SML-J14DTT96

TYPE PRODUCTS Surface Mount Chip LED PAGE ／ SML-J14DT 1. CONSTRUCTION AlGaInP orange visual light emitting diodes packaged with colorless epoxy. 2. USAGE Source of light for auxiliary AF 3. DIMENSIONS See Figure.1 4. ABSOLUTE MAXIMUM RATINGS Power Dissipation Forward Current Peak Forward Current R e v e r s e Vo l t a g e Operating Temperature Storage Temperature 5. ELECTRO－CHARACTERISTICS (Ta=25℃) P D ・・・・・・・・・・・・ 175mW I F ・・・・・・・・・・・・ 70mA I F P ・・・・・・・・・・・・ 200mA ( Notes 1 ) V R ・・・・・・・・・・・・ 5V Topr ・・・・・・・・・・・・ －40℃～＋ 85℃ Tstg ・・・・・・・・・・・・ －40℃～＋100℃ ( Notes1 Duty 1/10 1kHz ) ( Ta=25℃) DISCRIPTION SYMBOL CONDITION MIN. TYP. MAX. UNITS Forward Voltage VF IF=20mA (1.7) 2.0 (2.5) V Reverse Current IR VR=5V － － 100 μA *1 Luminous Intensity IV IF=20mA (20) 28 － cd Peak Wave Length λP IF=20mA － 611 － nm Spectral Line Half Width △λ IF=20mA － 17 － nm Optical Axis Gap θ － － ±3 － ° *1 Measurement tolerance : ±10% ( ) : Reference 6. PRODUCT WEIGHT Product weight per piece, approx 0.045grm. REV.： TSZ22111･05･002 A SPECIFICATION No.： SMLJ14 TYPE PRODUCTS Surface Mount Chip LED PAGE ／ SML-J14DT 【Figure.1】 4 C0.3 0.15 ① ② ③ ④ 4.55 3.15 3 3.4 3 .4 ② ③ ④ 0.5 1. 8 ① (2.3) ( Unit : mm ) ( ) : Reference ( note ) Tolerance is within ±0.1mm unless otherwise specified. REV.： TSZ22111･05･002 A SPECIFICATION No.： SMLJ14 TYPE PRODUCTS Surface Mount Chip LED PAGE ／ SML-J14DT 8.0 B ±0.1 5°max. ±0.2 4.2±0.1 Cross sectional view B-B 4.6±0.1 ±0.1 4.2±0.1 2.0 3.7±0.1 A 0 ～0.5 A 5°max. 9. 1 (Feeding holes) 0.4±0.05 12.0 B 5.5±0.05 φ1.5 +0.10 1.75±0.1 【T96】 A' Description A' (10 : 1) 4.35±0.1 Cross sectional view A-A φ330 17.4 ±1.0 Packing quantity 1,500pcs / reel Pull direction ( Unit : mm ) ( note ) Tolerance is within ±0.2mm unless otherwise specified. REV.： TSZ22111･05･002 A SPECIFICATION No.： SMLJ14 PRODUCTS Surface Mount Chip LED TYPE PAGE SML-J14DT 【STRUCTURE・MATERIAL】 ③ ④ ⑤ ① ② No. APPELLATION 1 Frame Ag plating over Cu frame 2 Die Bond Ag Paste 3 Chip AlGaInP 4 Bonding Wire Gold 5 Resin Epoxy Resin REV.： TSZ22111･05･002 MATERIAL A SPECIFICATION No.： SMLJ14 ／ TYPE PRODUCTS Surface Mount Chip LED PAGE SML-J1＊Series ／ 【PACKAGING REQUIREMENTS】 1. PACKING (1) 1,500pcs are packed in one reel. (2) One reel is packed in aluminum bag. The size of aluminum bag is 380(a)×400(b)mm. The size up to 380(c)mm is to zipper. (3) Aluminum bag is sealed by pressured for all directions. ｃ 2. MARKING The following information shall be described on a box label: ROHM Type number, Packing quantity, Luminous intensity rank, Lot number etc. ｂ ａ 【FORMER LABEL SPECIFICATION】 Type No. ＳＭＬ－Ｊ１４ＤＴＴ９６ 　 Ｆ　　１，５００ｐｃｓ　１００３　０００１２Ｗ FOR ROHM ONLY Country of origin Interoffice administration code Customers part No. etc. “F” means Pb-free, Quantity, Then Lot No. Displayed. Note) Indicates bar code expressed by code 39. indicates Pb-free Products. 【EXAMPLE OF LOT NO. MARKING】 １０ ０３ ０００１２ Ｗ Production facility sign (Reference the manufactory list) Serial number of lot Production week Production year REV.： TSZ22111･05･002 A SPECIFICATION No.： SMLJ1 PRODUCTS Surface Mount Chip LED 【ATTENTION POINT IN TYPE PAGE SML-J1＊Series ／ HANDLING】 This product was developed as a surface mount LED especially suitable for soldering. Please take care of following points when using this device. 0.7 1.1 0.7 1.DESIGNING OF PCB As for a recommendable solder pattern, Please refer to Fig-1. The size and direction of the pad pattern depends on the condition of the PCB, So, please investigate about the adjustment thoroughly before designing. (Unit : mm) 2.1 1.55 2.SOLDERING ( Sn-Cu, Sn-Ag-Cu, Sn-Ag-Bi-Cu ) LED products do not contain reinforcement materials such as glass fillers. Therefore, thermal stress by soldering greatly influence its reliability. The temperature conditions for reflow soldering should therefore be set up according to the characteristic of this product. (See Fig-2) Furthermore, a sudden heating or cooling of LED cause internal stress greatly and has a possibility to break the device. Therefore, thermal gradient shall be gradual as possible. Number of reflow process shall be max 2 times and these processes shall be performed in a row. Cooling process to normal temperature shall be required between first and second soldering process. 1.55 (Fig-1) 300 Max 250℃, Within 10sec 250 140～180℃ 200 230～250℃ 150 Max -6℃/sec 100 Min.1 min 50 Max 40sec 0 (Fig-2) Emitting Direction Resin 3.HANDLING AFTER MOUNTING In case outside force is given to the device, stress is concentrated to the jointed part between mold resin and substrate. Therefore please be careful when handling LED and PCB for there is a possibility to break the device or PCB. 4.WASHING Please note the following points when washing is required after soldering. 4-1) WASHING SOLVENT Isopropyl alcohol or other alcohol solvent is recommendable. 4-2) TEMPERATURE Below 30℃, immersion time ; within 3 minutes. 4-3) ULTRA SONIC WASHING Below 15 / 1 litter of solvent tub. 4-4) COOLING Below 100℃ within 3 minutes. Outside Force Soldering Part PCB Frame 5. Erosion Gas Utilization in erosion gas atmosphere may degenerate the plating surface which might cause deterioration of solder strength, optical characteristics, or functions. Please take precautions against occurrence of gas from the surrounding parts on the occasion of custody, and also after mounted on circuit board. REV.： TSZ22111･05･002 A SPECIFICATION No.： SMLJ1 PRODUCTS Surface Mount Chip LED TYPE PAGE SML-J1＊Series ／ 6.STORAGE At reflow soldering, the reliability of this product is often influenced by moisture absorption so we apply the packaging with moisture proof for better condition is use, please also note that 6-1) Not to be opened before using. 6-2) To be kept in our moisture proof packaging with some desiccant (SILICA GEL) after opening it. To be baked in case the SILICA GEL indicator changed its color from either blue to clear or green to pink. 6-3) Please use within 72 hours after the package was opened. (Condition at 30℃, max.70%Rh.) In case it is not used within 72 hours, please put it back into our packaging. 6-4) BAKING Please bake under reel condition at 60℃, 40～48 hours (max.20%Rh) after un-sealing. While baking is done, the reel and emboss tape may be easily deformed. Please be careful not to give any stress. REV.： TSZ22111･05･002 A SPECIFICATION No.： SMLJ1 PRODUCTS Surface Mount Chip LED TYPE PAGE SML-J1＊Series ／ 【ATTENTION POINTS IN SOLDERING OPERATION】 This product was developed as a surface mount LED especially suitable for reflow soldering. So refrow soldering is recommended. Incase of implementing manual soldering, please take care of following points. 1. SOLDERING OPERATION 1) SOLDER USED Sn-Cu, Sn-Ag-Cu, Sn-Ag-Bi-Cu 2)SOLDERING CONDITION LED products do not contain reinforcement material such as a glass fillers. So thermal stress by soldering greatly influence its reliability. Please keep following points for manual soldering. ITEM RECOMMENDED CONDITION a) Soldering iron Less than 30W, top of iron less than 3mm. b) Heating method c) Handling after soldering Condition ) Temp. of iron top less than 350℃ within 3 sec. Heating on PCB pattern, not direct to the LED. (Fig-1) Please handle after the part temp. Goes down to room temp. Fig-1 Soldering iron Soldering land 3)WASHING Please note the following points when washing is required after soldering. 3-1) WASHING SOLVENT Isopropyl alcohol or other alcohol solvent is recommendable. 3-2) TEMPERATURE Below 30℃, immersion time : within 3 minutes. 3-3) ULTRA SONIC WASHING Below 15W/1 litter of solvent tub. 3-4) CURING Below 100℃ within 3 minutes. 4)STORAGE At manual soldering, the reliability of this product is often influenced by moisture absorption so we apply the packaging with moisture proof for better condition is use, please also note that 4-1) Not to be opened before using. 4-2) To be kept in our moisture proof packaging with some desiccant (SILICA GEL) after opening it. To be baked in case the SILICA GEL indicator changed its color from either blue to clear or green to pink. 4-3) STORAGE CONDITION Please use products in a sort time after opening the package. In case all parts are not used at the sometime, put the remaining back into ROHM package. Storage condition : (Lower than 30℃, 70% Humidity max.72 hours.) 4-4) BAKING CONDITION 40～48 hours at 60℃, and humidity less than 20% REV.： TSZ22111･05･002 A SPECIFICATION No.： SMLJ1 PRODUCTS TYPE Surface Mount Chip LED PAGE ＳＭＬ－Ｊ１４ＤＴ ／ RELATIVE LUMINOUS INTENSITY - ATMOSPHERE TEMPERATURE RELATIVE LUMINOUS INTENSITY 光度　－　周囲温度特性 IF=20mA 1.4 1.3 1.2 1.1 1 0.9 0.8 0.7 0.6 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 ATOMOSPHERE TEMPERATURE：Ta(℃) FORWARD CURRENT - FORWARD VOLTAGE 順方向電流　－　順方向電圧特性 Ta=25℃ FORWARD CURRENT：IF(mA) 100 10 1 1.0 1.5 2.0 2.5 FORWARD VOLTAGE：VF(V) 3.0 Reference 　REV.：　　　　 Ａ SPECIFICATION No. ：　ＳＭＬＪ１４ PRODUCTS TYPE Surface Mount Chip LED PAGE ＳＭＬ－Ｊ１４ＤＴ ／ RATIO OF MAXIMUM TOLERABLE PEAK CURRENT - PULSE DURATION 最大許容ピーク電流　－　パルス幅特性 100Hz 200Hz 1kHz 2kHz 10kHz IFP Max／IF Max 10 2.86 1 1 10 100 1000 PULSE DURATION : Tw(μs) 10000 RELATIVE LUMINOUS INTENSITY - FORWARD CURRENT RELATIVE LUMINOUS INTENSITY 光度　－　順方向電流特性 Ta=25℃ 3.0 2.0 1.0 0.0 0 10 20 30 40 50 FORWARD CURRENT：(mA) 60 70 Reference 　REV.：　　　　 Ａ SPECIFICATION No. ：　ＳＭＬＪ１４ PRODUCTS Surface Mount Chip LED TYPE PAGE ＳＭＬ－Ｊ１４ＤＴ DERATING MAXIMUM FORWARD CURRENT：(mA) ディレイティング特性 80 70 60 50 40 30 20 10 0 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 AMBIENT TEMPERATURE：Ta(℃) Reference 　REV.：　　　　 Ａ SPECIFICATION No. ：　ＳＭＬＪ１４ ／ PRODUCTS TYPE PAGE Surface Mount Chip LED ＳＭＬ－Ｊ１４ＤＴ ／ RELATIVE LUMINOUS INTENSITY - VIEWING ANGLE 指向特性 SCANNING ANGLE(deg) 20 10 0 10 20 30 30 40 40 50 50 60 60 70 70 80 90 100 80 50 0 90 100 50 RELATIVE INTENSITY(%) Reference 　REV.：　　　　 Ａ SPECIFICATION No. ：　ＳＭＬＪ１４