SMLD12HBC7W1

TYPE PRODUCTS Surface Mount Chip LED PAGE 1. CONSTRUCTION Pink surface mount LEDs with reflector packaged featuring InGaN on SiC and phosphor technology. 2. USAGE Source of light for display unit. 3. DIMENSIONS See Figure.1 4. ABSOLUTE MAXIMUM RATINGS ／ SMLD12HBC7W1 (Ta=25℃) P D ・・・・・・・・・・・・ 66mW I F ・・・・・・・・・・・・ 20mA I F P ・・・・・・・・・・・・ 100mA ( Notes 1 ) V R ・・・・・・・・・・・・ 5V Topr ・・・・・・・・・・・・ －40℃～＋ 85℃ Tstg ・・・・・・・・・・・・ －40℃～＋100℃ ( Notes1 Duty 1/10 1kHz ) Power Dissipation Forward Current Peak Forward Current R e v e r s e Vo l t a g e Operating Temperature Storage Temperature 5. ELECTRO－CHARACTERISTICS ( Ta=25℃) DISCRIPTION SYMBOL CONDITION MIN. TYP. MAX. UNITS Forward Voltage VF IF=5mA *1 － 2.9 3.3 V Reverse Current IR VR=5V － － 10 μA Luminous Intensity IV IF=5mA *1 9.0 22 56 mcd x IF=5mA *1 － 0.47 － － y IF=5mA *1 － 0.25 － － Chromaticity Coordinates *1 Pulse width :30msec. 6. LUMINOUS CLASSIFICATION SYMBOL (Ta=25℃, IF=5mA) LUMINOUS CLASSIFICATION RANGE “M” ９．０ ～ １４ mcd “N” １４ ～ ２２ mcd “P” ２２ ～ ３６ mcd “Q” ３６ ～ ５６ mcd If rank shift occur, we may ask for re-approval of new rank when necessary. Measurement tolerance : ±10% REV.： TSZ22111･05･002 － SPECIFICATION No.： TENTATIVE(20091125) TYPE PRODUCTS Surface Mount Chip LED 7. PAGE SMLD12HBC7W1 CHROMATICITY DIAGRAM 0.32 0.30 0.28 CIE y C 0.26 B 0.24 A 0.22 0.20 0.18 0.40 0.42 0.44 0.46 0.48 0.50 0.52 0.54 CIE x 8. CHROMATICITY COORDIMATES A (Ta=25℃, IF=5mA) B C x y x y x y 0.430 0.242 0.460 0.262 0.490 0.282 0.430 0.195 0.460 0.215 0.490 0.235 0.460 0.215 0.490 0.235 0.520 0.255 0.460 0.262 0.490 0.282 0.520 0.302 Measurement tolerance : ±0.02 9. PRODUCT WEIGHT Product weight per piece, approx 0.0013grm. REV.： TSZ22111･05･002 － SPECIFICATION No.： TENTATIVE(20091125) ／ PRODUCTS Surface Mount Chip LED TYPE PAGE ／ SMLD12HBC7W1 【Figure 1】 1.6 0.5 0.8 1.2 R0.15 0.18 0.55 R0.275 1.5 0.65 0.8 Electrode Cathode index Cathode Anode （Unit：mm） (Note) Tolerance is within ± 0.1mm unless otherwise specified. REV.： TSZ22111･05･002 － SPECIFICATION No.： TENTATIVE(20091125) PRODUCTS Surface Mount Chip LED TYPE PAGE ／ SMLD12HBC7W1 1 ±0.1 8.0 3.5 ±0.05 1.75 ＋0.1 0 5.5 φ1.5 1.9 2 ±0.1 ±0.05 0～0.5 4 ±0.1 【Taping : 1】 0.73 +0.1 -0.08 +1 0 0 -3 φ180 φ13 φ60 11.4 ±1 Packing quantity 3000pcs/reel Pull direction （Unit：mm) (note) Tolerance is within ±0.2mm unless otherwise specified REV.： TSZ22111･05･002 － SPECIFICATION No.： TENTATIVE(20091125) TYPE PRODUCTS Surface Mount Chip LED PAGE SMLD12HBC7W1 【STRUCTURE・MATERIAL】 ③ ④ ② ⑤ ① ⑥ No. APPELLATION 1 Printed Wiring Board BT Resin, Glass Fabric 2 Die Bond Ag Paste 3 Chip AlGaInP on GaAs 4 Bonding Wire Gold 5 Resin Epoxy Resin 6 Electrode Bass plating : Cu , Nickel Top plating : Au REV.： TSZ22111･05･002 MATERIAL － SPECIFICATION No.： TENTATIVE(20091125) ／ TYPE PRODUCTS Surface Mount Chip LED PAGE SMLD12HBC7W1 ／ 【PACKAGING REQUIREMENTS】 1. PACKING (1) 3,000pcs are taped in one reel. (2) One reel is packed in aluminum bag. The size of aluminum bag is 240(a)×250(b)mm. The size up to zipper is 230(c)mm. (3) Aluminum bag is sealed by pressure for all directions. ｃ ｂ ａ 2. MARKING The following information shall be described in the label on the aluminum bag.: ROHM Type number, Packing quantity, Luminous intensity rank, and Lot number etc. 【FORMER LABEL SPECIFICATION】 Chromaticity Coordinates Rank Type No. Luminous Intensity Rank ＳＭＬＤ１２ＨＢＣ７Ｗ１　　　Ａ　Ｐ 　 Ｆ 　 　 ３ ,０ ０ ０ ｐ ｃ ｓ 　 ０ ９ ０ ３ 　 ０ ０ ０ １ ２ Ｗ FOR ROHM ONLY Country of origin Interoffice administration code Customers part No. etc. “F” means Pb-free, Quantity, Then Lot No. Displayed. Note) Indicates bar code expressed by code 39. indicates Pb-free Products. 【EXAMPLE OF LOT NO. MARKING】 ０９ ０３ ０００１２ Ｗ Production facility sign (Reference the manufactory list) Serial number of lot Production week Production year REV.： TSZ22111･05･002 － SPECIFICATION No.： TENTATIVE(20091125) PRODUCTS Surface Mount Chip LED TYPE PAGE ／ SMLD12HBC7W1 【ATTENTION POINTS IN HANDLING】 This product was developed as a surface mount LED especially suitable for reflow soldering. 0.8mm Please take care of following points when using this device. 1. DESIGNING OF PCB As for a recommendable solder pattern, Please refer to Fig-1. The size and direction of the pad pattern depend on the condition of the PCB, so, please investigate about the adjustment thoroughly before designing. (This product is structured with rear electrode to be soldered; i.e., the electrode shape is not subject to the formation of solder fillet.) 2. SOLDERING ( Sn-Cu, Sn-Ag-Cu, Sn-Ag-Bi-Cu ) LED products do not contain reinforcement materials such as glass fillers. Therefore, thermal stress by soldering greatly influences its reliability. The temperature conditions for reflow soldering should therefore be set up according to the characteristic of this product. (See Fig-2) Number of reflow process shall be max 2 times and these processes shall be performed in a row. Cooling process to normal temperature shall be required between the first and the second soldering process. (Fig-1) 0.8mm 0.85mm 0.8mm PCB Bonding Direction (Fig-2) 300 Max. 260℃,Within 10sec 250 200 140～180℃ 230～260℃ 150 100 50 Min.1 min Max. 40sec 0 (Fig-3) 3. HANDLING AFTER MOUNTING (Fig.-3) As shown in the drawing on the right, in case outside force of about 700g is given to the device, stress is concentrated to the jointed part between mold resin and substrate. Therefore there is a possibility to breath the device or PCB. Careful handing is needed as ROHM cannot guarantee the falling of the device by outside force after mounting. Emitting Direction Mold Outside Force Substrate Soldering part 4. WASHING Please note the following points when washing is required after soldering. 4-1) WASHING SOLVENT Isopropyl alcohol or other alcohol solvent is recommendable. 4-2) TEMPERATURE Below 30℃, immersion time ; within 3 minutes. 4-3) ULTRA SONIC WASHING Below 15W/1 litter of solvent tub or less. 4-4) COOLING Below 100℃ within 3 minutes. PCB 5. STORAGE At reflow soldering, the reliability of this product is often influenced by moisture absorption; so that we apply the package with moisture proof for better condition for use. Please also note that, 5-1) Package : Not to be opened before using. 5-2) After unpackaging : LEDs to be kept in our moisture proof package with some desiccant (SILICA GEL). LEDs to be baked in case the SILICA GEL indicator its color from either blue to clear or green to pink. 5-3) Please use LEDs within 168 hours after the package is opened. (Condition at 30℃, max.70%Rh.) In case they are not used within 168 hours, please put them back into the package. 5-4) BAKING (=Moisture Removal) Please conduct baking under “reel condition” at 60℃, 12～24 hours (max.20%Rh) after unpackaging. Please be careful not to give any stress to the reel & the embossed tape while baking, as they are susceptible to be deformed during the baking. REV.： TSZ22111･05･002 － SPECIFICATION No.： TENTATIVE(20091125)