SP8K33HZG
60V Nch+Nch Power MOSFET
Datasheet
l Outline
VDSS
60V
RDS(on)(Max.)
48mΩ
ID
±5.0A
SOP8
PD
2.0W
l Features
1) Low on - resistance
2) Small Surface Mount Package (SOP8)
3) Pb-free lead plating ; RoHS compliant
4) Halogen Free
5) Sn100% plating
6) AEC-Q101 Qualified
l Inner circuit
l Packaging specifications
Embossed
Tape
Packing
l Application
Switching
Type
Reel size (mm)
330
Tape width (mm)
12
Quantity (pcs)
2500
Taping code
TB
Marking
SP8K33
l Absolute maximum ratings (Ta = 25°C ,unless otherwise specified)
Parameter
Symbol
VDSS
Value
Unit
60
V
ID
±5.0
A
Pulsed drain current
IDP*1
±20
A
Gate - Source voltage
VGSS
±20
V
PD*2
2.0
PD*3
1.4
Tj
150
℃
Tstg
-55 to +150
℃
Drain - Source voltage
Continuous drain current
Power dissipation (total)
Junction temperature
Operating junction and storage temperature range
W
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1/11
20190827 - Rev.001
SP8K33HZG
Datasheet
l Thermal resistance
Parameter
Symbol
Thermal resistance, junction - ambient (total)
Values
Min.
Typ.
Max.
RthJA*2
-
-
62.5
RthJA*3
-
-
89.2
l Electrical characteristics (T a = 25°C)
Parameter
Symbol
Drain - Source breakdown
voltage
Breakdown voltage
temperature coefficient
V(BR)DSS VGS = 0V, ID = 1mA
ΔTj
℃/W
Conditions
ΔV(BR)DSS
Unit
ID = 1mA
referenced to 25℃
Values
Unit
Min.
Typ.
Max.
60
-
-
V
-
63.7
-
mV/℃
Zero gate voltage
drain current
IDSS
VDS = 60V, VGS = 0V
-
-
1
μA
Gate - Source
leakage current
IGSS
VGS = ±20V, VDS = 0V
-
-
±10
μA
Gate threshold
voltage
VGS(th)
VDS = 10V, ID = 1mA
1.0
-
2.5
V
-
-2.8
-
mV/℃
VGS = 10V, ID = 5.0A
-
34
48
RDS(on)*4 VGS = 4.5V, ID = 5.0A
-
38
54
VGS = 4.0V, ID = 5.0A
-
40
56
Gate threshold voltage
temperature coefficient
ΔVGS(th) ID = 1mA
ΔTj
Static drain - source
on - state resistance
referenced to 25℃
mΩ
Gate resistance
RG
f = 1MHz, open drain
-
4.6
-
Ω
Forward Transfer
Admittance
|Yfs| *4
VDS = 10V, ID = 5.0A
5.0
-
-
S
*1 Pw ≤ 10μs, Duty cycle ≤ 1%
*2 Mounted on a ceramic board (30×30×0.8mm)
*3 Mounted on a Cu board (40×40×0.8mm)
*4 Pulsed
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© 2019 ROHM Co., Ltd. All rights reserved.
2/11
20190827 - Rev.001
SP8K33HZG
Datasheet
l Electrical characteristics (Ta = 25°C)
Values
Parameter
Symbol
Conditions
Unit
Min.
Typ.
Max.
Input capacitance
Ciss
VGS = 0V
-
620
-
Output capacitance
Coss
VDS = 10V
-
145
-
Reverse transfer capacitance
Crss
f = 1MHz
-
70
-
VDD ⋍ 30V,VGS = 10V
-
12
-
tr*4
ID = 2.5A
-
20
-
td(off)*4
RL = 12Ω
-
40
-
tf*4
RG = 10Ω
-
20
-
Turn - on delay time
Rise time
td(on)*4
pF
ns
Turn - off delay time
Fall time
l Gate charge characteristics (Ta = 25°C)
Values
Parameter
Symbol
Total gate charge
Qg*4
Gate - Source charge
Qgs*4
Gate - Drain charge
Qgd*4
Conditions
VDD ⋍ 30V, ID = 5.0A
VGS = 5V
Unit
Min.
Typ.
Max.
-
8.0
12.0
-
2.0
-
-
2.6
-
nC
l Body diode electrical characteristics (Source-Drain) (Ta = 25°C)
Values
Parameter
Continuous forward current
Symbol
IS
Pulse forward current
ISP*1
Forward voltage
VSD*4
Conditions
Ta = 25℃
VGS = 0V, IS = 5.0A
Unit
Min.
Typ.
Max.
-
-
1.0
-
-
20
-
-
1.2
A
V
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© 2019 ROHM Co., Ltd. All rights reserved.
3/11
20190827 - Rev.001
SP8K33HZG
Datasheet
l Electrical characteristic curves
Fig.1 Power Dissipation Derating Curve
Fig.2 Maximum Safe Operating Area
Fig.3 Normalized Transient Thermal
Resistance vs. Pulse Width
Fig.4 Single Pulse Maximum Power
dissipation
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4/11
20190827 - Rev.001
SP8K33HZG
Datasheet
l Electrical characteristic curves
Fig.5 Typical Output Characteristics(I)
Fig.6 Typical Output Characteristics(II)
Fig.7 Breakdown Voltage vs.
Junction Temperature
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5/11
20190827 - Rev.001
SP8K33HZG
Datasheet
l Electrical characteristic curves
Fig.8 Typical Transfer Characteristics
Fig.9 Gate Threshold Voltage vs.
Junction Temperature
Fig.10 Forward Transfer Admittance vs.
Drain Current
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6/11
20190827 - Rev.001
SP8K33HZG
Datasheet
l Electrical characteristic curves
Fig.11 Drain Current Derating Curve
Fig.12 Static Drain - Source On - State
Resistance vs. Gate Source Voltage
Fig.13 Static Drain - Source On - State
Resistance vs. Junction Temperature
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7/11
20190827 - Rev.001
SP8K33HZG
Datasheet
l Electrical characteristic curves
Fig.14 Static Drain - Source On - State
Resistance vs. Drain Current (I)
Fig.15 Static Drain - Source On - State
Resistance vs. Drain Current (II)
Fig.16 Static Drain - Source On - State
Resistance vs. Drain Current (IlI)
Fig.17 Static Drain - Source On - State
Resistance vs. Drain Current (IV)
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8/11
20190827 - Rev.001
SP8K33HZG
Datasheet
l Electrical characteristic curves
Fig.18 Typical Capacitance vs.
Drain - Source Voltage
Fig.19 Switching Characteristics
Fig.20 Dynamic Input Characteristics
Fig.21 Source Current vs.
Source Drain Voltage
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9/11
20190827 - Rev.001
SP8K33HZG
Datasheet
l Measurement circuits
Fig.1-1 Switching Time Measurement Circuit
Fig.1-2 Switching Waveforms
Fig.2-1 Gate Charge Measurement Circuit
Fig.2-2 Gate Charge Waveform
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10/11
20190827 - Rev.001
SP8K33HZG
Datasheet
l Dimensions
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© 2019 ROHM Co., Ltd. All rights reserved.
11/11
20190827 - Rev.001
Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
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[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
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2.
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3.
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The proper names of companies or products described in this document are trademarks or registered trademarks of
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Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001