Data Sheet
1.5V Drive Pch MOSFET
RW1A030AP
Structure Silicon P-channel MOSFET Dimensions (Unit : mm)
WEMT6
Features 1) Low On-resistance. 2) Small high power package. 3) Low voltage drive.(1.5V)
(6)
(5)
(4)
(1)
(2)
(3)
Abbreviated symbol : SB
Application Switching
Packaging specifications Type Package Code Taping T2CR 8000
Inner circuit
(6) (5) (4)
Basic ordering unit (pieces) RW1A030AP
∗2
Absolute maximum ratings (Ta = 25 C) Parameter Drain-source voltage Gate-source voltage Drain current Source current (Body Diode) Power dissipation Channel temperature Range of storage temperature
*1 Pw10s, Duty cycle1% *2 Mounted on a ceramic board.
Symbol VDSS VGSS
Limits 12 0 to 8 3
*1
Unit V V A A A A W C C
(1) Drain (2) Drain (3) Gate (4) Source (5) Drain (6) Drain
∗1
(1)
(2)
(3)
∗1 ESD PROTECTION DIODE ∗2 BODY DIODE
Continuous Pulsed Continuous Pulsed
ID IDP IS ISP PD Tch Tstg
12 0.5 12 0.7 150 55 to 150
*1 *2
Thermal resistance Parameter Channel to Ambient
*Mounted on a ceramic board.
Symbol Rth (ch-a)*
Limits 179
Unit C / W
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2011.03 - Rev.A
RW1A030AP
Electrical characteristics (Ta = 25 C) Parameter Gate-source leakage Zero gate voltage drain current Gate threshold voltage Static drain-source on-state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Total gate charge Gate-source charge Gate-drain charge
*Pulsed
Symbol IGSS IDSS VGS (th) * RDS (on) Min. 12 0.3 l Yfs l * Ciss Coss Crss td(on) * tr * td(off) * tf * Qg * Qgs * Qgd * 3.8 Typ. 30 40 55 75 2700 170 150 10 30 240 75 22 3.9 3.1 Max. 10 10 1.0 42 56 82 150 S pF pF pF ns ns ns ns nC nC nC m Unit A V A V Conditions VGS=8V, VDS=0V ID=1mA, VGS=0V VDS=12V, VGS=0V VDS=6V, ID=1mA ID=3A, VGS=4.5V ID=1.5A, VGS=2.5V ID=1.5A, VGS=1.8V ID=0.6A, VGS=1.5V ID=3A, VDS=6V VDS=6V VGS=0V f=1MHz ID=1.5A, VDD 6V VGS=4.5V RL=4 RG=10 ID=3A VDD 6V VGS=4.5V
Data Sheet
Drain-source breakdown voltage V(BR)DSS
Body diode characteristics (Source-Drain) (Ta = 25C) Parameter Forward Voltage
*Pulsed
Symbol VSD *
Min. -
Typ. -
Max. 1.2
Unit V
Conditions Is=3A, VGS=0V
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2/6
2011.03 - Rev.A
RW1A030AP
Electrical characteristic curves (Ta=25C)
Fig.1 Typical Output Characteristics(Ⅰ) 10 VGS= -4.5V 8 DRAIN CURRENT : -ID[A] VGS= -2.5V
Data Sheet
Fig.2 Typical Output Characteristics(Ⅱ) 10 VGS= -1.8V 8 DRAIN CURRENT : -ID[A]
VGS= -1.8V 6 VGS= -1.5V 4 Ta=25°C Pulsed VGS= -1.2V 0 0 0.2 0.4 0.6 0.8 1 DRAIN-SOURCE VOLTAGE : -VDS[V]
VGS= -4.5V VGS= -2.5V VGS= -1.5V
6
4
Ta=25°C Pulsed VGS= -1.2V
2
2
0 0 2 4 6 8 10 DRAIN-SOURCE VOLTAGE : -VDS[V]
Fig.3 Typical Transfer Characteristics 10 VDS= -6V Pulsed 1 STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on)[mΩ] 1000
Fig.4 Static Drain-Source On-State Resistance vs. Drain Current(Ⅰ) Ta=25°C Pulsed VGS= -1.5V VGS= -1.8V VGS= -2.5V VGS= -4.5V
DRAIN CURRENT : -ID[A]
0.1
Ta=125°C Ta=75°C Ta=25°C Ta= -25°C
100
0.01
0.001 0 0.5 1 1.5 2 GATE-SOURCE VOLTAGE : -VGS[V]
10 0.1 1 DRAIN-CURRENT : -ID[A] 10
Fig.5 Static Drain-Source On-State Resistance vs. Drain Current(Ⅱ) 1000 VGS= -4.5V Pulsed STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on)[mΩ] STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on)[mΩ] 1000
Fig.6 Static Drain-Source On-State Resistance vs. Drain Current(Ⅱ) VGS= -2.5V Pulsed Ta=125°C Ta=75°C Ta=25°C Ta= -25°C 100
Ta=125°C Ta=75°C Ta=25°C Ta= -25°C 100
10 0.1 1 DRAIN-CURRENT : -ID[A] 10
10 0.1 1 DRAIN-CURRENT : -ID[A] 10
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2011.03 - Rev.A
RW1A030AP
Fig.7 Static Drain-Source On-State Resistance vs. Drain Current(Ⅲ)
Fig.8 Static Drain-Source On-State Resistance vs. Drain Current(Ⅳ) 1000 STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on)[mΩ]
Data Sheet
1000
STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on)[mΩ] VGS= -1.8V Pulsed Ta=125°C Ta=75°C Ta=25°C Ta= -25°C
VGS= -1.5V Pulsed Ta=125°C Ta=75°C Ta=25°C Ta= -25°C 100
100
10 0.1 1
DRAIN-CURRENT : -ID[A]
10
10
0.1
1 DRAIN-CURRENT : -ID[A] Fig.10 Reverse Drain Current vs. Sourse-Drain Voltage
10
Fig.9 Forward Transfer Admittance vs. Drain Current 10 FORWARD TRANSFER ADMITTANCE : |Yfs| [S] VDS= -6V Pulsed SOURCE CURRENT : -Is [A] 10 VGS=0V Pulsed
1
1
Ta=125°C Ta=75°C Ta=25°C Ta= -25°C
0.1
Ta=125°C Ta=75°C Ta=25°C Ta= -25°C
0.1 0.01
0.01 0.1 1 10 0 0.5 1 1.5 DRAIN-CURRENT : -ID[A] SOURCE-DRAIN VOLTAGE : -VSD [V]
Fig.11 Static Drain-Source On-State Resistance vs. Gate Source Voltage 150 Ta=25°C Pulsed ID= -1.5A 100 ID= -3.0A SWITCHING TIME : t [ns] 100 1000 td(off
Fig.12 Switching Characteristics
tf
STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(ON)[mΩ]
Ta=25°C VDD= -6V VGS= -4.5V RG=10W Pulsed
td(on)
50
10 tr
0 0 2 4 6 8 GATE-SOURCE VOLTAGE : -VGS[V]
1 0.01 0.1 1 10 100 DRAIN-CURRENT : -ID[A]
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2011.03 - Rev.A
RW1A030AP
Fig.14 Typical Capacitance vs. Drain-Source Voltage 10000
Data Sheet
Fig.13 Dynamic Input Characteristics 5
GATE-SOURCE VOLTAGE : -VGS [V]
4 CAPACITANCE : C [pF] Ciss 1000
3
2 Ta=25°C VDD= -6V ID= -3.0A Pulsed 0 5 10 15 20 25 30
Crss 100 Coss Ta=25°C f=1MHz VGS=0V 10 0.01 0.1 1 10 100
1
0 TOTAL GATE CHARGE : Qg [nC]
DRAIN-SOURCE VOLTAGE : -VDS[V]
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5/6
2011.03 - Rev.A
RW1A030AP
Measurement circuits
Data Sheet
Pulse Width
VGS
ID RL D.U.T.
VDS
VGS
10% 50% 10%
90%
50% 10% 90%
RG VDD
VDS td(on) ton 90% tr td(off) toff tf
Fig.1-1 Switching Time Measurement Circuit
Fig.1-2 Switching Waveforms
VG
ID VGS RL IG(Const.) D.U.T. VDD VDS
Qg VGS Qgs Qgd
Charge
Fig.2-1 Gate Charge Measurement Circuit
Fig.2-2 Gate Charge Waveform
Notice This product might cause chip aging and breakdown under the large electrified environment. Please consider to design ESD protection circuit.
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2011.03 - Rev.A
Notice
Notes
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R1120A
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