Data Sheet
4.5V Drive Nch MOSFET
RMW130N03
Structure Silicon N-channel MOSFET Dimensions (Unit : mm)
PSOP8
0.5 5.0 6.0
(8)
(7)
(6)
(5)
Features 1) High Power package(PSOP8). 2) High-speed switching,Low On-resistance. 3) Low voltage drive(4.5V drive).
0~0.1
0.5
1pin mark
(1) (2)
(3)
(4) 0.4
0.22 0.9
1.27
5.0
Application Switching
Packaging specifications Package Type Code Basic ordering unit (pieces) RMW130N03 Taping TB 2500
Inner circuit
(8) (7) (6) (5)
Absolute maximum ratings (Ta = 25C) Symbol Parameter Drain-source voltage Gate-source voltage Drain current Source current (Body Diode) Power dissipation Channel temperature Range of storage temperature
*1 Pw10s, Duty cycle1% *2 MOUNTED ON 40mm ×40mm Cu BOARD
Limits 30 20 13 52 2.5 52 3.0 150 55 to 150
Unit V V A A A A W C C
(1) (2) (3) (4) (5) (6) (7) (8)
Source Source Source Gate Drain Drain Drain Drain
∗2
∗1
(1)
(2)
(3)
(4)
VDSS Continuous Pulsed Continuous Pulsed VGSS ID IDP *1 IS ISP PD Tch Tstg
*1 *2
∗1 ESD PROTECTION DIODE ∗2 BODY DIODE
Thermal resistance Parameter Channel to Ambient
* MOUNTED ON 40mm ×40mm Cu BOARD
Symbol Rth (ch-a)*
Limits 41.7
Unit C / W
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2011.03 - Rev.A
RMW130N03
Electrical characteristics (Ta = 25C) Parameter Gate-source leakage Zero gate voltage drain current Gate threshold voltage Static drain-source on-state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Total gate charge Gate-source charge Gate-drain charge
*Pulsed
Symbol IGSS IDSS VGS (th) * RDS (on) l Yfs l* Ciss Coss Crss td(on)* tr * td(off)* tf * Qg * Qgs * Qgd * Min. 30 1.0 7 Typ. 9.0 12.6 650 310 85 11 35 30 8 12 2.7 2.6 Max. 10 1 2.5 12.6 17.7 Unit A V A V m S pF pF pF ns ns ns ns nC nC nC Conditions VGS=20V, VDS=0V ID=1mA, V GS=0V VDS=30V, VGS=0V VDS=10V, ID=1mA ID=13A, VGS=10V ID=13A, VGS=4.5V ID=13A, VDS=10V VDS=15V VGS=0V f=1MHz ID=6A, VDD 15V VGS=10V RL=2.5 RG=10 ID=13A, VDD 15V VGS=10V
Data Sheet
Drain-source breakdown voltage V(BR)DSS
Body diode characteristics (Source-Drain) (Ta = 25C) Parameter Forward Voltage
*Pulsed
Symbol VSD *
Min. -
Typ. -
Max. 1.2
Unit V
Conditions Is=2.5A, VGS=0V
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2011.03 - Rev.A
RMW130N03
Electrical characteristic curves (Ta=25C)
Fig.1 Typical Output Characteristics(Ⅰ) 13 12 11 10 DRAIN CURRENT : ID[A] Ta=25°C Pulsed
Data Sheet
Fig.2 Typical Output Characteristics(Ⅱ) 13 12 11 10 DRAIN CURRENT : ID[A] 9 8 7 6 5 4 3 2 VGS= 2.5V VGS= 3.0V VGS= 10V VGS= 4.5V VGS= 4.0V VGS= 3.5V Ta=25°C Pulsed
9 8 7 6 5 4 3 2 1 0 0 0.2 0.4 0.6 0.8 1 VGS= 2.5V VGS= 10V VGS= 4.5V VGS= 4.0V VGS= 3.5V VGS= 3.0V
1 0 0 2 4 6
8
10
DRAIN-SOURCE VOLTAGE : VDS[V]
DRAIN-SOURCE VOLTAGE : VDS[V] Fig.4 Static Drain-Source On-State Resistance vs. Drain Current(Ⅰ) 100 Ta=25°C Pulsed
Fig.3 Typical Transfer Characteristics 100 VDS= 10V Pulsed 10 DRAIN CURRENT : ID[A] Ta=125°C Ta=75°C Ta=25°C Ta=-25°C
1
STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on)[mΩ]
VGS= 4.5V VGS= 10V
10
.
0.1
0.01
0.001 0 1 2 3 4
1 0.1 1 10 100
GATE-SOURCE VOLTAGE : VGS[V] Fig.5 Static Drain-Source On-State Resistance vs. Drain Current(Ⅱ) 100 VGS= 10V Pulsed STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on)[mΩ] Ta=125°C Ta=75°C Ta=25°C Ta=-25°C STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on)[mΩ] 100 VGS= 4.5V Pulsed
DRAIN-CURRENT : ID[A] Fig.6 Static Drain-Source On-State Resistance vs. Drain Current(Ⅲ)
10
10 Ta=125°C Ta=75°C Ta=25°C Ta=-25°C
1 0.1 1 10 100
1 0.1 1 10 100 DRAIN-CURRENT : ID[A]
DRAIN-CURRENT : ID[A]
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2011.03 - Rev.A
RMW130N03
Fig.7 Forward Transfer Admittance vs. Drain Current Fig.8 Reverse Drain Current vs. Sourse-Drain Voltage 100 VGS=0V Pulsed SOURCE CURRENT : Is [A] 10
Data Sheet
100 FORWARD TRANSFER ADMITTANCE : |Yfs| [S] VDS= 10V Pulsed
10
1 Ta=125°C Ta=75°C Ta=25°C Ta=-25°C
1 Ta=125°C Ta=75°C Ta=25°C Ta=-25°C 0.1 0.01 0.1 1 10 100
0.1
0.01 0 0.5 1 1.5 DRAIN-CURRENT : ID[A] Fig.9 Static Drain-Source On-State Resistance vs. Gate Source Voltage
SOURCE-DRAIN VOLTAGE : VSD [V]
Fig.10 Switching Characteristics 10000
50 45 STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(ON)[mΩ] 40 35 30 25 20 15 10 5 0 0 5 10 15 ID= 13A ID= 6.5A Ta=25°C Pulsed
tf SWITCHING TIME : t [ns] 1000
Ta=25°C VDD= 15V VGS=10V RG=10Ω Pulsed
td(off) 100
td(on) 10 tr 1 0.01 0.1 1 10 100 DRAIN-CURRENT : ID[A] Fig.12 Typical Capacitance vs. Drain-Source Voltage
GATE-SOURCE VOLTAGE : VGS[V] Fig.11 Dynamic Input Characteristics 10 9 GATE-SOURCE VOLTAGE : VGS [V] Ciss 8 CAPACITANCE : C [pF] 7 6 5 4 3 2 1 0 0 1 2 3 4 5 6 7 8 9 10 11 12 13 Ta=25°C VDD= 15V ID= 13A RG=10Ω Pulsed 1000 Coss Crss 10000
100
Ta=25°C f=1MHz VGS=0V 10 0.01 0.1 1 10 100
TOTAL GATE CHARGE : Qg [nC]
DRAIN-SOURCE VOLTAGE : VDS[V]
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2011.03 - Rev.A
RMW130N03
Fig.13 Maximum Safe Operating Aera
Data Sheet
Fig.14 Normalized Transient Thermal Resistance vs. Pulse Width
1000 Operation in this area is limited by RDS(ON) (VGS=10V) DRAIN CURRENT : ID (A) 100 NORMARIZED TRANSIENT THERMAL RESISTANCE : r (t)
10
1
10
PW =100us
0.1
PW = 1ms 1 PW =10ms 0.1 Ta = 25°C Single Pulse Mounted on a COPPER BOARD 0.1 1 10 DC operation
0.01
Ta = 25°C Single Pulse : 1Unit Rth(ch-a)(t) = r(t)×Rth(ch-a) Rth(ch-a) = 41.7°C/W
0.001 0.01 0.1 1 10 100 1000
0.01 100
0.001
0.0001
DRAIN-SOURCE VOLTAGE : VDS[V]
PULSE WIDTH : Pw(s)
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2011.03 - Rev.A
RMW130N03
Measurement circuits
Data Sheet
Pulse width
VGS ID RL D.U.T. RG VDD VDS
VGS VDS
50% 10% 10% 90% td(on) ton tr
90%
50% 10% 90%
td(off) toff
tf
Fig.1-1 Switching Time Measurement Circuit
VGS
Fig.1-2 Switching Waveforms
VG
ID RL
VDS
Qg VGS Qgs Qgd
IG(Const.)
D.U.T. VDD
Charge
Fig.2-1 Gate Charge Measurement Circuit
Fig.2-2 Gate Charge Waveform
Notice This product might cause chip aging and breakdown under the large electrified environment. Please consider to design ESD protection circuit.
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6/6
2011.03 - Rev.A
Notice
Notes
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