Datasheet
Low Input Offset Voltage & Low Noise
Automotive High Precision & Input/Output
Rail-to-Rail CMOS Operational Amplifier
TLR376YG-C TLR2376Yxxx-C TLR4376YFV-C
General Description
Key Specifications
This product is a high precision & Input/Output Rail-toRail monolithic ICs integrated single, dual or quad
independent CMOS Op-Amps on a single chip. It features
low input offset voltage, low noise and low input bias
current. It is suitable for automotive requirements such as
engine control unit, electric power steering, anti-lock
braking system, sensor amplifier, and so on.
◼ Input Offset Voltage:
1.7 μV (Typ)
◼ Input-Referred Noise Voltage Density
f = 10 Hz:
20 nV/√Hz (Typ)
f = 1 kHz:
8 nV/√Hz (Typ)
◼ Common-mode Input Voltage Range:
VSS to VDD
◼ Input Bias Current:
0.5 pA (Typ)
◼ Operating Supply Voltage Range
Single Supply:
2.5 V to 5.5 V
Dual Supply:
±1.25 V to ±2.75 V
◼ Operating Temperature Range:
-40 °C to +125 °C
Features
◼
◼
◼
◼
AEC-Q100 Qualified(Note 1)
Low input offset voltage
Low Noise
Input/Output Rail-to-Rail
Packages
Applications
◼
◼
◼
◼
◼
◼
◼
◼
◼
◼
W (Typ) x D (Typ) x H (Max)
2.9 mm x 2.8 mm x 1.25 mm
2.9 mm x 4.0 mm x 0.9 mm
4.9 mm x 6.0 mm x 1.65 mm
5.0 mm x 6.4 mm x 1.35 mm
SSOP5
MSOP8
SOP-J8
SSOP-B14
(Note 1) Grade 1
Engine Control Unit
Electric Power Steering (EPS)
Anti-lock Braking System (ABS)
Automotive Electronics
Sensor Amplifiers
Battery-powered Equipment
Current Monitoring Amplifier
ADC Front Ends, Buffer Amplifier
Photodiode Amplifier
Amplifiers
Typical Application Circuit
RF = 10 kΩ
VDD = +2.5 V
RIN = 100 Ω
VIN
VOUT
𝑉𝑂𝑈𝑇 = −
𝑅𝐹
𝑉
𝑅𝐼𝑁 𝐼𝑁
VSS = -2.5 V
〇Product structure : Silicon integrated circuit
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TSZ22111 • 14 • 001
〇This product has no designed protection against radioactive rays.
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TLR376YG-C TLR2376Yxxx-C TLR4376YFV-C
Pin Configurations
TLR376YG-C: SSOP5
(TOP VIEW)
OUT 1
VSS 2
+IN 3
5 VDD
+
4 -IN
Pin No.
Pin Name
Function
1
OUT
Output
2
VSS
Negative power supply / Ground
3
+IN
Non-inverting input
4
-IN
Inverting input
5
VDD
Pin No.
Pin Name
1
OUT1
2
-IN1
Inverting input1
3
+IN1
Non-inverting input1
4
VSS
Negative power supply / Ground
5
+IN2
Non-inverting input2
6
-IN2
Inverting input2
7
OUT2
Output2
8
VDD
Positive power supply
Pin No.
Pin Name
1
OUT1
2
-IN1
Inverting input1
3
+IN1
Non-inverting input1
Positive power supply
TLR2376YFVM-C: MSOP8
TLR2376YFJ-C:
SOP-J8
(TOP VIEW)
OUT1 1
8 VDD
-IN1 2
7 OUT2
CH1
- +
+IN1 3
CH2
+ -
6 -IN2
5 +IN2
VSS 4
Function
Output1
TLR4376YFV-C: SSOP-B14
(TOP VIEW)
14 OUT4
OUT1 1
Function
Output1
4
VDD
Positive power supply
13 -IN4
5
+IN2
Non-inverting input2
+IN1 3
12 +IN4
6
-IN2
Inverting input2
VDD 4
11 VSS
7
OUT2
Output2
10 +IN3
8
OUT3
Output3
-IN1 2
CH1
- +
CH4
+ -
+IN2 5
-IN2 6
- +
CH2
+ CH3
OUT2 7
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TSZ22111 • 15 • 001
9 -IN3
8 OUT3
9
-IN3
Inverting input3
10
+IN3
Non-inverting input3
11
VSS
Negative power supply / Ground
12
+IN4
Non-inverting input4
13
-IN4
Inverting input4
14
OUT4
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Output4
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15.Jul.2021 Rev.002
TLR376YG-C TLR2376Yxxx-C TLR4376YFV-C
Block Diagram
VDD
Iref
+IN
+
-IN
-
AMP
OUT
VSS
(Note)
Each channel has the same configuration.
Description of Blocks
1.
AMP:
This block is a full-swing output operational amplifier with class-AB output circuit and high-precision-Rail-to-Rail
differential input stage.
2.
Iref:
This block supplies reference current which is needed to operate AMP block.
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TLR376YG-C TLR2376Yxxx-C TLR4376YFV-C
Absolute Maximum Ratings (Ta = 25 °C)
Parameter
Symbol
Rating
Unit
Supply Voltage (VDD - VSS)
VS
7.0
V
Signal Input Pin Voltage (+IN, -IN)
VI
(VSS - 0.3) to (VDD + 0.3)
V
Signal Input Pin Current (+IN, -IN)
II
±10
mA
Tjmax
150
°C
Tstg
- 55 to + 150
°C
Maximum Junction Temperature
Storage Temperature Range
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operate over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing
board size and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance(Note 1)
Parameter
Symbol
Thermal Resistance (Typ)
1s(Note 3)
2s2p(Note 4)
Unit
SSOP5
Junction to Ambient
θJA
376.5
185.4
°C/W
Parameter(Note 3)
ΨJT
40
30
°C/W
Junction to Ambient
θJA
284.1
135.4
°C/W
Junction to Top Characterization Parameter(Note 3)
ΨJT
21
11
°C/W
Junction to Ambient
θJA
149.3
76.9
°C/W
Junction to Top Characterization Parameter(Note 3)
ΨJT
18
11
°C/W
θJA
159.6
92.8
°C/W
ΨJT
13
9
°C/W
Junction to Top Characterization
MSOP8
SOP-J8
SSOP-B14
Junction to Ambient
Junction to Top Characterization
Parameter(Note 3)
(Note 1) Based on JESD51-2A(Still-Air).
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface
of the component package.
(Note 3) Using a PCB board based on JESD51-3.
(Note 4) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Single
Material
Board Size
FR-4
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70 μm
Layer Number of
Measurement Board
Material
Board Size
4 Layers
FR-4
114.3 mm x 76.2 mm x 1.6 mmt
Top
2 Internal Layers
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70 μm
74.2 mm x 74.2 mm
35 μm
74.2 mm x 74.2 mm
70 μm
Recommended Operating Conditions
Parameter
Symbol
Single Supply
Supply Voltage
(VDD - VSS)
Min
Typ
Max
2.5
5.0
5.5
±1.25
±2.5
±2.75
-40
+25
+125
VS
Dual Supply
Operating Temperature
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Unit
V
°C
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15.Jul.2021 Rev.002
TLR376YG-C TLR2376Yxxx-C TLR4376YFV-C
Electrical Characteristics
(Unless otherwise specified VS = 5 V, VSS = 0 V, VICM = 2.5 V, RL = 10 kΩ to VICM, Ta = 25 °C)
Limit
Parameter
Symbol
Input Offset Voltage
Unit
Min
Typ
Max
-
1.7
150
VIO
No load, Absolute value
μV
-
-
550
Conditions
No load, Absolute value,
Ta = -40 °C to +125 °C
Absolute value, No load,
Ta = -40 °C to +125 °C
Input Offset Voltage
Temperature Drift
ΔVIO/ΔT
-
0.1
4.0
μV/°C
Input Offset Current
IIO
-
0
-
pA
Absolute value
Input Bias Current
IB
-
0.5
-
pA
Absolute value
VICMR
0
-
5
V
VSS to VDD
-
645
950
-
-
1000
-
1245
1900
μA
-
-
2000
-
2490
3800
-
-
4000
TLR376YG-C, No load,
G = 0 dB
TLR376YG-C, No load,
G = 0 dB, Ta = -40 °C to +125 °C
TLR2376Yxxx-C, No load,
G = 0 dB
TLR2376Yxxx-C, No load,
G = 0 dB, Ta = -40 °C to +125 °C
TLR4376YFV-C, No load,
G = 0 dB
TLR4376YFV-C, No load,
G = 0 dB, Ta = -40 °C to +125 °C
4.925
4.975
-
4.90
-
-
4.50
4.75
-
IL = 10 mA
-
15
50
IL = 1 mA
-
-
60
-
100
250
Common-mode Input Voltage
Range
Supply Current
IDD
Output Voltage High
VOH
Output Voltage Low
VOL
IL = 1 mA
V
mV
IL = 1 mA,
Ta = -40 °C to +125 °C
IL = 1 mA,
Ta = -40 °C to +125 °C
IL = 10 mA
Output Source Current (Note 1)
IOH
25
50
-
mA
VOUT = VSS, Absolute value
Output Sink Current (Note 1)
IOL
25
50
-
mA
VOUT = VDD, Absolute value
Large Signal Voltage Gain
AV
110
137
-
90
-
-
GBW
-
4
-
MHz
G = 40 dB
Gain Bandwidth Product
Phase Margin
dB
Ta = -40 °C to +125 °C
θ
-
50
-
deg
G = 40 dB
Common-mode Rejection
Ratio
CMRR
80
100
-
dB
-
Power Supply Rejection Ratio
PSRR
75
95
-
dB
-
Slew Rate
SR
-
2
-
V/μs
Input-Referred Noise Voltage
Density
Vn
-
20
-
-
8
-
nV/√Hz
CL = 25 pF
f = 10 Hz
f = 1 kHz
Total Harmonic Distortion +
Noise
THD+N
-
0.001
-
%
VOUT = 4 Vp-p, f = 1 kHz
Channel Separation (Note 2)
CS
-
100
-
dB
input referred
(Note 1) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. When the output pin is short-circuited
continuously, the output current may decrease due to the temperature rise by the heat generation of inside the IC.
(Note 2) TLR2376Yxxx-C, TLR4376YFV-C
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TLR376YG-C TLR2376Yxxx-C TLR4376YFV-C
Typical Performance Curves
VSS = 0 V
3500
3000
2500
2500
2000
2000
1500
1500
1000
1000
500
500
0
0
2
3
4
5
Supply Voltage VS [V]
-50
6
45
45
40
40
VDD - Output Voltage VOH [mV]
50
Ta = +125 °C
30
Ta = +25 °C
25
20
Ta = -40 °C
15
0
25
50
75
100
125
150
Figure 2. Supply Current vs Ambient Temperature
50
35
-25
Ambient Temperature Ta [°C]
Figure 1. Supply Current vs Supply Voltage
VDD - Output Voltage VOH [mV]
VDD = 2.5 V
VDD = 5.0 V
VDD = 5.5 V
TLR376YG-C
TLR2376Yxxx-C
TLR4376YFV-C
Supply Current IDD [µA]
Supply Current IDD [µA]
3000
3500
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
TLR376YG-C
TLR2376Yxxx-C
TLR4376YFV-C
10
35
30
25
20
15
10
5
5
0
0
2
3
4
5
-50
6
-25
0
25
50
75
100
125
150
Ambient Temperature Ta [°C]
Supply Voltage VS [V]
Figure 3. Output Voltage High vs Supply Voltage
(IL = 1 mA)
Figure 4. Output Voltage High vs Ambient Temperature
(VS = 5 V, IL = 1 mA)
(Note) The above data is measurement value of typical sample, it is not guaranteed.
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TLR376YG-C TLR2376Yxxx-C TLR4376YFV-C
Typical Performance Curves - continued
30
30
25
25
Ta = +125 °C
Output Voltage VOL [mV]
Output Voltage VOL [mV]
VSS = 0 V
20
Ta = +25 °C
15
Ta = -40 °C
10
20
15
10
5
5
0
0
2
3
4
5
-50
6
-25
0
50
75
100
125
150
Ambient Temperature Ta [°C]
Supply Voltage VS [V]
Figure 5. Output Voltage Low vs Supply Voltage
(IL = 1 mA)
Figure 6. Output Voltage Low vs Ambient Temperature
(VS = 5 V, IL = 1 mA)
80
80
70
70
Ta = -40 °C
60
Output Sink Current IOL [mA]
Output Source Current IOH [mA]
25
50
Ta = +25 °C
40
30
Ta = +125 °C
20
10
Ta = -40 °C
60
50
Ta = +25 °C
40
Ta = +125 °C
30
20
10
0
0
0
1
2
3
4
5
6
Output Voltage VOUT V]
0
1
2
3
4
5
6
Output Voltage VOUT [V]
Figure 7. Output Source Current vs Output Voltage
(VS = 5 V)
Figure 8. Output Sink Current vs Output Voltage
(VS = 5 V)
(Note) The above data is measurement value of typical sample, it is not guaranteed.
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TLR376YG-C TLR2376Yxxx-C TLR4376YFV-C
Typical Performance Curves - continued
500
500
400
400
300
300
200
Input Offset Voltage VIO [µV]
Input Offset Voltage VIO [µV]
VSS = 0 V
Ta = +125 °C
100
0
VS = 5.5 V
200
VS = 5.0 V
100
0
-100
-100
Ta = +25 °C
Ta = -40 °C
-200
-200
VS = 2.5 V
-300
-300
-400
-400
-500
-500
2
3
4
5
-50
6
Supply Voltage VS [V]
0
25
50
75
100
125
150
Ambient Temperature Ta [°C]
Figure 9. Input Offset Voltage vs Supply Voltage
Figure 10. Input Offset Voltage vs Ambient Temperature
500
160
400
150
Large Signal Voltage Gain AV [dB]
300
Input Offset Voltage VIO [µV]
-25
200
Ta = +125 °C
100
+125 °C
0
-100
Ta = -40 °C
-200
Ta = +25 °C
+25 °C
-300
-400
Ta = -40 °C
140
130
Ta = +25 °C
Ta = +125 °C
120
110
100
90
80
-500
-1
0
1
2
3
4
5
6
2
3
4
5
6
Supply Voltage VS [V]
Input Common Mode Voltage VICM [V]
Figure 11. Input Offset Voltage vs Input Common Mode
Voltage
(VS = 5 V)
Figure 12. Large Signal Voltage Gain vs Supply Voltage
(RL = 10 kΩ)
(Note) The above data is measurement value of typical sample, it is not guaranteed.
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TLR376YG-C TLR2376Yxxx-C TLR4376YFV-C
Typical Performance Curves - continued
VSS = 0 V
160
Large Signal Voltage Gain AV [dB]
150
VS = 5.0 V
Common Mode Rejection Ratio CMRR [dB]
160
VS = 5.5 V
140
130
VS = 2.5 V
120
110
100
90
80
-50
-25
0
25
50
75
100
125
140
120
100
80
Ta = +125 °C
60
40
20
0
150
2
3
Ambient Temperature Ta [°C]
4
5
6
Supply Voltage VS [V]
Figure 13. Large Signal Voltage Gain vs Ambient
Temperature
Figure 14. Common-mode Rejection Ratio vs Supply Voltage
200
Power Supply Rejection Ratio PSRR [dB]
160
Common Mode Rejection Ratio CMRR [dB]
Ta = +25 °C
Ta = -40 °C
140
120
VS = 5.5 V
100
80
VS = 5.0 V
VS = 2.5 V
60
40
20
0
-50
-25
0
25
50
75
100
125
150
180
160
140
120
100
80
60
40
20
0
-50
-25
0
25
50
75
100
125
150
Ambient Temperature Ta [°C]
Ambient Temperature Ta [°C]
Figure 15. Common-mode Rejection Ratio vs Ambient
Temperature
Figure 16. Power Supply Rejection Ratio vs Ambient
Temperature
(Note) The above data is measurement value of typical sample, it is not guaranteed.
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TLR376YG-C TLR2376Yxxx-C TLR4376YFV-C
Typical Performance Curves - continued
VSS = 0 V
40
Input-Referred Noise Voltage Density Vn [nV/√Hz]
800
700
Input Bias Current IB [pA]
600
500
400
300
200
100
0
0
25
50
75
100
125
35
30
25
20
15
10
5
0
10
150
100
10000
100000
Frequency f [Hz]
Ambient Temperature Ta [°C]
Figure 17. Input Bias Current vs Ambient Temperature
(VS = 5 V)
Figure 18. Input-Referred Noise Voltage Density vs
Frequency
(VS = 5 V)
5
5
Fall
Fall
4
Slew Rate SR [V/µs]
4
Slew Rate SR [V/µs]
1000
3
Rise
2
1
Fall
3
Rise
Rise
2
Rise
1
0
2
3
4
5
6
0
-50
-25
0
25
50
75
100
125
150
Ambient Temperature Ta [°C]
Supply Voltage VS [V]
Figure 19. Slew Rate vs Supply Voltage
Figure 20. Slew Rate vs Ambient Temperature
(VS = 5 V)
(Note) The above data is measurement value of typical sample, it is not guaranteed.
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TLR376YG-C TLR2376Yxxx-C TLR4376YFV-C
Typical Performance Curves - continued
VSS = 0 V
90
80
5
VS = 5.0 V
70
VS = 5.5 V
Phase Margin θ [deg]
Gain Bandwidth Product GBW [MHz]
6
4
VS = 2.5 V
3
2
60
50
40
30
20
1
10
0
0
-50
-25
0
25
50
75
100
125
150
10
100
Ambient Temperature Ta [°C]
Load Capacitance CL [pF]
Figure 21. Gain Bandwidth Product vs Ambient Temperature
Figure 22. Phase Margin vs Load Capacitance
(VS = 5 V, RF = 10 kΩ, G = 40 dB)
18
180
80
1000
Phase
12
CL = 600 pF
135
60
CL = 500 pF
Gain
45
20
0
102
100
103
1000
104
10000
0
105 1000000
106 10000000
107
100000
Frequency f [Hz]
Voltage Gain G [dB]
90
40
Phase θ [deg]
Voltage Gain G [dB]
6
CL = 330 pF
0
-6
CL = 0 pF
-12
-18
102
103
104
105
106
107
Frequency f [Hz]
Figure 23. Voltage Gain, Phase vs Frequency
(VS = 5 V)
Figure 24. Voltage Gain vs Frequency
(VS = 5 V, G = 0 dB, VIN = 180 mVP-P)
(Note) The above data is measurement value of typical sample, it is not guaranteed.
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TLR376YG-C TLR2376Yxxx-C TLR4376YFV-C
Application Examples
○Voltage Follower
Using this circuit, the output voltage (VOUT) is configured
to be equal to the input voltage (VIN). This circuit also
stabilizes the output voltage due to high input impedance
and low output impedance. Computation for output
voltage is shown below.
VDD
VOUT
VIN
𝑉𝑂𝑈𝑇 = 𝑉𝐼𝑁
VSS
Figure 25. Voltage Follower Circuit
○Inverting Amplifier
RF
For inverting amplifier, input voltage (VIN) is amplified by
a voltage gain which depends on the ratio of RIN and RF,
and then it outputs phase-inverted voltage (VOUT). The
output voltage is shown in the next expression.
VDD
VIN
RIN
VOUT
𝑉𝑂𝑈𝑇 = −
𝑅𝐹
𝑉
𝑅𝐼𝑁 𝐼𝑁
This circuit has input impedance equal to RIN.
VSS
Figure 26. Inverting Amplifier Circuit
○Non-inverting Amplifier
RIN
RF
For non-inverting amplifier, input voltage (VIN) is amplified
by a voltage gain, which depends on the ratio of RIN and
RF. The output voltage (VOUT) is in-phase with the input
voltage and is shown in the next expression.
VDD
VOUT
VIN
𝑉𝑂𝑈𝑇 = (1 +
𝑅𝐹
)𝑉
𝑅𝐼𝑁 𝐼𝑁
Effectively, this circuit has high input impedance since its
input side is the same as that of the operational amplifier.
VSS
Figure 27. Non-inverting Amplifier Circuit
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TSZ22111 • 15 • 001
12/22
TSZ02201-0GLG2G500060-1-2
15.Jul.2021 Rev.002
TLR376YG-C TLR2376Yxxx-C TLR4376YFV-C
I/O Equivalence Circuits
○TLR376YG-C
Pin No.
Pin Name
Pin Description
Equivalence Circuit
5
1
OUT
Output
1
2
5
3
4
+IN
-IN
3, 4
Input
2
○TLR2376Yxxx-C
Pin No.
Pin Name
Pin Description
Equivalence Circuit
8
1
7
OUT1
OUT2
Output
1, 7
4
8
2
3
5
6
-IN1
+IN1
+IN2
-IN2
2, 3, 5, 6
Input
4
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© 2021 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
13/22
TSZ02201-0GLG2G500060-1-2
15.Jul.2021 Rev.002
TLR376YG-C TLR2376Yxxx-C TLR4376YFV-C
○TLR4376YFV-C
Pin No.
Pin Name
Pin Description
Equivalence Circuit
4
1
7
8
14
OUT1
OUT2
OUT3
OUT4
1, 7
8,14
Output
11
4
2
3
5
6
9
10
12
13
-IN1
+IN1
+IN2
-IN2
-IN3
+IN3
+IN4
-IN4
2, 3, 5, 6
9,10,12,13
Input
11
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© 2021 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
14/22
TSZ02201-0GLG2G500060-1-2
15.Jul.2021 Rev.002
TLR376YG-C TLR2376Yxxx-C TLR4376YFV-C
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
8.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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© 2021 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
15/22
TSZ02201-0GLG2G500060-1-2
15.Jul.2021 Rev.002
TLR376YG-C TLR2376Yxxx-C TLR4376YFV-C
Operational Notes – continued
10. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
Figure 28. Example of monolithic IC structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
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© 2021 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
16/22
TSZ02201-0GLG2G500060-1-2
15.Jul.2021 Rev.002
TLR376YG-C TLR2376Yxxx-C TLR4376YFV-C
Ordering Information
T
L
R
x
3
7
6
Y
x
Part Number
TLR376Y (Single Op-Amp)
Package
G
: SSOP5
TLR2376Y (Dual Op-Amp)
FVM : MSOP8
FJ : SOP-J8
TLR4376Y (Quad Op-Amp)
FV
x
x
-
C
x
x
Product Rank
C: Automotive (Engine control unit, EPS,
ABS, and so on)
Packaging and forming specification
TR: Embossed tape and reel
(SSOP5 / MSOP8)
E2: Embossed tape and reel
(SOP-J8 / SSOP-B14)
: SSOP-B14
Lineup
Operating
Temperature Range
Operating
Supply Voltage
Number of
Channels
Single
-40 °C to +125 °C
2.5 V to 5.5 V
Dual
Quad
Package
Orderable Part Number
SSOP5
Reel of 3000
TLR376YG-CTR
MSOP8
Reel of 3000
TLR2376YFVM-CTR
SOP-J8
Reel of 2500
TLR2376YFJ-CE2
SSOP-B14
Reel of 2500
TLR4376YFV-CE2
Marking Diagrams
SSOP5 (TOP VIEW)
MSOP8 (TOP VIEW)
Part Number Marking
Part Number Marking
b u
2
6
3
7
Y
Pin 1 Mark
LOT Number
SOP-J8 (TOP VIEW)
Part Number Marking
2 3 7 6 Y
SSOP-B14 (TOP VIEW)
Part Number Marking
4376Y
LOT Number
LOT Number
LOT Number
Pin 1 Mark
Pin 1 Mark
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© 2021 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
17/22
TSZ02201-0GLG2G500060-1-2
15.Jul.2021 Rev.002
TLR376YG-C TLR2376Yxxx-C TLR4376YFV-C
Physical Dimension and Packing Information
Package Name
www.rohm.com
© 2021 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
SSOP5
18/22
TSZ02201-0GLG2G500060-1-2
15.Jul.2021 Rev.002
TLR376YG-C TLR2376Yxxx-C TLR4376YFV-C
Physical Dimension and Packing Information - continued
Package Name
www.rohm.com
© 2021 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
MSOP8
19/22
TSZ02201-0GLG2G500060-1-2
15.Jul.2021 Rev.002
TLR376YG-C TLR2376Yxxx-C TLR4376YFV-C
Physical Dimension and Packing Information - continued
Package Name
www.rohm.com
© 2021 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
SOP-J8
20/22
TSZ02201-0GLG2G500060-1-2
15.Jul.2021 Rev.002
TLR376YG-C TLR2376Yxxx-C TLR4376YFV-C
Physical Dimension and Packing Information - continued
Package Name
www.rohm.com
© 2021 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
SSOP-B14
21/22
TSZ02201-0GLG2G500060-1-2
15.Jul.2021 Rev.002
TLR376YG-C TLR2376Yxxx-C TLR4376YFV-C
Revision History
Date
Revision
26.Feb.2021
001
New Release
15.Jul.2021
002
Add Lineup
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© 2021 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
Changes
22/22
TSZ02201-0GLG2G500060-1-2
15.Jul.2021 Rev.002
Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
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