SML-S15R2TT86
Data Sheet
1. CONSTRUCTION
Infrared Surface Mount Chip LEDs with lens featuring AlGaAs packed
with transparent colorless resin.
2. USAGE *1
Light source for sensor application
3. DIMENSIONS
See Figure.1
4. ABSOLUTE MAXIMUM RATINGS *2
Power Dissipation
PD (Ta=25℃)
・・・・・・・・
Forward Current
IF (Ta=25℃)
・・・・・・・・
IFP (Ta=25℃)
Peak Forward Current
・・・・・・・・
Reverse Voltage
VR (Ta=25℃)
・・・・・・・・
Operation Temperature Topr
・・・・・・・・
Storage Temperature
Tstg
・・・・・・・・
1)
Duty 1/10, 1kHz
100mW
50mA
1)
300mA
5V
-40~+85℃
-40~+100℃
5. ELECTRO-OPTICAL CHARACTERISTICS (Ta=25℃)
DISCRIPTION
SYMBOL
CONDITION
MIN.
TYP.
MAX.
UNITS
1.0
1.4
2.0
V
-
-
10
μA
2)
Forward Voltage
VF
IF=20mA
Reverse Current
IR
VR=5V
IF=20mA
3)
5.6
12
22
mW/sr
IF=20mA
3)
840
870
910
nm
IF=20mA
3)
-
45
-
nm
Radiant Intensity
4)
IE
Peak Wavelength
5)
λP
Δλ
Spectral Line Half Width
2)
3)
Lighting time : 1msec Lighting time : 10msec
Since there may be some variation on measurement result due to measurement machinery difference,
it is advisable to check the correlational measurement and the actual operation.
5)
Tolerance : ±2nm
4)
6. CLASSIFICATION *3
SYMBOL
"L"
"M"
"N"
Tolerance:±10%
(Ta=25℃, IF=20mA)
Radiant Intensity : IE (mW/sr)
5.6
9.0
14
~
~
~
9.0
14
22
7. PRODUCT WEIGHT Product weight per piece, approx 0.008 grm.
8. MSL
Level 3
*1 : This product cannot be used for Automotive & Industrial (base station, smart meters, signal, etc. and social infrastructure) usage.
If you are not sure about the usage, please contact ROHM.
*2 : Absolute maximum rating is the limit w hich must not be exceeded even for an instant, once exceeded, LED device destruction might occur.
This is not the value that guarantees intensity of light life and other reliabilities.
*3
Please refer to the derating data & conducting test data, and make sure to keep the value w ithin absolute maximum rating w hile using.
*3 : If rank shift occur, w e may ask for re-approval of new rank w hen necessary.
*4 : Even w ithin derating, the reliability and luminosity life may be affected by deterioration of sealing resin and reflector, etc.
So please check w ith your application again.
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[SML-S15R2TT86]
[Data Sheet]
【 Figure 1】
(Unit : mm)
( ):Reference
(Note) Tolerance is within ±0.1mm unless otherwise specified.
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2023.3 - Rev.001
[SML-S15R2TT86]
[Data Sheet]
【 Taping : T86】
(Unit : mm)
( ):Reference
(Note) Tolerance is within ±0.2mm unless otherwise specified.
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2023.3 - Rev.001
[SML-S15R2TT86]
[Data Sheet]
【 STRUCTURE・ MATERIAL】
No.
①
APPELLATION
MATERIAL
Printed Wiring Board Glass epoxy
②
Die Bond
Ag paste
③
LED Chip
AlGaAs
④
Bonding Wire
⑤
Resin
⑥
Electrode
Gold
Epoxy resin
Base plating:Cu,Ni
Top plating:Au
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2023.3 - Rev.001
[SML-S15R2TT86]
[Data Sheet]
【 PACKAGING REQUIREMENTS】
1. PACKING
(1) One reel is packed in aluminum bag.
The size of aluminum bag is 240(a)×250~280(b)mm.
(2) Aluminum bag is sealed by pressured for all directions.
(3) Insert the moisture indicator card to the aluminum bag.
(4) Print the “Electrical-Static Warning mark”label and
“MSL (Moisture Sensitivity Level : JEDEC compatible”label on the back side of aluminum bag.
【 Front side】
Label position (Refer next page)
b
a
【 Back side】
Electrical-Static Warning Mark
MSL (Moisture Sensitivity Level)
handling caution
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2023.3 - Rev.001
[SML-S15R2TT86]
[Data Sheet]
2. MARKING
The following information shall be described in the label on the aluminum bag.:
ROHM Type number, Packing quantity, Radiant intensity rank, and Lot number etc.
【FORMER LABEL SPECIFICATION】
Special Marking
Type No.
Radiant intensity rank
F
FOR ROHM ONLY
Country of origin
Interoffice administration code
MSL Information, Customers part No. etc.
“F” means Pb-free, Quantity, Then Lot No. Displayed.
Note) Indicates bar code expressed by code 39.
Indicates Pb-free Products.
【EXAMPLE OF LOT NO. MARKING】
20 03 00012 W
Production facility symbol
(Reference the manufactory list)
Serial number of lot
Production week
Production year
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2023.3 - Rev.001
[SML-S15R2TT86]
[Data Sheet]
● Precaution (Surface Mount Device)
1.Storage
If the product is heated during the reflow under the condition of hygroscopic state, it may vaporize and expand
which will influence the performance of the product. Therefore, the package is waterproof. Please use the product
following the conditions:
・Using Conditions
Classification
Temperature
Humidity
Expiration Date
①Before using
5~30℃
30~70%RH
Within 1 year from
Receiving
②After opening
package
5~30℃
Below 70%RH
Within 168h
Remark
Storage with waterproof package
Please storing in the airtight
container with our desiccant (silica
gel)
・Baking
Bake the product in case of below:
①The expiration date is passed.
②The color of 5% and 10% on humidity indicator card is not green.
(Even if the product is before expiration date.)
・Baking Conditions
Remark
Temperature
Time
Humidity
60±3℃
12~24h
Below 20%RH
・Bake products in reel.
・Reel and embossed tape are easy to be deformed when baking, so please try not to apply stress on it.
・Recommend bake once.
2.Application Methods
2-1.Color of sealing resin
This product may differ in the color of the resin due to the influence of the material contained in the sealing resin.
There are no problems with the use.
2-2. Precaution for Drive System and Off Mode
Design the circuit without the electric load exceeding the ABSOLUTE MAXIMUM RATING that applies on the
products. If drive by constant voltage, it may cause current deviation of the LED and result in deviation of luminous
intensity, so we recommend to drive by constant current. (Deviation of VF value will cause deviation of current in
LED.) Furthermore, for off mode, please do not apply voltage neither forward nor reverse. Especially, for the
products with the Ag-paste used in the die bonding, there’s high possibility to cause electro migration and result
in function failure.
2-3. About derating
It is considered that derating characteristics will not result in LED chip’s electrical destruction. Even within the
derating, the reliability and luminous life can be affected depending on operating conditions and ambient
environment. So we would be appreciate it if you can confirm with your application again.
2-4. About product life
Depending on operating conditions and environment(applied current, ambient temperature and humidity, corrosive
gas), decreasing of luminosity and change of chromaticity may occur even within the specification conditions.
Please contact our sales office if you use it for the following applications.
① It requires long luminosity life
② It is always lit
2-5.Applied Stress on Product
No resin hardening agent such as filler is used in the sealing resin of the product. Therefore, please pay attention
to the overstress on it which may influence its reliability.
2-6.Usage
The product is LED. We are not responsible for the usage as the diode such as protection chip, rectifier,
switching and so on.
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2023.3 - Rev.001
[SML-S15R2TT86]
[Data Sheet]
3. Others
3-1. Surrounding Gas
Notice that if it is stored under the condition of acid gas (chlorine gas, sulfured gas) or alkali gas (ammonia), it
may result in low soldering ability (caused by the change in quality of the plating surface ) or optical
characteristics changes (light intensity, chrominance) and change in quality of die bonding (Ag-paste) materials.
All of the above will cause function failure of the products.
Therefore, please pay attention to the storage environment for mounted product (concern the generated gas of the
surrounding parts of the products and the atmospheric environment).
3-2. Electrostatic Damage
The product is part of semiconductor and electrostatic sensitive, there’s high possibility to be damaged by the
electrostatic discharge. Please take appropriate measures to avoid the static electricity from human body and
earthing of production equipment.Especially, InGaN type LEDs have lower resistance value of electrostatic
discharge and it is recommended to introduce the ESD protection circuit.The resistance values of electrostatic
discharge (actual values) vary with products, therefore, please call our Sales staffs for inquiries.
3-3. Electromagnetic Wave
Applications with strong electromagnetic wave such as, IH cooker, will influence the reliability of LED,
therefore please evaluate before using it.
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[SML-S15R2TT86]
[Data Sheet]
4.Mounting
4-1. Soldering
・No resin hardening agent such as filler is used in the sealing resin of the product. Therefore, resin expansion
and moisture absorption at humidity will cause heat stress during soldering process and finally has bad influence
on the product’s reliability.
・The product is not guaranteed for flow soldering.
・Do not expose the product in the environment of high temperature (over 100℃) or rapid temperature shift
(within 3℃/sec. of temperature gradient) during the flow soldering of surrounding parts.
In case of carrying out flow soldering of surrounding parts without recommended conditions, please contact us for
inquiries.
・Please set appropriate reflow temperature based on our product usage conditions and specification.
・The max for reflowing is 2 times, please finish the second reflow soldering and flow soldering with other parts
within the usage limitation after open the moistureproof package.
・Compare with N2 reflow, during air reflow, because of the heat and surrounding conditions, it may cause the
discoloration of the resin.
・For our product that has no solder resist, because of its solder amount and soldering conditions, one of its
specific characteristics is that solder will penetrate into LED. Thus, there's high possibility that will influence its
reliability. Therefore, please be informed, concerning it before using it.
4-2. Automatic Mounting
4-2-1.Suction nozzle
Excessive load may cause damage inside the LED product, so select an optimal suction nozzle according to the
material and shape of the LED product.
4-2-2.Mini Package (Smaller than 1608 size)
Vibration may result in low mounting rate since it will cause the static electricity of product and adhere to top cover
tape. We recommend to
・set magnet on parts feeder cassette of the mounter to control the product stabilization
・set ionizer to prevent electrostatic charge
4-3. Mounting Location
The stress like bending stress of circuit board dividing after mounting, may cause LED package crack or damage
of LED internal junction, therefore, please concern the mounting direction and position to avoid bending or
screwing with great stress of the circuit board.
Stress strength according to
the mounting position:
A>B>C>D
4-4. Mechanical Stress after Mounting
The mechanical stress may damage the LED after circuit mounting, so please pay attention to the touch on product.
4-5. Soldering Pattern for Recommendation
We recommend the soldering pattern that shows on the right.
It will be different according to mounting situation of circuit board,
therefore, please concern before designing.
※The product has adopted the electrode structure that it should solder
with back electrode of the product.
Thus, please be informed that the shape of electrode pin of
solder fillet formation is not guaranteed.
The through hole on electrode surface is for conduction of front
and rear electrodes but not for formation of solder fillet.
(Unit:mm)
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2023.3 - Rev.001
[SML-S15R2TT86]
[Data Sheet]
4-6. Reflow Profile
For reflow profile, please refer to the conditions below:(※)
・Meaning of marks, Conditions
Mark
Meanings
Conditions
Ts max
Maximum of pre-heating temperature
180℃
Ts min
Ts
Minimum of pre-heating temperature
140℃
Time from Ts min to Ts max
Over 60 sec.
TL
Reference temperature
230~260℃
Within 40 sec.
tL
Retention time for TL
TP
Peak temperature
260℃(MAX.)
tP
Time for peak temperature
Within 10 sec.
ΔTR /Δt
Temperature rising rate
Under 3℃/sec.
Temperature decreasing rate
Within -3℃/sec.
ΔTD /Δt
※Above conditions are for reference. Therefore, evaluate by customer’s own circuit boards and reflow furnaces before
using, because stress from circuit boards and temperature variations of reflow furnaces vary by customer’s own
conditions.
4-7. Attention Points in Soldering Operation
This product was developed as a surface mount LED especially suitable for reflow soldering.
So reflow soldering is recommended. Incase of implementing manual soldering,
please take care of following points.
① SOLDER USED
Sn-Cu, Sn-Ag-Cu, Sn-Ag-Bi-Cu
②HAND SOLDERING CONDITION
LED products do not contain reinforcement material such as a glass fillers.
So thermal stress by soldering greatly influence its reliability.
Please keep following points for manual soldering.
ITEM
RECOMMENDED CONDITION
a)
Heating method
Condition ) Temp. of iron top less than
350 ℃ within 3 sec.
Heating on PCB pattern, not direct to the
LED. (Fig-1)
b)
Handling after
soldering
Please handle after the part temp.
Goes down to room temp.
Figure-1
4-8. Cleaning after Soldering
Please follow the conditions below if the cleaning is necessary after soldering.
Solvent
We recommend to use alcohols solvent such as, isopropyl alcohols
Temperature
Under 30℃ within 3 minutes
Ultrasonic Cleaning
Drying
15W/Below 1 liter (capacity of tank)
Under 100℃ within 3 minutes
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10/16
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2023.3 - Rev.001
[SML-S15R2TT86]
[Data Sheet]
【 MANUFACTORY】
FACTORY
SYMBOL
ROHM Wako Co.,Ltd.
W
100 Tomioka, Kasaoka, Okayama 714-8585 Japan
ROHM-Wako Electronics (Malaysia) Sdn. Bhd.
D
Lot 1320 Kawasan Perindustrian, Pengkalan ChepaII, Padang Tembak
16100 Kota Bharu, Kelantan, Malaysia
ROHM Semiconductor (China) Co.,Ltd.
N
No.7, Weisan Rd, Micro-electronics Ind, Jingang Highway
Xiqing Dist, Tianjin 300385
HARVATEK CORPORATION(Taiwan OEM)
1
No.18, Lane522, Sec.5, JhonghuaRd, Hsinchu City 300,
Taiwan 30094
* This sheet is mentioned all factory locations of LED products.
Please contact us if you need detail information about each package.
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[SML-S15R2TT86]
[Data Sheet]
RELATIVE RADIANT INTENSITY - ATMOSPHERE TEMPERATURE
RATIO OF MAXIMUM TOLERABLE PEAK CURRENT - PULSE DURATION
Reference
※This data is actual value from specific lot and is not guaranteed.
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2023.3 - Rev.001
[SML-S15R2TT86]
[Data Sheet]
RELATIVE RADIANT INTENSITY - FORWARD CURRENT
FORWARD CURRENT - FORWARD VOLTAGE
Reference
※This data is actual value from specific lot and is not guaranteed.
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2023.3 - Rev.001
[SML-S15R2TT86]
[Data Sheet]
DERATING ※ 1、 ※ 2
THERMAL RESISTANCE(JUNCTION/SOLDER POINT) ※ 1
Rθj-s ・・・ 260℃/W
THERMAL RESISTANCE(JUNCTION/AMBIENT) ※ 1
Rθj-a ・・・ 380℃/W
JUNCTION TEMPERATURE
TjMax ・・・ 100℃
※1:【Evaluation board】
Glass epoxy(FR4):30x10mm,t=1.6mm
Pad Size(Cu):4.0x4.0mm(Cathode),t=0.07mm
※2:Even w ithin derating, the reliability and luminosity life may be affected by deterioration of sealing
resin and reflector, etc. So please check w ith your application again.
Reference
※This data is actual value from specific lot and is not guaranteed.
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[SML-S15R2TT86]
[Data Sheet]
SPECTRUM
Reference
※This data is actual value from specific lot and is not guaranteed.
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[SML-S15R2TT86]
[Data Sheet]
RELATIVE LUMINOUS INTENSITY - VIEWING ANGLE
Reference
※This data is actual value from specific lot and is not guaranteed.
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2023.3 - Rev.001
Reliability Test Result
6
Product
Package
Series
RR-SML-1710
LED
SMD
SML-S15R2T
1.Test Result
n
(pcs)
Pn
(pcs)
22
0
22
0
22
0
22
0
22
0
22
0
JEITA ED-4701 Ta=85±2℃ 85±5%RH 240hrs
High Temperature
High Humidity Strage
B-121
22
0
Low Temperature
Strage
JESD22-A119A Ta=Tstg Min.±5℃
22
0
Load Life
JESD22-A108D Ta=25±5℃ IF=IFMax. 1000hrs
22
0
Reference
STD
Test Items
Test Condition
Solder Heat Resistance J-STD-020D-01 Prtreatment : Temperature Humidity Strage
for Reflow Soldering
Solderbility
(30℃/70%RH/168hr)
Reflow Peak Temp. : 260℃ 10sec Over 230℃/60sec
Preheat : 140 to 180℃ 60sec
Number of reflow : 2 times
JESD22-B102E Immerse into rosin flux for 5±1sec,and the device
for 3±0.5sec into Pb-free solder bath at 245±5℃
Drop test
*1
JEITA ED-4701 H=75cm Maple Boad : 3 times
A-124
Vibration
JEITA ED-4701 100~2000Hz 98.1m/s2
A-121
Thermal Cycle
2hours each on each direction of X,Y,Z
JESD22-A104E Ta=Tstg Min.℃(30min.) ~ Tstg Max.℃(30min.) 100cycle
High Temperature
Strage
JESD22-A103E Ta=Tstg Max.+5℃/-0℃ 1000hrs
1000hrs
2.Failure Criteria
*1
Items
Condition
Criteria
Radiant Intensity
IF=20mA
60% of the initial value
Forward Voltage
IF=20mA
Changing rate of ±10%
Reverse Current
VR=VR Max.
Maximum of specification
Appearance
Visual Check
No major change in appearance
Solderbility
More than 95% of the electrode must be covered with solder.
※This data is actual value from specific lot and is not guaranteed.
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2023.03-Rev.001
Notice
Notes
1) The information contained herein is subject to change without notice.
2) Before you use our Products, please contact our sales representative and verify the latest specifications.
3) Although ROHM is continuously working to improve product reliability and quality, semiconductors can break down and malfunction due to various factors.
Therefore, in order to prevent personal injury or fire arising from failure, please take safety
measures such as complying with the derating characteristics, implementing redundant and
fire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no
responsibility for any damages arising out of the use of our Poducts beyond the rating specified by
ROHM.
4) Examples of application circuits, circuit constants and any other information contained herein are
provided only to illustrate the standard usage and operations of the Products. The peripheral
conditions must be taken into account when designing circuits for mass production.
5) The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly,
any license to use or exercise intellectual property or other rights held by ROHM or any other
parties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use of
such technical information.
6) The Products are intended for use in general electronic equipment (i.e. AV/OA devices, communication, consumer systems, gaming/entertainment sets) as well as the applications indicated in
this document.
7) The Products specified in this document are not designed to be radiation tolerant.
8) For use of our Products in applications requiring a high degree of reliability (as exemplified
below), please contact and consult with a ROHM representative : transportation equipment (i.e.
cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety
equipment, medical systems, servers, solar cells, and power transmission systems.
9) Do not use our Products in applications requiring extremely high reliability, such as aerospace
equipment, nuclear power control systems, and submarine repeaters.
10) ROHM shall have no responsibility for any damages or injury arising from non-compliance with
the recommended usage conditions and specifications contained herein.
11) ROHM has used reasonable care to ensure the accuracy of the information contained in this
document. However, ROHM does not warrants that such information is error-free, and ROHM
shall have no responsibility for any damages arising from any inaccuracy or misprint of such
information.
12) Please use the Products in accordance with any applicable environmental laws and regulations,
such as the RoHS Directive. For more details, including RoHS compatibility, please contact a
ROHM sales office. ROHM shall have no responsibility for any damages or losses resulting
non-compliance with any applicable laws or regulations.
13) When providing our Products and technologies contained in this document to other countries,
you must abide by the procedures and provisions stipulated in all applicable export laws and
regulations, including without limitation the US Export Administration Regulations and the Foreign
Exchange and Foreign Trade Act.
14) This document, in part or in whole, may not be reprinted or reproduced without prior consent of
ROHM.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
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© 2015 ROHM Co., Ltd. All rights reserved.
R1107 A
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001