TLR342F-GE2

Datasheet Operational Amplifiers Low Voltage Operation Ground Sense Operational Amplifier TLR341G TLR342xxx TLR344xxx Key Specifications General Description  Operating Supply Voltage (Single Supply): +1.8V to +5.5V  Supply Current: TLR341G 75uA (Typ) TLR342xxx 150uA (Typ) TLR344xxx 300uA (Typ)  Voltage Gain (RL=2kΩ): 105dB (Typ)  Temperature Range: -40°C to +85°C  Input Offset Voltage: 4mV (Max)  Input Bias Current: 1pA (Typ)  Gain Bandwidth: 2.3MHz (Typ)  Slew Rate: 1.2V/µs (Typ)  Turn-on Time from Shutdown: 1.2µs (Typ) TLR341G, TLR342xxx, and TLR344xxx series are single, dual, and quad CMOS operational amplifier with low supply voltage operation and full swing output. These are suitable for battery-operated equipment. The MOSFET input stage provides low input bias current. It can be used for sensor applications. TLR341G includes shutdown function. Features  Low Operating Supply Voltage  Output Full Swing / Input Ground Sense  High Large Signal Voltage Gain  Low Input Bias Current  Low Supply Current  Low Input Offset Voltage Packages SSOP6 SOP8 SOP-J8 TSSOP-B8 TSSOP-B8J SOP14 SOP-J14 TSSOP-B14J Applications  Consumer Electronics  Buffer  Sensor Amplifier  Mobile Equipment  Battery-Operated Equipment W(Typ) x D(Typ) x H(Max) 2.90mm x 2.80mm x 1.25mm 5.00mm x 6.20mm x 1.71mm 4.90mm x 6.00mm x 1.65mm 3.00mm x 6.40mm x 1.20mm 3.00mm x 4.90mm x 1.10mm 8.70mm x 6.20mm x 1.71mm 8.65mm x 6.00mm x 1.65mm 5.00mm x 6.40mm x 1.20mm Pin Configuration TLR341G 5 VDD +IN : SSOP6 1 VSS 2 4 OUT -IN Pin No. Pin Name 1 +IN 2 VSS 3 -IN 6 VDD + - 3 5 SHDN 4 OUT 4 OUT 5 —————— 6 SHDN VDD SSOP6 Pin —————— SHDN Input condition State VSS Shutdown VDD Active Note: Please refer to Electrical Characteristics regarding to Shutdown Voltage Range. ○Product structure：Silicon monolithic integrated circuit www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･14･001 ○This product has no designed protection against radioactive rays. 1/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Pin Configuration – continued TLR342F TLR342FJ TLR342FVT TLR342FVJ OUT1 -IN1 : SOP8 : SOP-J8 : TSSOP-B8 : TSSOP-B8J 1 2 8 6 CH2 + - -IN1 3 +IN1 4 VSS 5 +IN2 6 -IN2 7 OUT2 8 VDD Pin No. Pin Name 1 OUT1 2 -IN1 3 +IN1 4 VDD 5 +IN2 -IN2 14 OUT4 CH1 - + CH4 + - 13 -IN4 +IN1 3 12 +IN4 VDD 4 11 VSS +IN2 5 10 +IN3 -IN2 6 OUT1 2 : SOP14 : SOP-J14 : TSSOP-B14J OUT1 1 -IN1 2 1 VDD 5 +IN2 VSS 4 TLR344F TLR344FJ TLR344FVJ Pin Name 7 OUT2 CH1 - + + +IN1 3 Pin No. - + CH2 + CH3 OUT2 7 www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 9 8 -IN3 OUT3 2/51 6 -IN2 7 OUT2 8 OUT3 9 -IN3 10 +IN3 11 VSS 12 +IN4 13 -IN4 14 OUT4 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Absolute Maximum Ratings (TA=25°C) Parameter Symbol Supply Voltage TLR341G VDD-VSS SSOP6 Power Dissipation Rating PD TLR342xxx TLR344xxx +7 0.67 (Note 1,9) V - - SOP8 - 0.68 (Note 2,9) SOP-J8 - 0.67 (Note 3,9) - 0.62 (Note 4,9) - 0.58 (Note 5,9) - TSSOP-B8 - Unit - TSSOP-B8J - SOP14 - - 0.56 (Note 6,9) SOP-J14 - - 1.02 (Note 7,9) TSSOP-B14J - - 0.84 (Note 8,9) W Differential Input (Note 10) Voltage VID VDD - VSS V Input Common-mode Voltage Range VICM (VSS-0.3) to (VDD+0.3) V Input Current (Note 11) II ±10 mA Operating Voltage Vopr +1.8 to +5.5 V Operating Temperature Topr -40 to +85 °C Storage Temperature Tstg -55 to +150 °C Tjmax +150 °C Maximum Junction Temperature (Note 1) (Note 2) (Note 3) (Note 4) (Note 5) (Note 6) (Note 7) (Note 8) (Note 9) (Note 10) Power dissipation is reduced by 5.4mW/°C above TA=25C. Power dissipation is reduced by 5.5mW/°C above TA=25C. Power dissipation is reduced by 5.4mW/°C above TA=25C. Power dissipation is reduced by 5.0mW/°C above TA=25C. Power dissipation is reduced by 4.7mW/°C above TA=25C. Power dissipation is reduced by 4.5mW/°C above TA=25C. Power dissipation is reduced by 8.2mW/°C above TA=25C. Power dissipation is reduced by 6.8mW/°C above TA=25C. Mounted on a FR4 glass epoxy PCB (70mm×70mm×1.6mm). Differential Input Voltage is the voltage difference between the inverting and non-inverting inputs. The input pin voltage is set to more than VSS. (Note 11) An excessive input current will flow when input voltages of more than VDD+0.6V or less than VSS-0.6V are applied. The input current can be set to less than the rated current by adding a limiting resistor. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 3/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Electrical Characteristics —————— ○TLR341G (Unless otherwise specified VDD=+1.8V, VSS=0V, VSHDN=VDD) Limits Temperature Parameter Symbol Range Min Typ 25°C 0.3 (Note 12,13) Input Offset Voltage VIO Full Range (Note 12,13) Input Offset Voltage Drift Max 4 4.5 Unit Conditions mV - ΔVIO/ΔT Full Range - 1.9 - μV/°C - IB 25°C - 1 200 pA - IIO 25°C - 1 200 pA - IDD 25°C Full Range - 70 - 150 200 μA - Shutdown Current IDD_SD 25°C - 0.2 1000 nA VSHDN=0V Common-mode Rejection Ratio CMRR 25°C 65 90 - dB VICM=0V to 0.7V Power Supply Rejection Ratio PSRR 25°C 75 95 - dB VDD=1.8V to 5.0V VICM 25°C 0 - 0.8 V CMRR ≥ 60 dB Large Signal Voltage Gain Av 25°C Maximum Output Voltage(High) VOH 25°C Maximum Output Voltage(Low) VOL 25°C ISOURCE 25°C 6 8 - mA VOUT=0V, Short Current ISINK 25°C 10 13 - mA VOUT=1.8V, Short Current SR 25°C - 1.2 - V/μs RL=10kΩ, V+IN=0.7VP-P GBW 25°C - 2.2 - MHz CL=200pF, RL=100kΩ Unity Gain Frequency fT 25°C - 1.2 - MHz CL=200pF, RL=100kΩ Phase Margin θM 25°C - 55 - deg CL=20pF, RL=100kΩ Gain Margin GM 25°C - 7 - dB CL=20pF, RL=100kΩ Input Referred Noise Voltage VN 25°C - 33 - nV/ Hz THD+N 25°C - 0.012 - % tON 25°C - 1.8 - μs 1.5 - 1.8 V (Note 15) 0 - 0.5 V (Note 16) (Note 12) Input Bias Current Input Offset Current Supply Current (Note 12) (Note 13) Input Common-mode Voltage Range (Note 14) Output Source Current Output Sink Current (Note 14) Slew Rate Gain Bandwidth Total Harmonic Distortion + Noise Turn-on Time from Shutdown 70 110 65 100 VDD-0.05 VDD-0.03 VDD-0.02 VDD-0.01 0.022 0.014 VSHDN_H Shutdown Voltage Range 0.055 0.02 dB V V 25°C VSHDN_L —————— RL=10kΩ, VRL=0.9V RL=2kΩ, VRL=0.9V RL=2kΩ, VRL=0.9V RL=10kΩ, VRL=0.9V RL=2kΩ, VRL=0.9V RL=10kΩ, VRL=0.9V f=1kHz f=1kHz, RL=600Ω AV=0dB, DIN-AUDIO - (Note 12) Absolute value (Note 13) Full Range: TA=-40°C to +85°C (Note 14) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC. (Note 15) This voltage range means active condition. (Note 16) This voltage range means shutdown condition. www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 4/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Electrical Characteristics – continued —————— ○TLR341G (Unless otherwise specified VDD=+5V, VSS=0V, VSHDN=VDD) Limits Temperature Parameter Symbol Range Min Typ 25°C 0.3 (Note 17,18) Input Offset Voltage VIO Full Range (Note 17,18) Input Offset Voltage Drift Max 4 4.5 Unit Conditions mV - ΔVIO/ΔT Full Range - 1.9 - μV/°C - IB 25°C - 1 200 pA - IIO 25°C - 1 200 pA - IDD 25°C Full Range - 75 - 150 200 μA - Shutdown Current IDD_SD 25°C - 0.2 1000 nA VSHDN=0V Common-mode Rejection Ratio CMRR 25°C 75 90 - dB VICM=0V to 3.9V Power Supply Rejection Ratio PSRR 25°C 75 95 - dB VDD=1.8V to 5.0V VICM 25°C 0 - 4.0 V CMRR ≥70 dB (Note 17) Input Bias Current Input Offset Current Supply Current (Note 17) (Note 18) Input Common-mode Voltage Range 80 110 75 105 VDD-0.06 VDD-0.03 VDD-0.02 VDD-0.01 0.04 0.02 0.06 0.03 RL=10kΩ, VRL=2.5V RL=2kΩ, VRL=2.5V RL=2kΩ, VRL=2.5V RL=10kΩ, VRL=2.5V RL=2kΩ, VRL=2.5V RL=10kΩ, VRL=2.5V Large Signal Voltage Gain Av 25°C Maximum Output Voltage(High) VOH 25°C Maximum Output Voltage(Low) VOL 25°C ISOURCE 25°C 60 100 - mA VOUT=0V, Short Current ISINK 25°C 80 120 - mA VOUT=5V, Short Current SR 25°C - 1.2 - V/μs RL=10kΩ, V+IN=2VP-P GBW 25°C - 2.3 - MHz CL=200pF, RL=100kΩ Unity Gain Frequency fT 25°C - 1.3 - MHz CL=200pF, RL=100kΩ Phase Margin θM 25°C - 55 - deg CL=20pF, RL=100kΩ Gain Margin GM 25°C - 7 - dB CL=20pF, RL=100kΩ Input Referred Noise Voltage VN 25°C - 33 - nV/ Hz THD+N 25°C - 0.012 - % tON 25°C - 1.2 - μs 4.5 - 5.0 V (Note 20) 0 - 0.8 V (Note 21) (Note 19) Output Source Current Output Sink Current (Note 19) Slew Rate Gain Bandwidth Total Harmonic Distortion + Noise Turn-on Time from Shutdown VSHDN_H Shutdown Voltage Range dB —————— V V 25°C VSHDN_L f=1kHz V+IN=1VP-P, f=1kHz RL=600Ω, AV=0dB, DIN-AUDIO - (Note 17) Absolute value (Note 18) Full Range: TA=-40°C to +85°C (Note 19) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC. (Note 20) This voltage range means active condition. (Note 21) This voltage range means shutdown condition. www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 5/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Electrical Characteristics – continued ○TLR342xxx (Unless otherwise specified VDD=+1.8V, VSS=0V) 25°C Full Range Min - Limit Typ 0.3 - Max 4 4.5 ΔVIO/ΔT Full Range - 1.9 IB 25°C - IIO 25°C IDD Common-mode Rejection Ratio Power Supply Rejection Ratio Parameter Symbol Temperature Range VIO Unit Conditions mV - - μV/°C - 1 200 pA - - 1 200 pA - 25°C Full Range - 150 - 300 400 μA - CMRR 25°C 65 90 - dB VICM=0V to 0.7V PSRR 25°C 75 95 - dB VDD=1.8V to 5.0V VICM 25°C 0 - 0.8 V CMRR ≥ 60 dB Large Signal Voltage Gain Av 25°C Maximum Output Voltage(High) VOH 25°C Maximum Output Voltage(Low) VOL 25°C ISOURCE 25°C 6 8 - mA VOUT=0V, Short Current ISINK 25°C 10 13 - mA VOUT=1.8V, Short Current SR 25°C - 1.2 - V/μs RL=10kΩ, V+IN=0.7VP-P GBW 25°C - 2.2 - MHz CL=200pF, RL=100kΩ Unity Gain Frequency fT 25°C - 1.2 - MHz CL=200pF, RL=100kΩ Phase Margin θM 25°C - 55 - deg CL=20pF, RL=100kΩ Gain Margin GM 25°C - 7 - dB CL=20pF, RL=100kΩ Input Referred Noise Voltage VN 25°C - 33 - nV/ Hz THD+N 25°C - 0.012 - % f=1kHz, RL=600Ω AV=0dB, DIN-AUDIO CS 25°C - 110 - dB AV=40dB, VOUT=1Vrms Input Offset Voltage (Note 22,23) Input Offset Voltage Drift (Note22,23) (Note 22) Input Bias Current Input Offset Current Supply Current (Note 22) (Note 23) Input Common-mode Voltage Range (Note 24) Output Source Current Output Sink Current (Note 24) Slew Rate Gain Bandwidth Total Harmonic Distortion + Noise Channel Separation 70 110 65 100 VDD-0.05 VDD-0.03 VDD-0.02 VDD-0.01 0.022 0.014 0.055 0.02 dB V V RL=10kΩ, VRL=0.9V RL=2kΩ, VRL=0.9V RL=2kΩ, VRL=0.9V RL=10kΩ, VRL=0.9V RL=2kΩ, VRL=0.9V RL=10kΩ, VRL=0.9V f=1kHz (Note 22) Absolute value (Note 23) Full Range: TA=-40°C to +85°C (Note 24) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC. www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 6/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Electrical Characteristics – continued ○TLR342xxx (Unless otherwise specified VDD=+5V, VSS=0V) 25°C Full Range Min - Limit Typ 0.3 - Max 4 4.5 ΔVIO/ΔT Full Range - 1.9 IB 25°C - IIO 25°C IDD Common-mode Rejection Ratio Power Supply Rejection Ratio Parameter Symbol Temperature Range VIO Unit Conditions mV - - μV/°C - 1 200 pA - - 1 200 pA - 25°C Full Range - 150 - 300 400 μA - CMRR 25°C 75 90 - dB VICM=0V to 3.9V PSRR 25°C 75 95 - dB VDD=1.8V to 5.0V VICM 25°C 0 - 4.0 V CMRR ≥70 dB Large Signal Voltage Gain Av 25°C Maximum Output Voltage(High) VOH 25°C Maximum Output Voltage(Low) VOL 25°C ISOURCE 25°C 60 100 - mA VOUT=0V, Short Current ISINK 25°C 80 120 - mA VOUT=5V, Short Current SR 25°C - 1.2 - V/μs RL=10kΩ, V+IN=2VP-P GBW 25°C - 2.3 - MHz CL=200pF, RL=100kΩ Unity Gain Frequency fT 25°C - 1.3 - MHz CL=200pF, RL=100kΩ Phase Margin θM 25°C - 55 - deg CL=20pF, RL=100kΩ Gain Margin GM 25°C - 7 - dB CL=20pF, RL=100kΩ Input Referred Noise Voltage VN 25°C - 33 - nV/ Hz THD+N 25°C - 0.012 - % V+IN=1VP-P, f=1kHz RL=600Ω, AV=0dB, DIN-AUDIO CS 25°C - 110 - dB AV=40dB, VOUT=1Vrms Input Offset Voltage (Note 25,26) (Note 25,26) Input Offset Voltage Drift (Note 25) Input Bias Current Input Offset Current Supply Current (Note 25) (Note 26) Input Common-mode Voltage Range (Note 27) Output Source Current Output Sink Current (Note 27) Slew Rate Gain Bandwidth Total Harmonic Distortion + Noise Channel Separation 80 110 75 105 VDD-0.06 VDD-0.03 VDD-0.02 VDD-0.01 0.04 0.02 0.06 0.03 dB V V RL=10kΩ, VRL=2.5V RL=2kΩ, VRL=2.5V RL=2kΩ, VRL=2.5V RL=10kΩ, VRL=2.5V RL=2kΩ, VRL=2.5V RL=10kΩ, VRL=2.5V f=1kHz (Note 25) Absolute value (Note 26) Full Range: TA=-40°C to +85°C (Note 27) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC. www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 7/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Electrical Characteristics – continued ○TLR344xxx (Unless otherwise specified VDD=+1.8V, VSS=0V) Temperature Parameter Symbol Range Min 25°C (Note 28,29) Input Offset Voltage VIO Full Range (Note 28,29) Input Offset Voltage Drift (Note 28) Input Bias Current ΔVIO/ΔT Full Range Limit Typ 0.3 - Max 4 4.5 - 1.9 Unit Conditions mV - - μV/°C - IB 25°C - 1 200 pA - IIO 25°C - 1 200 pA - IDD 25°C Full Range - 280 - 600 800 μA - Common-mode Rejection Ratio CMRR 25°C 65 90 - dB VICM=0V to 0.7V Power Supply Rejection Ratio PSRR 25°C 75 95 - dB VDD=1.8V to 5.0V VICM 25°C 0 - 0.8 V CMRR ≥ 60 dB Large Signal Voltage Gain Av 25°C Maximum Output Voltage(High) VOH 25°C Maximum Output Voltage(Low) VOL 25°C ISOURCE 25°C 6 8 - mA VOUT=0V, Short Current ISINK 25°C 10 13 - mA VOUT=1.8V, Short Current SR 25°C - 1.2 - V/μs RL=10kΩ, V+IN=0.7VP-P GBW 25°C - 2.2 - MHz CL=200pF, RL=100kΩ Unity Gain Frequency fT 25°C - 1.2 - MHz CL=200pF, RL=100kΩ Phase Margin θM 25°C - 55 - deg CL=20pF, RL=100kΩ Gain Margin GM 25°C - 7 - dB CL=20pF, RL=100kΩ Input Referred Noise Voltage VN 25°C - 33 - nV/ Hz THD+N 25°C - 0.012 - % f=1kHz, RL=600Ω AV=0dB, DIN-AUDIO CS 25°C - 110 - dB AV=40dB, VOUT=1Vrms Input Offset Current Supply Current (Note 28) (Note 29) Input Common-mode Voltage Range (Note 30) Output Source Current Output Sink Current (Note 30) Slew Rate Gain Bandwidth Total Harmonic Distortion + Noise Channel Separation 70 110 65 100 VDD-0.05 VDD-0.03 VDD-0.02 VDD-0.01 0.022 0.014 0.055 0.02 dB V V RL=10kΩ, VRL=0.9V RL=2kΩ, VRL=0.9V RL=2kΩ, VRL=0.9V RL=10kΩ, VRL=0.9V RL=2kΩ, VRL=0.9V RL=10kΩ, VRL=0.9V f=1kHz (Note 28) Absolute value (Note 29) Full Range: TA=-40°C to +85°C (Note 30) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC. www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 8/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Electrical Characteristics – continued ○TLR344xxx (Unless otherwise specified VDD=+5V, VSS=0V) Temperature Parameter Symbol Range Min 25°C (Note 31,32) VIO Input Offset Voltage Full Range (Note 31,32) Input Offset Voltage Drift (Note 31) Input Bias Current ΔVIO/ΔT Full Range Limit Typ 0.3 - Max 4 4.5 - 1.9 Unit Conditions mV - - μV/°C - IB 25°C - 1 200 pA - IIO 25°C - 1 200 pA - IDD 25°C Full Range - 300 - 600 800 μA - Common-mode Rejection Ratio CMRR 25°C 75 90 - dB VICM=0V to 3.9V Power Supply Rejection Ratio PSRR 25°C 75 95 - dB VDD=1.8V to 5.0V VICM 25°C 0 - 4.0 V CMRR ≥70 dB Large Signal Voltage Gain Av 25°C Maximum Output Voltage(High) VOH 25°C Maximum Output Voltage(Low) VOL 25°C ISOURCE 25°C 60 100 - mA VOUT=0V, Short Current ISINK 25°C 80 120 - mA VOUT=5V, Short Current SR 25°C - 1.2 - V/μs RL=10kΩ, V+IN=2VP-P GBW 25°C - 2.3 - MHz CL=200pF, RL=100kΩ Unity Gain Frequency fT 25°C - 1.3 - MHz CL=200pF, RL=100kΩ Phase Margin θM 25°C - 55 - deg CL=20pF, RL=100kΩ Gain Margin GM 25°C - 7 - dB CL=20pF, RL=100kΩ Input Referred Noise Voltage VN 25°C - 33 - nV/ Hz THD+N 25°C - 0.012 - % V+IN=1VP-P, f=1kHz RL=600Ω, AV=0dB, DIN-AUDIO CS 25°C - 110 - dB AV=40dB, VOUT=1Vrms Input Offset Current Supply Current (Note 31) (Note 32) Input Common-mode Voltage Range (Note 33) Output Source Current Output Sink Current (Note 33) Slew Rate Gain Bandwidth Total Harmonic Distortion + Noise Channel Separation 80 110 75 105 VDD-0.06 VDD-0.03 VDD-0.02 VDD-0.01 0.04 0.02 0.06 0.03 dB V V RL=10kΩ, VRL=2.5V RL=2kΩ, VRL=2.5V RL=2kΩ, VRL=2.5V RL=10kΩ, VRL=2.5V RL=2kΩ, VRL=2.5V RL=10kΩ, VRL=2.5V f=1kHz (Note 31) Absolute value (Note 32) Full Range: TA=-40°C to +85°C (Note 33) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC. www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 9/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Description of Electrical Characteristics Described below are descriptions of the relevant electrical terms used in this datasheet. Items and symbols used are also shown. Note that item name and symbol and their meaning may differ from those on another manufacturer’s document or general document. 1. Absolute Maximum Ratings Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics. (1) Supply Voltage (VDD/VSS) Indicates the maximum voltage that can be applied between the VDD pin and VSS pin without deterioration or destruction of characteristics of internal circuit. (2) Differential Input Voltage (VID) Indicates the maximum voltage that can be applied between non-inverting and inverting pins without damaging the IC. (3) Input Common-mode Voltage Range (VICM) Indicates the maximum voltage that can be applied to the non-inverting and inverting pins without deterioration or destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics. (4) Power Dissipation (PD) Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25°C (normal temperature). As for package product, PD is determined by the temperature that can be permitted by the IC in the package (maximum junction temperature) and the thermal resistance of the package. 2. Electrical Characteristics (1) Input Offset Voltage (VIO) Indicates the voltage difference between non-inverting pin and inverting pins. It can be translated into the input voltage difference required for setting the output voltage at 0V. (2) Input Offset Voltage drift (VIO/T) Denotes the ratio of the input offset voltage fluctuation to the ambient temperature fluctuation. (3) Input Offset Current (IIO) Indicates the difference of input bias current between the non-inverting and inverting pins. (4) Input Bias Current (IB) Indicates the current that flows into or out of the input pin. It is defined by the average of input bias currents at the non-inverting and inverting pins. (5) Supply Current (IDD) Indicates the current that flows within the IC under specified no-load conditions. (6) Shutdown current (IDD_SD) Indicates the current when the circuit is shutdown. (7) Maximum Output Voltage(High) / Maximum Output Voltage(Low) (VOH/VOL) Indicates the voltage range of the output under specified load condition. It is typically divided into maximum output voltage high and low. Maximum output voltage high indicates the upper limit of output voltage. Maximum output voltage low indicates the lower limit. (8) Large Signal Voltage Gain (AV) Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting pin and inverting pin. It is normally the amplifying rate (gain) with reference to DC voltage. AV = (Output Voltage) / (Differential Input Voltage) (9) Input Common-mode Voltage Range (VICM) Indicates the input voltage range where IC normally operates. (10) Common-mode Rejection Ratio (CMRR) Indicates the ratio of fluctuation of input offset voltage when the input common-mode voltage is changed. It is normally the fluctuation of DC. CMRR = (Change of Input Common-mode voltage)/(Input offset fluctuation) (11) Power Supply Rejection Ratio (PSRR) Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. It is normally the fluctuation of DC. PSRR = (Change of power supply voltage)/(Input offset fluctuation) (12) Output Source Current/ Output Sink Current (ISOURCE / ISINK) The maximum current that can be output from the IC under specific output conditions. The output source current indicates the current flowing out from the IC, and the output sink current indicates the current flowing into the IC. (13) Slew Rate (SR) Indicates the ratio of the change in output voltage with time when a step input signal is applied. (14) Unity Gain Frequency (fT) Indicates a frequency where the voltage gain of operational amplifier is 1. (15) Gain Bandwidth (GBW) The product of the open-loop voltage gain and the frequency at which the voltage gain decreases 6dB/octave. www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 10/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Description of Electrical Characteristics - continued (16) Phase Margin (θM) Indicates the margin of phase from 180 degree phase lag at unity gain frequency. (17) Gain Margin (GM) Indicates the difference between 0dB and the gain where operational amplifier has 180 degree phase delay. (18) Input Referred Noise Voltage (VN) Indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in series with input pin. (19) Total Harmonic Distortion + Noise (THD+N) Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage of driven channel. (20) Channel Separation (CS) Indicates the fluctuation in the output voltage of the driven channel with reference to the change of output voltage of the channel which is not driven. (21)Turn On Time From Shutdown (tON) Indicates the time from applying the voltage to shutdown terminal until the IC is active. (22)Turn On Voltage / Turn Off Voltage (VSHDN_H/ VSHDN_L) The IC is active if the shutdown terminal is applied more than Turn On Voltage (VSHDN_H). The IC is shutdown if the shutdown terminal is applied less than Turn Off Voltage (VSHDN_L). www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 11/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Typical Performance Curves 1.0 100 0.8 90 0.6 0.4 0.2 80 -40°C 70 60 0.0 0 25 50 75 85 50 100 125 150 1 2 3 4 5 6 Supply Voltage [V] Ambient Temperature [°C] Figure 2. Supply Current vs Supply Voltage Figure 1. Power Dissipation vs Ambient Temperature (Derating Curve) 6 100 Maximum Output Voltage (High) [V] 5.0V 90 Supply Current [µA] 85°C 25°C TLR341G Supply Current [µA] Power Dissipation [W] ○TLR341G 80 1.8V 70 60 50 5 85°C 4 25°C 3 2 -40°C 1 0 -50 -25 0 25 50 75 100 Ambient Temperature [°C] 1 2 3 4 5 6 Supply Voltage [V] Figure 3. Supply Current vs Ambient Temperature Figure 4. Maximum Output Voltage High vs Supply Voltage (RL=2kΩ) (*)The data above is measurement value of typical sample, it is not guaranteed. www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 12/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Typical Performance Curves – continued ○TLR341G 30 Maximum Output Voltage (Low) [mV] Maximum Output Voltage (High) [V] 6 5 5V 4 3 2 1.8V 1 20 85°C 25°C 15 10 -40°C 5 0 0 -50 -25 0 25 50 75 1 100 2 3 4 5 Ambient Temperature [°C] Supply Voltage [V] Figure 5. Maximum Output Voltage High vs Ambient Temperature (RL=2kΩ) Figure 6. Maximum Output Voltage Low vs Supply Voltage (RL=2kΩ) 25 6 14 12 20 5V Output Source Current [mA] Maximum Output Voltage (Low) [mV] 25 15 10 1.8V 5 10 -40°C 8 25°C 6 85°C 4 2 0 -50 0 -25 0 25 50 75 100 0.0 0.5 1.0 1.5 2.0 Output Voltage [V] Ambient Temperature [°C] Figure 8. Output Source Current vs Output Voltage (VDD=1.8V) Figure 7. Maximum Output Voltage (Low) vs Ambient Temperature (RL=2kΩ) (*)The data above is measurement value of typical sample, it is not guaranteed. www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 13/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Typical Performance Curves – continued 150 25 120 20 -40°C Output Sink Current [mA] Output Source Current [mA] ○TLR341G 5V 90 60 30 15 85°C 10 25°C 5 1.8V 0 -50 -25 0 25 50 75 0 100 0.0 0.5 Ambient Temperature [°C] 1.0 1.5 2.0 Output Voltage [V] Figure 9. Output Source Current vs Ambient Temperature (VOUT=0V) Figure 10. Output Sink Current vs Output Voltage (VDD=1.8V) 150 4 3 5V 120 Input Offset Voltage [mV] Output Sink Current [mA] 2 90 60 30 1 85°C 0 -1 25°C -40°C -2 1.8V -3 0 -50 -25 0 25 50 75 100 -4 Ambient Temperature [°C] 1 2 3 4 5 6 Supply Voltage [V] Figure 12. Input Offset Voltage vs Supply Voltage Figure 11. Output Sink Current vs Ambient Temperature (VOUT=VDD) (*)The data above is measurement value of typical sample, it is not guaranteed. www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 14/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Typical Performance Curves – continued 4 4 3 3 2 2 Input Offset Voltage [mV] Input Offset Voltage [mV] ○TLR341G 1 5.0V 0 -1 1.8V -2 1 0 -1 85°C -40°C -2 25°C -3 -3 -4 -50 -25 0 25 50 75 -4 100 -2 0 1 2 3 4 Ambient Temperature [°C] Input Voltage [V] Figure 13. Input Offset Voltage vs Ambient Temperature Figure 14. Input Offset Voltage vs Input Voltage (VDD=5V) 5 120 120 110 110 85°C Large Signal Voltage Gain [dB] Large Signal Voltage Gain [dB] -1 -40°C 100 25°C 90 80 70 1.8V 100 5V 90 80 70 60 60 1 2 3 4 5 6 -50 -25 0 25 50 75 Supply Voltage [V] Ambient Temperature [°C] Figure 15. Large Signal Voltage Gain vs Supply Voltage (RL=2kΩ) Figure 16. Large Signal Voltage Gain vs Ambient Temperature (RL=2kΩ) 100 (*)The data above is measurement value of typical sample, it is not guaranteed. www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 15/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Typical Performance Curves – continued 120 120 110 110 Common-mode Rejection Ratio [dB] Common-mode Rejection Ratio [dB] ○TLR341G 25°C 100 85°C 90 -40°C 80 70 60 5V 100 90 1.8V 80 70 60 1 2 3 4 5 6 -50 -25 Supply Voltage [V] 25 50 75 100 Ambient Temperature [°C] Figure 17. Common-mode Rejection Ratio vs Supply Voltage (VDD=1.8V) Figure 18. Common-mode Rejection Ratio vs Ambient Temperature 120 1.6 110 1.5 100 1.4 Slew Rate L-H [V/μs] Power Supply Rejection Ratio [dB] 0 90 80 70 5V 1.3 1.2 1.8V 1.1 60 1.0 -50 -25 0 25 50 75 100 -50 -25 0 25 50 75 100 Ambient Temperature [°C] Ambient Temperature [°C] Figure 19. Power Supply Rejection Ratio vs Ambient Temperature (VDD=1.8V to 5.0V) Figure 20. Slew Rate L-H vs Ambient Temperature (*)The data above is measurement value of typical sample, it is not guaranteed. www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 16/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Typical Performance Curves – continued ○TLR341G 1.6 100 200 1.4 Voltage Gain [dB] Slew Rate H-L [V/μs] 1.5 5V 1.3 1.8V 1.2 80 160 60 120 40 Gain 80 20 1.1 0 102 100 1.0 -50 -25 0 25 50 75 40 100 103 1000 0 104 1000001000000 105 106 10000000 107 100000000 108 10000 Frequency [Hz] Ambient Temperature [ C] Figure 21. Slew Rate H-L vs Ambient Temperature Figure 22. Voltage Gain, Phase vs Frequency (VDD=1.8V, TA=25°C) 100 100 Shutdown Current [nA] 1000 Shutdown Current [nA] 1000 25°C -40°C 10 85°C 1 0 5V 10 1.8V 1 0.1 1 2 3 4 5 6 -50 -25 0 25 50 75 Supply Voltage [V] Ambient Temperature [°C] Figure 23. Shutdown Current vs Supply Figure 24. Shutdown Current vs Ambient —————— 100 —————— Voltage (VSHDN=0V) Temperature (VSHDN=0V) (*)The data above is measurement value of typical sample, it is not guaranteed. www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 17/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 Phase [deg] Phase TLR341G TLR342xxx Datasheet TLR344xxx Typical Performance Curves – continued 4 4 3 3 2 Turn On Time [us] Turn On Time [us] ○TLR341G -40°C 85°C 1.8V 2 25°C 1 1 5V 0 0 1 2 3 4 5 -50 6 0 25 50 75 100 Supply Voltage [V] Ambient Temperature [°C] Figure 25. Turn On Time vs Supply Voltage Figure 26. Turn On Time vs Ambient Temperature 1 3 2.5 Output Voltage [V] 0.8 Output Voltage [V] -25 0.6 VSHDN_L 0.4 VSHDN_H 0.2 2 VSHDN_L VSHDN_H 1.5 1 0.5 0 0 0 0.5 1 1.5 2 Shutdown Voltage [V] 0 1 2 3 4 5 Shutdown Voltage [V] Figure 27. Output Voltage vs Shutdown Voltage (VDD=1.8V, AV=0dB, V+IN=0.7V, TA=25°C) Figure 28. Output Voltage vs Shutdown Voltage (VDD=5V, AV=0dB, V+IN=2.5V, TA=25°C) (*)The data above is measurement value of typical sample, it is not guaranteed. www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 18/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Typical Performance Curves – continued ○TLR342xxx 1.0 200 180 TLR342F TLR342FJ Supply Current [μA] Power Dissipation [W] 0.8 0.6 TLR342FVT TLR342FVJ 0.4 85°C 160 25°C 140 -40°C 120 0.2 0.0 0 25 50 75 85 100 100 125 150 1 3 4 5 Ambient Temperature [°C] Supply Voltage [V] Figure 29. Power Dissipation vs Ambient Temperature (Derating Curve) Figure 30. Supply Current vs Supply Voltage 200 6 Maximum Output Voltage (High) [V] 6 180 Supply Current [μA] 2 160 5V 140 1.8V 120 100 5 85°C 25°C 4 3 -40°C 2 1 0 -50 -25 0 25 50 75 100 1 2 3 4 5 6 Supply Voltage [V] Ambient Temperature [°C] Figure 32. Maximum Output Voltage High vs Supply Voltage (RL=2kΩ) Figure 31. Supply Current vs Ambient Temperature (*)The data above is measurement value of typical sample, it is not guaranteed. www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 19/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Typical Performance Curves – continued ○TLR342xxx 30 Maximum Output Voltage (Low) [mV] Maximum Output Voltage (High) [V] 6 5 5V 4 3 2 1.8V 1 25 20 85°C 15 10 -40°C 25°C 5 0 0 -50 -25 0 25 50 75 1 100 2 4 5 6 Supply Voltage [V] Ambient Temperature [°C] Figure 34. Maximum Output Voltage Low vs Supply Voltage (RL=2kΩ) Figure 33. Maximum Output Voltage High vs Ambient Temperature (RL=2kΩ) 14 25 12 20 Output Source Current [mA] Maximum Output Voltage (Low) [mV] 3 5V 15 10 1.8V 5 10 -40°C 8 25°C 6 85°C 4 2 0 -50 0 -25 0 25 50 75 100 0.0 0.5 1.0 1.5 2.0 Ambient Temperature [°C] Output Voltage [V] Figure 35. Maximum Output Voltage (Low) vs Ambient Temperature (RL=2kΩ) Figure 36. Output Source Current vs Output Voltage (VDD=1.8V) (*)The data above is measurement value of typical sample, it is not guaranteed. www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 20/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Typical Performance Curves – continued 150 25 120 20 -40°C 5V Output Sink Current [mA] Output Source Current [mA] ○TLR342xxx 90 60 30 15 25°C 10 85°C 5 1.8V 0 -50 -25 0 25 50 75 0 100 0.0 0.5 Ambient Temperature [°C] 1.0 1.5 2.0 Output Voltage [V] Figure 38. Output Sink Current vs Output Voltage (VDD=1.8V) Figure 37. Output Source Current vs Ambient Temperature (VOUT=0V) 150 4 3 5V 120 Input Offset Voltage [mV] Output Sink Current [mA] 2 90 60 30 1 -40°C 0 25°C 85°C -1 -2 1.8V -3 0 -50 -25 0 25 50 75 100 -4 1 2 3 4 5 Ambient Temperature [°C] Supply Voltage [V] Figure 39. Output Sink Current vs Ambient Temperature (VOUT=VDD) Figure 40. Input Offset Voltage vs Supply Voltage 6 (*)The data above is measurement value of typical sample, it is not guaranteed. www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 21/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Typical Performance Curves – continued 4 4 3 3 2 2 Input Offset Voltage [mV] Input Offset Voltage [mV] ○TLR342xxx 1 1.8V 0 5V -1 -2 -3 1 -40°C 85°C -1 -2 -3 -4 -50 -4 -25 0 25 50 75 100 -2 -1 0 Ambient Temperature [°C] 1 2 3 4 5 Input Voltage [V] Figure 41. Input Offset Voltage vs Ambient Temperature Figure 42. Input Offset Voltage vs Input Voltage (VDD=5V) 120 120 110 110 Large Signal Voltage Gain [dB] Large Signal Voltage Gain [dB] 25°C 0 -40°C 25°C 100 85°C 90 80 70 1.8V 100 5V 90 80 70 60 60 1 2 3 4 5 6 -50 -25 0 25 50 75 100 Ambient Temperature [°C] Supply Voltage [V] Figure 44. Large Signal Voltage Gain vs Ambient Temperature (RL=2kΩ) Figure 43. Large Signal Voltage Gain vs Supply Voltage (RL=2kΩ) (*)The data above is measurement value of typical sample, it is not guaranteed. www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 22/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Typical Performance Curves – continued 120 120 110 110 Common-mode Rejection Ratio [dB] Common-mode Rejection Ratio [dB] ○TLR342xxx 25°C 100 85°C 90 -40°C 80 70 5V 100 1.8V 90 80 70 60 60 1 2 3 4 5 -50 6 -25 25 50 75 100 Ambient Temperature [°C] Supply Voltage [V] Figure 46. Common-mode Rejection Ratio vs Ambient Temperature Figure 45. Common-mode Rejection Ratio vs Supply Voltage (VDD=1.8V) 120 1.6 110 1.5 100 1.4 Slew Rate L-H [V/μs] Power Supply Rejection Ratio [dB] 0 90 80 5V 1.3 1.2 1.8V 70 1.1 60 -50 -25 0 25 50 75 100 1.0 Ambient Temperature [°C] -50 -25 0 25 50 75 100 Ambient Temperature [°C] Figure 48. Slew Rate L-H vs Ambient Temperature Figure 47. Power Supply Rejection Ratio vs Ambient Temperature (VDD=1.8V to 5.0V) (*)The data above is measurement value of typical sample, it is not guaranteed. www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 23/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Typical Performance Curves – continued ○TLR342xxx 100 1.6 200 Phase 80 160 60 120 1.8V 1.3 1.2 40 Gain 80 20 1.1 1.0 -50 -25 0 25 50 75 100 40 0 100 102 1000 103 0 10000 104 1000001000000 105 106 10000000 107 100000000 108 Frequency [Hz] Ambient Temperature [ C] Figure 50. Voltage Gain, Phase vs Frequency (VDD=1.8V, TA=25°C) Figure 49. Slew Rate H-L vs Ambient Temperature (*)The data above is measurement value of typical sample, it is not guaranteed. www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 24/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 Phase [deg] 5V 1.4 Voltage Gain [dB] Slew Rate H-L [V/μs] 1.5 TLR341G TLR342xxx Datasheet TLR344xxx Typical Performance Curves – continued ○TLR344xxx 400 1.2 1.0 340 85°C Supply Current [µA] Power Dissipation [W] TLR344FVJ 0.8 TLR344FJ 0.6 0.4 0.0 0 25 280 220 -40°C 160 TLR344F 0.2 25°C 50 75 85 100 100 125 150 1 2 3 Ambient Temperature [°C] 5 6 Supply Voltage [V] Figure 52. Supply Current vs Supply Voltage Figure 51. Power Dissipation vs Ambient Temperature (Derating Curve) 6 Maximum Output Voltage (High) [V] 400 340 Supply Current [µA] 4 1.8V 280 5V 220 160 100 5 85°C 4 25°C 3 2 -40°C 1 0 -50 -25 0 25 50 75 100 1 2 3 4 5 6 Supply Voltage [V] Ambient Temperature [°C] Figure 53. Supply Current vs Ambient Temperature Figure 54. Maximum Output Voltage High vs Supply Voltage (RL=2kΩ) (*)The data above is measurement value of typical sample, it is not guaranteed. www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 25/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Typical Performance Curves – continued ○TLR344xxx 30 Maximum Output Voltage (Low) [mV] Maximum Output Voltage (High) [V] 6 5 5V 4 3 2 1.8V 1 25 20 85°C 15 10 5 0 0 -50 -25 0 25 50 75 1 100 2 3 4 5 6 Supply Voltage [V] Ambient Temperature [°C] Figure 56. Maximum Output Voltage Low vs Supply Voltage (RL=2kΩ) Figure 55. Maximum Output Voltage High vs Ambient Temperature (RL=2kΩ) 14 25 12 20 Output Source Current [mA] Maximum Output Voltage (Low) [mV] -40°C 25°C 5V 15 10 1.8V 5 10 -40°C 8 25°C 6 85°C 4 2 0 -50 0 -25 0 25 50 75 100 0.0 Ambient Temperature [°C] 0.5 1.0 1.5 2.0 Output Voltage [V] Figure 58. Output Source Current vs Output Voltage (VDD=1.8V) Figure 57. Maximum Output Voltage (Low) vs Ambient Temperature (RL=2kΩ) (*)The data above is measurement value of typical sample, it is not guaranteed. www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 26/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Typical Performance Curves – continued ○TLR344xxx 150 25 120 20 Output Sink Current [mA] Output Source Current [mA] -40°C 5V 90 60 15 25°C 85°C 10 5 30 1.8V 0 -50 0 -25 0 25 50 75 0.0 100 0.5 1.0 1.5 2.0 Ambient Temperature [°C] Output Voltage [V] Figure 59. Output Source Current vs Ambient Temperature (VOUT=0V) Figure 60. Output Sink Current vs Output Voltage (VDD=1.8V) 4 150 3 2 Input Offset Voltage [mV] Output Sink Current [mA] 120 5V 90 60 1.8V 30 1 25°C 85°C 0 -1 -40°C -2 -3 0 -50 -4 -25 0 25 50 75 100 1 2 3 4 5 6 Supply Voltage [V] Ambient Temperature [°C] Figure 62. Input Offset Voltage vs Supply Voltage Figure 61. Output Sink Current vs Ambient Temperature (VOUT=VDD) (*)The data above is measurement value of typical sample, it is not guaranteed. www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 27/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Typical Performance Curves – continued 4 4 3 3 2 2 Input Offset Voltage [mV] Input Offset Voltage [mV] ○TLR344xxx 1 1.8V 0 5.0V -1 -2 -3 1 85°C 0 -1 -40°C -2 -3 -4 -50 -25 0 25 50 75 -4 -2.0 100 -1.0 0.0 Ambient Temperature [°C] 1.0 2.0 3.0 4.0 5.0 Input Voltage [V] Figure 64.Input Offset Voltage vs Input Voltage (VDD=5V) Figure 63. Input Offset Voltage vs Ambient Temperature 120 120 110 110 Large Signal Voltage Gain [dB] Large Signal Voltage Gain [dB] 25°C -40°C 25°C 100 85°C 90 80 70 1.8V 100 5V 90 80 70 60 60 1 2 3 4 5 6 -50 -25 0 25 50 75 100 Ambient Temperature [°C] Supply Voltage [V] Figure 66. Large Signal Voltage Gain vs Ambient Temperature (RL=2kΩ) Figure 65. Large Signal Voltage Gain vs Supply Voltage (RL=2kΩ) (*)The data above is measurement value of typical sample, it is not guaranteed. www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 28/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Typical Performance Curves – continued ○TLR344xxx 120 Common-mode Rejection Ratio [dB] Common-mode Rejection Ratio [dB] 120 110 -40°C 100 25°C 90 85°C 80 70 60 110 5V 100 1.8V 90 80 70 60 1 2 3 4 Supply Voltage [V] 5 6 -50 25 120 1.6 110 1.5 100 90 80 70 0 25 50 75 100 1.4 5V 1.3 1.2 1.8V 1.1 -25 50 Figure 68. Common-mode Rejection Ratio vs Ambient Temperature Slew Rate L-H [V/μs] Power Supply Rejection Ratio [dB] 0 Ambient Temperature [°C] Figure 67. Common-mode Rejection Ratio vs Supply Voltage 60 -50 -25 75 100 1.0 -50 -25 0 25 50 75 100 Ambient Temperature [°C] Ambient Temperature [°C] Figure 69. Power Supply Rejection Ratio vs Ambient Temperature (VDD=1.8V to 5.0V) Figure 70. Slew Rate L-H vs Ambient Temperature (*)The data above is measurement value of typical sample, it is not guaranteed. www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 29/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Typical Performance Curves – continued ○TLR344xxx 100 100 1.6 1000 10000 100000 1000000 10000000 100000000 200 1.4 Voltage Gain [dB] Slew Rate H-L [V/μs] 1.5 1.8V 1.3 5V 1.2 80 160 60 120 40 Gain 80 20 1.1 1.0 -50 -25 0 25 50 75 100 40 0 0 100 102 Ambient Temperature [°C] 7 1,000 103 10,000 104 100,000 105 1,000,000 106 10,000,000 10100,000,000 108 Frequency [Hz] Figure 71. Slew Rate H-L vs Ambient Temperature Figure 72. Voltage Gain, Phase vs Frequency (VDD=1.8V, TA=25°C) (*)The data above is measurement value of typical sample, it is not guaranteed. www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 30/51 Phase [deg] Phase TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Application Information NULL method condition for Test Circuit 1 VDD, VSS, EK, VICM Unit:V Parameter Input Offset Voltage VF SW1 SW2 SW3 VDD VSS EK VICM Calculation VF1 ON ON OFF 5 0 -2.5 2.5 1 ON ON ON 5 0 2.5 2 ON ON OFF 5 0 -2.5 ON ON OFF 0 -0.9 VF2 Large Signal Voltage Gain VF3 VF4 Common-mode Rejection Ratio (Input Common-mode Voltage Range) VF5 VF6 Power Supply Rejection Ratio VF7 1.8 5 -0.5 -3.5 0 3 3 0.5 4 － Calculation－ |VF1| 1 + RF/RS 1. Input Offset Voltage (VIO) VIO = 2. Large Signal Voltage Gain (AV) Av = 20Log 3. Common-mode Rejection Ratio (CMRR) CMRR = 20Log 4. Power Supply Rejection Ratio (PSRR) PSRR = 20Log [V] EK × (1+RF/RS) |VF2 - VF3| [dB] VICM × (1+RF/RS) |VF4 - VF5| VDD × (1+ RF/RS) |VF6 - VF7| [dB] [dB] 0.1μF RF=50kΩ SW1 RS=50Ω 500kΩ VDD RI=1MΩ Vo 0.01μF 15V EK 500kΩ 0.1μF 0.1μF DUT SW3 RS=50Ω 1000pF RI=1MΩ RL VICM 50kΩ NULL SW2 V VF VRL -15V VSS Figure 73. Test Circuit 1 www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 31/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Application Information – continued Switch Condition for Test Circuit 2 SW No. SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12 Supply Current OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF OFF Maximum Output Voltage RL=10kΩ OFF ON OFF OFF ON OFF OFF Output Current OFF ON OFF OFF ON OFF OFF OFF OFF Slew Rate OFF OFF Unity Gain Frequency ON Turn On Time OFF OFF ON OFF OFF OFF OFF OFF ON ON ON ON OFF OFF ON ON OFF OFF OFF OFF OFF OFF ON ON ON ON ON OFF OFF OFF OFF OFF OFF ON OFF OFF OFF OFF OFF OFF OFF SW3 R2=100kΩ SW4 ● VDD － SW1 SW2 ＋ SW5 SW6 SW7 SW8 SW9 RL CL SW10 SW11 SW12 R1=1kΩ VSS V-IN V+IN VOUT VRL Figure 74. Test Circuit 2 (Each Op-Amp) Output Voltage Input Voltage VH VH SR=V/t 90% V 10% VL VL t Input Wave t t Output Wave Figure 75. Slew Rate Input and Output Wave www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 32/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Application Information – continued —————— S H D N Voltage VDD VSS t Input Wave Output Voltage VOUT tON 50% of VOUT VSS t Output Wave Figure 76. Turn On Time Input and Output Wave VDD VDD R1//R2 R1// R2 VSS VSS R1 VIN R2 V VOUT1 = 1Vrms R1 CS = 20 × log R2 V VOUT2 100 × VOUT1 VOUT2 Figure 77. Test Circuit 3 (Channel Separation) (R1=1kΩ, R2=100kΩ) www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 33/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Application Information – continued 1. Unused Circuits When there are unused op-amps, it is recommended that they are connected as in Figure 78, setting the non-inverting input pin to a potential within the in-phase input voltage range (VICM). Keep this potential in VICM 2. Input Voltage Applying VDD+0.3V to the input pin is possible without causing deterioration of the electrical characteristics or destruction. However, this does not ensure normal circuit operation. Please note that the circuit operates normally only when the input voltage is within the common mode input voltage range of the electric characteristics. VDD VICM VSS Figure 78. Example of Application Circuit for Unused Op-amp 3. Power Supply(single/dual) The operational amplifiers operate when the voltage supplied is between V DD and VSS. Therefore, the single supply operational amplifiers can be used as dual supply operational amplifiers as well. 4. Output Capacitor If a large capacitor is connected between the output pin and VSS pin, current from the charged capacitor will flow into the output pin and may destroy the IC when the VDD pin is shorted to ground or pulled down to 0V. Use a capacitor smaller than 0.1µF between output pin and VSS pin. 5. Oscillation by Output Capacitor Please pay attention to the oscillation by output capacitor and in designing an application of negative feedback loop circuit with these ICs. 6. Latch Up Be careful of input voltage that exceed the VDD and VSS. When CMOS device have sometimes occur latch up and protect the IC from abnormaly noise. 7. Shutdown Terminal The shutdown terminal can’t be left unconnected. In case shutdown operation is not needed, the shutdown pin should be connected to VDD when the IC is used. Leaving the shutdown pin floating will result in an undefined operation mode, either shutdown or active, or even oscillating between the two modes. www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 34/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx I/O Equivalent Circuit Symbol Pin No. TLR341G TLR342xxx TLR344xxx +IN -IN 1,3 2,3,5,6 2,3,5,6, 9,10,12,13 OUT 4 1,7 1,7,8,14 VDD 6 8 4 —————— 5 - - SHDN www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Equivalent Circuit 35/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Application Example ○Voltage Follower Voltage gain is 0dB. VDD Using this circuit, the output voltage (VOUT) is configured to be equal to the input voltage (VIN). This circuit also stabilizes the output voltage (VOUT) due to high input impedance and low output impedance. Computation for output voltage (VOUT) is shown below. VOUT VIN VOUT=VIN VSS Figure 79. Voltage Follower Circuit ○Inverting Amplifier R2 For inverting amplifier, input voltage (VIN) is amplified by a voltage gain and depends on the ratio of R1 and R2. The out-of-phase output voltage is shown in the next expression VDD R1 VIN VOUT VOUT=-(R2/R1)・VIN This circuit has input impedance equal to R1. VSS Figure 80. Inverting Amplifier Circuit ○Non-inverting Amplifier R1 R2 For non-inverting amplifier, input voltage (VIN) is amplified by a voltage gain, which depends on the ratio of R1 and R2. The output voltage (VOUT) is in-phase with the input voltage (VIN) and is shown in the next expression. VDD VOUT VIN VOUT=(1 + R2/R1)・VIN Effectively, this circuit has high input impedance since its input side is the same as that of the operational amplifier. VSS Figure 81. Non-inverting Amplifier Circuit www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 36/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Power Dissipation Power dissipation (total loss) indicates the power that the IC can consume at TA=25°C (normal temperature). As the IC consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and consumable power. Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold resin or lead frame of the package. Thermal resistance, represented by the symbol θJA°C/W, indicates this heat dissipation capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance. Figure 82(a) shows the model of the thermal resistance of a package. The equation below shows how to compute for the Thermal resistance (θJA), given the ambient temperature (TA), maximum junction temperature (Tjmax), and power dissipation (PD). θJA = (Tjmax－TA) / PD °C/W The derating curve in Figure 82(b) indicates the power that the IC can consume with reference to ambient temperature. Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal resistance (θJA), which depends on the chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Figure 82 (c), (d), and (e) shows an example of the derating curve for TLR341G, TLR342xxx, and TLR344xxx, respectively. θJA=(Tjmax-TA)/ PD °C/W Power Dissipation of LSI [W] Power Dissipation of IC PDmax Ambient Temperature TA [ °C ] P2 θJA2 P1 Tjmax θJA1 0 Chip Surface Temperature TJ [ °C ] θJA2 < θJA1 25 50 (a) Thermal Resistance 100 125 150 (b) Derating Curve 1.0 1.0 0.8 0.8 Power Dissipation [W] Power Dissipation [W] 75 Ambient Temperature TA [ °C ] TLR341G (Note 34) 0.6 0.4 TLR342F(Note 35) TLR342FJ(Note 36) 0.6 TLR342FVT(Note 37) TLR342FVJ(Note 38) 0.4 0.2 0.2 0.0 0 25 50 75 85 0.0 100 125 150 Ambient Temperature [°C] 25 50 75 85 100 125 150 Ambient Temperature [°C] (c) TLR341G www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 0 (d) TLR342xxx 37/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx 1.2 Power Dissipation [W] 1.0 TLR344FVJ(Note 41) 0.8 TLR344FJ(Note 40) 0.6 0.4 TLR344F(Note 39) 0.2 0.0 0 25 50 75 85 100 125 150 Ambient Temperature [°C] (e) TLR344xxx (Note 34) (Note 35) (Note 36) (Note 37) (Note 38) (Note 39) (Note 40) (Note 41) Unit 5.4 5.5 5.4 5.0 4.7 4.5 8.2 6.8 mW/°C When using the unit above TA =25°C, subtract the value above per Celsius degree. Power dissipation is the value when FR4 glass epoxy board 70mm×70mm×1.6mm (copper foil area less than 3%) is mounted. Figure 82.Thermal Resistance and Derating Curve www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 38/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the GND traces of external components do not cause variations on the GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the PD stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the PD rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have voltages within the values specified in the electrical characteristics of this IC. www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 39/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Physical Dimension, Tape and Reel Information Package Name www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 SSOP6 40/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Physical Dimension, Tape and Reel Information – continued Package Name SOP8 (Max 5.35 (include.BURR)) (UNIT : mm) PKG : SOP8 Drawing No. : EX112-5001-1 www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 41/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Physical Dimension, Tape and Reel Information – continued Package Name www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 SOP-J8 42/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Physical Dimension, Tape and Reel Information – continued Package Name www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 TSSOP-B8 43/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Physical Dimension, Tape and Reel Information – continued Package Name www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 TSSOP-B8J 44/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Physical Dimension, Tape and Reel Information – continued Package Name SOP14 (Max 9.05 (include.BURR)) (UNIT : mm) PKG : SOP14 Drawing No. : EX113-5001 www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 45/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Physical Dimension, Tape and Reel Information – continued Package Name www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 SOP-J14 46/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Physical Dimension, Tape and Reel Information – continued Package Name www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 TSSOP-B14J 47/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Ordering Information T L R 3 4 x Part Number TLR341G TLR342F TLR342FJ TLR342FVT TLR342FVJ TLR344F TLR344FJ TLR344FVJ x x x - Package G : SSOP6 F : SOP8 : SOP14 FJ : SOP-J8 : SOP-J14 FVT : TSSOP-B8 FVJ : TSSOP-B8J : TSSOP-B14J x x Packaging and forming specification TR: Embossed tape and reel (SSOP6) E2: Embossed tape and reel (SOP8, SOP-J8, TSSOP-B8, TSSOP-B8J, SOP14, SOP-J14, TSSOP-B14J) Line-up Topr Channels 1ch Package Orderable Part Number SSOP6 Reel of 3000 TLR341G-TR SOP8 Reel of 2500 TLR342F-E2 SOP-J8 Reel of 2500 TLR342FJ-E2 TSSOP-B8 Reel of 2500 TLR342FVT-E2 TSSOP-B8J Reel of 2500 TLR342FVJ-E2 SOP14 Reel of 2500 TLR344F-E2 SOP-J14 Reel of 2500 TLR344FJ-E2 TSSOP-B14J Reel of 2500 TLR344FVJ-E2 2ch -40°C to +85°C 4ch www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 48/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Marking Diagram SSOP6(TOP VIEW) SOP8(TOP VIEW) Part Number Marking Part Number Marking LOT Number 1PIN MARK 1PIN MARK LOT Number SOP-J8(TOP VIEW) TSSOP-B8(TOP VIEW) Part Number Marking Part Number Marking LOT Number LOT Number 1PIN MARK 1PIN MARK TSSOP-B8J(TOP VIEW) SOP14(TOP VIEW) Part Number Marking Part Number Marking LOT Number LOT Number 1PIN MARK 1PIN MARK SOP-J14(TOP VIEW) TSSOP-B14J (TOP VIEW) Part Number Marking Part Number Marking LOT Number LOT Number 1PIN MARK www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 1PIN MARK 49/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Marking Diagram – continued Product Name TLR341 TLR342 TLR344 Package Type Marking G SSOP6 BC F SOP8 T342 FJ SOP-J8 T342 FVT TSSOP-B8 T342 FVJ TSSOP-B8J T342 F SOP14 TLR344F FJ SOP-J14 TLR344FJ FVJ TSSOP-B14J T344 Land Pattern Data SSOP6 0.95 SOP8, SOP-J8, TSSOP-B8, TSSOP-B8J, SOP14, SOP-J14, TSSOP-B14J 0.95 1.0 e 2.4 MIE b2 0.6 ℓ2 All dimensions in mm Land pitch e Land space MIE Land length ≧ℓ2 Land width b2 SSOP6 0.95 2.4 1.0 0.6 SOP8 SOP14 1.27 4.60 1.10 0.76 SOP-J8 SOP-J14 1.27 3.9 1.35 0.76 TSSOP-B8 TSSOP-B14J 0.65 4.60 1.20 0.35 TSSOP-B8J 0.65 3.20 1.15 0.35 Package www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 50/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 TLR341G TLR342xxx Datasheet TLR344xxx Revision History Date Revision Changes 29.Aug.2014 001 New Release 19.Mar.2015 002 Add TLR342FJ, TLR342FVT, TLR342FVJ, TLR344F 14.Oct.2015 003 Add TLR344FJ and TLR344FVJ 03.Feb.2016 004 Add TLR341G www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 51/51 TSZ02201-0RAR0G200720-1-2 03.Feb.2016 Rev.004 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001