RSS105N03
Transistor
Switching (30V, ±10.5A)
RSS105N03
Features 1) Low on-resistance. 2) Built-in G-S Protection Diode. 3) Small and Surface Mount Package (SOP8). External dimensions (Unit : mm)
SOP8
(8)
5.0±0.2
(5)
6.0±0.3 3.9±0.15
1.5±0.1 0.15
Applications Power switching, DC/DC converter.
(1)Source (2)Source (3)Source (4)Gate (5)Drain (6)Drain (7)Drain (8)Drain
1.27
0.4±0.1 0.1 Each lead has same dimensions
Structure •Silicon N-channel MOS FET
Equivalent circuit
(8) (7) (6) (5) (8) (7) (6) (5)
∗2 ∗1
Max.1.75
(1) (2) (3) (4)
(1)Source (2)Source (3)Source (4)Gate (5)Drain (6)Drain (7)Drain (8)Drain
(1)
(2)
(3)
(4)
∗1 ESD PROTECTION DIODE ∗2 BODY DIODE
∗A protection diode is included between the gate and the source terminals to protect the diode against static electricity when the product is in use. Use the protection circuit when the fixed voltages are exceeded.
Absolute maximum ratings (Ta=25°C)
Parameter Drain-source voltage Gate-source voltage Drain current Source current (Body diode) Total power dissipatino Channel temperature Strage temperature
∗1 Pw≤10µs, Duty cycle≤1% ∗2 Mounted on a ceramic board.
Continuous Pulsed Continuous Pulsed
Symbol VDSS VGSS ID IDP IS ISP PD Tch Tstg
Limits 30 20 ±10.5 ±42 1.6 6.4 2 150 −55 to +150
Unit V V A A A A W °C °C
∗1 ∗1 ∗2
0.5±0.1
(1) (4)
0.2±0.1
1/3
RSS105N03
Transistor
Thermal resistance (Ta=25°C)
Parameter Channel to ambient
∗ Mounted on a ceramic board.
Symbol Rth (ch-a)
Limits 62.5
Unit °C / W
∗
Electrical characteristics (Ta=25°C)
Parameter Symbol IGSS Gate-source leakage Drain-source breakdown voltage V(BR) DSS Zero gate voltage drain current IDSS Gate threshold voltage VGS (th) Static drain-source on-starte resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Tum-on delay time Rise time Tum-off delay time Fall time Total gate charge Gate-source charge Gate-drain charge
∗Pulsed
RDS (on)
Yfs Ciss Coss Crss td (on) tr td (off) tf Qg Qgs Qgd
Min. − 30 − 1.0 − − − 7.0 − − − − − − − − − −
Typ. − − − − 8.5 11.4 12.4 − 1130 350 210 9 16 53 22 15 2.9 5.9
Max. 10 − 10 2.5 11.7 15.8 17.2 − − − − − − − − − − −
Unit µA V µA V mΩ S pF pF pF ns ns ns ns nC nC nC
Conditions VGS=20V, VDS=0V ID=1mA, VGS=0V VDS=30V, VGS=0V VDS=10V, ID=1mA ID=±10.5A, VGS=10V ID=±10.5A, VGS=4.5V ID=±10.5A, VGS=4V ID=±10.5A, VDS=10V VDS=10V VGS=0V f=1MHz ID=5.25A, VDD 15V VGS=10V RL=2.86Ω RGS=10Ω VDD 15V VGS=5V ID=±10.5A
∗ ∗ ∗ ∗
∗ ∗ ∗ ∗ ∗ ∗ ∗
Body diode characteristics (Source-Drain Characteristics) (Ta=25°C)
Parameter Forward voltage
∗Pulsed
Symbol VSD
Min. −
Typ. −
Max. 1.2
Unit V
Conditions IS=6.4A, VGS=0V
∗
Electrical characteristic curves
10000
CAPACITANCE : C (pF)
1000
tf td (off)
1000
Ciss
GATE-SOURCE VOLTAGE : VGS (V)
SWITCHING TIME : t (ns)
Ta=25°C f=1MHz VGS=0V
10000
Ta=25°C VDD=15V VGS=10V RG=10Ω Pulsed
8
Ta=25°C 7 VDD=15V ID=10.5A 6 RG=10Ω Pulsed 5 4 3 2 1 0 0 2 4 6 8 10 12 14 16
100
Coss
100
Crss
10
tr td (on)
10 0.01
0.1
1
10
100
1 0.01
0.1
1
10
100
DRAIN-SOURCE VOLTAGE : VDS (V)
DRAIN CURRENT : ID (A)
TOTAL GATE CHARGE : Qg (nC)
Fig.1 Typical Capacitance vs. Drain-Source Voltage
Fig.2 Switching Characteristics
Fig.3 Dynamic Input Characteristics
2/3
RSS105N03
Transistor
VDS=10V Pulsed
Ta=125°C Ta=75°C Ta=25°C Ta= −25°C
STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS (on) (mΩ)
100
500 450 400 350 300 250 200 150 100 50 0 0 2 4 6 8 10
ID=10.5A ID=5.25A
Ta=25°C Pulsed
100
VGS=0V Pulsed
Ta=125°C Ta=75°C Ta=25°C Ta= −25°C
SOURCE CURRENT : Is (A)
DRAIN CURRENT : ID (A)
10
10
1
1
0.1
0.01
0.1
0.001 0.0
0.5
1.0
1.5
2.0
2.5
3.0
12
14
16
0.01 0.0
0.5
1.0
1.5
GATE-SOURCE VOLTAGE : VGS (V)
GATE-SOURCE VOLTAGE : VGS (V)
SOURCE-DRAIN VOLTAGE : VSD (V)
Fig.4 Typical Transfer Characteristics
Fig.5 Static Drain-Source On-State Resistance vs. Gate-Source Voltage
Fig.6 Source Current vs. Source-Drain Voltage
STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS (on) (mΩ)
STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS (on) (mΩ)
VGS=10V Pulsed
Ta=125°C Ta=75°C Ta=25°C Ta= −25°C
VGS=4.5V Pulsed
Ta=125°C Ta=75°C Ta=25°C Ta= −25°C
STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS (on) (mΩ)
1000
1000
1000
VGS=4V Pulsed
Ta=125°C Ta=75°C Ta=25°C Ta= −25°C
100
100
100
10
10
10
1 0.1
1
10
100
1 0.1
1
10
100
1 0.1
1
10
100
DRAIN CURRENT : ID (A)
DRAIN CURRENT : ID (A)
DRAIN CURRENT : ID (A)
Fig.7 Static Drain-Source On-State Resistance vs. Drain Current (Ι)
Fig.8 Static Drain-Source On-State Resistance vs. Drain Current (ΙΙ)
Fig.9 Static Drain-Source On-State Resistance vs. Drain Current (ΙΙΙ)
3/3
Appendix
Notes
No technical content pages of this document may be reproduced in any form or transmitted by any means without prior permission of ROHM CO.,LTD. The contents described herein are subject to change without notice. The specifications for the product described in this document are for reference only. Upon actual use, therefore, please request that specifications to be separately delivered. Application circuit diagrams and circuit constants contained herein are shown as examples of standard use and operation. Please pay careful attention to the peripheral conditions when designing circuits and deciding upon circuit constants in the set. Any data, including, but not limited to application circuit diagrams information, described herein are intended only as illustrations of such devices and not as the specifications for such devices. ROHM CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any third party's intellectual property rights or other proprietary rights, and further, assumes no liability of whatsoever nature in the event of any such infringement, or arising from or connected with or related to the use of such devices. Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or otherwise dispose of the same, no express or implied right or license to practice or commercially exploit any intellectual property rights or other proprietary rights owned or controlled by ROHM CO., LTD. is granted to any such buyer. Products listed in this document use silicon as a basic material. Products listed in this document are no antiradiation design.
The products listed in this document are designed to be used with ordinary electronic equipment or devices (such as audio visual equipment, office-automation equipment, communications devices, electrical appliances and electronic toys). Should you intend to use these products with equipment or devices which require an extremely high level of reliability and the malfunction of with would directly endanger human life (such as medical instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other safety devices), please be sure to consult with our sales representative in advance. About Export Control Order in Japan Products described herein are the objects of controlled goods in Annex 1 (Item 16) of Export Trade Control Order in Japan. In case of export from Japan, please confirm if it applies to "objective" criteria or an "informed" (by MITI clause) on the basis of "catch all controls for Non-Proliferation of Weapons of Mass Destruction.
Appendix1-Rev1.0
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