Data Sheet
1.5V Drive Pch + Pch MOSFET
TT8J11
Structure Silicon P-channel MOSFET Dimensions (Unit : mm)
TSST8
(8)
(7)
(6)
(5)
Features 1) Low On-resistance. 2) Small high power package. 3) Low voltage drive(1.5V drive).
(1)
(2)
(3)
(4)
Abbreviated symbol : J11
Application Switching
Inner circuit
(8) (7) (6) (5)
Packaging specifications Type TT8J11 Package Code Basic ordering unit (pieces) Taping TCR 3000
(1) Tr1 Source (2) Tr1 Gate (3) Tr2 Source (4) Tr2 Gate (5) Tr2 Drain (6) Tr2 Drain (7) Tr1 Drain (8) Tr1 Drain
∗2 ∗2
∗1
∗1
(1)
(2)
(3)
(4)
Absolute maximum ratings (Ta = 25C) Symbol Parameter Drain-source voltage Gate-source voltage Drain current Source current (Body Diode) Power dissipation Channel temperature Range of storage temperature
*1 Pw10s, Duty cycle1% *2 Mounted on a ceramic board.
∗1 ESD PROTECTION DIODE ∗2 BODY DIODE
Limits 12 0 to 8 3.5
Unit V V A A A A W / TOTAL W / ELEMENT C C
VDSS Continuous Pulsed Continuous Pulsed VGSS ID IDP Is Isp PD Tch Tstg
*1
*1 *2
12 0.8 12 1.25 1 150 55 to 150
Thermal resistance Parameter Channel to Ambient
* Mounted on a ceramic board.
Symbol Rth (ch-a)
*
Limits 100 125
Unit ˚C / W /TOTAL ˚C / W /ELEMENT
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2011.05 - Rev.A
TT8J11
Electrical characteristics (Ta = 25C) Parameter Gate-source leakage Zero gate voltage drain current Gate threshold voltage Static drain-source on-state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Total gate charge Gate-source charge Gate-drain charge
*Pulsed
Data Sheet
Symbol IGSS IDSS VGS (th)
Min. 12 0.3 4 -
Typ. 31 43 60 80 2600 200 190 15 30 170 60 22 3.9 3.1
Max. 10 10 1.0 43 60 90 160 -
Unit A V A V
Conditions VGS=8V, VDS=0V ID=1mA, V GS=0V VDS=12V, VGS=0V VDS=6V, ID=1mA ID=3.5A, VGS=4.5V ID=1.7A, VGS=2.5V ID=1.7A, VGS=1.8V ID=0.7A, VGS=1.5V ID=3.5A, VDS=6V VDS=6V VGS=0V f=1MHz ID=1.7A, VDD 6V VGS=4.5V RL=3.5 RG=10 ID=3.5A VDD 6V VGS=4.5V
Drain-source breakdown voltage V (BR)DSS
* RDS (on)
m
l Yfs l* Ciss Coss Crss td(on)* tr * td(off)* tf * Qg * Qgs * Qgd *
S pF pF pF ns ns ns ns nC nC nC
Body diode characteristics (Source-Drain) (Ta = 25C) Parameter Forward Voltage
*Pulsed
Symbol VSD *
Min. -
Typ. -
Max. 1.2
Unit V
Conditions Is=3.5A, VGS=0V
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2/6
2011.05 - Rev.A
TT8J11
Electrical characteristic curves (Ta=25C)
Fig.1 Typical Output Characteristics (Ⅰ) 3.5
Data Sheet
Fig.2 Typical Output Characteristics (Ⅱ) 3.5
Ta=25°C pulsed
Ta=25°C pulsed VGS=-4.5V VGS=-4.0V VGS=-2.8V
3
3
2.5 Drain Current : -ID [A]
2
VGS=-4.0V VGS=-2.8V
Drain Current : -ID [A]
VGS=-4.5V
2.5
2
VGS=-1.8V VGS=-1.5V
1.5 VGS=-1.8V 1 VGS=-1.5V
1.5
1 VGS=-1.2V
0.5 VGS=-1.2V 0 0 0.2 0.4 0.6 0.8 1
0.5
0 0 2 4 6 8 10
Drain-Source Voltage : -VDS [V] Fig.3 Static Drain-Source On-State Resistance vs. Drain Current
Drain-Source Voltage : -VDS [V] Fig.4 Static Drain-Source On-State Resistance vs. Drain Current
1000 Ta=25°C pulsed VGS=-1.5V VGS=-1.8V VGS=-2.5V VGS=-4.5V
1000 VGS=-4.5V pulsed Static Drain-Source On-State Resistance RDS(on) [mΩ] Ta=125°C Ta=75°C Ta=25°C Ta=-25°C
Static Drain-Source On-State Resistance RDS(on) [mΩ]
100
100
10
10
1 0.01
0.1 Drain Current : -ID [A]
1
10
1 0.01
0.1
1 Drain Current : -ID [A]
10
Fig.5 Static Drain-Source On-State Resistance vs. Drain Current 1000 VGS=-2.5V pulsed Static Drain-Source On-State Resistance RDS(on) [mΩ] Ta=125°C Ta=75°C Ta=25°C Ta=-25°C 1000
Fig.6 Static Drain-Source On-State Resistance vs. Drain Current
100
Static Drain-Source On-State Resistance RDS(on) [mΩ]
VGS=-1.8V pulsed
Ta=125°C Ta=75°C Ta=25°C Ta=-25°C
100
10
10
1 0.01
0.1
1
10
1 0.01
0.1
1
10
Drain Current : -ID [A]
Drain Current : -ID [A]
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3/6
2011.05 - Rev.A
TT8J11
Data Sheet
Fig.7 Static Drain-Source On-State Resistance vs. Drain Current
Fig.8 Forward Transfer Admittance vs. Drain Current 100
1000 VGS=-1.5V pulsed Ta=125°C Ta=75°C Ta=25°C Ta=-25°C
VDS=-6V pulsed
Static Drain-Source On-State Resistance RDS(on) [mΩ]
Forward Transfer Admittance Yfs [S]
100
10
10
1
Ta=125°C Ta=75°C Ta=25°C Ta=-25°C
1 0.01
0.1
1
10
0.1 0.01
0.1
1
10
Drain Current : -ID [A]
Drain Current : -ID [A] Fig.10 Source Current vs. Source-Drain Voltage 10
Fig.9 Typical Transfer Characteristics 10 VDS=-6V pulsed
VGS=0V pulsed
Source Current : -Is [A]
1 Drain Currnt : -ID [A]
1
0.1
Ta=125°C Ta=75°C Ta=25°C Ta=-25°C
Ta=125°C Ta=75°C Ta=25°C Ta=-25°C
0.1
0.01
0.001 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
0.01 0.0 0.5 1.0 1.5 2.0
Gate-Source Voltage : -VGS [V]
Source-Drain Voltage : -VSD [V]
Fig.11 Static Drain-Source On-State Resistance vs. Gate-Source Voltage 200 Ta=25°C pulsed Static Drain-Source On-State Resistance RDS(on) [mΩ] ID=-0.7A 150 ID=-3.5A Switching Time : t [ns] 100 1000
Fig.12 Switching Characteristics
td(off)
tf
100
tr 10 VDD≒-6V VGS=-4.5V RG=10Ω Ta=25°C Pulsed 1 0.01 0.1 1 10 td(on)
50
0 0 2 4 6 8 Gate-Source Voltage : -VGS [V]
Drain Current :- ID [A]
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4/6
2011.05 - Rev.A
TT8J11
Data Sheet
Fig.13 Dynamic Input Characteristics 100000 Ta=25°C VDD=-6V ID=-3.5A Pulsed 10000 Capacitance : C [pF]
Fig.14 Typical Capacitance vs. Drain-Source Voltage
5
Ta=25°C f=1MHz VGS=0V
4 Gate-Source Voltage : -VGS [V]
3
1000
Ciss Coss
2
1
100
Crss
0 0 5 10 15 20 25
10 0.01 0.1 1 10 100 Drain-Source Voltage : -VDS [V]
Total Gate Charge : -Qg [nC]
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5/6
2011.05 - Rev.A
TT8J11
Measurement circuits
Data Sheet
Pulse Width
VGS
ID RL D.U.T.
VDS
VGS
10% 50% 10%
90%
50% 10% 90%
RG VDD
VDS td(on) ton 90% tr td(off) toff tf
Fig.1-1 Switching Time Measurement Circuit
Fig.1-2 Switching Waveforms
VG
ID VGS RL IG(Const.) D.U.T. VDD VDS
Qg VGS Qgs Qgd
Charge
Fig.2-1 Gate Charge Measurement Circuit
Fig.2-2 Gate Charge Waveform
Notice This product might cause chip aging and breakdown under the large electrified environment. Please consider to design ES protection circuit.
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6/6
2011.05 - Rev.A
Notice
Notes
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http://www.rohm.com/contact/
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