TYPE
PRODUCTS
Surface Mount
Chip LED
PAGE
1.
CONSTRUCTION
Pink surface mount LEDs with reflector packaged
featuring InGaN on SiC and phosphor technology.
2.
USAGE
Source of light for display unit.
3.
DIMENSIONS
See Figure.1
4. ABSOLUTE MAXIMUM RATINGS
/
SMLD12HBC7W1
(Ta=25℃)
P D ・・・・・・・・・・・・
66mW
I F ・・・・・・・・・・・・
20mA
I F P ・・・・・・・・・・・・
100mA ( Notes 1 )
V R ・・・・・・・・・・・・
5V
Topr ・・・・・・・・・・・・ -40℃~+ 85℃
Tstg ・・・・・・・・・・・・ -40℃~+100℃
( Notes1 Duty 1/10 1kHz )
Power Dissipation
Forward Current
Peak Forward Current
R e v e r s e Vo l t a g e
Operating Temperature
Storage Temperature
5. ELECTRO-CHARACTERISTICS
( Ta=25℃)
DISCRIPTION
SYMBOL
CONDITION
MIN.
TYP.
MAX.
UNITS
Forward Voltage
VF
IF=5mA *1
-
2.9
3.3
V
Reverse Current
IR
VR=5V
-
-
10
μA
Luminous Intensity
IV
IF=5mA *1
9.0
22
56
mcd
x
IF=5mA *1
-
0.47
-
-
y
IF=5mA *1
-
0.25
-
-
Chromaticity
Coordinates
*1 Pulse width :30msec.
6. LUMINOUS CLASSIFICATION
SYMBOL
(Ta=25℃, IF=5mA)
LUMINOUS CLASSIFICATION RANGE
“M”
9.0
~
14
mcd
“N”
14
~
22
mcd
“P”
22
~
36
mcd
“Q”
36
~
56
mcd
If rank shift occur, we may ask for
re-approval of new rank when necessary.
Measurement tolerance : ±10%
REV.:
TSZ22111・05・002
-
SPECIFICATION No.: TENTATIVE(20091125)
TYPE
PRODUCTS
Surface Mount
Chip LED
7.
PAGE
SMLD12HBC7W1
CHROMATICITY DIAGRAM
0.32
0.30
0.28
CIE y
C
0.26
B
0.24
A
0.22
0.20
0.18
0.40
0.42
0.44
0.46
0.48
0.50
0.52
0.54
CIE x
8. CHROMATICITY COORDIMATES
A
(Ta=25℃, IF=5mA)
B
C
x
y
x
y
x
y
0.430
0.242
0.460
0.262
0.490
0.282
0.430
0.195
0.460
0.215
0.490
0.235
0.460
0.215
0.490
0.235
0.520
0.255
0.460
0.262
0.490
0.282
0.520
0.302
Measurement tolerance : ±0.02
9.
PRODUCT WEIGHT
Product weight per piece, approx 0.0013grm.
REV.:
TSZ22111・05・002
-
SPECIFICATION No.: TENTATIVE(20091125)
/
PRODUCTS
Surface Mount
Chip LED
TYPE
PAGE
/
SMLD12HBC7W1
【Figure 1】
1.6
0.5
0.8
1.2
R0.15
0.18
0.55
R0.275
1.5
0.65
0.8
Electrode
Cathode index
Cathode
Anode
(Unit:mm)
(Note) Tolerance is within ± 0.1mm unless otherwise specified.
REV.:
TSZ22111・05・002
-
SPECIFICATION No.: TENTATIVE(20091125)
PRODUCTS
Surface Mount
Chip LED
TYPE
PAGE
/
SMLD12HBC7W1
1
±0.1
8.0
3.5 ±0.05
1.75
+0.1
0
5.5
φ1.5
1.9
2
±0.1
±0.05
0~0.5
4
±0.1
【Taping : 1】
0.73
+0.1
-0.08
+1
0
0
-3
φ180
φ13
φ60
11.4 ±1
Packing quantity
3000pcs/reel
Pull
direction
(Unit:mm)
(note)
Tolerance is within ±0.2mm
unless otherwise specified
REV.:
TSZ22111・05・002
-
SPECIFICATION No.: TENTATIVE(20091125)
TYPE
PRODUCTS
Surface Mount
Chip LED
PAGE
SMLD12HBC7W1
【STRUCTURE・MATERIAL】
③
④
②
⑤
①
⑥
No.
APPELLATION
1
Printed Wiring Board
BT Resin, Glass Fabric
2
Die Bond
Ag Paste
3
Chip
AlGaInP on GaAs
4
Bonding Wire
Gold
5
Resin
Epoxy Resin
6
Electrode
Bass plating : Cu , Nickel
Top plating : Au
REV.:
TSZ22111・05・002
MATERIAL
-
SPECIFICATION No.: TENTATIVE(20091125)
/
TYPE
PRODUCTS
Surface Mount
Chip LED
PAGE
SMLD12HBC7W1
/
【PACKAGING REQUIREMENTS】
1. PACKING
(1) 3,000pcs are taped in one reel.
(2) One reel is packed in aluminum bag.
The size of aluminum bag is 240(a)×250(b)mm.
The size up to zipper is 230(c)mm.
(3) Aluminum bag is sealed by pressure for all directions.
c
b
a
2. MARKING
The following information shall be described in the label on the aluminum bag.:
ROHM Type number, Packing quantity, Luminous intensity rank, and Lot number etc.
【FORMER LABEL SPECIFICATION】
Chromaticity
Coordinates Rank
Type No.
Luminous Intensity Rank
SMLD12HBC7W1 A P
F 3 ,0 0 0 p c s 0 9 0 3 0 0 0 1 2 W
FOR ROHM ONLY
Country of origin
Interoffice administration code
Customers part No. etc.
“F” means Pb-free, Quantity, Then Lot No. Displayed.
Note)
Indicates bar code expressed by code 39.
indicates Pb-free Products.
【EXAMPLE OF LOT NO. MARKING】
09
03
00012
W
Production facility sign
(Reference the manufactory list)
Serial number of lot
Production week
Production year
REV.:
TSZ22111・05・002
-
SPECIFICATION No.: TENTATIVE(20091125)
PRODUCTS
Surface Mount
Chip LED
TYPE
PAGE
/
SMLD12HBC7W1
【ATTENTION POINTS IN HANDLING】
This product was developed as a surface mount LED especially suitable for reflow soldering.
0.8mm
Please take care of following points when using this device.
1. DESIGNING OF PCB
As for a recommendable solder pattern, Please refer to Fig-1.
The size and direction of the pad pattern depend on the condition of the PCB,
so, please investigate about the adjustment thoroughly before designing.
(This product is structured with rear electrode to be soldered;
i.e., the electrode shape is not subject to the formation of solder fillet.)
2. SOLDERING ( Sn-Cu, Sn-Ag-Cu, Sn-Ag-Bi-Cu )
LED products do not contain reinforcement
materials such as glass fillers.
Therefore, thermal stress by soldering greatly
influences its reliability.
The temperature conditions for reflow soldering
should therefore be set up according to the
characteristic of this product. (See Fig-2)
Number of reflow process shall be max 2 times
and these processes shall be performed in a row.
Cooling process to normal temperature shall be required
between the first and the second soldering process.
(Fig-1)
0.8mm
0.85mm
0.8mm
PCB Bonding Direction
(Fig-2)
300
Max. 260℃,Within 10sec
250
200
140~180℃
230~260℃
150
100
50
Min.1 min
Max. 40sec
0
(Fig-3)
3. HANDLING AFTER MOUNTING (Fig.-3)
As shown in the drawing on the right, in case outside force of
about 700g is given to the device, stress is concentrated to the
jointed part between mold resin and substrate.
Therefore there is a possibility to breath the device or PCB.
Careful handing is needed as ROHM cannot guarantee
the falling of the device by outside force after mounting.
Emitting Direction
Mold
Outside Force
Substrate
Soldering part
4. WASHING
Please note the following points when washing is required after soldering.
4-1) WASHING SOLVENT
Isopropyl alcohol or other alcohol solvent is recommendable.
4-2) TEMPERATURE
Below 30℃, immersion time ; within 3 minutes.
4-3) ULTRA SONIC WASHING
Below 15W/1 litter of solvent tub or less.
4-4) COOLING
Below 100℃ within 3 minutes.
PCB
5. STORAGE
At reflow soldering, the reliability of this product is often influenced by moisture absorption;
so that we apply the package with moisture proof for better condition for use. Please also note that,
5-1) Package : Not to be opened before using.
5-2) After unpackaging : LEDs to be kept in our moisture proof package with some desiccant (SILICA GEL).
LEDs to be baked in case the SILICA GEL indicator its color from either blue to clear or green to pink.
5-3) Please use LEDs within 168 hours after the package is opened. (Condition at 30℃, max.70%Rh.)
In case they are not used within 168 hours, please put them back into the package.
5-4) BAKING (=Moisture Removal)
Please conduct baking under “reel condition” at 60℃, 12~24 hours (max.20%Rh) after unpackaging.
Please be careful not to give any stress to the reel & the embossed tape while baking, as they are susceptible
to be deformed during the baking.
REV.:
TSZ22111・05・002
-
SPECIFICATION No.: TENTATIVE(20091125)
很抱歉,暂时无法提供与“SMLD12HBC7W1”相匹配的价格&库存,您可以联系我们找货
免费人工找货