Data Sheet
4V Drive Nch MOSFET
RSR010N10
Structure Silicon N-channel MOSFET Dimensions (Unit : mm)
TSMT3
Features 1) Low on-resistance. 2) Built-in G-S Protection Diode. 3) Small Surface Mount Package (TSMT3).
(3)
(1)
(2)
Abbreviated symbol : ZJ
Application Switching
Packaging specifications Package Type Code Basic ordering unit (pieces) RSR010N10 Taping TL 3000
Inner circuit
(3)
∗1
∗2
Absolute maximum ratings (Ta = 25C) Symbol Parameter Drain-source voltage Gate-source voltage Drain current Source current (Body Diode) Power dissipation Channel temperature Range of storage temperature
*1 Pw10s, Duty cycle1% *2 Mounted on a ceramic board.
Limits 100 20 1 4 0.8 4 1 150 55 to 150
Unit V V A A A A W C C
VDSS Continuous Pulsed Continuous Pulsed VGSS ID IDP *1 IS ISP PD Tch Tstg
*1 *2
(1) Gate (2) Source (3) Drain
(1)
(2)
∗1 ESD PROTECTION DIODE ∗2 BODY DIODE
Thermal resistance Parameter Channel to Ambient
*Mounted on a ceramic board.
Symbol Rth (ch-a)*
Limits 125
Unit C / W
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2011.05 - Rev.A
RSR010N10
Electrical characteristics (Ta = 25 C) Parameter Gate-source leakage Zero gate voltage drain current Gate threshold voltage Static drain-source on-state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Total gate charge Gate-source charge Gate-drain charge
*Pulsed
Data Sheet
Symbol IGSS IDSS VGS (th) * RDS (on) l Yfs l* Ciss Coss Crss td(on) * tr * td(off) * tf * Qg * Qgs * Qgd *
Min. 100 1.0 1 -
Typ. 370 400 410 140 20 12 6 9 22 15 3.5 0.9 0.8
Max. 10 1 2.5 520 560 580 -
Unit A V A V
Conditions VGS=20V, VDS=0V ID=1mA, VGS=0V VDS=100V, VGS=0V VDS=10V, ID=1mA ID=1A, VGS=10V
Drain-source breakdown voltage V(BR)DSS
m ID=1A, VGS=4.5V ID=1A, VGS=4.0V S pF pF pF ns ns ns ns nC nC nC ID=1A, VDS=10V VDS=25V VGS=0V f=1MHz ID=0.5A, VDD 50V VGS=10V RL=100 RG=10 ID=1A, VDD 50V VGS=5V
Body diode characteristics (Source-Drain) (Ta = 25C) Parameter Forward Voltage
*Pulsed
Symbol VSD *
Min. -
Typ. -
Max. 1.2
Unit V
Conditions Is=1A, VGS=0V
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2011.05 - Rev.A
RSR010N10
Electrical characteristic curves (Ta=25C)
Fig.1 Typical Output Characteristics (Ⅰ) 1 VGS=10.0V 0.8 VGS=4.5V VGS=2.5V VGS=4.0V VGS=2.8V
Data Sheet
Fig.2 Typical Output Characteristics (Ⅱ) 1 VGS=2.5V 0.8 VGS=10.0V Drain Current : ID [A] VGS=4.5V 0.6 VGS=4.0V VGS=2.8V 0.4 Ta=25°C pulsed
Drain Current : ID [A]
0.6
0.4
0.2 Ta=25°C pulsed 0 0 0.2 0.4 0.6 0.8 1
0.2
0 0 2 4 6 8 10
Drain-Source Voltage : VDS [V] Fig.3 Static Drain-Source On-State Resistance vs. Drain Current 10000 Ta=25°C pulsed Static Drain-Source On-State Resistance RDS(on) [mΩ] VGS=4.0V VGS=4.5V VGS=10V 10000 VGS=10V pulsed Static Drain-Source On-State Resistance RDS(on) [mΩ]
Drain-Source Voltage : VDS [V] Fig.4 Static Drain-Source On-State Resistance vs. Drain Current
1000
1000
Ta=125°C Ta=75°C Ta=25°C Ta=-25°C
100
100
10 0.01
0.1
1
10
10 0.01
0.1
1
10
Drain Current : ID [A]
Drain Current : ID [A] Fig.6 Static Drain-Source On-State Resistance vs. Drain Current 10000
Fig.5 Static Drain-Source On-State Resistance vs. Drain Current 10000 VGS=4.5V pulsed Static Drain-Source On-State Resistance RDS(on) [mΩ] Ta=125°C Ta=75°C Ta=25°C Ta=-25°C
VGS=4V pulsed Static Drain-Source On-State Resistance RDS(on) [mΩ] Ta=125°C Ta=75°C Ta=25°C Ta=-25°C
1000
1000
100
100
10 0.01
0.1
1
10
10 0.01
0.1
1
10
Drain Current : ID [A]
Drain Current : ID [A]
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2011.05 - Rev.A
RSR010N10
Data Sheet
Fig.7 Forward Transfer Admittance vs. Drain Current 10 VDS=10V pulsed 10 VDS=10V pulsed
Fig.8 Typical Transfer Characteristics
Forward Transfer Admittance Yfs [S]
1 Drain Currnt : ID [A] 1 Ta=125°C Ta=75°C Ta=25°C Ta=-25°C 0.1 Ta=125°C Ta=75°C Ta=25°C Ta=-25°C
0.1
0.01
0.01 0.01
0.001 0.1 1 10 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
Drain Current : ID [A]
Gate-Source Voltage : VGS [V]
Fig.9 Source Current vs. Source-Drain Voltage 10 VGS=0V pulsed Static Drain-Source On-State Resistance RDS(on) [mΩ]
Fig.10 Static Drain-Source On-State Resistance vs. Gate-Source Voltage 1000 Ta=25°C pulsed 800 ID=0.5A ID=1.0A
Source Current : Is [A]
1 Ta=125°C Ta=75°C Ta=25°C Ta=-25°C 0.1
600
400
200
0.01 0.0 0.5 1.0 1.5 2.0
0 0 2 4 6 8 10 Gate-Source Voltage : VGS [V]
Source-Drain Voltage : VSD [V]
Fig.11 Switching Characteristics 1000 VDD≒50V VGS=10V RG=10Ω Ta=25°C Pulsed Switching Time : t [ns] 100 td(off) tf 10 Ta=25°C VDD=50V ID=1A Pulsed
Fig.12 Dynamic Input Characteristics
8 Gate-Source Voltage : VGS [V]
6
10
tr
4
td(on)
2
1 0.01 0.1 1 10 Drain Current : ID [A]
0 0 2 4 6 8 10 Total Gate Charge : Qg [nC]
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4/6
2011.05 - Rev.A
RSR010N10
Data Sheet
Fig.13 Typical Capacitance vs. Drain-Source Voltage 1000 Ta=25°C f=1MHz VGS=0V 1 Capacitance : C [pF] 100 Drain Current : ID [ A ] Ciss 10
Fig.14 Maximum Safe Operating Area Operation in this area is limited by RDS(on) (VGS = 10V)
PW = 100μs
0.1
PW = 1ms PW = 10ms
10
Coss Crss
0.01
Ta=25°C Single Pulse Mounted on a ceramic board. (30mm × 30mm × 0.8mm) 0.1 1 10
DC Operation
1 0.01 0.1 1 10 100 1000
0.001 100 1000
Drain-Source Voltage : VDS [V]
Drain-Source Voltage : VDS [ V ]
Fig.15 Normalized Transient Thermal Resistance v.s. Pulse Width
10
Normalized Transient Thermal Resistance : r (t)
Ta=25°C Single Pulse
1
0.1
0.01
Mounted on a ceramic board. (30mm × 30mm × 0.8mm) Rth(ch-a)=125°C/W Rth(ch-a)(t)=r(t)×Rth(ch-a)
0.001 0.0001 0.001 0.01 0.1 1 10 100 1000
Pulse width : Pw (s)
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5/6
2011.05 - Rev.A
RSR010N10
Measurement circuits
Pulse width
Data Sheet
VGS
ID RL D.U.T.
VDS
VGS VDS
50% 10% 10%
90%
50% 10% 90%
RG
VDD
td(on) ton
90% tr td(off) toff
tf
Fig.1-1 Switching Time Measurement Circuit
VGS
Fig.1-2 Switching Waveforms
VG
ID RL
VDS
Qg VGS Qgs Qgd
IG(Const.)
D.U.T. VDD
Charge
Fig.2-1 Gate Charge Measurement Circuit
Fig.2-2 Gate Charge Waveform
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6/6
2011.05 - Rev.A
Notice
Notes
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