RSQ020N03
Nch 30V 2A Small Signal MOSFET
Datasheet
l Outline
VDSS
30V
RDS(on)(Max.)
134mΩ
SC-95
ID
±2.0A
TSMT6
PD
1.25W
SOT-457T
l Inner circuit
l Features
1) Low on - resistance
2) Built-in G-S protection diode
3) Small surface mount package(TSMT6)
4) Pb-free lead plating ; RoHS compliant
l Packaging specifications
Embossed
Tape
Packing
l Application
Reel size (mm)
Tape width (mm)
Basic ordering unit (pcs)
Taping code
Marking
Type
Switching
180
8
3000
TR
QQ
l Absolute maximum ratings (Ta = 25°C ,unless otherwise specified)
Parameter
Drain - Source voltage
Continuous drain current
Pulsed drain current
Gate - Source voltage
Power dissipation
Junction temperature
Operating junction and storage temperature range
Symbol
Value
Unit
VDSS
ID
IDP*1
VGSS
PD*2
PD*3
Tj
30
V
±2.0
±8.0
±20
1.25
0.95
150
-55 to +150
A
A
V
W
W
Tstg
℃
℃
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1/11
20180702 - Rev.003
RSQ020N03
Datasheet
l Thermal resistance
Parameter
Symbol
Thermal resistance, junction - ambient
Values
Unit
Min.
Typ.
Max.
RthJA*2
-
-
100
℃/W
RthJA*3
-
-
132
℃/W
l Electrical characteristics (T a = 25°C)
Parameter
Symbol
Drain - Source breakdown
voltage
Breakdown voltage
temperature coefficient
Conditions
V(BR)DSS VGS = 0V, ID = 1mA
ΔV(BR)DSS ID = 1mA
ΔTj referenced to 25℃
Values
Unit
Min.
Typ.
Max.
30
-
-
V
-
29
-
mV/℃
Zero gate voltage
drain current
IDSS
VDS = 30V, VGS = 0V
-
-
1
μA
Gate - Source leakage current
IGSS
VGS = ±20V, VDS = 0V
-
-
±10
μA
VGS(th)
VDS = 10V, ID = 1mA
1.0
-
2.5
V
-
-1.6
-
mV/℃
VGS = 10V, ID = 2.0A
-
96
134
RDS(on)*4 VGS = 4.5V, ID = 2.0A
-
148
207
VGS = 4.0V, ID = 2.0A
-
168
235
Gate threshold voltage
Gate threshold voltage
temperature coefficient
ΔVGS(th) ID = 1mA
ΔTj referenced to 25℃
Static drain - source
on - state resistance
mΩ
Gate resistance
RG
f = 1MHz, open drain
-
9.2
-
Ω
Forward Transfer
Admittance
|Yfs| *4
VDS = 10V, ID = 2.0A
1.5
-
-
S
*1 Pw≦10μs , Duty cycle≦1%
*2 Mounted on a ceramic board (30×30×0.8mm)
*3 Mounted on a FR4 (25×25×0.8mm)
*4 Pulsed
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2/11
20180702 - Rev.003
RSQ020N03
Datasheet
l Electrical characteristics (Ta = 25°C)
Values
Parameter
Symbol
Conditions
Unit
Min.
Typ.
Max.
Input capacitance
Ciss
VGS = 0V
-
110
-
Output capacitance
Coss
VDS = 10V
-
40
-
Reverse transfer capacitance
Crss
f = 1MHz
-
22
-
VDD ⋍ 15V,VGS = 10V
-
7
-
ID = 1.0A
-
9
-
td(off)*4
RL ⋍ 15.0Ω
-
16
-
tf*4
RG = 10Ω
-
4
-
Turn - on delay time
td(on)*4
tr*4
Rise time
Turn - off delay time
Fall time
pF
ns
l Gate charge characteristics (Ta = 25°C)
Values
Parameter
Symbol
Total gate charge
Qg*4
Gate - Source charge
Qgs*4
Gate - Drain charge
Qgd*4
Conditions
VDD ⋍ 15V,
ID = 2.0A,
VGS = 5V
Unit
Min.
Typ.
Max.
-
2.2
3.1
-
0.7
-
-
0.6
-
nC
l Body diode electrical characteristics (Source-Drain) (Ta = 25°C)
Values
Parameter
Continuous forward current
Symbol
IS
Pulse forward current
ISP*1
Forward voltage
VSD*4
Conditions
Ta = 25℃
VGS = 0V, IS = 1.0A
Unit
Min.
Typ.
Max.
-
-
1.0
A
-
-
8.0
A
-
-
1.2
V
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© 2018 ROHM Co., Ltd. All rights reserved.
3/11
20180702 - Rev.003
RSQ020N03
Datasheet
l Electrical characteristic curves
Fig.1 Power Dissipation Derating Curve
Fig.2 Maximum Safe Operating Area
Fig.3 Normalized Transient Thermal
Resistance vs. Pulse Width
Fig.4 Single Pulse Maximum Power
dissipation
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4/11
20180702 - Rev.003
RSQ020N03
Datasheet
l Electrical characteristic curves
Fig.5 Typical Output Characteristics(I)
Fig.6 Typical Output Characteristics(II)
Fig.7 Breakdown Voltage vs.
Junction Temperature
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20180702 - Rev.003
RSQ020N03
Datasheet
l Electrical characteristic curves
Fig.8 Typical Transfer Characteristics
Fig.9 Gate Threshold Voltage vs.
Junction Temperature
Fig.10 Forward Transfer Admittance vs.
Drain Current
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6/11
20180702 - Rev.003
RSQ020N03
Datasheet
l Electrical characteristic curves
Fig.11 Drain Current Derating Curve
Fig.12 Static Drain - Source On - State
Resistance vs. Gate Source Voltage
Fig.13 Static Drain - Source On - State
Resistance vs. Junction Temperature
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7/11
20180702 - Rev.003
RSQ020N03
Datasheet
l Electrical characteristic curves
Fig.14 Static Drain - Source On - State
Resistance vs. Drain Current (I)
Fig.15 Static Drain - Source On - State
Resistance vs. Drain Current (II)
Fig.16 Static Drain - Source On - State
Resistance vs. Drain Current (IlI)
Fig.17 Static Drain - Source On - State
Resistance vs. Drain Current (IV)
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8/11
20180702 - Rev.003
RSQ020N03
Datasheet
l Electrical characteristic curves
Fig.18 Typical Capacitance vs.
Drain - Source Voltage
Fig.19 Switching Characteristics
Fig.20 Dynamic Input Characteristics
Fig.21 Source Current vs.
Source Drain Voltage
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9/11
20180702 - Rev.003
RSQ020N03
Datasheet
l Measurement circuits
Fig.1-1 Switching Time Measurement Circuit
Fig.1-2 Switching Waveforms
Fig.2-1 Gate Charge Measurement Circuit
Fig.2-2 Gate Charge Waveform
l Notice
This product might cause chip aging and breakdown under the large electrified environment.
Please consider to design ESD protection circuit.
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10/11
20180702 - Rev.003
RSQ020N03
Datasheet
l Dimensions
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11/11
20180702 - Rev.003
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
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extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
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A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
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3.
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4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
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Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
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notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
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liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
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Rev.001