4V Drive Nch MOS FET
RSR020N06
Structure Silicon N-channel MOSFET Dimensions (Unit : mm)
TSMT3
1.0MAX 2.9 0.4
(3)
0.85 0.7
Features 1) Low on-resistance. 2) Built-in G-S Protection Diode. 3) Small Surface Mount Package (TSMT3) .
(1) Gate (2) Source
1.6 2.8
0~0.1
(1)
(2)
0.95 0.95 1.9 0.16
Each lead has same dimensions Abbreviated symbol : PZ
Application Switching
(3) Drain
Inner circuit
(3) (3)
Packaging specifications
Package Type RSR020N06 Code Basic ordering unit (pieces) Taping TL 3000
∗1 (2) ∗1 ESD PROTECTION DIODE ∗2 BODY DIODE (1) ∗2 (1) (2)
(1) Gate (2) Source (3) Drain
Absolute maximum ratings (Ta=25°C)
Parameter Drain-source voltage Gate-source voltage Drain current Source current (Body diode) Continuous Pulsed Continuous Pulsed Symbol VDSS VGSS ID IDP ∗1 IS ISP ∗1 PD ∗2 Tch Tstg Limits 60 ±20 ±2 ±8 0.8 8 1.0 150 −55 to +150 Unit V V A A A A W °C °C
Total power dissipation Range of channel temperature Storage temperature
∗1 Pw≤10µs, Duty cycle≤1% ∗2 When mounted on a ceramic board.
Thermal resistance
Parameter Channel to ambient
∗2 When mounted on a ceramic board.
Symbol Rth (ch-a) ∗
Limits 125
Unit °C / W
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c ○ 2009 ROHM Co., Ltd. All rights reserved.
0.3~0.6
1/4
2009.06 - Rev.A
RSR020N06
Electrical characteristics (Ta=25°C)
Parameter Symbol Min. − 60 − 1.0 − − − 1.3 − − − − − − − − − − Typ. − − − − 120 140 150 − 180 50 22 6 10 20 6 2.7 1.0 0.6 Max. ±10 − 1 2.5 170 195 210 − − − − − − − − − − − IGSS Gate-source leakage Drain-source breakdown voltage V(BR) DSS Zero gate voltage drain current IDSS Gate threshold voltage VGS (th) Static drain-source on-state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Total gate charge Gate-source charge Gate-drain charge
∗Pulsed
Data Sheet
Unit µA V µA V mΩ S pF pF pF ns ns ns ns nC nC nC
Conditions VGS=±20V, VDS=0V ID=1mA, VGS=0V VDS=60V, VGS=0V VDS=10V, ID=1mA ID=2A, VGS=10V ID=2A, VGS=4.5V ID=2A, VGS=4V VDS=10V, ID=2A VDS=10V VGS=0V f=1MHz VDD 30V, ID=1A VGS=10V RL 30Ω RG=10Ω VDD 30V ID=2A, VGS=5V RL 15Ω, RG=10Ω
RDS (on) ∗
Yfs Ciss Coss Crss td (on) tr td (off) tf Qg Qgs Qgd
∗
∗ ∗ ∗ ∗ ∗ ∗ ∗
Body diode characteristics (Source-Drain) (Ta=25°C)
Parameter Forward voltage
∗Pulsed
Symbol Min. VSD ∗ −
Typ. −
Max. 1.2
Unit V
Conditions IS=2A, VGS=0V
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c ○ 2009 ROHM Co., Ltd. All rights reserved.
2/4
2009.06 - Rev.A
RSR020N06
Electrical characteristic curves
4 VGS= 10V VGS= 4.5V VGS= 4.0V Ta=25°C Pulsed DRAIN CURRENT : ID [A] 4 Ta=25°C Pulsed DRAIN CURRENT : ID [A] VGS= 10V VGS= 4.5V VGS= 4.0V VGS= 2.8V 10 VDS= 10V Pulsed
Data Sheet
DRAIN CURRENT : ID [A]
3
3
1 Ta= 125°C Ta= 75°C Ta= 25°C Ta= - 25°C
VGS= 2.8V 2
2
VGS= 2.4V
0.1
1 VGS= 2.4V 0 0 0.2 0.4 0.6 0.8 1
1
VGS= 2.2V
0.01
0 0 2 4 6 8 10
0.001 0 0.5 1 1.5 2 2.5 3
DRAIN-SOURCE VOLTAGE : VDS[V] Fig.1 Typical Output Characteristics( Ⅰ)
DRAIN-SOURCE VOLTAGE : VDS[V] Fig.2 Typical Output Characteristics( Ⅱ)
GATE-SOURCE VOLTAGE : VGS[V] Fig.3 Typical Transfer Characteristics
1000 STATIC DRAIN-SOURCE ON-STATE RESISTANCE : R DS(on)[mΩ]
STATIC DRAIN-SOURCE ON-STATE RESISTANCE : R DS(on)[mΩ]
100 VGS= 4.0V VGS= 4.5V VGS= 10V
100 Ta=125°C Ta=75°C Ta=25°C Ta= -25°C 10 0.01
STATIC DRAIN-SOURCE ON-STATE RESISTANCE : R DS(on)[mΩ]
Ta= 25°C Pulsed
1000
VGS= 10V Pulsed
1000
VGS= 4.5V Pulsed
100 Ta=125°C Ta=75°C Ta=25°C Ta= -25°C
10 0.01
0.1
1
10
0.1
1
10
10 0.01
0.1
1
10
DRAIN-CURRENT : ID [A] Fig.4 Static Drain-Source On-State Resistance vs. Drain Current( Ⅰ)
DRAIN-CURRENT : ID [A] Fig.5 Static Drain-Source On-State Resistance vs. Drain Current( Ⅱ)
DRAIN-CURRENT : ID [A] Fig.6 Static Drain-Source On-State Resistance vs. Drain Current( Ⅲ)
1000 STATIC DRAIN-SOURCE ON-STATE RESISTANCE : R DS(on)[mΩ]
REVERSE DRAIN CURRENT : Is [A]
VGS= 4.0V Pulsed FORWARD TRANSFER ADMITTANCE : |Yfs| [S]
10
VDS= 10V Pulsed
10
VGS=0V Pulsed
1
100 Ta=125°C Ta=75°C Ta=25°C Ta= -25°C
1 Ta= -25°C Ta=25°C Ta=75°C Ta=125°C 0.1 0.01
0.1
Ta=125°C Ta=75°C Ta=25°C Ta=-25°C
10 0.01
0.1
1
10
0.1
1
10
0.01 0 0.5 1 1.5
DRAIN-CURRENT : ID [A] Fig.7 Static Drain-Source On-State Resistance vs. Drain Current( Ⅳ)
DRAIN-CURRENT : ID [A] Fig.8 Forward Transfer Admittance vs. Drain Current
SOURCE-DRAIN VOLTAGE : VSD [V] Fig.9 Reverse Drain Current vs. Sourse-Drain Voltage
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c ○ 2009 ROHM Co., Ltd. All rights reserved.
3/4
2009.06 - Rev.A
RSR020N06
500 STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(ON)[mΩ] Ta=25°C Pulsed ID = 1.0A 300 ID = 2.0A 1000 td (off) SWITCHING TIME : t [ns] tf 100 Ta=25°C VDD = 30V VGS=10V RG=10Ω Pulsed 10 GATE-SOURCE VOLTAGE : VGS [V] Ta=25°C VDD = 30V 8 ID = 2.0A RG=10Ω Pulsed 6
Data Sheet
400
200
4
10
100 td (on) 0 0 5 10 15 20 1 0.01 0.1 1
2
tr
0 10 0 1 2 3 4 5
GATE-SOURCE VOLTAGE : VGS[V] Fig.10 Static Drain-Source On-State Resistance vs. Gate Source Voltage
DRAIN-CURRENT : ID [A] Fig.11 Switching Characteristics
TOTAL GATE CHARGE : Qg [nC] Fig.12 Dynamic Input Characteristics
1000
CAPACITANCE : C [pF]
Ta=25°C f=1MHz VGS=0V
Ciss
100
Crss Coss 10 0.01 0.1 1 10 100
DRAIN-SOURCE VOLTAGE : VDS[V] Fig.13 Typical Capacitance vs. Drain-Source Voltage
Measurement circuit
Pulse width
VGS ID RL D.U.T. RG VDD VDS
VGS VDS
50% 10% 10% 90% td(on) ton tr
90%
50% 10% 90%
td(off) toff
tf
Fig.1-1 Switching time measurement circuit
Fig.1-2 Switching waveforms
VG
VGS
ID RL
VDS
Qg VGS Qgs Qgd
IG(Const.) RG
D.U.T. VDD
Charge
Fig.2-1 Gate charge measurement circuit
Fig.2-2 Gate charge waveform
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c ○ 2009 ROHM Co., Ltd. All rights reserved.
4/4
2009.06 - Rev.A
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