]
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VGE=15V
50
75
100
125
150
175
Junction Temperature : Tj [ºC]
6/11
2017.10 - Rev.A
Datasheet
RGW00TK65D
Electrical Characteristic Curves
Fig.9 Typical Collector To Emitter Saturation
Voltage vs. Gate To Emitter Voltage
Fig.10 Typical Collector To Emitter Saturation
Voltage vs. Gate To Emitter Voltage
20
Collector To Emitter Saturation Voltage
: VCE (sat) [V]
Collector To Emitter Saturation Voltage
: VCE (sat) [V]
20
Tj=25ºC
15
IC=100A
10
IC=50A
IC=25A
5
0
5
10
15
Tj=175ºC
15
IC=100A
10
IC=50A
IC=25A
5
0
20
5
10
Gate to Emitter Voltage : VGE [V]
20
Gate to Emitter Voltage : VGE [V]
Fig.11 Typical Switching Time vs.
Collector Current
Fig.12 Typical Switching Time
vs. Gate Resistance
1000
1000
td(off)
100
Switching Time [ns]
td(off)
Switching Time [ns]
15
tf
td(on)
10
tr
tf
100
td(on)
tr
10
VCC=400V, VGE=15V
RG=10Ω, Tj=175ºC
Inductive load
VCC=400V, IC=50A
VGE=15V, Tj=175ºC
Inductive load
1
0
1
10 20 30 40 50 60 70 80 90 100
0
Collector Current : IC [A]
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10
20
30
40
50
Gate Resistance : RG [Ω]
7/11
2017.10 - Rev.A
Datasheet
RGW00TK65D
Electrical Characteristic Curves
Fig.13 Typical Switching Energy Losses vs.
Collector Current
Fig.14 Typical Switching Energy Losses vs.
Gate Resistance
10
Eoff
1
Eon
0.1
VCC=400V, VGE=15V
RG=10Ω, Tj=175ºC
Inductive load
Switching Energy Losses [mJ]
Switching Energy Losses [mJ]
10
0.01
Eoff
1
Eon
0.1
VCC=400V, IC=50A
VGE=15V, Tj=175ºC
Inductive load
0.01
0
10 20 30 40 50 60 70 80 90 100
0
10
30
40
50
Gate Resistance : RG [Ω]
Collector Current : IC [A]
Fig.15 Typical Capacitance vs.
Collector To Emitter Voltage
Fig.16 Typical Gate Charge
15
Cies
1000
Coes
100
Cres
10
f=1MHz
VGE=0V
Tj=25ºC
1
0.01
Gate to Emitter Voltage : VGE [V]
10000
Capacitance [pF]
20
10
5
VCC=400V
IC=50A
Tj=25ºC
0
0.1
1
10
0
100
Collector To Emitter Voltage : VCE[V]
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20
40
60
80
100 120 140 160
Gate Charge : Qg[nC]
8/11
2017.10 - Rev.A
Datasheet
RGW00TK65D
Electrical Characteristic Curves
Fig.17 Typical Diode Forward Current vs.
Forward Voltage
Fig.18 Typical Diode Reverse Recovery Time
vs. Forward Current
400
200
Reverse Recovery Time : trr [ns]
Forward Current : IF [A]
180
160
140
120
100
Tj=25ºC
80
60
Tj=175ºC
40
20
300
200
Tj=175ºC
100
Tj=25ºC
0
0
0
1
2
3
4
0
5
10 20 30 40 50 60 70 80 90 100
Forward Current : IF [A]
Forward Voltage : VF[V]
Fig.19 Typical Diode Reverse Recovery
Current vs. Forward Current
Fig.20 Typical Diode Reverse
Recovery Charge
2.5
15
Tj=175ºC
10
5
Tj=25ºC
VCC=400V
diF/dt=200A/μs
Inductive load
Reverse Recovery Charge : Qrr [μC]
20
Reverse Recovery Curren : Irr [A]
VCC=400V
diF/dt=200A/μs
Inductive load
0
VCC=400V
diF/dt=200A/μs
Inductive load
2
1.5
Tj=175ºC
1
0.5
Tj=25ºC
0
0
10 20 30 40 50 60 70 80 90 100
0
Forward Current : IF [A]
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10 20 30 40 50 60 70 80 90 100
Forward Current : IF [A]
9/11
2017.10 - Rev.A
Datasheet
RGW00TK65D
Electrical Characteristic Curves
Fig.21 Typical IGBT Transient Thermal Impedance
Transient Thermal Impedance
: ZthJC [ºC/W]
10
D= 0.5
1
0.1
0.2
0.1
PDM
Single Pulse
0.01
t1
0.01
0.05
0.001
1E-6
C1
C2
700.4u 5.560m
0.02
1E-5
1E-4
C3
R1
R2
R3
165.6m 203.1m 288.8m 488.1m
1E-3
t2
Duty=t1/t2
Peak Tj=PDM×ZthJCTC
1E-2
1E-1
1E+0
Pulse Width : t1[s]
Fig.22 Typical Diode Transient Thermal Impedance
Transient Thermal Impedance
: ZthJC [ºC/W]
10
D= 0.5
0.2
0.1
1
0.1
PDM
Single Pulse
0.01
t1
0.01
0.05
0.001
1E-6
0.02
1E-5
C1
C2
365.8u 2.816m
1E-4
C3
R1
R2
R3
124.8m 227.9m 543.1m 579.0m
1E-3
1E-2
t2
Duty=t1/t2
Peak Tj=PDM×ZthJCTC
1E-1
1E+0
Pulse Width : t1[s]
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10/11
2017.10 - Rev.A
Datasheet
RGW00TK65D
Inductive Load Switching Circuit and Waveform
Gate Drive Time
90%
D.U.T.
D.U.T.
VGE
10%
VG
90%
Fig.23 Inductive Load Circuit
IC
10%
td(on)
tr
ton
IF
td(off)
tf
toff
trr , Qrr
VCE
diF/dt
10%
Eon
Irr
Fig.25 Diode Reverce Recovery Waveform
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Eoff
VCE(sat)
Fig.24 Inductive Load Waveform
11/11
2017.10 - Rev.A
Notice
Notes
1) The information contained herein is subject to change without notice.
2) Before you use our Products, please contact our sales representative and verify the latest specifications.
3) Although ROHM is continuously working to improve product reliability and quality, semiconductors can break down and malfunction due to various factors.
Therefore, in order to prevent personal injury or fire arising from failure, please take safety
measures such as complying with the derating characteristics, implementing redundant and
fire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no
responsibility for any damages arising out of the use of our Poducts beyond the rating specified by
ROHM.
4) Examples of application circuits, circuit constants and any other information contained herein are
provided only to illustrate the standard usage and operations of the Products. The peripheral
conditions must be taken into account when designing circuits for mass production.
5) The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly,
any license to use or exercise intellectual property or other rights held by ROHM or any other
parties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use of
such technical information.
6) The Products specified in this document are not designed to be radiation tolerant.
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below), please contact and consult with a ROHM representative : transportation equipment (i.e.
cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety
equipment, medical systems, and power transmission systems.
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equipment, nuclear power control systems, and submarine repeaters.
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the recommended usage conditions and specifications contained herein.
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shall have no responsibility for any damages arising from any inaccuracy or misprint of such
information.
11) Please use the Products in accordance with any applicable environmental laws and regulations,
such as the RoHS Directive. For more details, including RoHS compatibility, please contact a
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R1107 S