SCT3040KLHR
Automotive Grade N-channel SiC power MOSFET
Datasheet
lOutline
VDSS
RDS(on) (Typ.)
ID*1
PD
1200V
40mΩ
55A
262W
TO-247N
(1) (2)(3)
lInner circuit
lFeatures
(1) Gate
(2) Drain
(3) Source
1) Qualified to AEC-Q101
2) Low on-resistance
*Body Diode
3) Fast switching speed
4) Fast reverse recovery
Please note Driver Source and Power Source are
not exchangeable. Their exchange might lead to
malfunction.
5) Easy to parallel
6) Simple to drive
7) Pb-free lead plating ; RoHS compliant
lPackaging specifications
lApplication
Packing
・Automobile
Reel size (mm)
-
Tape width (mm)
-
・Switch mode power supplies
Type
Tube
Basic ordering unit (pcs)
30
Taping code
C11
Marking
SCT3040KL
lAbsolute maximum ratings (Ta = 25°C)
Parameter
Symbol
Value
Unit
VDSS
1200
V
Tc = 25°C
ID *1
55
A
Tc = 100°C
ID *1
39
A
ID,pulse *2
137
A
-4 to +22
V
-4 to +26
V
VGS_op*4
0 / +18
V
Tj
175
°C
Tstg
-55 to +175
°C
Drain - Source Voltage
Continuous Drain current
Pulsed Drain current
VGSS
Gate - Source voltage (DC)
Gate - Source surge voltage (tsurge < 300nsec)
VGSS_surge
Recommended drive voltage
Junction temperature
Range of storage temperature
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SCT3040KLHR
Datasheet
lElectrical characteristics (Ta = 25°C)
Parameter
Symbol
Drain - Source breakdown
voltage
Values
Conditions
Min.
Typ.
Max.
V(BR)DSS Tj = 25°C
1200
-
-
Tj = -55°C
1200
-
-
Tj = 25°C
-
1
10
Tj = 150°C
-
2
-
Unit
VGS = 0V, ID = 1mA
V
VGS = 0V, VDS =1200V
Zero Gate voltage
Drain current
IDSS
Gate - Source leakage current
IGSS+
VGS = +22V , VDS = 0V
-
-
100
nA
Gate - Source leakage current
IGSS-
VGS = -4V
-
-
-100
nA
2.7
-
5.6
V
-
40
52
mΩ
Tj = 150°C
-
68
-
f = 1MHz, open drain
-
7
-
, VDS = 0V
VGS (th) VDS = 10V, ID = 10mA
Gate threshold voltage
μA
VGS = 18V, ID = 20A
Static Drain - Source
on - state resistance
RDS(on) *5 Tj = 25°C
RG
Gate input resistance
Ω
lThermal resistance
Parameter
Symbol
RthJC
Thermal resistance, junction - case
Values
Min.
Typ.
Max.
-
0.44
0.57
Unit
°C/W
lTypical Transient Thermal Characteristics
Symbol
Value
Rth1
2.56E-02
Rth2
1.95E-01
Rth3
2.20E-01
Unit
K/W
Tj
PD
Value
Cth1
1.39E-03
Cth2
1.00E-02
Cth3
3.57E-02
Rth,n
Rth1
Cth1
Symbol
Cth2
Unit
Ws/K
Tc
Cth,n
Ta
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SCT3040KLHR
Datasheet
lElectrical characteristics (Ta = 25°C)
Parameter
Symbol
Conditions
Values
Min.
Typ.
Max.
Transconductance
gfs *5
VDS = 10V, ID = 20A
-
8.3
-
Input capacitance
Ciss
VGS = 0V
-
1337
-
Output capacitance
Coss
VDS = 800V
-
76
-
Reverse transfer capacitance
Crss
f = 1MHz
-
27
-
Effective output capacitance,
energy related
Co(er)
-
122
-
Total Gate charge
Qg *5
-
107
-
-
17
-
-
56
-
-
21
-
VGS = 0V/+18V
-
39
-
RG = 0Ω
-
49
-
-
24
-
-
283
-
*5
Gate - Source charge
Qgs
Gate - Drain charge
Qgd *5
Turn - on delay time
td(on) *5
Rise time
Turn - off delay time
Fall time
tr
*5
td(off)
*5
tf *5
VGS = 0V
VDS = 0V to 600V
VDS = 600V
ID = 20A
VGS = 18V
See Fig. 1-1.
VDS = 400V
ID = 18A
RL = 22Ω
See Fig. 1-1, 1-2.
Unit
S
pF
pF
nC
ns
VDS = 600V
Turn - on switching loss
Eon *5
VGS=0V/18V, ID = 20A
RG = 0Ω, L = 250μH
Turn - off switching loss
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TSZ22111・15・001
Eoff *5
Eon includes diode
reverse recovery
Lσ = 50nH, Cσ = 200pF
See Fig. 2-1, 2-2.
3/12
μJ
-
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SCT3040KLHR
Datasheet
lBody diode electrical characteristics (Source-Drain) (Ta = 25°C)
Parameter
Symbol
Body diode continuous,
forward current
IS *1
Body diode direct current,
pulsed
ISM *2
Forward voltage
VSD *5
Reverse recovery time
trr *5
*5
Reverse recovery charge
Qrr
Peak reverse recovery current
Irrm *5
Conditions
Values
Unit
Min.
Typ.
Max.
-
-
55
A
-
-
137
A
-
3.2
-
V
-
25
-
ns
di/dt = 1100A/μs
-
115
-
nC
Lσ = 50nH, Cσ = 200pF
See Fig. 3-1, 3-2.
-
9
-
A
Tc = 25°C
VGS = 0V, ID = 20A
IF = 20A
VR = 600V
*1 Limited by maximum temperature allowed.
*2 PW 10μs, Duty cycle 1%
*3 Example of acceptable VGS waveform
Please note especially when using driver source that VGSS_surge must be in the range of
absolute maximum rating.
*4 Please be advised not to use SiC-MOSFETs with VGS below 13V as doing so may cause
thermal runaway.
*5 Pulsed
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Datasheet
lElectrical characteristic curves
Fig.2 Maximum Safe Operating Area
Fig.1 Power Dissipation Derating Curve
1000
Operation in this area is limited by RDS(on)
250
Drain Current : ID [A]
Power Dissipation : PD [W]
300
200
150
100
100
25
75
125
0.1
175
Case Temperature : TC [°C]
PW = 10μs*
PW = 100μs
PW = 1ms
PW = 10ms
1
50
0
PW = 1μs*
10
Ta = 25ºC
Single Pulse
*Calculation(PW10μs)
0.1
1
10
100
1000 10000
Drain - Source Voltage : VDS [V]
Fig.3 Typical Transient Thermal
Resistance vs. Pulse Width
Transient Thermal Resistance :
RthJC [K/W]
1
0.1
0.01
0.001
Ta = 25ºC
Single Pulse
0.0001
1E-6 1E-5 1E-4 1E-3 1E-2 1E-1 1E+0 1E+1
Pulse Width : PW [s]
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SCT3040KLHR
Datasheet
lElectrical characteristic curves
Fig.4 Typical Output Characteristics(I)
40
Drain Current : ID [A]
25
20V
18V
16V
20V
14V
Ta = 25ºC
Pulsed
30
20
10V
10
0
20
12V
Drain Current : ID [A]
50
Fig.5 Typical Output Characteristics(II)
VGS= 8V
0
2
4
6
8
16V
Drain - Source Voltage : VDS [V]
14V
15
12V
10V
10
Ta = 25ºC
Pulsed
5
0
10
18V
VGS= 8V
0
1
2
3
4
5
Drain - Source Voltage : VDS [V]
Fig.6 Tj = 25ºC 3rd Quadrant Characteristics
0
Ta = 25ºC
Pulsed
Drain Current : ID [A]
-10
VGS = -4V
VGS = -2V
VGS = 0V
VGS = 18V
-20
-30
-40
-50
-10
-8
-6
-4
-2
0
Drain - Source Voltage : VDS [V]
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SCT3040KLHR
Datasheet
lElectrical characteristic curves
Fig.7 Tj = 150ºC Typical Output
Characteristics(I)
50
40
Drain Current : ID [A]
16V
14V
12V
18V
20V
10V
Drain Current : ID [A]
20V
Fig.8 Tj = 150ºC Typical Output
Characteristics(II)
25
30
20
VGS= 8V
10
0
2
4
6
8
20
12V
15
14V
16V
18V
VGS= 8V
10
5
Ta = 150ºC
Pulsed
0
0
10
Ta = 150ºC
Pulsed
0
Drain - Source Voltage : VDS [V]
Drain Current : ID [A]
VGS = -4V
VGS = -2V
VGS = 0V
VGS = 18V
-20
-30
-40
-50
-10
-8
-6
-4
-2
0
Drain - Source Voltage : VDS [V]
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TSZ22111・15・001
2
3
4
5
Fig.10 Body Diode Forward Voltage
vs. Gate - Source Voltage
Body Diode Forward Voltage : VSD [V]
Ta = 150ºC
Pulsed
-10
1
Drain - Source Voltage : VDS [V]
Fig.9 Tj = 150ºC 3rd Quadrant Characteristics
0
10V
6
ID=20A
5
4
3
2
Ta= 150ºC
1
0
Ta= 25ºC
-4
0
4
8
12
16
20
Gate - Source Voltage : VGS [V]
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SCT3040KLHR
Datasheet
lElectrical characteristic curves
Fig.11 Typical Transfer Characteristics (I)
50
100
VDS = 10V
Pulsed
Ta= 150ºC
Ta= 75ºC
Ta= 25ºC
Ta= -25ºC
1
0.1
0.01
VDS = 10V
Pulsed
40
10
Drain Current : ID [A]
Drain Current : ID [A]
Fig.12 Typical Transfer Characteristics (II)
30
Ta= 150ºC
Ta= 75ºC
Ta= 25ºC
Ta= -25ºC
20
10
0
2
4
6
0
8 10 12 14 16 18 20
0
Gate - Source Voltage : VGS [V]
6
8 10 12 14 16 18 20
Fig.14 Transconductance vs. Drain Current
6
10
VDS = 10V
ID = 10mA
5
Transconductance : gfs [S]
Gate Threshold Voltage : V GS(th) [V]
4
Gate - Source Voltage : VGS [V]
Fig.13 Gate Threshold Voltage
vs. Junction Temperature
4
3
2
1
0
2
-50
0
50
100
150
1
Ta = 150ºC
Ta = 75ºC
Ta = 25ºC
Ta = -25ºC
0.1
200
Junction Temperature : Tj [ºC]
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TSZ22111・15・001
VDS = 10V
Pulsed
0.1
1
10
Drain Current : ID [A]
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TSQ50211-SCT3040KLHR
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SCT3040KLHR
Datasheet
lElectrical characteristic curves
Fig.15 Static Drain - Source On - State
Resistance vs. Gate - Source Voltage
0.16
Static Drain - Source On-State
Resistance : RDS(on) [Ω]
Static Drain - Source On-State
Resistance : RDS(on) [Ω]
Ta = 25ºC
Pulsed
ID= 37A
0.14
0.12
0.10
0.08
ID= 20A
0.06
0.04
ID= -20A
0.02
0.00
8
10
12
14
16
18
20
Fig.16 Static Drain - Source On - State
Resistance vs. Junction Temperature
0.10
VGS = 18V
Pulsed
0.08
ID= 37A
0.06
ID= 20A
0.04
ID= -20A
0.02
0.00
22
-50
Gate - Source Voltage : VGS [V]
0
50
100
150
200
Junction Temperature : Tj [ºC]
Fig.17 Static Drain - Source On - State
Resistance vs. Drain Current
Fig.18 Normalized Drain - Source Breakdown
Voltage vs. Junction Temperature
0.1
Static Drain - Source On-State
Resistance : RDS(on) [Ω]
1.04
Normalized Drain - Source
Breakdown Voltage
1.03
1.02
1.01
Ta = 150ºC
Ta = 125ºC
Ta = 75ºC
Ta = 25ºC
Ta = -25ºC
0.01
1.00
0.99
VGS = 18V
Pulsed
1
10
0.98
100
Drain Current : ID [A]
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TSZ22111・15・001
-50
0
50
100
150
200
Junction Temperature : Tj [ºC]
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Datasheet
lElectrical characteristic curves
Fig.19 Typical Capacitance
vs. Drain - Source Voltage
Fig.20 Coss Stored Energy
40
10000
Ta = 25ºC
Coss Stored Energy : EOSS [µJ]
Capacitance : C [pF]
Ciss
1000
Coss
100
Crss
10
1
Ta = 25ºC
f = 1MHz
VGS = 0V
0.1
1
10
100
30
20
10
0
1000
Drain - Source Voltage : VDS [V]
0
200
400
600
800
Drain - Source Voltage : VDS [V]
Fig.21 Dynamic Input Characteristics
*Gate Charge Waveform
Gate - Source Voltage : VGS [V]
20
Ta = 25ºC
VDD = 600V
ID = 20A
Pulsed
15
10
5
0
0
20
40
60
80
100
120
Total Gate Charge : Qg [nC]
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SCT3040KLHR
Datasheet
lElectrical characteristic curves
Switching Time : t [ns]
1000
Ta =
VDD=
VGS=
RG =
tf
100
Fig.20 Typical Switching Loss
vs. Drain - Source Voltage
500
25°C
400V
+18V/0V
0Ω
td(off)
tr
td(on)
10
Ta =
ID =
VGS=
RG =
L=
450
Switching Energy : E [µJ]
Fig.19 Typical Switching Time
vs. Drain Current
10000
400
350
25°C
20A
+18V/0V
0Ω
250μH
Eon
300
250
200
150
Eoff
100
50
1
0.1
1
10
0
100
200
Drain Current : ID [A]
600
800
Fig.22 Typical Switching Loss
vs. External Gate Resistance
1800
1800
1400
1200
25°C
600V
+18V/0V
0Ω
250μH
1000
Eon
800
600
400
Eoff
200
0
0
10
20
30
40
50
1400
1200
25°C
20A
600V
+18V/0V
250μH
1000
800
Eon
600
Eoff
400
200
0
60
Drain Current : ID [A]
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TSZ22111・15・001
Ta =
ID =
VDD=
VGS=
L=
1600
Switching Energy : E [µJ]
Ta =
VDD=
VGS=
RG =
L=
1000
Drain - Source Voltage : VDS [V]
Fig.21 Typical Switching Loss
vs. Drain Current
1600
Switching Energy : E [µJ]
400
0
5
10
15
20
25
30
External Gate Resistance : RG [Ω]
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SCT3040KLHR
Datasheet
lMeasurement circuits and waveforms
Fig.1-1 Gate Charge and Switching Time Measurement Circuit
Fig.1-2 Waveforms for Switching Time
Fig.2-1 Switching Energy Measurement Circuit
Fig.2-2 Waveforms for Switching Energy Loss
Eon = ID ∙ VDS dt
VDS
Eoff =
ID ∙ VDS dt
Vsurge
Irr
ID
Fig.3-1 Reverse Recovery Time Measurement Circuit
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Fig.3-2 Reverse Recovery Waveform
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Notice
Notes
1) The information contained herein is subject to change without notice.
2) Before you use our Products, please contact our sales representative and verify the latest specifications.
3) Although ROHM is continuously working to improve product reliability and quality, semiconductors can break down and malfunction due to various factors.
Therefore, in order to prevent personal injury or fire arising from failure, please take safety
measures such as complying with the derating characteristics, implementing redundant and
fire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no
responsibility for any damages arising out of the use of our Poducts beyond the rating specified by
ROHM.
4) Examples of application circuits, circuit constants and any other information contained herein are
provided only to illustrate the standard usage and operations of the Products. The peripheral
conditions must be taken into account when designing circuits for mass production.
5) The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly,
any license to use or exercise intellectual property or other rights held by ROHM or any other
parties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use of
such technical information.
6) The Products specified in this document are not designed to be radiation tolerant.
7) For use of our Products in applications requiring a high degree of reliability (as exemplified
below), please contact and consult with a ROHM representative : transportation equipment (i.e.
cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety
equipment, medical systems, and power transmission systems.
8) Do not use our Products in applications requiring extremely high reliability, such as aerospace
equipment, nuclear power control systems, and submarine repeaters.
9) ROHM shall have no responsibility for any damages or injury arising from non-compliance with
the recommended usage conditions and specifications contained herein.
10) ROHM has used reasonable care to ensure the accuracy of the information contained in this
document. However, ROHM does not warrants that such information is error-free, and ROHM
shall have no responsibility for any damages arising from any inaccuracy or misprint of such
information.
11) Please use the Products in accordance with any applicable environmental laws and regulations,
such as the RoHS Directive. For more details, including RoHS compatibility, please contact a
ROHM sales office. ROHM shall have no responsibility for any damages or losses resulting
non-compliance with any applicable laws or regulations.
12) When providing our Products and technologies contained in this document to other countries,
you must abide by the procedures and provisions stipulated in all applicable export laws and
regulations, including without limitation the US Export Administration Regulations and the Foreign
Exchange and Foreign Trade Act.
13) This document, in part or in whole, may not be reprinted or reproduced without prior consent of
ROHM.
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