Data Sheet
10V Drive Nch MOSFET
RSJ400N06
Structure Silicon N-channel MOSFET Dimensions (Unit : mm)
LPTS
10.1 4.5 1.3
Features 1) Low on-resistance. 2) High current 3) High power Package
13.1 9.0
3.0
1.0
1.24
0.78
(3)
5.08
(1) (2)
2.7
Application Switching
Packaging specifications Package Type Code Basic ordering unit (pieces) RSJ400N06 Taping TL 1000
Inner circuit
∗1
∗2
(1) Gate (2) Drain (3) Source
(1)
(2)
1 ESD PROTECTION DIODE 2 BODY DIODE
Absolute maximum ratings (Ta = 25°C) Parameter Drain-source voltage Gate-source voltage Drain current Source current (Body Diode) Power dissipation Channel temperature Range of storage temperature
*1 Pw10s, Duty cycle1% *2 Tc=25C
Symbol VDSS VGSS ID IDP IS ISP PD Tch Tstg
*1
Limits 60 20 40 80 40 80 50 150 55to150
Unit V V A A A A W C C
Continuous Pulsed Continuous Pulsed
*1 *2
Thermal resistance Parameter Channel to Case
* T c=25C
Symbol Rth (ch-c) *
Limits 2.5
Unit C / W
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1/5
2011.09 - Rev.A
1.2
2.54
0.4
(3)
RSJ400N06
Electrical characteristics (Ta = 25°C) Parameter Gate-source leakage Zero gate voltage drain current Gate threshold voltage Static drain-source on-state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Total gate charge Gate-source charge Gate-drain charge
*Pulsed
Symbol IGSS IDSS VGS (th) * RDS (on) l Yfs l* Ciss Coss Crss td(on) * tr * td(off) * tf * Qg * Qgs * Qgd * Min. 60 1.0 14 Typ. 11 2400 490 250 20 60 90 140 52 8 15 Max. 10 1 3.0 16 Unit A V A V Conditions VGS=20V, VDS=0V ID=1mA, V GS=0V VDS=60V, VGS=0V VDS=10V, ID=1mA
Data Sheet
Drain-source breakdown voltage V(BR)DSS
m ID=40A, VGS=10V S pF pF pF ns ns ns ns nC nC nC ID=20A, VDS=10V VDS=10V VGS=0V f=1MHz ID=20A, VDD 30V VGS=10V RL=1.5 RG=10 VDD 30V ID=40A, VGS=10V
Body diode characteristics (Source-Drain) (Ta = 25C) Parameter Forward Voltage
*Pulsed
Symbol VSD *
Min. -
Typ. -
Max. 1.2
Unit V
Conditions Is=40A, VGS=0V
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2/5
2011.09 - Rev.A
RSJ400N06
Electrical characteristic curves (Ta=25C)
Fig.1 Static Drain-Source On-State Resistance vs. Drain Current 100 Ta=25°C VGS=10V pulsed
Data Sheet
Fig.2 Static Drain-Source On-State Resistance vs. Drain Current 100 VGS=10V pulsed Static Drain-Source On-State Resistance RDS(on) [mΩ] Ta=125°C Ta=75°C Ta=25°C Ta=-25°C
Static Drain-Source On-State Resistance RDS(on) [mΩ]
10
10
1 0.01
0.1
1 Drain Current : ID [A]
10
100
1 0.01
0.1
1 Drain Current : ID [A]
10
100
Fig.3 Static Drain-Source On-State Resistance vs. Drain Current 100 VGS=4.5V pulsed Static Drain-Source On-State Resistance RDS(on) [mΩ] Ta=125°C Ta=75°C Ta=25°C Ta=-25°C
Fig.4 Static Drain-Source On-State Resistance vs. Drain Current 100 VGS=4V pulsed Static Drain-Source On-State Resistance RDS(on) [mΩ] Ta=125°C Ta=75°C Ta=25°C Ta=-25°C
10
10
1 0.01
0.1
1 Drain Current : ID [A]
10
100
1 0.01
0.1
1 Drain Current : ID [A]
10
100
Fig.5 Forward Transfer Admittance vs. Drain Current 100 VDS=10V pulsed 10 Forward Transfer Admittance Yfs [S] 10 Drain Currnt : ID [A] 100
Fig.6 Typical Transfer Characteristics
VDS=10V pulsed
1
0.1
1
Ta=125°C Ta=75°C Ta=25°C Ta=-25°C
Ta=125°C Ta=75°C Ta=25°C Ta=-25°C
0.01
0.001 0.1 0.0001
0.01 0.01
0.00001 0.1 1 Drain Current : ID [A] 10 100 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 Gate-Source Voltage : VGS [V]
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3/5
2011.09 - Rev.A
RSJ400N06
Data Sheet
Fig.7 Source Current vs. Source-Drain Voltage 100 VGS=0V pulsed 10 Static Drain-Source On-State Resistance RDS(on) [mΩ]
Fig.8 Static Drain-Source On-State Resistance vs. Gate-Source Voltage 50 Ta=25°C pulsed 40
Source Current : Is [A]
1
0.1
Ta=125°C Ta=75°C Ta=25°C Ta=-25°C
30
ID=20A ID=40A
20
0.01
0.001
10
0.0001 0.0 0.5 1.0 1.5 Source-Drain Voltage : VSD [V]
0 0 2 4 6 8 10 12 14 16 18 20 Gate-Source Voltage : VGS [V]
Fig.9 Switching Characteristics 10000 VDD≒30V VGS=10V RG=10Ω Ta=25°C Pulsed tf td(off) 100 td(on) 10 Ta=25°C VDD=30V ID=40A Pulsed
Fig.10 Dynamic Input Characteristics
8 Gate-Source Voltage : VGS [V] 100
1000 Switching Time : t [ns]
6
4
10
tr
2
1 0.01 0.1 1 Drain Current : ID [A] 10
0 0 5 10 15 20 25 30 35 40 45 50 55 60 Total Gate Charge : Qg [nC]
Fig.11 Typical Capacitance vs. Drain-Source Voltage 100000 Normalized Transient Thermal Resistance : r(t) Ta=25°C f=1MHz VGS=0V Ciss
Fig.12 Normalized Transient Thermal Resistance v.s. Pulse Width
10
Tc=25°C Single Pulse
10000 Capacitance : C [pF]
1
1000
Coss
0.1
100 Crss
0.01
10
Rth(ch-c)=2.5°C/W Rth(ch-c)(t)=r(t)×Rth(ch-c)
0.001 0.0001 0.001 0.01 0.1 1 10 100 1000
1 0.01 0.1 1 10 100 Drain-Source Voltage : VDS [V]
Pulse width : Pw (s)
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4/5
2011.09 - Rev.A
RSJ400N06
Measurement circuits
Data Sheet
Pulse width
VGS ID RL D.U.T. RG VDD VDS
VGS VDS
50% 10% 10% 90% td(on) ton tr
90%
50% 10% 90%
td(off) toff
tf
Fig.1-1 Switching Time Measurement Circuit
Fig.1-2 Switching Waveforms
VG
VGS ID RL IG(Const.) D.U.T. VDD VDS
Qg VGS Qgs Qgd
Charge
Fig.2-1 Gate Charge Measurement Circuit
Fig.2-2 Gate Charge Waveform
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5/5
2011.09 - Rev.A
Notice
Notes
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