RGW40TK65D
Datasheet
650V 20A Field Stop Trench IGBT
lOutline
VCES
650V
16A
1.5V
61W
IC (100°C)
VCE(sat) (Typ.)
PD
lFeatures
TO-3PFM
(1) (2)(3)
lInner Circuit
1) Low Collector - Emitter Saturation Voltage
(2)
(1) Gate
(2) Collector
(3) Emitter
2) High Speed Switching
*1
3) Low Switching Loss & Soft Switching
(1)
4) Built in Very Fast & Soft Recovery FRD
*1 Built in FRD
(3)
5) Pb - free Lead Plating ; RoHS Compliant
lApplication
lPackaging Specifications
PFC
Packaging
UPS
Reel Size (mm)
-
Tape Width (mm)
-
Welding
Type
Solar Inverter
IH
Tube
Basic Ordering Unit (pcs)
450
Packing Code
C11
Marking
RGW40TK65D
lAbsolute Maximum Ratings (at TC = 25°C unless otherwise specified)
Parameter
Symbol
Value
Unit
Collector - Emitter Voltage
VCES
650
V
Gate - Emitter Voltage
VGES
±30
V
TC = 25°C
IC
27
A
TC = 100°C
IC
16
A
ICP*1
80
A
TC = 25°C
IF
27
A
TC = 100°C
IF
16
A
IFP*1
80
A
TC = 25°C
PD
61
W
TC = 100°C
PD
30
W
Tj
-40 to +175
°C
Tstg
-55 to +175
°C
Collector Current
Pulsed Collector Current
Diode Forward Current
Diode Pulsed Forward Current
Power Dissipation
Operating Junction Temperature
Storage Temperature
*1 Pulse width limited by Tjmax.
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1/11
2020.11 - Rev.A
Datasheet
RGW40TK65D
lThermal Resistance
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Thermal Resistance IGBT Junction - Case
Rθ(j-c)
-
-
2.44
C/W
Thermal Resistance Diode Junction - Case
Rθ(j-c)
-
-
2.79
C/W
lIGBT Electrical Characteristics (at Tj = 25°C unless otherwise specified)
Parameter
Collector - Emitter Breakdown
Voltage
Symbol
Conditions
BVCES IC = 10μA, VGE = 0V
Values
Unit
Min.
Typ.
Max.
650
-
-
V
Collector Cut - off Current
ICES
VCE = 650V, VGE = 0V
-
-
10
μA
Gate - Emitter Leakage
Current
IGES
VGE = ±30V, VCE = 0V
-
-
±200
nA
5.0
6.0
7.0
V
-
1.5
1.9
V
-
1.85
-
Gate - Emitter Threshold
Voltage
VGE(th) VCE = 5V, IC = 13.3mA
IC = 20A, VGE = 15V,
Collector - Emitter Saturation
Voltage
VCE(sat) Tj = 25°C
Tj = 175°C
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2/11
2020.11 - Rev.A
Datasheet
RGW40TK65D
lIGBT Electrical Characteristics (at Tj = 25°C unless otherwise specified)
Parameter
Symbol
Conditions
Values
Min.
Typ.
Max.
Input Capacitance
Cies
VCE = 30V,
-
1680
-
Output Capacitance
Coes
VGE = 0V,
-
47
-
Reverse transfer Capacitance
Cres
f = 1MHz
-
31
-
Total Gate Charge
Qg
VCE = 400V,
-
59
-
Gate - Emitter Charge
Qge
IC = 20A,
-
13
-
Gate - Collector Charge
Qgc
VGE = 15V
-
23
-
Turn - on Delay Time
td(on)
-
33
-
-
10
-
-
76
-
-
63
-
-
0.33
-
-
0.30
-
-
31
-
-
10
-
-
102
-
-
76
-
-
0.34
-
-
0.43
-
tr
Rise Time
Turn - off Delay Time
td(off)
tf
Fall Time
Turn - on Switching Loss
Eon
Turn - off Switching Loss
Eoff
Turn - on Delay Time
td(on)
tr
Rise Time
Turn - off Delay Time
td(off)
tf
Fall Time
Turn - on Switching Loss
Eon
Turn - off Switching Loss
Eoff
IC = 20A, VCC = 400V,
VGE = 15V, RG = 10Ω,
Tj = 25°C
Inductive Load
*Eon include diode
reverse recovery
IC = 20A, VCC = 400V,
VGE = 15V, RG = 10Ω,
Tj = 175°C
Inductive Load
*Eon include diode
reverse recovery
Unit
pF
nC
ns
mJ
ns
mJ
IC = 80A, VCC = 520V,
Reverse Bias Safe Operating
Area
RBSOA VP = 650V, VGE = 15V,
FULL SQUARE
-
RG = 100Ω, Tj = 175°C
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3/11
2020.11 - Rev.A
Datasheet
RGW40TK65D
lFRD Electrical Characteristics (at Tj = 25°C unless otherwise specified)
Parameter
Symbol
Conditions
Values
Unit
Min.
Typ.
Max.
Tj = 25°C
-
1.45
1.9
Tj = 175°C
-
1.55
-
-
92
-
ns
-
6.7
-
A
-
0.34
-
μC
IF = 20A,
Diode Forward Voltage
VF
V
Diode Reverse Recovery
Time
trr
Diode Peak Reverse
Recovery Current
Irr
Diode Reverse Recovery
Charge
Qrr
Diode Reverse Recovery
Energy
Err
-
14.1
-
μJ
Diode Reverse Recovery
Time
trr
-
123
-
ns
Diode Peak Reverse
Recovery Current
Irr
-
7.8
-
A
Diode Reverse Recovery
Charge
Qrr
-
0.59
-
μC
Diode Reverse Recovery
Energy
Err
-
30.7
-
μJ
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IF = 20A,
VCC = 400V,
diF/dt = 200A/μs,
Tj = 25°C
IF = 20A,
VCC = 400V,
diF/dt = 200A/μs,
Tj = 175°C
4/11
2020.11 - Rev.A
Datasheet
RGW40TK65D
lElectrical Characteristic Curves
Fig.2 Collector Current
vs. Case Temperature
40
Collector Current : IC [A]
Power Dissipation : PD [W]
Fig.1 Power Dissipation
vs. Case Temperature
80
60
40
20
30
20
10
Tj ≤ 175ºC
VGE ≥ 15V
0
0
0
25
50
0
75 100 125 150 175
Case Temperature : TC [°C ]
50
75 100 125 150 175
Case Temperature : TC [°C ]
Fig.3 Forward Bias Safe Operating Area
Fig.4 Reverse Bias Safe Operating Area
100
1000
1μs
100
Collector Current : IC [A]
Collector Current : IC [A]
25
10μs
10
100μs
1
0.1
80
60
40
20
Tj ≤ 175ºC
VGE = 15V
TC = 25ºC
Single Pulse
0
0.01
1
10
100
0
1000
Collector To Emitter Voltage : VCE [V]
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200
400
600
800
Collector To Emitter Voltage : VCE [V]
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2020.11 - Rev.A
Datasheet
RGW40TK65D
lElectrical Characteristic Curves
Fig.5 Typical Output Characteristics
Fig.6 Typical Output Characteristics
80
80
Tj = 175ºC
VGE = 20V
60
VGE = 15V
Collector Current : IC [A]
Collector Current : IC [A]
Tj = 25ºC
VGE = 12V
VGE = 10V
40
20
VGE = 20V
60
VGE = 15V
VGE = 12V
40
VGE = 10V
20
VGE = 8V
VGE = 8V
0
0
0
1
2
3
4
5
0
Collector To Emitter Voltage : VCE [V]
40
3
4
5
VGE = 15V
Collector To Emitter Saturation
Voltage : VCE(sat) [V]
VCE = 10V
Collector Current : IC [A]
2
Fig.8 Typical Collector to Emitter Saturation
Voltage vs. Junction Temperature
4
Fig.7 Typical Transfer Characteristics
30
20
10
1
Collector To Emitter Voltage : VCE [V]
Tj = 175ºC
Tj = 25ºC
3
IC = 40A
2
IC = 20A
1
IC = 10A
0
0
0
2
4
6
8
10
25
12
Gate To Emitter Voltage : VGE [V]
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50
75
100 125 150 175
Junction Temperature : Tj [°C ]
6/11
2020.11 - Rev.A
Datasheet
RGW40TK65D
lElectrical Characteristic Curves
Fig.9 Typical Collector to Emitter Saturation
Voltage vs. Gate to Emitter Voltage
20
Fig.10 Typical Collector to Emitter Saturation
Voltage vs. Gate to Emitter Voltage
20
Tj = 175ºC
Collector To Emitter Saturation
Voltage : VCE(sat) [V]
Collector To Emitter Saturation
Voltage : VCE(sat) [V]
Tj = 25ºC
IC = 40A
15
IC = 20A
IC = 10A
10
5
0
15
IC = 40A
IC = 20A
IC = 10A
10
5
0
5
10
15
20
5
10
Gate To Emitter Voltage : VGE [V]
Switching Time [ns]
Switching Time [ns]
Fig.12 Typical Switching Time
vs. Gate Resistance
1000
td(off)
tf
td(on)
10
tr
20
Gate To Emitter Voltage : VGE [V]
Fig.11 Typical Switching Time
vs. Collector Current
1000
100
15
td(off)
100
tf
td(on)
10
tr
VCC = 400V, VGE = 15V,
RG = 10Ω, Tj = 175ºC
Inductive load
VCC = 400V, VGE = 15V,
IC = 20A, Tj = 175ºC
Inductive load
1
1
0
10
20
30
40
0
20
30
40
50
Gate Resistance : RG [Ω]
Collecter Current : IC [A]
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10
7/11
2020.11 - Rev.A
Datasheet
RGW40TK65D
lElectrical Characteristic Curves
Fig.14 Typocal Switching Energy Losses
vs. Gate Resistance
10
Switching Energy Losses [mJ]
Switching Energy Losses [mJ]
Fig.13 Typical Switching Energy Losses
vs. Collector Current
10
1
Eoff
0.1
Eon
VCC = 400V, VGE = 15V,
RG = 10Ω, Tj = 175ºC
Inductive load
0.01
1
Eoff
Eon
0.1
VCC = 400V, IC = 20A,
VGE = 15V, Tj = 175ºC
Inductive load
0.01
0
10
20
30
40
0
Fig.15 Typical Capacitance
vs. Collector to Emitter Voltage
10000
Capacitance [pF]
1000
Coes
Cres
f = 1MHz
VGE = 0V
Tj = 25ºC
1
0.01
30
40
50
Fig.16 Typical Gate Charge
15
Gate To Emitter Voltage : V GE [V]
Cies
10
20
Gate Resistance : RG [Ω]
Collecter Current : IC [A]
100
10
10
5
VCC = 400V
IC = 20A
Tj = 25ºC
0
0.1
1
10
100
0
Collector To Emitter Voltage : VCE [V]
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10
20
30
40
50
60
Gate Charge : Qg [nC]
8/11
2020.11 - Rev.A
Datasheet
RGW40TK65D
lElectrical Characteristic Curves
Fig.18 Typical Diode Revese Recovery Time
vs. Forward Current
200
Reverse Recovery Time : trr [ns]
Forward Current : IF [A]
Fig.17 Typical Diode Forward Current
vs. Forward Voltage
80
60
40
Tj = 25ºC
Tj = 175ºC
20
0
180
160
140
Tj = 175ºC
120
100
80
Tj = 25ºC
60
40
VCC = 400V
diF/dt = 200A/μs
Inductive load
20
0
0
0.5
1
1.5
2
2.5
3
0
Forward Voltage : VF [V]
20
30
40
Forward Current : IF [A]
Fig.20 Typical Diode Rrverse Recovery
Charge vs. Forward Current
1.5
Reverse Recovery Charge : Qrr [μC]
Fig.19 Typical Diode Reverse Recovery
Current vs. Forward Current
15
Reverse Recovery Current : Irr [A]
10
10
Tj = 175ºC
5
Tj = 25ºC
VCC = 400V
diF/dt = 200A/μs
Inductive load
0
1
Tj = 175ºC
0.5
VCC = 400V
diF/dt = 200A/μs
Inductive load
Tj = 25ºC
0
0
10
20
30
40
0
Forward Current : IF [A]
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10
20
30
40
Forward Current : IF [A]
9/11
2020.11 - Rev.A
Datasheet
RGW40TK65D
lElectrical Characteristic Curves
Fig.21 Typical IGBT Transient Thermal Impedance
1E+1
D = 0.5
Transient Thermal Impedance
: Zθ(j-c) [°C/W]
0.2
0.1
1E+0
1E-1
PDM
t1
Single Pulse
1E-2
t2
Duty = t1/t2
Peak Tj = PDM×Zθ(j-c)+TC
0.01
0.02
C1
425.1u
0.05
1E-3
1E-6
1E-5
1E-4
C2
4.458m
1E-3
C3
72.53m
R1
503.1m
1E-2
R2
499.6m
R3
436.9m
1E-1
1E+0
Pulse Width : t1 [s]
Fig.22 Typical Diode Transient Thermal Impedance
1E+1
Transient Thermal Impedance
: Zθ(j-c) [°C/W]
D = 0.5
0.2
0.1
1E+0
1E-1
PDM
1E-2
t2
Duty = t1/t2
Peak Tj = PDM×Zθ(j-c)+TC
0.01
0.02
1E-3
1E-6
t1
Single Pulse
C1
221.3u
0.05
1E-5
1E-4
C2
1.179m
1E-3
C3
25.34m
1E-2
R1
360.3m
R2
687.0m
1E-1
R3
592.7m
1E+0
Pulse Width : t1 [s]
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2020.11 - Rev.A
Datasheet
RGW40TK65D
●Inductive Load Switching Circuit and Waveform
Gate Drive Time
90%
D.U.T.
D.U.T.
VGE
10%
VG
90%
Fig.23 Inductive Load Circuit
IC
10%
tr
td(on)
trr , Qrr
IF
ton
diF/dt
tf
td(off)
toff
VCE
10%
Irr
Eon
Fig.25 Diode Reverse Recovery Waveform
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Eoff
VCE(sat)
Fig.24 Inductive Load Waveform
11/11
2020.11 - Rev.A
Notice
Notes
1) The information contained herein is subject to change without notice.
2) Before you use our Products, please contact our sales representative and verify the latest specifications :
3) Although ROHM is continuously working to improve product reliability and quality, semiconductors can break down and malfunction due to various factors.
Therefore, in order to prevent personal injury or fire arising from failure, please take safety
measures such as complying with the derating characteristics, implementing redundant and
fire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no
responsibility for any damages arising out of the use of our Poducts beyond the rating specified by
ROHM.
4) Examples of application circuits, circuit constants and any other information contained herein are
provided only to illustrate the standard usage and operations of the Products. The peripheral
conditions must be taken into account when designing circuits for mass production.
5) The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly,
any license to use or exercise intellectual property or other rights held by ROHM or any other
parties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use of
such technical information.
6) The Products specified in this document are not designed to be radiation tolerant.
7) For use of our Products in applications requiring a high degree of reliability (as exemplified
below), please contact and consult with a ROHM representative : transportation equipment (i.e.
cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety
equipment, medical systems, and power transmission systems.
8) Do not use our Products in applications requiring extremely high reliability, such as aerospace
equipment, nuclear power control systems, and submarine repeaters.
9) ROHM shall have no responsibility for any damages or injury arising from non-compliance with
the recommended usage conditions and specifications contained herein.
10) ROHM has used reasonable care to ensur the accuracy of the information contained in this
document. However, ROHM does not warrants that such information is error-free, and ROHM
shall have no responsibility for any damages arising from any inaccuracy or misprint of such
information.
11) Please use the Products in accordance with any applicable environmental laws and regulations,
such as the RoHS Directive. For more details, including RoHS compatibility, please contact a
ROHM sales office. ROHM shall have no responsibility for any damages or losses resulting
non-compliance with any applicable laws or regulations.
12) When providing our Products and technologies contained in this document to other countries,
you must abide by the procedures and provisions stipulated in all applicable export laws and
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R1102S