2.5V Drive Nch MOSFET
RSE002N06
Structure
Silicon N-channel MOSFET
Dimensions (Unit : mm)
EMT3
or
SOT-416
0.7
1.6
0.55
0.3
(2)
0.2
(1)
0.2
0.15
0.5 0.5
0.1Min.
0.8
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1.6
(3)
Features
1) High speed switing.
2) Small package(EMT3).
3) Low voltage drive(2.5V drive).
1.0
(1)Source
(2)Gate
Abbreviated symbol : RK
(3)Drain
Application
Switching
Packaging specifications
Inner circuit
Package
Type
Code
Basic ordering unit (pieces)
RSE002N06
(3)
Taping
TL
3000
∗2
(2)
∗1
Absolute maximum ratings (Ta = 25C)
Parameter
Drain-source voltage
Unit
VDSS
60
V
VGSS
20
V
ID
250
mA
Pulsed
Continuous
IDP
IS
*1
1
125
A
mA
Pulsed
ISP
*1
1
A
PD
*2
R
Source current
(Body Diode)
Limits
Continuous
Gate-source voltage
Drain current
Symbol
Power dissipation
150
mW
Tch
Tstg
150
55 to +150
C
C
Symbol
Limits
Unit
Rth (ch-a)*
833
C / W
(1)
∗1 ESD PROTECTION DIODE
∗2 BODY DIODE
ot
Channel temperature
Range of storage temperature
(1) Source
(2) Gate
(3) Drain
*1 Pw10s, Duty cycle1%
N
*2 Each terminal mounted on a recommended land.
Thermal resistance
Parameter
Channel to ambient
* Each terminal mounted on a recommended land.
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c 2010 ROHM Co., Ltd. All rights reserved.
○
1/5
2010.01 - Rev.A
RSE002N06
Data Sheet
Electrical characteristics (Ta = 25C)
Parameter
Symbol
Gate-source leakage
IGSS
Drain-source breakdown voltage V(BR)DSS
Zero gate voltage drain current
Gate threshold voltage
Min.
Typ.
Max.
Unit
Conditions
-
-
10
A
VGS=20V, VDS=0V
60
-
-
V
ID=1mA, VGS=0V
IDSS
-
-
1
A
VDS=60V, VGS=0V
VGS (th)
1.0
-
2.3
V
VDS=10V, ID=1mA
-
1.7
2.4
-
2.1
3.0
-
2.3
3.2
ID=250mA, VGS=10V
ID=250mA, VGS=4.5V
Static drain-source on-state
resistance
*
RDS (on)
-
3.0
12.0
Forward transfer admittance
l Yfs l*
0.25
-
-
S
ID=250mA, VDS=10V
Input capacitance
Ciss
-
15
-
pF
VDS=25V
ID=250mA, VGS=4.0V
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ID=10mA, VGS=2.5V
Output capacitance
Coss
-
4.5
-
pF
VGS=0V
Reverse transfer capacitance
Crss
-
2.0
-
pF
f=1MHz
Turn-on delay time
td(on) *
-
3.5
-
ns
ID=100mA, VDD 30V
tr *
-
5
-
ns
VGS=10V
td(off) *
tf *
-
18
28
-
ns
ns
RL 300
RG=10
Rise time
Turn-off delay time
Fall time
*Pulsed
Body diode characteristics (Source-Drain) (Ta = 25C)
Parameter
Symbol
Min.
Typ.
*
Forward voltage
VSD
1.2
Unit
V
Conditions
Is=250mA, VGS=0V
N
ot
R
*Pulsed
Max.
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c 2010 ROHM Co., Ltd. All rights reserved.
○
2/5
2010.01 - Rev.A
RSE002N06
Data Sheet
Electrical characteristic curves
0.4
VGS= 10V
VGS= 4.5V
VGS= 4.0V
0.3
0.2
VGS= 2.8V
0.4
0.3
VGS= 2.8V
0.2
0.1
0.1
Ta= 25C
Pulsed
VGS= 10V
VGS= 4.5V
VGS= 4.0V
DRAIN CURRENT : ID[A]
DRAIN CURRENT : ID[A]
Ta= 25C
Pulsed
DRAIN CURRENT : ID[A]
1
0.5
0.5
VDS= 10V
Pulsed
0.1
Ta=125C
Ta=75C
Ta=25C
Ta= -25C
0.01
0.001
VGS= 2.5V
0.0001
0
0
0
0.2
0.4
0.6
0.8
0
1
DRAIN-SOURCE VOLTAGE : VDS[V]
6
8
0.5
1
1.5
2
2.5
0.1
0.001
0.01
0.1
1
100
VGS= 10V
Pulsed
Fig.3 Typical Transfer Characteristics
Ta=125C
Ta=75C
Ta=25C
Ta= -25C
10
1
0.1
0.001
0.01
0.1
DRAIN-CURRENT : ID[A]
Fig.4 Static Drain-Source On-State
Resistance vs. Drain Current( I )
Fig.5 Static Drain-Source On-State
Resistance vs. Drain Current( II )
0.1
0.001
0.01
0.1
1
DRAIN-CURRENT : ID[A]
Fig.7 Static Drain-Source On-State
Resistance vs. Drain Current( IV )
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c 2010 ROHM Co., Ltd. All rights reserved.
○
10
Ta=125C
Ta=75C
Ta=25C
Ta= -25C
1
0.01
0.1
1
DRAIN-CURRENT : ID[A]
1
VGS= 2.5V
Pulsed
10
Ta=125C
Ta=75C
Ta=25C
Ta= -25C
FORWARD TRANSFER
ADMITTANCE : |Yfs| [S]
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on)[]
R
1
VGS= 4.5V
Pulsed
Fig.6 Static Drain-Source On-State
Resistance vs. Drain Current( III )
100
Ta=125C
Ta=75C
Ta=25C
Ta= -25C
100
0.1
0.001
1
DRAIN-CURRENT : ID[A]
VGS= 4.0V
Pulsed
3
GATE-SOURCE VOLTAGE : VGS[V]
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on)[]
1
10
0
10
Fig.2 Typical Output Characteristics( II )
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on)[]
10
VGS= 2.5V
VGS= 4.0V
VGS= 4.5V
VGS= 10V
ot
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on)[]
4
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STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on)[]
Ta= 25C
Pulsed
100
N
2
DRAIN-SOURCE VOLTAGE : VDS[V]
Fig.1 Typical Output Characteristics( I )
100
or
VGS= 2.5V
1
0.1
0.001
0.01
0.1
1
DRAIN-CURRENT : ID[A]
Fig.8 Static Drain-Source On-State
Resistance vs. Drain Current( IV )
3/5
VDS= 10V
Pulsed
0.1
Ta= -25C
Ta=25C
Ta=75C
Ta=125C
0.01
0.001
0.01
0.1
1
DRAIN-CURRENT : ID[A]
Fig.9 Forward Transfer Admittance
vs. Drain Current
2010.01 - Rev.A
0.1
Ta=125C
Ta=75C
Ta=25C
Ta=-25C
0.01
0.001
0
0.5
1
1.5
SOURCE-DRAIN VOLTAGE : V SD [V]
CAPACITANCE : C [pF]
100
Ta=25C
f=1MHz
VGS=0V
10
Crss
1000
Ta=25C
Pulsed
6
ID= 0.01A
4
ID= 0.25A
2
0
td(off)
tf
Ta=25C
VDD= 30V
VGS=10V
RG=10
Pulsed
100
10
tr
td(on)
1
0
2.5
5
7.5
10
GATE-SOURCE VOLTAGE : VGS[V]
Fig.11 Static Drain-Source On-State
Resistance vs. Gate Source Voltage
0.01
0.1
1
DRAIN-CURRENT : ID[A]
Fig.12 Switching Characteristics
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Fig.10 Reverse Drain Current
vs. Sourse-Drain Voltage
8
or
VGS=0V
Pulsed
SWITCHING TIME : t [ns]
1
Data Sheet
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(ON)[]
REVERSE DRAIN CURRENT : Is [A]
RSE002N06
Ciss
Coss
1
0.01
0.1
1
10
100
DRAIN-SOURCE VOLTAGE : VDS [V]
N
ot
R
Fig.13 Typical Capacitance
vs. Drain-Source Voltage
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c 2010 ROHM Co., Ltd. All rights reserved.
○
4/5
2010.01 - Rev.A
RSE002N06
Data Sheet
Measurement circuits
Pulse width
ID
VDS
RL
50%
10%
D.U.T.
RG
90%
50%
10%
VGS
VDS
VDD
10%
90%
td(on)
tr
ton
90%
td(off)
tf
toff
Fig.1-2 Switching waveforms
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Fig.1-1 Switching time measurement circuit
or
VGS
N
ot
R
Notice
This product might cause chip aging and breakdown under the large electrified environment.
Please consider to design ESD protection circuit.
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c 2010 ROHM Co., Ltd. All rights reserved.
○
5/5
2010.01 - Rev.A
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
or
The content specified herein is subject to change for improvement without notice.
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The content specified herein is for the purpose of introducing ROHM's products (hereinafter
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illustrate the standard usage and operations of the Products. The peripheral conditions must
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However, should you incur any damage arising from any inaccuracy or misprint of such
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N
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