SML-010x/011x Series
■Features
• Reflector type (3.0×2.0mm, t=1.3mm)
• Reflector improved the concentration of viewing angle
and luminous intensity to the front direction
Data Sheet
■Outline
■Size
Color
Type
3020 (1208)
3.0×2.0mm (t=1.3mm)
V
U
D
Y
M
P
■Dimensions
■Recommended Solder Pattern
3.0
1.3
0.3
0.5
1.6
2.0
1.6
2.3
+0.2
-0.1
1.45
Through Hole
Cathode Index
1.5
1.45
2-R0.3
1.7
PCB Bonding Direction
Tolerance : ±0.2
■Moisture sensitivity level(MSL) :
(unit : mm)
(unit : mm)
Electrode
1.6
Level 3
■Specifications
Absolute Maximum Ratings (Ta=25ºC)
Part No.
Emitting
Power Forward
Peak Forward
Reverse
Chip Structure
Dissipation
SML-010VT
Red
SML-010DT
Orange
SML-010MT
SML-010PT
Yellow
Typ.
Current Current Voltage
PD(mW) IF(mA) IFP(mA) VR(V)
GaAsP
Forward Voltage VF
Topr(ºC)
Tstg(ºC)
(V)
IF
VR
Min.
(V)
(nm) (nm) (nm) (mA) (mcd) (mcd) (mA)
10
25
60*1
4
-30〜+85 -40〜+85
2.1
2.2
100
Green
-
4
20
Typ. Max.
650
-
610
-
3.6
10
-
2.2
6.3
-
570
-
-
555
-
Red
-
630
-
-
611
-
-
590
-
-
639
-
-
611
-
-
590
-
Yellow
Red
SML-011DT(A)
Orange
SML-011YT(A)
Yellow
75
30
100*2
5
-40〜+100 -40〜+100
2.0
10
10
5
20
10
IF
6.3
585
Orange
AlGaInP
2.2
Typ.
-
SML-011DT
SML-011VT(A)
Min.
-
SML-011UT
SML-011YT
IF
Luminous Intensity IV
Max.
2.0
70
Peak Wavelength λP
(mA) (μA)
Yellow Green
GaP
Reverse Current IR
Operating Temp. Storage Temp.
Color
SML-010YT
Electrical and Optical Characteristics (Ta=25ºC)
5.6
25
2.2
6.3
22
63
14
28
22.4
45
20
10
11.2 22.4
*1: Duty1/5 pulse width 1ms *2 : Duty1/10 1kHz
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©2020 ROHM Co., Ltd. All rights reserved
2020.4 - Rev.002
[SML-010x/011x series]
[Data Sheet]
■Electrical Characteristics Curves
Reference
Fig.2 Luminous Intensity Atmosphere Temperature
100
FORWARD CURRENT : IF [mA]
SML-010VT
SML-010DT
SML-010YT
SML-010MT
SML-010PT
Ta=25ºC
10
1
1
1.2
1.4
1.6
1.8
2
2.2
2.4
2.6
2.8
3
RELATIVE LUMINOUS INTENSITY [a.u.]
Fig.1 Forward Current
- Forward Voltages
FORWARD VOLTAGE : VF [V]
SML-010VT
SML-010DT
SML-010YT
SML-010MT
SML-010PT
0.9
0.6
0.3
5
10
15
20
FORWARD CURRENT : IF [mA]
25
MAXIMUM FORWARD CURRENT : [mA]
RELATIVE LUMINOUS INTENSITY
Ta=25ºC
0
1.4
1.2
1
0.8
SML-010VT
SML-010DT
SML-010YT
SML-010MT
SML-010PT
0.6
0.4
-40 -30 -20 -10 0
10 20 30 40 50 60 70 80 90 100
Fig.4 Derating
1.5
0
IF=20mA
ATMOSPHERE TEMPERATURE : Ta [ºC]
Fig.3 Luminous Intensity - Forward Current
1.2
1.6
30
28
26
24
22
20
18
16
14
12
10
SML-010VT
SML-010DT
SML-010YT
SML-010MT
SML-010PT
8
6
4
2
0
-40
-20
0
20
40
60
80
100
AMBIENT TEMPERATURE : Ta [ºC]
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2/11
©2020 ROHM Co., Ltd. All rights reserved
2020.4 - Rev.002
[SML-010x/011x series]
[Data Sheet]
■Electrical Characteristics Curves
Reference
Fig.2 Luminous Intensity Atmosphere Temperature
RELATIVE LUMINOUS INTENSITY [a.u.]
Fig.1 Forward Current
- Forward Voltages
FORWARD CURRENT : IF [mA]
100
Ta=25ºC
SML-011UT
SML-011DT
SML-011YT
10
1
1.0
1.5
2.0
2.5
3.0
1.6
1.2
1.0
0.8
0.6
0.4
0.2
2.0
Ta=25ºC
SML-011UT
SML-011DT
SML-011YT
1.5
1.0
0.5
5
10
15
20
25
FORWARD CURRENT : IF [mA]
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100
Fig.4 Derating
30
MAXIMUM FORWARD CURRENT : [mA]
RELATIVE LUMINOUS INTENSITY
Fig.3 Luminous Intensity - Forward Current
0
SML-011UT
SML-011DT
SML-011YT
ATMOSPHERE TEMPERATURE : Ta [ºC]
FORWARD VOLTAGE : VF [V]
0.0
IF=20mA
1.4
40
SML-011UT
SML-011DT
SML-011YT
30
20
10
0
-40 -30 -20 -10 0
10 20 30 40 50 60 70 80 90 100
AMBIENT TEMPERATURE : Ta [ºC]
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3/11
©2020 ROHM Co., Ltd. All rights reserved
2020.4 - Rev.002
[SML-010x/011x series]
[Data Sheet]
■Electrical Characteristics Curves
Reference
Fig.2 Luminous Intensity Atmosphere Temperature
RELATIVE LUMINOUS INTENSITY [a.u.]
Fig.1 Forward Current
- Forward Voltages
FORWARD CURRENT : IF [mA]
100
Ta=25ºC
SML-011VT(A)
SML-011DT(A)
SML-011YT(A)
10
1
1.0
1.5
2.0
2.5
3.0
RELATIVE LUMINOUS INTENSITY
3.0
Ta=25ºC
2.0
1.0
0
5
10
15
20
25
FORWARD CURRENT : IF [mA]
1.2
1.0
0.8
0.6
0.4
0.2
SML-011VT(A)
SML-011DT(A)
SML-011YT(A)
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100
Fig.4 Derating
30
MAXIMUM FORWARD CURRENT : [mA]
Fig.3 Luminous Intensity - Forward Current
0.0
IF=10mA
1.4
ATMOSPHERE TEMPERATURE : Ta [ºC]
FORWARD VOLTAGE : VF [V]
SML-011VT(A)
SML-011DT(A)
SML-011YT(A)
1.6
40
SML-011VT(A)
SML-011DT(A)
SML-011YT(A)
30
20
10
0
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100110
AMBIENT TEMPERATURE : Ta [ºC]
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©2020 ROHM Co., Ltd. All rights reserved
2020.4 - Rev.002
[SML-010/011 series]
[Data Sheet]
■Viewing Angle
Reference
SCANNING ANGLE (deg)
X - Y
ｽｷｬﾝ方向
(Scanning Direction)
SCANNING ANGLE (deg)
SML-010/ 011 series
0
10
10
20
20
30
30
40
40
50
50
60
60
70
70
80
90
100
X
80
50
0
50
RELATIVE INTENSITY (%)
90
100
Y
RELATIVE INTENSITY (%)
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5/11
©2020 ROHM Co., Ltd. All rights reserved
2020.4 - Rev.002
[SML-010x/011x series]
[Data Sheet]
■Rank Reference of Brightness*
*Measurement tolerance:±10%
Red(V,U)
Rank
Iv (mcd)
SML-010VT
Rank
Iv (mcd)
SML-011UT
(Ta=25ºC, IF＝20mA)
J
K
L
M
N
P
Q
R
S
T
U
V
2.5〜4.0 4.0〜6.3 6.3〜10 10〜16 16〜25 25〜40 40〜63 63〜100 100〜160 160〜250 250〜400 400〜630
J
K
L
M
9〜18
2.2〜4.5 3.6〜7.1 5.6〜11
N
P
Q
R
S
T
U
V
14〜28 22〜45 36〜71 56〜110 90〜180 140〜280 220〜450 360〜710
W
X
630〜1000 1000〜1600
W
X
560〜1100 900〜1800
(Ta=25ºC, IF＝10mA)
Rank
Iv (mcd)
AG
AH
9.0〜11.2 11.2〜14
SML-011VT(A)
AJ
14〜18
AK
AL
AM
AN
18 〜22.4 22.4〜28 28〜35.5 35.5〜45
AP
AQ
AR
AS
AT
AU
AV
AW
AX
AY
AZ
45〜56 56〜71 71〜90 90〜112 112〜140 140〜180 180〜224 224〜280 280〜355 355〜450 450〜560
∗Please note that the brightness of some products may fall between ranks (half rank)
Orange(D)
Rank
Iv (mcd)
SML-010DT
Rank
Iv (mcd)
SML-011DT
Rank
Iv (mcd)
(Ta=25ºC, IF＝20mA)
J
K
L
M
N
P
Q
R
S
T
U
V
2.5〜4.0 4.0〜6.3 6.3〜10 10〜16 16〜25 25〜40 40〜63 63〜100 100〜160 160〜250 250〜400 400〜630
J
K
L
M
9〜18
2.2〜4.5 3.6〜7.1 5.6〜11
N
P
Q
R
S
T
U
V
14〜28 22〜45 36〜71 56〜110 90〜180 140〜280 220〜450 360〜710
W
X
630〜1000 1000〜1600
W
X
560〜1100 900〜1800
(Ta=25ºC, IF＝10mA)
AG
AH
9.0〜11.2 11.2〜14
SML-011DT(A)
AJ
14〜18
AK
AL
AM
AN
18 〜22.4 22.4〜28 28〜35.5 35.5〜45
AP
AQ
AR
AS
AT
AU
AV
AW
AX
AY
AZ
45〜56 56〜71 71〜90 90〜112 112〜140 140〜180 180〜224 224〜280 280〜355 355〜450 450〜560
∗Please note that the brightness of some products may fall between ranks (half rank)
Yellow(Y)
Rank
Iv (mcd)
SML-010YT
Rank
Iv (mcd)
SML-011YT
Rank
Iv (mcd)
(Ta=25ºC, IF＝20mA)
J
K
L
M
N
P
Q
R
S
T
U
V
2.5〜4.0 4.0〜6.3 6.3〜10 10〜16 16〜25 25〜40 40〜63 63〜100 100〜160 160〜250 250〜400 400〜630
J
K
L
M
9〜18
2.2〜4.5 3.6〜7.1 5.6〜11
N
P
Q
R
S
T
U
V
14〜28 22〜45 36〜71 56〜110 90〜180 140〜280 220〜450 360〜710
W
X
630〜1000 1000〜1600
W
X
560〜1100 900〜1800
(Ta=25ºC, IF＝10mA)
AG
AH
9.0〜11.2 11.2〜14
SML-011YT(A)
AJ
14〜18
AK
AL
AM
AN
18 〜22.4 22.4〜28 28〜35.5 35.5〜45
AP
AQ
AR
AS
AT
AU
AV
AW
AX
AY
AZ
45〜56 56〜71 71〜90 90〜112 112〜140 140〜180 180〜224 224〜280 280〜355 355〜450 450〜560
∗Please note that the brightness of some products may fall between ranks (half rank)
Yellow Green/Green(M,P)
Rank
Iv (mcd)
SML-010MT
SML-010PT
J
K
L
(Ta=25ºC, IF＝20mA)
M
N
P
Q
R
S
T
U
V
2.5〜4.0 4.0〜6.3 6.3〜10 10〜16 16〜25 25〜40 40〜63 63〜100 100〜160 160〜250 250〜400 400〜630
W
X
630〜1000 1000〜1600
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©2020 ROHM Co., Ltd. All rights reserved
2020.4 - Rev.002
[SML-010x/011x series]
[Data Sheet]
1.75 ±0.1
■Taping（T86）
±0.1
4
2 ±0.05
φ1.5
+0.1
0
8.0
5.5
0～0.5
3.4
3.5
±0.05
Cathode index
2.4
±0.1
1.6
0
+1
0
φ60
φ180 -3
φ13
11.4 ±1
Unit:ｍｍ
Packing quantity
2,500pcs/reel
Note)Tolerance is within ±0.2mm unless
Pull
direction
otherwise specified.
■Part No. Construction
*"-"will be taken out for emitting color
Special Code will be applied for
Chromaticity rank
Rank sign
WB/B/E series.
Emitting color WB/B/E series.
(for white LED）
(Brightness Rank)*
S
M
L
－
Series name
SML
Chip LED
0
1
0
Package Type
Chip type
D
T
Emitting Color
Resin Color
6
0
Standard Type
V
Red
T
1
Low Current Type
U
Red
W Milky White
D1 1.6x0.8 t=0.55mm
2
High Brightness type
U2
Red
B
H1
3
D
Orange
2.0x1.25 t=0.8mm
4
Y3
Yellow
Y2
Yellow
Y
Yellow
7
W
Yellow
8
M2 Yellowish green
01 3.0x2.0 t=1.3mm
5
3.5x2.8 t=1.9mm
6
A1 1.6x1.15 t=0.55mm
3.4x1.25 t=1.1mm
81/82
Ultra High Brightness type
K1 4.5x2.0 t=0.6mm
M
Yellowish green
S1 3.2x1.6 t=1.85mm
F
Green
P2 1.0x1.0 t=0.2mm
P
Green
52 1.3x1.5 t=0.6mm
E
Green
P34
1.0x1.0 t=0.2mm
B
Blue
P36
1.5x1.0 t=0.2mm
WB
White
VN 3.5x2.8 t=0.6mm
T Phototransistors
RGB
01 3.0x1.5 t=2.2mm
Red/Green/Blue
K
Taping Specification
E1 1.6x0.8 t=0.36mm
Z1/ZN
Chip LED
8
P1 1.0x0.6 t=0.2mm
M1
SCM
T
Transparent Colorless
T86
Cathode at sprocket hole side(the top)
Black
*Concerning the Brightness rank.
*Please refer to the rank chart above for
luminous intensity classification.
*Part name is individual for each rank.
*When shipped as sample,the part name will
be a representative part name.
General products are free of ranks.
Please contact sales if rank appointment
is needed.
■Packing Specification
Complying with IPC/JEDEC J-STD-033.
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©2020 ROHM Co., Ltd. All rights reserved
2020.4 - Rev.002
[SML-010x/011x series]
[Data Sheet]
■Precaution (Surface Mount Device)
１．Storage
If the product is heated during the reflow under the condition of hygroscopic state,
it may vaporize and expand which will influence the performance of the product.
Therefore, the package is waterproof. Please use the product following the conditions:
・Using Conditions
Classification Temperature
Humidity
Expiration Date
Remark
Within 1 year
①Before using 5〜30℃
30〜70%RH
Storage with waterproof package
from Receiving
②After opening
Please storing in the airtight container
5〜30℃ Below 70%RH
Within 168h
package
with our desiccant (silica gel)
・Baking
Bake the product in case of below:
①The expiration date is passed.
②The color of 5% and 10% on humidity indicator card is not green.
(Even if the product is before expiration date.)
・Baking Conditions
Temperature
Time
Humidity
60±3℃
12〜24h
Below 20%RH
・Bake products in reel.
・Reel and embossed tape are easy to be deformed when baking,
Remark
so please try not to apply stress on it.
・Recommend bake once.
２．Application Methods
２－１．Precaution for Drive System and Off Mode
Design the circuit without the electric load exceeding the ABSOLUTE MAXIMUM RATING that
applies on the products. If drive by constant voltage, it may cause current deviation of the LED and
result in deviation of luminous intensity, so we recommend to drive by constant current.
(Deviation of VF Value will cause deviation of current in LED.) Furthermore, for off mode,
please do not apply voltage neither forward nor reverse. Especially, for the products with the
Ag-paste used in the die bonding, there’s high possibility to cause electro migration and result
in function failure.
２－２．About Derating
It is considered that derating characteristics will not result in LED chip's electrical destruction.
Even within the derating, the reliability and luminous life can be affected depending on operating
conditions and ambient environment. So we would be appreciate it if you can confirm with your
application again.
２－３．About product life
Depending on operating conditions and environment(applied current, ambient temperature and
humidity, corrosive gas), decreasing of luminosity and change of chromaticity may occur even
within the specification conditions.
Please contact our sales office if you use it for the following applications.
①It requires long luminosity life
②It is always lit
２－４．Applied Stress on Product
No resin hardening agent such as filler is used in the sealing resin of the product.
Therefore, please pay attention to the overstress on it which may influence its reliability.
２－５．Usage
The Product is LED. We are not responsible for the usage as the diode such as Protection Chip,
Rectifier, Switching and so on.
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©2020 ROHM Co., Ltd. All rights reserved
2020.4 - Rev.002
[SML-010x/011x series]
[Data Sheet]
３．Others
３－１．Surrounding Gas
Notice that if it is stored under the condition of acid gas (chlorine gas, sulfured gas) or
alkali gas (ammonia), it may result in low soldering ability (caused by the change in quality of
the plating surface ) or optical characteristics changes (light intensity, chrominance) and change
in quality of cause die bonding (Ag-paste) materials. All of the above will function failure of
the products.
Therefore, please pay attention to the storage environment for mounted product (concern the
generated gas of the surrounding parts of the products and the atmospheric environment).
３－２．Electrostatic Damage
The product is part of semiconductor and electrostatic sensitive, there’s high possibility to be damaged
by the electrostatic discharge. Please take appropriate measures to avoid the static electricity from
human body and earthing of production equipment. Especially, InGaN type LEDs have lower resistance
value of electrostatic discharge and it is recommended to introduce the ESD protection circuit.
The resistance values of electrostatic discharge (actual values) vary with products, therefore,
please call our Sales staffs for inquiries.
３－３． Electromagnetic Wave
Applications with strong electromagnetic wave such as, IH cooker, will influence the reliability of LED,
therefore please evaluate before using it.
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©2020 ROHM Co., Ltd. All rights reserved
2020.4 - Rev.002
[SML-010x/011x series]
[Data Sheet]
４．Mounting
４－１. Soldering
・No resin hardening agent such as filler is used in the sealing resin of the product. Therefore, resin
expansion and moisture absorption at humidity will cause heat stress during soldering process and
finally has bad influence on the product’s reliability.
・The product is not guaranteed for flow soldering.
・Do not expose the product in the environment of high temperature (over 100℃) or rapid temperature
shift (within 3℃/sec. of temperature gradient) during the flow soldering of surrounding parts.
In case of carrying out flow soldering of surrounding parts without recommended conditions, please
contact us for inquiries.
・Please set appropriate reflow temperature based on our product usage conditions and specification.
・The max for reflowing is 2 times, please finish the second reflow soldering and flow soldering
with other parts within the usage limitation after open the moistureproof package.
・Compare with N2 reflow, during air reflow, because of the heat and surrounding conditions,
it may cause the discoloration of the resin.
・For our product that has no solder resist, because of its solder amount and soldering conditions,
one of its specific characteristics is that solder will penetrate into LED. Thus, there's high possibility
that will influence its reliability.Therefore, please be informed, concerning it before using it.
４－２. Automatic Mounting
４-２-１. Suction nozzle
Excessive load may cause damage inside the LED product, so select an optimal suction nozzle
according to the material and shape of the LED product.
４-２-２. Mini Package (Smaller than 1608 size)
・Vibration may result in low mounting rate since it will cause the static electricity of product and
adhere to top cover tape. Therefore, the magnet should be set on parts feeder cassette of
the mounter to control the product stabilization. In addition, it is recommended to set ionizer
to prevent electrostatic charge.
４－３. Mounting Location
The stress like bending stress of circuit board dividing after mounting, may cause LED package crack
or damage of LED internal junction, therefore, please concern the mounting direction and position
to avoid bending or screwing with great stress of the circuit board.
Stress strength according to
he mounting position:
A＞B＞C＞D
４―４. Mechanical Stress after Mounting
The mechanical stress may damage the LED after Circuit Mounting,
so please pay attention to the touch on product.
４－５．Soldering Pattern for Recommendation
We recommend the soldering pattern that shows on the right.
It will be different according to mounting situation of circuit board,
therefore, please concern before designing.
※The product has adopted the electrode structure that it should solder
with back electrode of the product.
Thus, please be informed that the shape of electrode pin of
solder fillet formation is not guaranteed.
The through hole on electrode surface is for conduction of front
and rear electrodes but not for formation of solder fillet.
1.6mm
1.45mm
1.5mm
1.45mm
PCB Bonding Direction
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©2020 ROHM Co., Ltd. All rights reserved
2020.4 - Rev.002
[SML-010x/011x series]
[Data Sheet]
４－６．Reflow Profile
For reflow profile, please refer to the conditions below:(※)
■Meaning of marks, Conditions
Mark
Tsmax
Tsmin
ts
TL
tL
TP
tP
ΔTR/Δt
ΔTD/Δt
Meanings
Maximum of pre-heating temperature
Minimum of pre-heating temperature
Time from Tsmin to Tsmax
Reference temperature
Retention time for TL
Peak temperature
Time for peak temperature
Temperature rising rate
Temperature decreasing rate
Conditions
180℃
140℃
Over 60sec.
210〜250℃
Within 40sec.
250℃(Max)
Within 10sec.
Under 3℃/sec.
Over -3℃/sec.
※Above conditions are for reference. Therefore, evaluate by customer’s own circuit boards and
reflow furnaces before using, because stress from circuit boards and temperature variations of reflow
furnaces vary by customer’s own conditions.
４－７．Attention Points in Soldering Operation
This product was developed as a surface mount LED especially suitable for reflow soldering.
So reflow soldering is recommended. In case of implementing manual soldering,
please take care of following points.
①SOLDER USED
Sn-Cu，Sn-Ag-Cu，Sn-Ag-Bi-Cu
②HAND SOLDERING CONDITION
LED products do not contain reinforcement material such as a glass fillers.
So thermal stress by soldering greatly influence its reliability.
Please keep following points for manual soldering.
ITEM
a)
b)
RECOMMENDED CONDITION
Condition ) Temp. of iron top less than
400℃ within 3 sec.
Heating method
Heating on PCB pattern, not direct to the
LED. (Fig-1)
Handling after Please handle after the part temp.
soldering goes down to room temp.
Fig-1
SOLDERING IRON
SOLDERING LAND
４－８．Cleaning after Soldering
Please follow the conditions below if the cleaning is necessary after soldering.
Solvent
We recommend to use alcohols solvent such as, isopropyl alcohols
Temperature
Under 30℃ within 3 minutes
Ultrasonic Cleaning
15W／Below 1 liter (capacity of tank)
Drying
Under 100℃ within 3 minutes
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©2020 ROHM Co., Ltd. All rights reserved
2020.4 - Rev.002
