Data Sheet
4.5V Drive Nch MOSFET
RMW200N03
Structure Silicon N-channel MOSFET Dimensions (Unit : mm)
PSOP8
0.5 5.0 6.0
(8)
(7)
(6)
(5)
Features 1) High Power package(PSOP8). 2) High-speed switching,Low On-resistance. 3) Low voltage drive(4.5V drive).
0~0.1
0.5
1pin mark
(1) (2)
(3)
(4) 0.4
0.22 0.9
1.27
5.0
Application Switching
Packaging specifications Package Code Basic ordering unit (pieces) RMW200N03 Type Taping TB 2500
Inner circuit
(8) (7) (6) (5)
Absolute maximum ratings (Ta = 25 C) Parameter Drain-source voltage Gate-source voltage Drain current Source current (Body Diode) Power dissipation Channel temperature Range of storage temperature
*1 Pw10s, Duty cycle1% *2 MOUNTED ON 40mm×40mm Cu BOARD
Symbol VDSS VGSS
Limits 30 20 20
Unit V V A A A A W C C
(1) (2) (3) (4) (5) (6) (7) (8)
Source Source Source Gate Drain Drain Drain Drain
∗2
∗1
(1)
(2)
(3)
(4)
∗1 ESD PROTECTION DIODE ∗2 BODY DIODE
Continuous Pulsed Continuous Pulsed
ID IDP IS ISP PD Tch Tstg
*1
80 2.5 80 3.0 150 55 to 150
*1 *2
Thermal resistance Parameter Channel to Ambient
* MOUNTED ON 40mm×40mm Cu BOARD
Symbol Rth (ch-a)*
Limits 41.7
Unit C / W
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2011.03 - Rev.A
RMW200N03
Electrical characteristics (Ta = 25C) Parameter Gate-source leakage Zero gate voltage drain current Gate threshold voltage Static drain-source on-state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Total gate charge Gate-source charge Gate-drain charge
*Pulsed
Symbol IGSS IDSS VGS (th) * RDS (on) l Yfs l* Ciss Coss Crss td(on)* tr * td(off)* tf * Qg * Qgs * Qgd * Min. 30 1.0 20 Typ. 3.0 4.0 1780 580 210 18 50 60 20 29 5.7 5.5 Max. 10 1 2.5 4.2 5.6 Unit A V A V m S pF pF pF ns ns ns ns nC nC nC Conditions VGS=20V, VDS=0V ID=1mA, V GS=0V VDS=30V, VGS=0V VDS=10V, ID=1mA ID=20A, VGS=10V ID=20A, VGS=4.5V ID=20A, VDS=10V VDS=15V VGS=0V f=1MHz ID=10A, VDD 15V VGS=10V RL=1.5 RG=10 ID=20A, VDD 15V VGS=10V
Data Sheet
Drain-source breakdown voltage V(BR)DSS
Body diode characteristics (Source-Drain) (Ta = 25C) Parameter Forward Voltage
*Pulsed
Symbol VSD *
Min. -
Typ. -
Max. 1.2
Unit V
Conditions Is=2.5A, VGS=0V
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2011.03 - Rev.A
RMW200N03
Electrical characteristic curves (Ta=25C)
Fig.1 Typical Output Characteristics(Ⅰ) 20 18 16 DRAIN CURRENT : ID[A] 14 12 10 8 6 4 2 0 0 0.2 0.4 0.6 0.8 1 DRAIN-SOURCE VOLTAGE : VDS[V] VGS= 2.5V VGS= 10V VGS= 4.5V VGS= 4.0V VGS= 3.5V Ta=25°C Pulsed
Fig.2 Typical Output Characteristics(Ⅱ) 20 18 16 DRAIN CURRENT : ID[A] 14 12 10 8 6 4 2 0 0 2 4 6 8 10 DRAIN-SOURCE VOLTAGE : VDS[V] Fig.4 Static Drain-Source On-State Resistance vs. Drain Current(Ⅰ) 10 VGS= 2.5V VGS= 10V VGS= 4.5V VGS= 4.0V VGS= 3.5V VGS= 3.0V Ta=25°C Pulsed
Data Sheet
VGS= 3.0V
Fig.3 Typical Transfer Characteristics 100 VDS= 10V Pulsed 10 DRAIN CURRENT : ID[A] Ta=125°C Ta=75°C Ta=25°C Ta=-25°C
1
STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on)[mΩ]
Ta=25°C Pulsed
.
0.1
0.01
VGS= 4.5V VGS= 10V
0.001 0 1 2 3
1 0.1 1 10 100
GATE-SOURCE VOLTAGE : VGS[V] Fig.5 Static Drain-Source On-State Resistance vs. Drain Current(Ⅱ) 100 STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on)[mΩ] VGS= 10V Pulsed STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on)[mΩ] 100 VGS= 4.5V Pulsed
DRAIN-CURRENT : ID[A] Fig.6 Static Drain-Source On-State Resistance vs. Drain Current(Ⅲ)
10
Ta=125°C Ta=75°C Ta=25°C Ta=-25°C
Ta=125°C Ta=75°C Ta=25°C Ta=-25°C 10
1 0.1 1 10 100 DRAIN-CURRENT : ID[A]
1 0.1 1 10 100
DRAIN-CURRENT : ID[A]
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3/6
2011.03 - Rev.A
RMW200N03
Fig.7 Forward Transfer Admittance vs. Drain Current Fig.8 Reverse Drain Current vs. Sourse-Drain Voltage 100 VGS=0V Pulsed SOURCE CURRENT : Is [A] 10
Data Sheet
100 FORWARD TRANSFER ADMITTANCE : |Yfs| [S] VDS= 10V Pulsed
10
1 Ta=125°C Ta=75°C Ta=25°C Ta=-25°C
1
Ta=125°C Ta=75°C Ta=25°C Ta=-25°C
0.1
0.1 0.01
0.01 0.1 1 10 100 0 0.5 1 1.5
DRAIN-CURRENT : ID[A] Fig.9 Static Drain-Source On-State Resistance vs. Gate Source Voltage 10 ID= 10A STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(ON)[mΩ] 8 SWITCHING TIME : t [ns] ID= 20A 1000 Ta=25°C Pulsed tf 10000
SOURCE-DRAIN VOLTAGE : VSD [V]
Fig.10 Switching Characteristics Ta=25°C VDD= 15V VGS=10V RG=10Ω Pulsed td(off) 100 td(on) 10
6
4
2
tr
0 0 5 10 15
1 0.01 0.1 1 10 100
GATE-SOURCE VOLTAGE : VGS[V] Fig.11 Dynamic Input Characteristics 10 10000 Ciss GATE-SOURCE VOLTAGE : VGS [V] 8 CAPACITANCE : C [pF] Coss 1000 Crss
DRAIN-CURRENT : ID[A] Fig.12 Typical Capacitance vs. Drain-Source Voltage
6
4 Ta=25°C VDD= 15V ID= 20A RG=10Ω Pulsed 0 5 10 15 20 25 30
100 Ta=25°C f=1MHz VGS=0V 10 0.01 0.1 1 10 100
2
0
TOTAL GATE CHARGE : Qg [nC]
DRAIN-SOURCE VOLTAGE : VDS[V]
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4/6
2011.03 - Rev.A
RMW200N03
Data Sheet
Fig.13 Maximum Safe Operating Aera 1000 Operation in this area is limited by RDS(ON) (VGS=10V) 100 DRAIN CURRENT : ID (A) PW =100us 10 NORMARIZED TRANSIENT THERMAL RESISTANCE : r (t)
Fig.14 Normalized Transient Thermal Resistance vs. Pulse Width
10
1
0.1
1
PW =1ms PW = 10ms
0.01
0.1
Ta = 25°C Single Pulse Mounted on a COPPER BOARD 0.1 1 10
DC operation
0.001
Ta = 25°C Single Pulse : 1Unit Rth(ch-a)(t) = r(t)×Rth(ch-a) Rth(ch-a) = 41.7°C/W
0.001 0.01 0.1 1 10 100 1000
0.01 100
0.0001
0.0001
DRAIN-SOURCE VOLTAGE : VDS[V]
PULSE WIDTH : Pw(s)
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5/6
2011.03 - Rev.A
RMW200N03
Measurement circuits
Data Sheet
Pulse width
VGS
ID RL D.U.T.
VDS
VGS VDS
50% 10% 10%
90%
50% 10% 90%
RG
VDD
td(on) ton
90% tr td(off) toff
tf
Fig.1-1 Switching Time Measurement Circuit
VGS
Fig.1-2 Switching Waveforms
VG
ID RL
VDS
Qg VGS Qgs Qgd
IG(Const.)
D.U.T. VDD
Charge
Fig.2-1 Gate Charge Measurement Circuit
Fig.2-2 Gate Charge Waveform
Notice This product might cause chip aging and breakdown under the large electrified environment. Please consider to design ESD protection circuit.
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6/6
2011.03 - Rev.A
Notice
Notes
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