SML-M13x/MN2x Series
■Features
• Compact LED with reflector
• Die is located at the center of the package,achieving
equivalent distribution of light emission.
Data Sheet
■Outline
■Size
Color
Type
20125 (0805)
2.0×1.25mm (t=0.8mm)
V
U
D
Y
M
P
E
B
■Dimensions
WB
■Recommended Solder Pattern
0.8
2.0
0.85
1.25
1.1
0.3
1.4
1.25
Through Hole
1.1
1.25
0.9
2-R0.3
PCB Bonding Direction
Electrode
Tolerance : ±0.2
1.0
(unit : mm)
(unit : mm)
■Moisture sensitivity level(MSL) :
Level 3
■Specifications
Absolute Maximum Ratings (Ta=25ºC)
Emitting
Part No.
Power Forward
Peak Forward
Electrical and Optical Characteristics (Ta=25ºC)
Reverse
Forward Voltage VF
Reverse Current IR
Operating Temp. Storage Temp.
Chip Structure
Color
Dissipation
Current Current Voltage
PD(mW) IF(mA) IFP(mA) VR(V)
Topr(ºC)
Tstg(ºC)
Typ.
IF
Max.
VR
(V)
(mA)
(µA)
(V)
SML-M13VT
Red
SML-M13UT
75
SML-M13DT
2.0
Orange
30
AlGaInP
SML-M13YT
Yellow
SML-M13MT
Yellowish green
-40 〜 +85 -40 〜 +100
100*1
81
SML-M13PT
5
20
10
5
SMLMN2BCT(C)
70
InGaN
68
SMLMN2WB1CW(C) *3
White
3.0
20
Blue
/Chromaticity coordinate(x,y)
Min.*2 Typ. Max.*2
IF
Luminous Intensity IV
Min.
Typ.
(nm)
(nm)
(nm)
625
630
635
40
75
615
620
625
63
120
602
605
608
100
160
587
590
593
569
572
575
25
45
557
560
563
6.3
16
519
527
536
56
140
464
470
476
IF
(mA) (mcd) (mcd) (mA)
20
20
2.2
Green
SMLMN2ECT(C)
Dominant Wavelength λD
12
-40 〜 +100 -40 〜 +100
5
2.9
10
12
(x,y)(0.30, 0.28)
5
14
36
56
140
5
*1 : 1/10,1kHz *2 : Measurement tolerance:±1nm、*3:Brightness for white color is noted with chromaticity coordinate(x,y).
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©2020 ROHM Co., Ltd. All rights reserved
2020.4 - Rev.011
[SML-M13x/MN2x series]
[Data Sheet]
■Electrical Characteristics Curves
Reference
RELATIVE LUMINOUS INTENSITY [a.u.]
Fig.1 Forward Current
- Forward Voltages
FORWARD CURRENT : IF [mA]
100
Ta=25ºC
SML-M13VT
SML-M13UT
SML-M13DT
SML-M13YT
SML-M13MT
SML-M13PT
10
1
1.5
2.0
Fig.2 Luminous Intensity Atmosphere Temperature
1.6
IF=20mA
1.4
1.2
1
0.8
0.6
0.4
-40
2.5
FORWARD VOLTAGE : VF [V]
-20
0
20
40
MAXIMUM FORWARD CURRENT : [mA]
1.2
100
SML-M13VT
SML-M13UT
SML-M13DT
SML-M13YT
SML-M13MT
SML-M13PT
40
Ta=25ºC
SML-M13VT
SML-M13UT
SML-M13DT
SML-M13YT
SML-M13MT
SML-M13PT
80
Fig.4 Derating
1.6
1.4
60
ATMOSPHERE TEMPERATURE : Ta [ºC]
Fig.3 Luminous Intensity - Forward Current
RELATIVE LUMINOUS INTENSITY
SML-M13VT
SML-M13UT
SML-M13DT
SML-M13YT
SML-M13MT
SML-M13PT
30
1.0
20
0.8
0.6
10
0.4
0.2
0.0
0
5
10
15
20
25
FORWARD CURRENT : IF [mA]
30
0
-40
-20
0
20
40
60
80
100
AMBIENT TEMPERATURE : Ta [ºC]
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©2020 ROHM Co., Ltd. All rights reserved
2020.4 - Rev.011
[SML-M13x/MN2x series]
[Data Sheet]
■Electrical Characteristics Curves
Reference
Fig.2 Luminous Intensity Atmosphere Temperature
100
Ta=25ºC
FORWARD CURRENT : IF [mA]
SMLMN2BCT(C)
SMLMN2WB1CW(C)
SMLMN2ECT(C)
10
1
RELATIVE LUMINOUS INTENSITY [a.u.]
Fig.1 Forward Current
- Forward Voltages
1.6
1.4
1.2
1
0.8
0.6
0.4
2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0
FORWARD VOLTAGE : VF [V]
Ta=25ºC
5.0
10.0
15.0
FORWARD CURRENT : IF [mA]
20.0
MAXIMUM FORWARD CURRENT : [mA]
RELATIVE LUMINOUS INTENSITY
Fig.4 Derating
SMLMN2BCT(C)
SMLMN2WB1CW(C)
SMLMN2ECT(C)
0.0
-40-30-20-10 0 10 20 30 40 50 60 70 80 90100
ATMOSPHERE TEMPERATURE : Ta [ºC]
Fig.3 Luminous Intensity - Forward Current
4.0
3.8
3.6
3.4
3.2
3.0
2.8
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
IF=5mA
SMLMN2BCT(C)
SMLMN2WB1CW(C)
SMLMN2ECT(C)
30
28
26
24
22
20
18
16
14
12
10
8
6
4
2
0
SMLMN2BCT(C)
SMLMN2WB1CW(C)
SMLMN2ECT(C)
-40 -20
0
20
40
60
80
100 120
AMBIENT TEMPERATURE : Ta [ºC]
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©2020 ROHM Co., Ltd. All rights reserved
2020.4 - Rev.011
[SML-M13x/MN2x series]
[Data Sheet]
■Viewing Angle
Reference
SCANNING ANGLE (deg)
X - Y
ｽｷｬﾝ方向
(Scanning Direction)
SCANNING ANGLE (deg)
X' - Y'
0
10
20
SML-M13VT
SML-M13UT
SML-M13DT
SML-M13YT
SML-M13MT
SML-M13PT
0
10
10
10
20
20
20
30
30
30
30
ｽｷｬﾝ方向
(Scanning Direction)
40
40
50
40
40
50
50
50
60
60
60
60
70
70
70
70
80
80
80
80
90
100
50
50
0
RELATIVE INTENSITY (%)
X
90
100
90
100
50
SCANNING ANGLE (deg)
90
100
50
0
RELATIVE INTENSITY (%)
X'
Y
Y'
SCANNING ANGLE (deg)
X' - Y'
X - Y
ｽｷｬﾝ方向
(Scanning Direction)
0
10
10
0
SMLMN2BCT(C)
SMLMN2WB1CW(C)
SMLMN2ECT(C)
10
10
20
20
20
20
30
ｽｷｬﾝ方向
(Scanning Direction)
30
30
30
40
40
40
40
50
50
50
50
60
60
60
60
70
70
70
70
80
80
80
90
100
X
80
50
0
50
RELATIVE INTENSITY (%)
90
100
90
100
50
0
50
Y'
X'
Y
90
100
RELATIVE INTENSITY (%)
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©2020 ROHM Co., Ltd. All rights reserved
2020.4 - Rev.011
[SML-M13x/MN2x series]
[Data Sheet]
■Rank Reference of Brightness*
Red(V,U)
*Measurement tolerance:±10%
(Ta=25ºC, IF＝20mA)
K
Rank
Iv (mcd)
SML-M13VT
SML-M13UT
M
N
P
Q
R
4.0〜6.3
6.3〜10
10〜16
16〜25
25〜40
40〜63
63〜100
K
L
M
N
P
Q
R
Orange(D)
Rank
Iv (mcd)
SML-M13DT
L
S
T
U
S
T
U
S
T
U
S
T
U
V
W
100〜160 160〜250 250〜400 400〜630 630〜1000
(Ta=25ºC, IF＝20mA)
4.0〜6.3
6.3〜10
10〜16
16〜25
25〜40
40〜63
63〜100
K
L
M
N
P
Q
R
Yellow(Y)
V
W
100〜160 160〜250 250〜400 400〜630 630〜1000
(Ta=25ºC, IF＝20mA)
Rank
Iv (mcd)
SML-M13YT
4.0〜6.3
6.3〜10
10〜16
16〜25
25〜40
40〜63
63〜100
M
N
P
Q
R
Yellowish Green(M)
K
Rank
Iv (mcd)
SML-M13MT
L
4.0〜6.3
W
(Ta=25ºC, IF＝20mA)
6.3〜10
10〜16
16〜25
25〜40
40〜63
63〜100
L
M
N
P
Q
R
Green(P,E)
V
100〜160 160〜250 250〜400 400〜630 630〜1000
V
W
100〜160 160〜250 250〜400 400〜630 630〜1000
(Ta=25ºC, IF＝20mA(P),Ta=25ºC, IF＝5mA(E))
Rank
K
Iv (mcd)
4.0〜6.3
SML-M13PT
Rank
K
Iv (mcd)
3.6〜5.6
SMLMN2ECT(C)
6.3〜10
L
10〜16
M
16〜25
N
25〜40
P
40〜63
Q
63〜100
R
S
S
5.6〜9
9〜14
14〜22
22〜36
36〜56
56〜90
90〜140
L
M
N
P
Q
R
S
Blue(B)
T
U
V
W
T
U
V
W
T
U
T
U
100〜160 160〜250 250〜400 400〜630 630〜1000
140〜220 220〜360 360〜560 560〜900
(Ta=25ºC, IF＝5mA)
Rank
K
Iv (mcd)
3.6〜5.6
SMLMN2BCT(C)
White(WB)
Rank
Iv (mcd)
SMLMN2WB1CW(C)
5.6〜9
9〜14
14〜22
22〜36
36〜56
56〜90
90〜140
L
M
N
P
Q
R
S
V
W
140〜220 220〜360 360〜560 560〜900
(Ta=25ºC, IF＝5mA)
K
3.6〜5.6
5.6〜9
9〜14
14〜22
22〜36
36〜56
56〜90
90〜140
V
W
140〜220 220〜360 360〜560 560〜900
■Chromaticity Diagram
（Ｔａ＝25℃、If=5mA)
0.36
0.35
1
2
0.34
x
y
x
y
x
0.33
0.286
0.244
0.280
0.252
0.296
0.259
0.280
0.252
0.273
0.261
0.291
0.268
0.291
0.268
0.285
0.279
0.310
0.297
0.296
0.259
0.291
0.268
0.313
0.284
y
x
y
x
0.291
0.268
0.313
0.284
0.310
0.297
0.285
0.279
0.310
0.297
0.307
0.312
0.307
0.312
0.330
0.330
0.330
0.347
0.310
0.297
0.330
0.310
0.330
0.330
5
4
0.32
0.31
CIE y
0
0.30
y
3
0.29
0.28
2
0.27
x
1
0.26
0
0.25
0.24
0.23
0.26
0.27
0.28
0.29
0.30
CIE x
0.31
0.32
0.33
0.34
3
4
5
y
Measurement tolerance：±0.01
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2020.4 - Rev.011
[SML-M13x/MN2x series]
+0.1
0
5.5
0～0.5
2.5
3.5
φ1.5
1.75±0.1
4±0.1
2±0.05
8.0
■Taping(T86)
[Data Sheet]
1.7
1.1±0.1
Unit:ｍｍ
+1
0
φ13
φ60
φ180
0
-3
11.4±1
Note)Tolerance is within ±0.2mm unless
otherwise specified.
Packing quantity
3,000pcs / reel
Pull
direction
■Part No. Construction
*"-"will be taken out for emitting color
Special Code will be applied for
Chromaticity rank
Rank sign
WB/B/E series.
Emitting color WB/B/E series.
(for white LED）
(Brightness Rank)*
S
M
L
Series name
SML
Chip LED
－
M
1
3
Package Type
Chip type
U
T
Emitting Color
Resin Color
6
0
Standard Type
V
Red
T
1
Low Current Type
U
Red
W Milky White
D1 1.6x0.8 t=0.55mm
2
High Brightness type
U2
Red
B
H1
3
D
Orange
4
Y3
Yellow
Y2
Yellow
Y
Yellow
Yellow
2.0x1.25 t=0.8mm
01 3.0x2.0 t=1.3mm
5
3.5x2.8 t=1.9mm
6
A1 1.6x1.15 t=0.55mm
7
W
3.4x1.25 t=1.1mm
8
M2 Yellowish green
81/82
Ultra High Brightness type
S
Taping Specification
E1 1.6x0.8 t=0.36mm
Z1/ZN
Transparent Colorless
Black
T86
1
Cathode at sprocket hole side(the top)
For white LED,
cathode at sprocket hole side
*Concerning the Brightness rank.
K1 4.5x2.0 t=0.6mm
M
Yellowish green
S1 3.2x1.6 t=1.85mm
F
Green
*Please refer to the rank chart above for
P2 1.0x1.0 t=0.2mm
P
Green
52 1.3x1.5 t=0.6mm
E
Green
luminous intensity classification.
*Part name is individual for each rank.
P34
1.0x1.0 t=0.2mm
B
Blue
P36
1.5x1.0 t=0.2mm
WB
White
VN 3.5x2.8 t=0.6mm
T Phototransistors
RGB
Chip LED
8
P1 1.0x0.6 t=0.2mm
M1
SCM
T
01 3.0x1.5 t=2.2mm
Red/Green/Blue
*When shipped as sample,the part name will
be a representative part name.
General products are free of ranks.
Please contact sales if rank appointment
is needed.
■Packing Specification
Complying with IPC/JEDEC J-STD-033.
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©2020 ROHM Co., Ltd. All rights reserved
2020.4 - Rev.011
[SML-M13x/MN2x series]
[Data Sheet]
■Precaution (Surface Mount Device)
１．Storage
If the product is heated during the reflow under the condition of hygroscopic state,
it may vaporize and expand which will influence the performance of the product.
Therefore, the package is waterproof. Please use the product following the conditions:
・Using Conditions
Classification Temperature
Humidity
Expiration Date
Remark
Within 1 year
①Before using 5〜30℃
30〜70%RH
Storage with waterproof package
from Receiving
②After opening
Please storing in the airtight container
5〜30℃ Below 70%RH
Within 168h
package
with our desiccant (silica gel)
・Baking
Bake the product in case of below:
①The expiration date is passed.
②The color of 5% and 10% on humidity indicator card is not green.
(Even if the product is before expiration date.)
・Baking Conditions
Temperature
Time
Humidity
60±3℃
40〜48h
Below 20%RH
・Bake products in reel.
・Reel and embossed tape are easy to be deformed when baking,
Remark
so please try not to apply stress on it.
・Recommend bake once.
２．Application Methods
２－１．Precaution for Drive System and Off Mode
Design the circuit without the electric load exceeding the ABSOLUTE MAXIMUM RATING that
applies on the products. If drive by constant voltage, it may cause current deviation of the LED and
result in deviation of luminous intensity, so we recommend to drive by constant current.
(Deviation of VF Value will cause deviation of current in LED.) Furthermore, for off mode,
please do not apply voltage neither forward nor reverse. Especially, for the products with the
Ag-paste used in the die bonding, there’s high possibility to cause electro migration and result
in function failure.
２－２．About Derating
It is considered that derating characteristics will not result in LED chip's electrical destruction.
Even within the derating, the reliability and luminous life can be affected depending on operating
conditions and ambient environment. So we would be appreciate it if you can confirm with your
application again.
２－３．About product life
Depending on operating conditions and environment(applied current, ambient temperature and
humidity, corrosive gas), decreasing of luminosity and change of chromaticity may occur even
within the specification conditions.
Please contact our sales office if you use it for the following applications.
①It requires long luminosity life
②It is always lit
２－４．Applied Stress on Product
The top of the LED is very soft, which the silicon resin is used as sealing resin.
Therefore, please pay attention to the overstress on it which may influence its reliability.
２－５．Usage
The Product is LED. We are not responsible for the usage as the diode such as Protection Chip,
Rectifier, Switching and so on.
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©2020 ROHM Co., Ltd. All rights reserved
2020.4 - Rev.011
[SML-M13x/MN2x series]
[Data Sheet]
３．Others
３－１．Surrounding Gas
Notice that if it is stored under the condition of acid gas (chlorine gas, sulfured gas) or
alkali gas (ammonia), it may result in low soldering ability (caused by the change in quality of
the plating surface ) or optical characteristics changes (light intensity, chrominance) and change
in quality of cause die bonding (Ag-paste) materials. All of the above will function failure of
the products.
Therefore, please pay attention to the storage environment for mounted product (concern the
generated gas of the surrounding parts of the products and the atmospheric environment).
３－２．Electrostatic Damage
The product is part of semiconductor and electrostatic sensitive, there’s high possibility to be damaged
by the electrostatic discharge. Please take appropriate measures to avoid the static electricity from
human body and earthing of production equipment. Especially, InGaN type LEDs have lower resistance
value of electrostatic discharge and it is recommended to introduce the ESD protection circuit.
The resistance values of electrostatic discharge (actual values) vary with products, therefore,
please call our Sales staffs for inquiries.
３－３． Electromagnetic Wave
Applications with strong electromagnetic wave such as, IH cooker, will influence the reliability of LED,
therefore please evaluate before using it.
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©2020 ROHM Co., Ltd. All rights reserved
2020.4 - Rev.011
[SML-M13x/MN2x series]
[Data Sheet]
４．Mounting
４－１. Soldering
・No resin hardening agent such as filler is used in the sealing resin of the product. Therefore, resin
expansion and moisture absorption at humidity will cause heat stress during soldering process and
finally has bad influence on the product’s reliability.
・The product is not guaranteed for flow soldering.
・Do not expose the product in the environment of high temperature (over 100℃) or rapid temperature
shift (within 3℃/sec. of temperature gradient) during the flow soldering of surrounding parts.
In case of carrying out flow soldering of surrounding parts without recommended conditions, please
contact us for inquiries.
・Please set appropriate reflow temperature based on our product usage conditions and specification.
・The max for reflowing is 2 times, please finish the second reflow soldering and flow soldering
with other parts within the usage limitation after open the moistureproof package.
・Compare with N2 reflow, during air reflow, because of the heat and surrounding conditions,
it may cause the discoloration of the resin.
・For our product that has no solder resist, because of its solder amount and soldering conditions,
one of its specific characteristics is that solder will penetrate into LED. Thus, there's high possibility
that will influence its reliability.Therefore, please be informed, concerning it before using it.
４－２. Automatic Mounting
４-２-１. Suction nozzle
Excessive load may cause damage inside the LED product, so select an optimal suction nozzle
according to the material and shape of the LED product.
４-２-２. Mini Package (Smaller than 1608 size)
・Vibration may result in low mounting rate since it will cause the static electricity of product and
adhere to top cover tape. Therefore, the magnet should be set on parts feeder cassette of
the mounter to control the product stabilization. In addition, it is recommended to set ionizer
to prevent electrostatic charge.
４－３. Mounting Location
The stress like bending stress of circuit board dividing after mounting, may cause LED package crack
or damage of LED internal junction, therefore, please concern the mounting direction and position
to avoid bending or screwing with great stress of the circuit board.
Stress strength according to
he mounting position:
A＞B＞C＞D
1.1mm
４―４. Mechanical Stress after Mounting
The mechanical stress may damage the LED after Circuit Mounting,
so please pay attention to the touch on product.
４－５．Soldering Pattern for Recommendation
We recommend the soldering pattern that shows on the right.
It will be different according to mounting situation of circuit board,
therefore, please concern before designing.
※The product has adopted the electrode structure that it should solder
with back electrode of the product.
Thus, please be informed that the shape of electrode pin of
solder fillet formation is not guaranteed.
The through hole on electrode surface is for conduction of front
and rear electrodes but not for formation of solder fillet.
1.25mm
1.1mm
1.25mm
PCB Bonding Direction
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©2020 ROHM Co., Ltd. All rights reserved
2020.4 - Rev.011
[SML-M13x/MN2x series]
[Data Sheet]
４－６．Reflow Profile
For reflow profile, please refer to the conditions below:(※)
■Meaning of marks, Conditions
Mark
Tsmax
Tsmin
ts
TL
tL
TP
tP
ΔTR/Δt
ΔTD/Δt
Meanings
Maximum of pre-heating temperature
Minimum of pre-heating temperature
Time from Tsmin to Tsmax
Reference temperature
Retention time for TL
Peak temperature
Time for peak temperature
Temperature rising rate
Temperature decreasing rate
Conditions
180℃
140℃
Over 60sec.
230〜250℃
Within 40sec.
250℃(Max)
Within 10sec.
Under 3℃/sec.
Over -3℃/sec.
※Above conditions are for reference. Therefore, evaluate by customer’s own circuit boards and
reflow furnaces before using, because stress from circuit boards and temperature variations of reflow
furnaces vary by customer’s own conditions.
４－７．Attention Points in Soldering Operation
This product was developed as a surface mount LED especially suitable for reflow soldering.
So reflow soldering is recommended. In case of implementing manual soldering,
please take care of following points.
①SOLDER USED
Sn-Cu，Sn-Ag-Cu，Sn-Ag-Bi-Cu
②HAND SOLDERING CONDITION
LED products do not contain reinforcement material such as a glass fillers.
So thermal stress by soldering greatly influence its reliability.
Please keep following points for manual soldering.
ITEM
a)
b)
RECOMMENDED CONDITION
Condition ) Temp. of iron top less than
325℃ within 3 sec.
Heating method
Heating on PCB pattern, not direct to the
LED. (Fig-1)
Handling after Please handle after the part temp.
soldering goes down to room temp.
Fig-1
SOLDERING IRON
SOLDERING LAND
４－８．Cleaning after Soldering
Please follow the conditions below if the cleaning is necessary after soldering.
Solvent
We recommend to use alcohols solvent such as, isopropyl alcohols
Temperature
Under 30℃ within 3 minutes
Ultrasonic Cleaning
15W／Below 1 liter (capacity of tank)
Drying
Under 100℃ within 3 minutes
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©2020 ROHM Co., Ltd. All rights reserved
2020.4 - Rev.011
Notice
Notes
1) The information contained herein is subject to change without notice.
2) Before you use our Products, please contact our sales representative and verify the latest specifications :
3) Although ROHM is continuously working to improve product reliability and quality, semiconductors can break down and malfunction due to various factors.
Therefore, in order to prevent personal injury or fire arising from failure, please take safety
measures such as complying with the derating characteristics, implementing redundant and
fire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no
responsibility for any damages arising out of the use of our Poducts beyond the rating specified by
ROHM.
4) Examples of application circuits, circuit constants and any other information contained herein are
provided only to illustrate the standard usage and operations of the Products. The peripheral
conditions must be taken into account when designing circuits for mass production.
5) The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly,
any license to use or exercise intellectual property or other rights held by ROHM or any other
parties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use of
such technical information.
6) The Products are intended for use in general electronic equipment (i.e. AV/OA devices, communication, consumer systems, gaming/entertainment sets) as well as the applications indicated in
this document.
7) The Products specified in this document are not designed to be radiation tolerant.
8) For use of our Products in applications requiring a high degree of reliability (as exemplified
below), please contact and consult with a ROHM representative : transportation equipment (i.e.
cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety
equipment, medical systems, servers, solar cells, and power transmission systems.
9) Do not use our Products in applications requiring extremely high reliability, such as aerospace
equipment, nuclear power control systems, and submarine repeaters.
10) ROHM shall have no responsibility for any damages or injury arising from non-compliance with
the recommended usage conditions and specifications contained herein.
11) ROHM has used reasonable care to ensur the accuracy of the information contained in this
document. However, ROHM does not warrants that such information is error-free, and ROHM
shall have no responsibility for any damages arising from any inaccuracy or misprint of such
information.
12) Please use the Products in accordance with any applicable environmental laws and regulations,
such as the RoHS Directive. For more details, including RoHS compatibility, please contact a
ROHM sales office. ROHM shall have no responsibility for any damages or losses resulting
non-compliance with any applicable laws or regulations.
13) When providing our Products and technologies contained in this document to other countries,
you must abide by the procedures and provisions stipulated in all applicable export laws and
regulations, including without limitation the US Export Administration Regulations and the Foreign
Exchange and Foreign Trade Act.
14) This document, in part or in whole, may not be reprinted or reproduced without prior consent of
ROHM.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
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